JP2014050067A - Vibration device, electronic equipment, and mobile device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration device capable of improving vibration characteristic.SOLUTION: A crystal resonator 1 comprises: a crystal vibration piece 10 having a vibration part 11, a frame part 12 enclosing the vibration part 11, and a pair of connection parts 13 and 14 for connecting first direction opposite ends 11a and 11d of the vibration part 11 and the frame part 12; and a package 20 for accommodating the crystal vibration piece 10. The connection part 13 (14) of the crystal vibration piece 10 includes: first connection parts 13a and 13b (14a and 14b) extending from two node parts 11b and 11c (11e and 11f) at the time of contour vibration at an end 11a (11d) of the vibration part 11; a coupling part 13c (14c) for coupling the first connection parts 13a and 13b (14a and 14b) together; and a second connection part 13d (14d) for connecting the coupling part 13c (14c) and the frame part 12. In this configuration, a first straight line L1 linking the second connection parts 13d and 14d together and a second straight line L2 linking the stationary parts 12e and 12f of long sides 12c and 12d of the frame part 12 together cross each other.

Description

  The present invention relates to a vibration device, an electronic apparatus including the vibration device, and a moving object.

Conventionally, as a resonator element that is a constituent element of a vibration device, a vibration main body portion formed of a rectangular crystal substrate, a frame portion surrounding an outer periphery away from the vibration main body portion, and the vibration main body portion and the frame portion are connected. 2. Description of the Related Art A crystal resonator (hereinafter referred to as a vibrating piece) including a connecting portion is known (see, for example, Patent Document 1).
This vibrating piece has a configuration in which the four corners of the vibration main body portion and the four corners inside the frame portion are connected via beam-shaped connecting portions, respectively.

JP 2004-242254 A

  In the resonator element of Patent Document 1, terminal electrodes are provided in each of the portions of the frame portion that face each other across the vibration main body portion, and a part of each is a fixed portion. The fixing portion is fixed inside the package, which is a container for the resonator element, by a conductive bonding member such as a conductive adhesive or solder. Here, a device including a resonator element and a package is referred to as a vibration device.

Since the main material of the resonator element is quartz and the main material of the package is generally a ceramic material, the thermal expansion coefficients of both are different.
Due to the difference in thermal expansion coefficient between them, a thermal stress in a direction in which the portions where the fixing portions are provided is brought close to (or away from) the frame portion of the resonator element as the surrounding temperature changes.
This thermal stress may be transmitted to the vibration main body through connection portions that connect the four corners of the vibration main body and the four corners inside the frame.
As a result, the vibration piece of Patent Document 1 is affected by the vibration of the vibration main body, and, for example, a frequency temperature characteristic (hereinafter also simply referred to as a temperature characteristic) indicating the degree of change in the transmission frequency accompanying a change in ambient temperature. In addition, there is a risk that vibration characteristics such as frequency aging characteristics (hereinafter also simply referred to as aging characteristics) representing the degree of change in the transmission frequency due to aging (aging, aging) may deteriorate.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A vibration device according to this application example includes a vibration part that vibrates in outline, a frame part that includes a pair of fixing parts provided to sandwich the vibration part in plan view, and surrounds the vibration part, A vibrating piece having a pair of connection portions for connecting both ends of the vibrating portion in the first direction and the frame portion along the first direction, and fixing the vibrating piece with the pair of fixing portions. A package for housing, wherein each of the connection portions of the resonator element extends from each of at least two node portions during contour vibration at the end of the vibration portion, and the first connection portion. A second connecting portion that connects the second connecting portions, and a second straight line that connects the second connecting portions; and a second connecting portion that connects the connecting portions and the frame portion. The straight lines intersect with each other.

According to this, in the vibration device, each connection portion of the vibration piece includes a first connection portion extending from each of at least two node portions during contour vibration at an end portion of the vibration portion (corresponding to the vibration main body portion), A first straight line connecting the second connection parts; a frame part; a connection part connecting the connection parts; a second connection part connecting the connection part and the frame part (corresponding to the frame part); And the second straight line connecting the fixed portions intersect each other.
Thereby, in the vibrating device, the thermal stress generated by the difference in the thermal expansion coefficient between the vibrating piece and the package is along the second linear direction of the frame portion in the second connection portion that connects the connecting portion and the frame portion. The component from one side and the component from the other side are almost offset (in other words, displacement due to thermal stress hardly occurs).
As a result, since the vibration device can suppress the influence of the thermal stress generated in the frame portion on the vibration portion via the connection portion, for example, vibration characteristics such as temperature characteristics and aging characteristics are conventionally (for example, disclosed in Patent Document 1). It is possible to improve compared to a vibrating device using a vibrating piece.

  Application Example 2 In the vibration device according to the application example described above, it is preferable that each of the second connection portions is provided on a center line of the frame portion along the first direction.

According to this, since the second connecting portion is provided on the center line of the frame portion along the first direction, the vibration device has one side across the center line of the thermal stress generated in the frame portion. The component from the other side and the component from the other side are balanced, and are surely offset at the second connecting portion.
As a result, the vibration device can reliably suppress the influence of the thermal stress generated in the frame part on the vibration part via the connection part. For example, vibration characteristics such as temperature characteristics and aging characteristics can be improved more reliably than before. Can be made.

  Application Example 3 In the vibration device according to the application example, it is preferable that the first straight line and the second straight line are orthogonal to each other.

According to this, since the first straight line and the second straight line are orthogonal to each other in the vibrating device, most of the thermal stress generated in the frame portion is caused by a component from one side along the second straight line and It becomes a component from the other side, and both are surely offset at the second connecting portion on the first straight line.
As a result, the vibration device can further suppress the influence of the thermal stress generated in the frame part on the vibration part via the connection part, so that, for example, vibration characteristics such as temperature characteristics and aging characteristics can be further improved than before. Can do.

  Application Example 4 In the vibration device according to the application example described above, the first straight line overlaps with a center line of the frame portion along the first direction in a plan view, and the second straight line corresponds to the frame portion of the frame portion. It is preferable to overlap with a center line along a second direction perpendicular to the first direction in plan view.

According to this, in the vibrating device, the first straight line overlaps the center line of the frame portion along the first direction in a plan view, and the second straight line is perpendicular to the first direction of the frame portion in the plan view. It overlaps with the center line along the direction in plan view.
From this, in the vibration device, most of the thermal stress generated in the frame portion is a component from one side and a component from the other side along the second straight line, and both of them sandwich the second straight line. The second connecting portion on the side and the second connecting portion on the other side are balanced.
In the vibrating device, the component from one side across the center line (first straight line) along the first direction of the thermal stress generated in the frame portion is balanced with the component from the other side, and each second It is surely offset at the connecting portion.
As a result, the vibration device can further suppress the influence of the thermal stress generated in the frame part on the vibration part via the connection part, so that, for example, vibration characteristics such as temperature characteristics and aging characteristics can be further improved than before. Can do.

  Application Example 5 In the vibration device according to the application example described above, it is preferable that the two first connection portions connected by the connection portion are provided at positions symmetrical with respect to the first straight line. .

According to this, since the vibration device is provided at the position where the two first connection parts connected by the connection part are symmetrical with respect to the first straight line, the balance of support for the vibration part is good. It becomes.
As a result, the vibration device can eliminate the influence on the vibration of the vibration part due to the asymmetric arrangement of the first connection part.

  Application Example 6 An electronic apparatus according to this application example includes the vibration device according to any one of the application examples described above.

  According to this, since the electronic device of this configuration includes the vibration device described in any of the above application examples, the electronic device reflecting the effect described in any of the above application examples is provided. Can do.

  Application Example 7 A moving object according to this application example includes the vibration device according to any one of the application examples described above.

  According to this, since the moving body of this configuration includes the vibration device according to any one of the application examples, the moving object reflecting the effect according to any of the application examples is provided. Can do.

It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is a schematic top view seen from the lid (lid body) side, (b) is a schematic in the AA line of (a). Sectional drawing. The schematic cross section in the BB line of Fig.1 (a). It is a schematic diagram explaining a lame mode vibration, (a) is a schematic top view which shows the displacement state of the vibration part at the time of one electric field direction, (b) is a schematic diagram which shows the displacement state of the vibration part at the time of the other electric field direction Plan view. The schematic plan view explaining the thermal stress which arises in a crystal oscillator. FIG. 9 is a schematic plan view showing a schematic configuration of a crystal resonator according to Modification 1. FIG. 9 is a schematic plan view showing a schematic configuration of a crystal resonator according to Modification 2. It is a schematic diagram which shows schematic structure of the crystal oscillator of 2nd Embodiment, (a) is a schematic top view seen from the lid side, (b) is a schematic cross section in the AA of (a). The model perspective view which shows the mobile telephone of 3rd Embodiment. The model perspective view which shows the motor vehicle of 4th Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a crystal resonator as an example of a vibrating device will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. FIG. 1A is a schematic plan view seen from the lid (lid) side, and FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. FIG. 2 is a schematic sectional view taken along line BB in FIG.
In the schematic plan view of FIG. 1A, the lid is omitted for convenience of explanation. In addition, for easy understanding, the dimensional ratio of each component is different from the actual one.

As shown in FIGS. 1 and 2, the crystal resonator 1 includes a crystal resonator element 10 as a resonator element and a package 20 that accommodates the crystal resonator element 10, and is configured in a substantially rectangular parallelepiped shape.
The quartz crystal vibrating piece 10 is cut out at a predetermined angle from, for example, a quartz crystal or the like, and the planar shape is formed in a substantially rectangular flat plate shape.
The quartz crystal resonator element 10 includes a substantially rectangular vibration part 11 that vibrates in outline, a square frame part 12 that surrounds the vibration part 11 with a gap (space) in plan view, and a first direction of the vibration part 11. It has a pair of connection parts 13 and 14 which connect both end parts 11a and 11d (longitudinal direction, right and left direction on the paper surface) and the frame part 12 along the first direction.
The quartz crystal resonator element 10 includes a vibrating portion 11, a frame portion 12, and a pair of connecting portions 13 and 14 that are integrally formed. Further, the outer shape of the quartz crystal vibrating piece 10 is formed with high accuracy using techniques such as photolithography and etching.

  The connecting portion 13 is a first connecting portion extending along the first direction from each of the two node portions 11b and 11c during contour vibration (here, referred to as lame mode vibration) at one end portion 11a of the vibrating portion 11. 13a, 13b, extending along a second direction orthogonal to the first direction in plan view, connecting portion 13c connecting the first connecting portions 13a, 13b, and extending along the first direction, connecting portion 13c and a second connection portion 13d that connects one short side portion 12a extending along the second direction of the frame portion 12.

  The connection portion 14 is a first connection extending along the first direction from each of the two node portions 11e and 11f during contour vibration at the other end portion 11d opposite to the one end portion 11a of the vibration portion 11. Portions 14a and 14b, extending along the second direction, and connecting portions 14c connecting the first connecting portions 14a and 14b, and extending along the first direction, in the second direction of the connecting portions 14c and the frame portion 12. A second connecting portion 14d for connecting the other short side portion 12b extending along the second connecting portion 14d.

The quartz crystal vibrating piece 10 is provided with fixing portions 12e and 12f to the package 20 on the long side portions 12c and 12d as both portions extending in the first direction across the vibrating portion 11 in the frame portion 12, respectively.
In other words, the quartz crystal vibrating piece 10 includes a pair of fixing portions 12 e and 12 f provided so as to sandwich the vibrating portion 11 in plan view, and has a frame portion 12 surrounding the vibrating portion 11.
The quartz crystal vibrating piece 10 is configured such that a first straight line L1 connecting the second connection portions 13d and 14d and a second straight line L2 connecting the fixing portions 12e and 12f intersect each other.

On one main surface 11g of the vibration part 11, substantially rectangular (substantially square) excitation electrodes 15a, 16a, and 15b having the same shape are arranged in this order from the left side of the sheet.
The excitation electrodes 15a and 15b are connected to each other by a wiring pattern provided between the excitation electrode 16a and the outer peripheral portion of the vibration part 11, and the connection part 13 and the short side are connected by a wiring pattern extending from the excitation electrode 15a to the connection part 13 side. The terminal electrode 17 provided on the long side portion 12c of the frame portion 12 is connected via the portion 12a.
Further, the excitation electrode 16a is connected to the length of the frame portion 12 via the connection portion 14 and the short side portion 12b by a wiring pattern extending from the excitation electrode 16a and between the excitation electrode 15b and the outer peripheral portion of the vibration portion 11. It is connected to a terminal electrode 18 provided on the side portion 12d.
The terminal electrodes 17 and 18 are also provided on the opposite surface (the surface on the other main surface 11 h side of the vibrating portion 11) around the side surface of the frame portion 12.

Exciting electrodes 16b, 15c, 16c having a substantially rectangular shape and substantially the same shape are arranged in this order from the left side of the paper surface on the other main surface 11h of the vibration part 11. The excitation electrodes 16b, 15c, and 16c have substantially the same shape as each of the excitation electrodes 15a, 16a, and 15b, and are disposed at positions that overlap each other in plan view.
Specifically, the excitation electrode 16b is disposed at a position overlapping with the excitation electrode 15a, the excitation electrode 15c is disposed at a position overlapping with the excitation electrode 16a, and the excitation electrode 16c is disposed at a position overlapping with the excitation electrode 15b. .

The excitation electrode 15c is connected to the long side portion of the frame portion 12 via the connection portion 13 and the short side portion 12a by a wiring pattern extending from the excitation electrode 15c and between the excitation electrode 16b and the outer peripheral portion of the vibration portion 11. The terminal electrode 17 provided in 12c is connected.
The excitation electrodes 16b and 16c are connected to each other by a wiring pattern provided between the excitation electrode 15c and the outer peripheral portion of the vibration part 11, and the connection part 14 and the short side are connected by a wiring pattern extending from the excitation electrode 16c to the connection part 14 side. The terminal electrode 18 provided on the long side portion 12d of the frame portion 12 is connected via the portion 12b.
The excitation electrodes 15a, 15b, 15c, 16a, 16b, 16c, the terminal electrodes 17, 18 and the wiring pattern are, for example, metal films in which chromium is used as a base layer and gold is laminated thereon.

The package 20 includes a package base 21 having a substantially rectangular planar shape and a recess, and a substantially rectangular parallelepiped lid (cover) 22 having a substantially rectangular planar shape covering the recess of the package base 21. Is formed.
The package base 21 includes an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, etc., which are formed by stacking and firing ceramic green sheets. Ceramic-based insulating materials, glass, silicon and the like are used.
The lid 22 is made of the same material as the package base 21 or a metal such as Kovar, 42 alloy, or stainless steel.

The package base 21 is provided with substantially rectangular internal terminals 24 a and 24 b at positions corresponding to the fixing portions 12 e and 12 f of the frame portion 12 of the crystal vibrating piece 10 on the inner bottom surface (the bottom surface inside the recess) 23. Yes.
More specifically, the internal terminal 24 a is provided at a position facing the fixing portion 12 e of the frame portion 12 of the crystal vibrating piece 10 (a position overlapping in plan view), and the internal terminal 24 b is provided on the frame portion 12 of the crystal vibrating piece 10. It is provided at a position facing the fixed portion 12f.

A pair of external terminals 26 and 27 that are used when the package base 21 is attached to an external member such as an electronic device are formed on an outer bottom surface (a surface opposite to the inner bottom surface 23, an outer bottom surface) 25. The external terminals 26 and 27 are connected to the internal terminals 24a and 24b by internal wiring (not shown).
Specifically, the external terminal 26 is connected to the internal terminal 24a, and the external terminal 27 is connected to the internal terminal 24b.
The internal terminals 24a and 24b and the external terminals 26 and 27 are metal films in which films such as nickel and gold are laminated on a metallized layer such as tungsten and molybdenum by plating or the like.

In the quartz crystal resonator element 10, the other main surface 11 h side is the attachment surface side, and the fixing portions 12 e and 12 f of the frame portion 12 are connected to the internal terminals 24 a and 24 b of the package base 21, such as a conductive adhesive or solder. It is fixed via the conductive bonding member 30.
In the crystal resonator 1, the concave portion of the package base 21 is covered with the lid 22 in a state where the crystal vibrating piece 10 is fixed to the package base 21 via the conductive bonding member 30, and the package base 21 and the lid 22 are seamed. Bonding is performed by a bonding member 28 such as a ring, low-melting glass, or adhesive (the lid 22 is attached to the package base 21).

The crystal unit 1 is hermetically sealed in a state in which the inside of the package 20 is decompressed (a state in which the degree of vacuum is high) or a state in which an inert gas such as nitrogen, helium, or argon is filled.
The package 20 may have a recess in both the package base 21 and the lid 22.

In the crystal resonator 1, each of the second connection portions 13d and 14d is preferably provided on the center line (here, AA line) of the frame portion 12 along the first direction. .
In the crystal resonator 1, it is preferable that the first straight line L1 and the second straight line L2 are orthogonal to each other.
Further, in the crystal resonator 1, the first straight line L1 overlaps with the center line (A-A line) of the frame portion 12 along the first direction in a plan view, and the second straight line L2 extends with respect to the first direction. It is preferable that it overlaps with the center line (here, BB line) of the frame portion 12 along the second direction orthogonal in the plan view in the plan view.
Further, in the crystal resonator 1, the two first connection parts 13a and 13b connected by the connection part 13c and the two first connection parts 14a and 14b connected by the connection part 14c are respectively in a first straight line. It is preferably provided at a position that is symmetrical with respect to L1.

  The crystal unit 1 is applied to the excitation electrodes 15a, 15b, 15c, 16a, 16b, and 16c of the crystal vibrating piece 10 via the external terminals 26 and 27, the internal terminals 24a and 24b, the terminal electrodes 17 and 18, and the like. The drive signal (alternating voltage) generates an electric field between the excitation electrodes that overlap in plan view (for example, between the excitation electrode 15a and the excitation electrode 16b), and the vibration unit 11 causes the lame mode vibration at a predetermined frequency. Oscillates (resonates). Then, the crystal unit 1 outputs the oscillation frequency (resonance frequency) of the crystal resonator element 10 as an output signal.

Here, the outline of the lame mode vibration will be described with reference to FIG. FIG. 3 is a schematic diagram for explaining the lame mode vibration, FIG. 3A is a schematic plan view showing a displacement state of the vibration part in one electric field direction, and FIG. It is a schematic plan view which shows the displacement state of the vibration part at the time of an electric field direction.
In FIG. 3, for convenience of explanation, the connection portions 13 and 14 and the wiring pattern are omitted.

  As indicated by a broken line in FIG. 3A, when one electric field direction is applied, the two sides along the first direction (longitudinal direction) of the excitation electrodes 15a and 15b of the vibration part 11 bulge outward in a substantially arc shape. The two sides along the second direction (the direction orthogonal to the longitudinal direction) are recessed in a substantially arc shape inside, and the two sides along the first direction of the excitation electrode 16a are recessed in a substantially arc shape inside. At the same time, the two side portions along the second direction bulge outward in a substantially arc shape.

  As indicated by a broken line in FIG. 3B, when the other electric field direction is used, the displacement is opposite to that in the one electric field direction. That is, the two side portions along the first direction of the excitation electrodes 15a and 15b of the vibration portion 11 are recessed inward in a substantially arc shape, and the two side portions along the second direction bulge outward in a substantially arc shape, and are excited. The two sides along the first direction of the electrode 16a bulge outward in a substantially arc shape, and the two sides along the second direction are recessed in a substantially arc shape on the inside.

The vibration part 11 of the quartz crystal vibrating piece 10 oscillates a lame mode vibration by alternately repeating the displacement of FIG. 3A and the displacement of FIG.
As can be seen from FIG. 3, the four corners of the excitation electrodes 15a, 16a and 15b are hardly displaced during the lame mode vibration. This portion is called a node during lame mode vibration (during contour vibration).
In this embodiment, the four corners of the vibration part 11 are the node parts 11b, 11c, 11e, and 11f.

Here, due to the difference in thermal expansion coefficient between the quartz crystal resonator element 10 of the quartz crystal resonator 1 and the package base 21 due to a change in ambient temperature, the frame portion 12 in which the fixing portions 12e and 12f are provided. Let us assume a case where thermal stress is generated in a direction in which the long side portions 12c and 12d are brought close to each other.
FIG. 4 is a schematic plan view for explaining the thermal stress generated in the crystal resonator. For convenience of explanation, electrodes and wiring patterns are omitted.

As shown in FIG. 4, when thermal stresses F1 and F2 in the direction in which the long sides 12c and 12d of the frame 12 are brought close to each other are generated, the four corners on the inner side of the frame 12 and vibration at the connecting portion indicated by a two-dot chain line In the conventional configuration (patent document 1) in which the four corners of the part 11 are connected, the component forces F1a, F1b, F2a, and F2b of the thermal stresses F1 and F2 may be transmitted to the vibrating part 11.
As a result, in the conventional configuration, the lame mode vibration of the vibration unit 11 is affected (specifically, the resonance frequency varies), for example, the frequency temperature due to the change in the resonance frequency with an increase or decrease in thermal stress. There is a risk of deterioration of characteristics and vibration characteristics such as frequency aging characteristics due to relaxation of thermal stress generated between the package base 21 and the quartz crystal vibrating piece 10 over time.
Further, in the conventional configuration, temperature hysteresis due to increase or decrease of the ambient temperature (for example, the resonance frequency when the ambient temperature rises from the − side to a predetermined temperature, and decreases from the + side to the predetermined temperature). (The degree of deviation from the resonance frequency in the case of becoming) may also deteriorate due to the effect of relaxation of thermal stress.

On the other hand, in the configuration of the present embodiment, the thermal stress F1 from one side and the thermal stress F2 from the other side along the second straight line L2 direction of the short sides 12a and 12b of the frame 12 are the short sides. 12a and 12b are balanced, and the thermal stresses F1 and F2 are almost canceled in the second connecting portions 13d and 14d (in other words, the displacement due to the thermal stresses F1 and F2 hardly occurs). ).
As a result, the crystal resonator 1 can suppress the influence of the thermal stresses F1 and F2 generated in the frame portion 12 on the vibrating portion 11 via the connecting portions 13 and 14, and thus, for example, temperature characteristics, aging characteristics, and temperature hysteresis Such vibration characteristics can be improved as compared with the conventional case.
Note that the quartz resonator 1 has the same action as described above even when the thermal stresses F1 and F2 are in the opposite direction to FIG. 4 (when the thermal stress in the direction of moving the long side portions 12c and 12d away from each other). F1 and F2 are offset and the same effects as described above can be obtained.

As described above, in the crystal resonator 1 according to the first embodiment, the connection portion 13 (14) of the crystal vibrating piece 10 is at the time of the lame mode vibration (at the time of contour vibration) at the end portion 11a (11d) of the vibration portion 11. First connecting portions 13a and 13b (14a and 14b) extending from at least two node portions 11b and 11c (11e and 11f), respectively, and a connecting portion 13c for connecting the first connecting portions 13a and 13b (14a and 14b) to each other. (14c) and a second connecting portion 13d (14d) that connects the connecting portion 13c (14c) and the short side portion 12a (12b) of the frame portion 12 to each other.
The crystal resonator 1 includes a first straight line L1 that connects the second connection parts 13d (14d) and a second straight line L2 that connects the fixing parts 12e and 12f to the package base 21 in the frame part 12. Crossed.

As a result, in the crystal resonator 1, the thermal stress generated by the difference in thermal expansion coefficient between the crystal resonator element 10 and the package 20 (package base 21) causes the connection portion 13 c (14 c) and the short side portion 12 a ( 12b), the component (thermal stress F1) from one side along the second straight line L2 direction (second direction) of the frame portion 12 and the second connection portion 13d (14d) connecting to the other side 12b) This is almost offset by the component (thermal stress F2).
As a result, the crystal resonator 1 can suppress the influence of the thermal stress generated in the frame portion 12 on the vibration portion 11 via the connection portions 13 and 14, so that vibrations such as temperature characteristics, aging characteristics, temperature hysteresis, and the like can be obtained. The characteristics can be improved as compared with the conventional one.

Further, in the crystal resonator 1, when the second connection portions 13 d and 14 d of the crystal resonator element 10 are provided on the center line (A-A line) of the frame portion 12 along the first direction, The component (thermal stress F1) from one side across the center line and the component (thermal stress F2) from the other side of the thermal stress generated in the frame portion 12 of the crystal vibrating piece 10 are balanced, and the second connection portion In 13d and 14d, both are surely offset.
As a result, the crystal unit 1 can surely suppress the influence of the thermal stress generated in the frame 12 on the vibration part 11 via the connection parts 13 and 14, for example, temperature characteristics, aging characteristics, temperature hysteresis, etc. The vibration characteristics can be improved more reliably than before.

Further, in the crystal resonator 1, when the first straight line L1 and the second straight line L2 are orthogonal to each other, most of the thermal stress generated in the frame portion 12 of the crystal vibrating piece 10 is the second straight line L2. And a component (thermal stress F1) from one side along the line and a component (thermal stress F2) from the other side, both of which are surely offset by the second connection portions 13d and 14d on the first straight line L1. Become.
As a result, the crystal resonator 1 can further suppress the influence of the thermal stress generated in the frame portion 12 on the vibration portion 11 via the connection portions 13 and 14, so that, for example, temperature characteristics, aging characteristics, temperature hysteresis, etc. The vibration characteristics can be further improved than before.

Further, in the crystal resonator 1, the first straight line L1 overlaps with the center line (AA line) of the frame part 12 along the first direction in a plan view, and the second straight line L2 is the frame part along the second direction. 12 overlaps with the center line (BB line) in plan view, most of the thermal stress generated in the frame portion 12 of the quartz crystal vibrating piece 10 is a component (thermal) from one side along the second straight line L2. Stress F1) and the component from the other side (thermal stress F2), and both balance between the second connecting portion 13d on one side and the second connecting portion 14d on the other side across the second straight line L2.
The quartz resonator 1 includes a component (thermal stress F1) from one side of the center line (first straight line L1) along the first direction of the thermal stress generated in the frame portion 12 and the other side. The component (thermal stress F2) is balanced, and the second connecting portions 13d and 14d are surely offset.
As a result, the crystal resonator 1 can further suppress the influence of the thermal stress generated in the frame portion 12 on the vibration portion 11 via the connection portions 13 and 14, so that, for example, temperature characteristics, aging characteristics, temperature hysteresis, etc. The vibration characteristics can be further improved than before.

Further, in the crystal resonator 1, the two first connecting portions 13a and 13b (14a and 14b) connected by the connecting portion 13c (14c) are provided at positions that are symmetric with respect to the first straight line L1. In this case, the support balance of the crystal vibrating piece 10 with respect to the vibrating portion 11 becomes good.
As a result, the crystal resonator 1 suppresses the vibration caused by the asymmetric arrangement of the first connection portions 13a and 13b (14a and 14b) while suppressing the influence of the thermal stress on the vibration portion 11 via the connection portions 13 and 14. The influence on the vibration of the part 11 can be eliminated.

Here, a modification of the crystal resonator of the first embodiment will be described.
(Modification 1)
FIG. 5 is a schematic plan view showing a schematic configuration of the crystal resonator of the first modification.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 5, the crystal resonator 2 of Modification 1 is different from the first embodiment in the configuration of the vibration unit 11 of the crystal vibrating piece 110.
The vibrating part 11 has a protruding part 11 i that protrudes in a rectangular shape from the excitation electrode 16 a part toward the long side part 12 d of the frame part 12. An excitation electrode 15d is provided on one main surface 11g of the protrusion 11i, and an excitation electrode 16d is provided on the other main surface 11h. Excitation electrodes 15d and 16d are connected to terminal electrodes 17 and 18 via wiring patterns and the like, respectively.
As a result, in the crystal resonator 2, in addition to the excitation electrodes 15a, 16a, and 15b, the excitation electrode 15d also oscillates the lame mode vibration. As a result, the crystal unit 2 oscillates a higher order mode of the lame mode vibration than the first embodiment while achieving the same effect as the first embodiment, and the resonance frequency can be increased.

(Modification 2)
FIG. 6 is a schematic plan view showing a schematic configuration of the crystal resonator of the second modification.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 6, the crystal resonator 3 of Modification 2 is different from the first embodiment in the configuration of the crystal resonator element 210.
The vibrating portion 11 of the quartz crystal vibrating piece 210 includes a plurality of rectangular excitation electrodes 15 and 16 arranged in a checkered pattern, and four rows in the first direction (the first straight line L1 direction) and the second direction (the first direction). (2 straight lines L2 direction) is provided in a matrix of 3 rows.
The excitation electrodes 15 and the excitation electrodes 16 are connected to each other by a wiring pattern (indicated by a single line in the vibration unit 11), and are connected to the terminal electrodes 17 and 18, respectively. As in the first embodiment, the crystal vibrating piece 210 is configured so that the excitation electrode 15 and the excitation electrode 16 overlap each other on one main surface 11g and the other main surface 11h of the vibration unit 11 in plan view. Is arranged.

The first connection portions 13a and 13b of the connection portion 13 of the quartz crystal vibrating piece 210 have two node portions 11b and 11c at the time of the lame mode vibration at the end portion 11a of the central row along the first direction of the excitation electrodes 15 and 16. Extending from each of the.
On the other hand, the first connection portions 14a and 14b of the connection portion 14 are respectively connected to the two node portions 11e and 11f during the lame mode vibration at the end portion 11d of the central row along the first direction of the excitation electrodes 15 and 16. It extends.

According to this, in the quartz crystal resonator 3 of the second modification, the plurality of rectangular excitation electrodes 15 and 16 are arranged in the vibrating portion 11 of the quartz crystal vibrating piece 210 in four rows in the first direction and three rows in the second direction. It is provided in the shape.
From this, the quartz crystal resonator 3 oscillates a higher order mode (4 × 3) lame mode vibration than the first embodiment and the first modification while exhibiting the same effect as the first embodiment. Further resonance frequency can be increased.
In addition to the first connection portions 13a, 13b, 14a, and 14b, the crystal resonator 3 may be provided with another first connection portion that extends from the four corners of the vibration portion 11.

(Second Embodiment)
Next, a crystal oscillator as an example of a vibration device provided with an oscillation circuit (drive circuit) that oscillates a crystal resonator element in the crystal resonator of the first embodiment and each modification will be described.
FIG. 7 is a schematic diagram showing a schematic configuration of the crystal oscillator of the second embodiment. FIG. 7A is a schematic plan view seen from the lid side, and FIG. 7B is a schematic cross-sectional view taken along line AA of FIG. 7A. In the schematic plan view of FIG. 7A, the lid and some components are omitted for convenience of explanation. In addition, common parts with the first embodiment and the respective modifications are denoted by the same reference numerals, detailed description thereof will be omitted, and differences from the first embodiment and the respective modifications will be mainly described.

As shown in FIG. 7, the crystal oscillator 5 includes either the crystal resonator 1 described in the first embodiment or the crystal resonators 2 and 3 of the respective modifications (here, referred to as the crystal resonator 1), And an IC chip 40 as an oscillation circuit that oscillates the crystal resonator element 10 of the crystal resonator 1.
On the inner bottom surface 23 of the package base 21 of the crystal oscillator 5, a recess 23 a for accommodating the IC chip 40 is provided.
A plurality of internal connection terminals 23b are provided on the bottom surface of the recess 23a.

The IC chip 40 incorporating the oscillation circuit is fixed to the bottom surface of the recess 23a of the inner bottom surface 23 of the package base 21 using an adhesive (not shown).
In the IC chip 40, a connection pad (not shown) is connected to the internal connection terminal 23b by a metal wire 41 such as gold or aluminum.

The internal connection terminal 23b is a metal film in which a film of nickel, gold, or the like is laminated on a metallized layer such as tungsten or molybdenum by plating or the like, and external terminals 26 and 27 of the package 20 via internal wiring (not shown). Are connected to the internal terminals 24a and 24b.
For connecting the connection pads of the IC chip 40 and the internal connection terminals 23b, a connection method by flip chip mounting by inverting the IC chip 40 is used in addition to a connection method by wire bonding using the metal wire 41. May be.

The crystal oscillator 5 is applied from the IC chip 40 to the excitation electrodes 15a, 15b, 15c, 16a, 16b, and 16c of the crystal vibrating piece 10 via the internal connection terminals 23b, the internal terminals 24a and 24b, the terminal electrodes 17 and 18, and the like. In response to the drive signal (alternating voltage), the vibration unit 11 oscillates (resonates) the lame mode vibration at a predetermined frequency.
Then, the crystal oscillator 5 outputs an oscillation signal generated along with this oscillation to the outside via the IC chip 40, the internal connection terminal 23b, the external terminals 26 and 27, and the like.

As described above, since the crystal oscillator 5 of the second embodiment includes the crystal resonator 1 and the IC chip 40 that oscillates the crystal resonator element 10 of the crystal resonator 1, for example, temperature characteristics, The vibration characteristics such as aging characteristics and temperature hysteresis can be improved as compared with the conventional crystal oscillator using a crystal resonator including the resonator element of Patent Document 1, for example.
The crystal oscillator 5 may include either the crystal resonator 2 or 3 instead of the crystal resonator 1. According to this, the crystal oscillator 5 can exhibit the same effects as described above and the effects specific to each modification.

(Third embodiment)
Next, a mobile phone will be described as an example of an electronic device including the above-described crystal resonator.
FIG. 8 is a schematic perspective view showing the mobile phone of the third embodiment.
A cellular phone 700 is a cellular phone including the crystal resonator (any one of 1 to 3) of the first embodiment and each modification.
A cellular phone 700 shown in FIG. 8 uses the above-described crystal resonator (any one of 1 to 3) as a timing device such as a reference clock oscillation source, a liquid crystal display device 701, a plurality of operation buttons 702, and a reception A mouth 703 and a mouthpiece 704 are provided.
According to this, since the mobile phone 700 includes the crystal resonator (any one of 1 to 3), the effects described in the first embodiment and the respective modifications are reflected, and excellent performance is exhibited. can do.
The form of the mobile phone 700 is not limited to the illustrated type, and may be a so-called smartphone type.

  The above-described vibrating devices such as the crystal oscillator and the crystal oscillator are not limited to the mobile phone 700 described above, but are an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a navigation device, a pager, an electronic notebook, a calculator, It can be suitably used as a timing device such as a word processor, a workstation, a videophone, a POS terminal, or a device equipped with a touch panel. In any case, the effects described in the first embodiment and each modification are reflected. An electronic device can be provided.

(Fourth embodiment)
Next, an automobile will be described as an example of the moving body including the above-described crystal resonator.
FIG. 9 is a schematic perspective view showing the automobile of the fourth embodiment.
The automobile 800 includes, for example, various electronically controlled devices (for example, an electronically controlled fuel injection device, an electronically controlled device) in which the crystal resonators (any one of 1 to 3) of the first embodiment and the modified examples are mounted. It is used as a timing device for generating a reference clock of a type ABS apparatus, an electronically controlled constant speed traveling apparatus, and the like.
According to this, since the automobile 800 includes the crystal resonator (any one of 1 to 3), the effects described in the first embodiment and each modification are reflected, and excellent performance is exhibited. be able to.

  The above-described vibration devices such as the crystal oscillator and the crystal oscillator are not limited to the automobile 800 described above, and are suitable as a timing device for a mobile object including a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, an artificial satellite, and the like In any case, it is possible to provide a moving body in which the effects described in the first embodiment and each modification are reflected.

The material of the resonator element of the vibration device is not limited to quartz, but LiTaO ₃ (lithium tantalate), Li ₂ B ₄ O ₇ (lithium tetraborate), LiNbO ₃ (lithium niobate), A piezoelectric body such as PZT (lead zirconate titanate), ZnO (zinc oxide), or AlN (aluminum nitride) may be used.
Further, the shape of the frame portion (12) of the resonator element is not limited to a quadrangular shape, and may be an elliptical shape.

  DESCRIPTION OF SYMBOLS 1, 2, 3 ... Crystal oscillator as a vibration device, 5 ... Crystal oscillator as a vibration device, 10 ... Crystal vibration piece as a vibration piece, 11 ... Vibration part, 11a, 11d ... End part, 11b, 11c, 11e , 11f ... node part, 11g, 11h ... main surface, 11i ... projecting part, 12 ... frame part, 12a, 12b ... short side part, 12c, 12d ... long as both parts extending in the first direction across the vibration part Side part, 12e, 12f ... fixed part, 13, 14 ... connecting part, 13a, 13b, 14a, 14b ... first connecting part, 13c, 14c ... connecting part, 13d, 14d ... second connecting part, 15, 15a, 15b, 15c, 15d, 16, 16a, 16b, 16c, 16d ... excitation electrode, 17, 18 ... terminal electrode, 20 ... package, 21 ... package base, 22 ... lid, 23 ... inner bottom surface, 23a ... concave, 23b Internal connection terminals, 24a, 24b ... internal terminals, 25 ... outer bottom surface, 26,27 ... external terminals, 28 ... joining members, 30 ... conductive joining members, 40 ... IC chips as oscillation circuits, 41 ... metal wires, 110 , 210 ... Quartz vibrating piece as a vibrating piece, 700 ... Mobile phone as an electronic device, 701 ... Liquid crystal display device, 702 ... Operation buttons, 703 ... Earpiece, 704 ... Mouthpiece, 800 ... Automobile as a moving body.

Claims (7)

A vibration part that vibrates in outline, a frame part that includes a pair of fixing parts provided so as to sandwich the vibration part in plan view, surrounds the vibration part, both ends in the first direction of the vibration part, and the frame part And a resonator element having a pair of connecting portions that connect the first and second connectors along the first direction,
A package for fixing and accommodating the vibrating piece with the pair of fixing portions,
Each connecting portion of the vibrating piece includes a first connecting portion extending from each of at least two node portions during contour vibration at the end of the vibrating portion;
A connecting portion that connects the first connecting portions;
A second connecting part for connecting the connecting part and the frame part;
A vibrating device, wherein a first straight line connecting the second connecting portions and a second straight line connecting the fixing portions intersect each other. The vibrating device according to claim 1,
Each said 2nd connection part is provided on the centerline of the said frame part along the said 1st direction, The vibration device characterized by the above-mentioned. The vibrating device according to claim 1 or 2,
The vibrating device, wherein the first straight line and the second straight line are orthogonal to each other. The vibrating device according to claim 3.
The first straight line overlaps the center line of the frame portion along the first direction in a plan view, and the second straight line is a second direction orthogonal to the first direction of the frame portion in a plan view. A vibration device that overlaps with a center line along a plane in plan view. The vibrating device according to any one of claims 1 to 4,
The vibrating device, wherein the two first connecting portions connected by the connecting portion are provided at positions symmetrical with respect to the first straight line.   An electronic apparatus comprising the vibration device according to any one of claims 1 to 5.   A moving body comprising the vibration device according to any one of claims 1 to 5.

Images