JP2012090083A - Vibration device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration device that has a package in which vibrating reeds of different planar sizes can be housed.SOLUTION: A quartz vibrating reed 10A has lead electrodes 16a and 17a at a base portion 11. A package 20 has electrode pads 23 and 24 to which the lead electrodes 16a and 17a of the quartz vibrating reed 10A are joined, and a pillow part 25 in a position opposite to an opposite end 13 of the quartz vibrating reed 10A. The electrode pads 23 and 24 and the pillow part 25 have stepped portions 23a, 24a, and 25a. Side surfaces 23d, 24d, and 25d of side surfaces interconnecting steps 23b-23c, 24b-24c, and 25b-25c of the stepped portions 23a, 24a, and 25a extend in a first direction, and side surfaces 23e, 24e, and 25e extend in a second direction. The quartz vibrating reed 10A is stretched between the steps 23b and 24b of the stepped portions 23a and 24a of the electrode pads 23 and 24 and the step 25b of the stepped portion 25a of the pillow part 25, all selected according to the planar size.

Description

  The present invention relates to a vibration device represented by a piezoelectric vibration device and the like, and an electronic apparatus including the vibration device.

  Conventionally, the vibration device includes a piezoelectric diaphragm, a ceramic package that houses the piezoelectric diaphragm, and a lid that hermetically seals the upper surface of the ceramic package, and a pair of conductive pads is formed on the bottom of the ceramic package, A piezoelectric vibration device in which a pillow material is formed at a position facing a pair of conductive pads, wherein one end of the piezoelectric vibration plate is joined to the pair of conductive pads, and the other end is spaced from the pillow material. A piezoelectric vibration device having such a configuration is known (for example, see Patent Document 1).

A piezoelectric vibration device (hereinafter referred to as a vibration device) as described in Patent Document 1 has one type of package corresponding to one type of piezoelectric vibration plate (hereinafter referred to as a vibration piece) (here, the ceramic package described above). And a structure having a lid is defined as a package).
With this configuration, the vibrating piece having one end joined to the conductive pad of the package (hereinafter referred to as an electrode pad) is a package pillow material (hereinafter referred to as a pillow portion) formed at a position facing the other end of the vibrating piece. ) Restricts the inclination toward the other end.
At this time, the pillow portion is a position facing the other end portion of the vibrating piece in the package, and for example, the excitation electrode so as not to affect the frequency characteristics of the vibrating piece as much as possible when contacting with the vibrating piece such as when dropped. It is formed in the position away from.

However, in such a configuration, it is necessary to change the distance between the electrode pad and the pillow portion of the package every time the type of the vibrating piece is different, specifically, when the planar size of the vibrating piece is different. Therefore, a package corresponding to that is required (so-called one-piece uniform form).
As a result, in the production of the vibration device, a great number of types of packages must be prepared according to the increase in the number of types of vibration pieces, so that the production management becomes complicated and the production type ( There is a risk that productivity will deteriorate, such as an increase in setup time required for model change.

  As a solution to this problem, Patent Document 2 discloses a vibration device having a configuration in which a stepped portion is provided on opposite sides of the electrode pad and the pillow portion, and the package can be shared even if the size of the vibration piece is different. It is disclosed.

JP 2004-96275 A JP 2009-239414 A

  However, in Patent Document 2, a configuration corresponding to the size difference of the vibrating piece in the direction connecting the electrode pad and the pillow portion is disclosed, but the configuration corresponding to the size difference of the vibrating piece in the other direction is considered. There is room for further improvement.

Moreover, when providing a step part in an electrode pad and a pillow part like patent document 2, it is necessary to make it a multilayered structure on account of manufacture.
As a result, for example, as shown in FIG. 3 of Patent Document 2, when a positional shift occurs in the printing process (coating process) of each layer, a paste-like material is packaged in a portion where the outer shape of each layer matches. When it hangs down to the inner bottom surface, it deviates from a predetermined shape, and depending on the degree, there is a possibility that problems such as interference with other components occur.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A vibration device according to this application example includes a vibration piece having one end and another end parallel to the one end, and a package that houses the vibration piece. The vibrating piece has a joining portion at the one end, and the package has an electrode pad to which the joining portion of the vibrating piece is joined, and a pillow portion at a position facing the other end of the vibrating piece. A step portion is provided in the electrode pad and the pillow portion, the step portion includes a plurality of step portions, and a part of a side surface connecting the step portions is in plan view, Extending along a first direction connecting the electrode pad and the pillow portion, and another part of the side surface extends along a second direction intersecting the first direction in plan view, The vibration piece is selected according to the planar size of the vibration piece, and the step portion of the electrode pad Said stepped portion, in said step portion of the stepped portion of the pillow portion, bridged, characterized in that it is arranged so as to be parallel to the bottom surface of the package.

According to this, in the vibrating device, the electrode pad and the pillow portion are provided with stepped portions, and the stepped portion of the electrode pad stepped portion and the stepped portion of the pillow portion are selected according to the planar size of the vibrating piece. It is placed across the section.
For this reason, for example, when the vibrating device of a predetermined size is used, the side surface of the first step portion from the bottom of each step portion extends in the second direction. In the case of using a B vibrating piece that is bridged between the sides and has a size in the first direction larger than that of the A vibrating piece, the bridge is placed between the two steps from the bottom to arrange 2 One type of package can be shared for each type of vibrating piece.
In addition, when the vibrating device uses a C vibrating piece having a size in the first direction larger than that of the A vibrating piece and a size in the second direction, the side surface of the first step of the stepped portion is the first side. One type of package can be shared with respect to three types of vibration pieces by arranging the bridges between the sides extending along one direction.

That is, the vibrating device can store the vibrating pieces having different planar sizes in one or both of the first direction and the second direction using a common package.
Therefore, the vibrating device can use the same shape package even if the size of the vibrating piece is different, and thus the number of types of packages can be suppressed.
In addition, since the bottom surface of the package and the resonator element can be stored in parallel, the resonator device can provide a resonator device having a lower height than a package that stores the resonator element obliquely. That is, the vibration device can accommodate a plurality of sizes of vibration pieces and provide a vibration device having a low height.
As a result, the vibration device can alleviate the complexity of production management, and can improve productivity, such as reducing the setup time required for changing the production model of the production line.

  Application Example 2 In the vibration device according to the application example described above, it is preferable that at least one of the stepped portions is provided on the entire circumference of the electrode pad or the pillow portion.

According to this, the vibration device can have a space between the contours of the step portions in plan view by providing the step portions on the entire circumference of the electrode pad or the pillow portion.
For this reason, the vibration device has the above-mentioned distance over the entire circumference, for example, wider than the position displacement range of each step (each layer) in the manufacturing process. It is possible to avoid problems such as deviation from a predetermined shape due to or interference with other components due to this deviation.

  Application Example 3 In the vibration device according to the application example described above, it is preferable that the pillow portion is disposed at at least one of positions facing both corner portions of the other end portion of the vibration piece.

According to this, the vibration device is disposed at at least one of the positions where the pillow portion faces both corners of the other end of the vibrating piece, for example, at a position facing the center of the other end. Compared with the case where it is arranged, it is further away from the vibration region of the resonator element (referred to as an elliptical shape in plan view).
For this reason, the vibration device can minimize the influence on the vibration characteristics of the vibration piece when the vibration device is in contact with the vibration piece such as when the pillow portion is dropped.

  Application Example 4 In the vibrating device according to the application example, it is preferable that the electrode pad and the pillow portion are formed using the same material.

According to this, since the electrode pad and the pillow part are formed using the same kind of material in the vibrating device, the electrode pad and the pillow part can be collectively formed in the same process.
From this, the vibration device can improve productivity compared with the case where the electrode pad and the pillow part are formed in different processes using different materials.

  Application Example 5 In the vibrating device according to the application example described above, it is preferable that the material of the vibrating piece is quartz.

  According to this, since the vibrating device is made of quartz crystal, the vibrating device can obtain a vibrating piece having excellent workability and high Q value and excellent vibration characteristics.

  Application Example 6 The vibration device according to the application example described above preferably includes an oscillation circuit that drives the vibration piece.

  According to this, since the vibration device includes the oscillation circuit that drives the vibration piece, it is possible to provide an oscillator that exhibits the effect described in any one of the application examples.

  Application Example 7 An electronic apparatus according to this application example includes the vibration device according to any one of the application examples.

  According to this, since the electronic device includes the vibration device described in any one of the application examples, it is possible to provide an electronic device that exhibits the effects described in any one of the application examples.

It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing of (a). It is a schematic diagram which shows schematic structure of the other crystal resonator of 1st Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing of (a). It is a schematic diagram which shows schematic structure of another crystal resonator of 1st Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing of (a). The principal part schematic plan view of the crystal oscillator of the modification 1. FIG. The principal part schematic plan view of the crystal oscillator of the modification 2. FIG. The principal part schematic plan view of the crystal oscillator of the modification 3. FIG. The schematic cross section which shows schematic structure of the crystal oscillator of 2nd Embodiment. The model perspective view which shows the mobile telephone of 3rd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
Here, a description will be given of a crystal resonator as a vibrating device in which three types of vibrating pieces having different sizes are individually stored in one type of package.
1 to 3 are schematic views showing a schematic configuration of the crystal resonator of the present embodiment. 1 (a), 2 (a), and 3 (a) are plan views viewed from the lid (lid) side, and FIG. 1 (b) is an AA line in FIG. 1 (a). 2B is a cross-sectional view taken along line BB in FIG. 2A, and FIG. 3B is a cross-sectional view taken along line CC in FIG. 3A. In each plan view, the lid is omitted for convenience.

(Crystal resonator 1)
As shown in FIG. 1, the crystal resonator 1 includes a crystal vibrating piece 10A as a vibrating piece, and a package 20 that houses the crystal vibrating piece 10A.
The quartz crystal vibrating piece 10A is an AT-cut type cut out from a quartz crystal or the like at a predetermined angle. The planar shape is formed in a substantially rectangular shape, and is connected to the base 11 as one end and the thickness shear vibration. And the other end portion 13 parallel to the base portion 11 with the vibration portion 12 interposed therebetween. Here, the base portion 11 and the other end portion 13 are in a positional relationship opposite to each other with the vibration portion 12 interposed therebetween.

In the crystal vibrating piece 10 </ b> A, lead electrodes 16 a and 17 a are formed on the base portion 11 as joint portions that are drawn from the excitation electrodes 16 and 17 formed on the one main surface 14 and the other main surface 15 of the vibration portion 12. Has been.
The lead electrode 16 a is drawn from the excitation electrode 16 on one main surface 14 to the base portion 11 along the longitudinal direction (left and right direction on the paper surface) of the crystal vibrating piece 10 </ b> A, and to the other main surface 15 along the side surface of the base portion 11. It wraps around and extends to the vicinity of the excitation electrode 17 on the other main surface 15.
The lead electrode 17a is drawn from the excitation electrode 17 on the other main surface 15 to the base portion 11 along the longitudinal direction of the quartz crystal vibrating piece 10A, wraps around the one main surface 14 along the side surface of the base portion 11, and The surface 14 extends to the vicinity of the excitation electrode 16.
The excitation electrodes 16 and 17 and the extraction electrodes 16a and 17a are metal films having a structure in which Cr is a base layer and Au is laminated thereon.

The package 20 includes a package base 21 having a substantially rectangular planar shape and a recess, and a lid 22 having a substantially rectangular planar shape covering the recess of the package base 21 and having a substantially rectangular parallelepiped shape. .
The package base 21 is made of an aluminum oxide sintered body, crystal, glass, silicon, or the like formed by laminating and firing ceramic green sheets.
The package base 21 has a two-layer structure of a flat layer that forms the bottom portion of the recess and a frame-like layer that forms the outer periphery of the recess.
The lid 22 is made of the same material as the package base 21 or a metal such as Kovar, 42 alloy, or stainless steel.

The package base 21 is opposed to the inner bottom surface 21a (the bottom surface on the concave side) of the electrode pads 23 and 24 to which the extraction electrodes 16a and 17a of the crystal vibrating piece 10A are joined and the other end 13 of the crystal vibrating piece 10A. A pillow portion 25 is provided at a position overlapping the other end portion 13 in plan view.
On the outer bottom surface 26 (outer bottom surface) of the package base 21, a pair of external terminals 27 and 28 used when mounted on an electronic device or the like are formed.

The electrode pads 23 and 24 and the external terminals 27 and 28 are made of a metal film in which a film such as Ni or Au is laminated on a metallized layer such as W by plating.
The external terminals 27 and 28 are connected to the electrode pads 23 and 24 by internal wiring (not shown). For example, the external terminal 27 is connected to the electrode pad 23, and the external terminal 28 is connected to the electrode pad 24.
The pillow portion 25 is a metal coating made of a metallized layer such as W, which is the same material as the electrode pads 23 and 24.

The electrode pads 23 and 24 and the pillow part 25 are provided with step parts 23a, 24a and 25a on the entire circumference.
More specifically, the side surface 23d, which is a part of the side surface connecting the first step portion 23b and the second step portion 23c from the inner bottom surface 21a of the package base 21 in the step portion 23a, is an electrode pad in plan view. 23 extends along the first direction (the long side direction of the package 20) connecting the pillow portion 25 and the pillow portion 25.
The side surface 23e, which is another part of the side surface, extends along a second direction (a short side direction of the package 20) intersecting the first direction in plan view.
Here, in the stepped portion 23b and the stepped portion 23c, the stepped portion 23c of the second step is formed to have a smaller area, and has an interval W1 around the entire circumference between the contours of the stepped portions 23b and 23c in plan view. ing.

Similarly, a side surface 24d which is a part of a side surface connecting the first step 24b and the second step 24c of the step 24a extends along the long side direction of the package 20 in plan view. is doing. The side surface 24e, which is another part of the side surface, extends along the short side direction of the package 20 in plan view.
Here, in the stepped portion 24b and the stepped portion 24c, the second stepped portion 24c is formed with a smaller area, and has an interval W2 around the entire circumference between the contours of the stepped portions 24b and 24c in plan view. ing.

Similarly, the side surface 25d, which is a part of the side surface connecting the first step portion 25b and the second step portion 25c of the step portion 25a, extends along the long side direction of the package 20 in plan view. It is extended. The side surface 25e, which is another part of the side surface, extends along the short side direction of the package 20 in plan view.
Here, in the stepped portion 25b and the stepped portion 25c, the second stepped portion 25c has a smaller area, and has an interval W3 on the entire circumference between the contours of the stepped portions 25b and 25c in plan view. ing.

The step portions 23a, 24a, and 25a have a two-layer structure. The first step (the layer including the step portions 23b, 24b, and 25b) is formed first, and then the second step (the step). Parts 23c, 24c, 25c and side surfaces 23d, 23e, 24d, 24e, 25d, 25e).
More specifically, the stepped portions 23a, 24a, and 25a are formed on the inner bottom surface 21a of the package base 21 by screen printing a paste-like material (W) using a mask that matches the first-stage planar shape. It is formed by metallizing the eyes, and then using a mask adapted to the planar shape of the second stage to screen-print a paste-like material on the first stage and then metallize the second stage.
Thereafter, with respect to the stepped portions 23a and 24a, coatings such as Ni and Au are laminated by plating or the like.

  At this time, the step portions 23a, 24a, and 25a have intervals W1 to W3 between the first step and the second step in a plan view, so that one step is set by appropriately setting the intervals W1 to W3. Even if there is a printing position shift between the second stage and the second stage, the second stage is prevented from protruding (deviating) from the first stage.

The quartz crystal vibrating piece 10A is selected according to the planar size of the quartz crystal vibrating piece 10A, and the side surface 23e side of the stepped portion 23b of the stepped portion 23a of the electrode pad 23 and the side surface 24e of the stepped portion 24b of the stepped portion 24a of the electrode pad 24 are selected. And the side surface 25e side of the step portion 25b of the step portion 25a of the pillow portion 25, and is arranged so as to be substantially parallel to the inner bottom surface 21a of the package base 21.
In the quartz crystal vibrating piece 10A, the lead electrodes 16a and 17a are connected to the electrode pads 23 and 24 via the conductive adhesive 30 such as epoxy, silicone or polyimide mixed with a conductive material such as a metal filler. Are joined to the step portions 23b and 24b.
At this time, the step portion 25b of the pillow portion 25 serves as a stopper, and the inclination of the other end portion 13 of the crystal vibrating piece 10A toward the pillow portion 25 is restricted.

In the crystal resonator 1, the concave portion of the package base 21 is covered with the lid 22 in a state where the crystal vibrating piece 10 </ b> A is bonded to the electrode pads 23 and 24 of the package base 21, and the package base 21 and the lid 22 are seamed. The inside of the package 20 is hermetically sealed by bonding with a bonding material 29 such as low melting glass or adhesive.
Note that the inside of the package 20 is in a vacuum state (a high degree of vacuum) or a state in which an inert gas such as nitrogen, helium, or argon is filled.

  In the crystal resonator 1, the crystal resonator element 10 </ b> A is excited by a drive signal applied from the outside via the external terminals 27 and 28, the electrode pads 23 and 24, the extraction electrodes 16 a and 17 a, and the excitation electrodes 16 and 17. Resonates at a predetermined frequency.

(Crystal resonator 2)
Next, a crystal resonator that uses the same package 20 as the crystal resonator 1 and stores a crystal resonator element having a plane size different from that of the crystal resonator element 10A will be described. In addition, about the common part with the crystal oscillator 1, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part.
As shown in FIG. 2, the crystal resonator element 10B of the crystal unit 2 is larger in size in the first direction (the long side direction of the package 20) than the crystal resonator element 10A, and the second direction (the short side of the package 20). Direction) is the same size.

Thereby, the crystal vibrating piece 10B includes a stepped portion 23c of the stepped portion 23a of the electrode pad 23 and a stepped portion 24c of the stepped portion 24a of the electrode pad 24, which are selected according to the planar size of the crystal vibrating piece 10B, and the pillow portion. It is bridged to the step 25c of the 25 step portions 25a and is arranged so as to be substantially parallel to the inner bottom surface 21a of the package base 21.
In the quartz crystal vibrating piece 10 </ b> B, the lead electrodes 16 a and 17 a are joined to the step portions 23 c and 24 c of the electrode pads 23 and 24 via the conductive adhesive 30.
At this time, the step portion 25c of the pillow portion 25 serves as a stopper, and the inclination of the other end portion 13 of the crystal vibrating piece 10B toward the pillow portion 25 side is regulated.

(Crystal resonator 3)
Next, a description will be given of a crystal resonator that uses the same package 20 as the crystal resonators 1 and 2 and accommodates a crystal resonator element having a different plane size from the crystal resonator elements 10A and 10B. In addition, about the common part with the crystal oscillators 1 and 2, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part.
As shown in FIG. 3, the crystal vibrating piece 10 </ b> C of the crystal resonator 3 has a package 20 having a longer side direction size larger than the crystal vibrating piece 10 </ b> A and smaller than the crystal vibrating piece 10 </ b> B. Is smaller than the quartz crystal vibrating pieces 10A and 10B.

Thereby, the crystal vibrating piece 10C is selected according to the planar size of the crystal vibrating piece 10C, and the side surface 23d side of the step 23b of the step 23a of the electrode pad 23 and the step 24b of the step 24a of the electrode pad 24 are selected. Are bridged between the side surface 24d side facing the side surface 23d side of the step portion 23b and the side surface 25e side of the step portion 25b of the step portion 25a of the pillow portion 25, and substantially parallel to the inner bottom surface 21a of the package base 21. It is arranged to be.
In the quartz crystal vibrating piece 10 </ b> C, the lead electrodes 16 a and 17 a are joined to the step portions 23 b and 24 b of the electrode pads 23 and 24 through the conductive adhesive 30.
At this time, the step portion 25b of the pillow portion 25 serves as a stopper, and the inclination of the other end portion 13 of the crystal vibrating piece 10C toward the pillow portion 25 is restricted.

  As described above, the crystal resonators 1, 2, and 3 according to the first embodiment use the electrode pads 23 and 24 and the step portions 23 a, 24 a, and 25 a of the pillow portion 25 (23 b, 23 c, etc.) By selecting (using differently) according to the plane sizes of the resonator elements 10A, 10B, and 10C, the crystal resonator elements 10A, 10B, and 10C having different plane sizes in one or both of the first direction and the second direction are used as a common package. 20 can be stored.

Therefore, since the quartz resonators 1, 2, and 3 can use the same package even if the types of the quartz vibrating pieces are different, the number of types of packages can be suppressed.
As a result, the quartz resonators 1, 2, and 3 can alleviate the complexity of production management, and can improve productivity such as reduction of setup time required for changing the production model of the production line.

The quartz resonators 1, 2 and 3 are provided with intervals W1 to W3 on the entire circumference between the contours of the step portions (23b, 23c, etc.) in plan view of the step portions 23a, 24a and 25a. Therefore, the intervals W1 to W3 can be set wider than the range of misalignment in the printing process of each step portion (each layer) of the step portions 23a, 24a, and 25a.
From this, the quartz resonators 1, 2, and 3 have a deviation from a predetermined shape due to the positional deviation of each layer as in the past, and interference with other components due to the deviation (for example, a paste-like material is package base In such a case, it is possible to avoid problems such as the outflow of the second layer (frame-shaped portion) of the outer peripheral portion of the inner bottom surface 21a of the inner surface 21a).

Further, since the crystal pads 1, 2 and 3 are formed using the same material (W) in the electrode pads 23 and 24 and the pillow part 25, the electrode pads 23 and 24 and the pillow part 25 are formed in the same process. It can be formed in a lump.
From this, the crystal resonators 1, 2, and 3 can improve productivity compared with the case where the electrode pads 23 and 24 and the pillow part 25 are formed in different processes using different materials. it can.

  In addition, the crystal resonators 1, 2 and 3 have excellent workability, high Q value, and excellent vibration characteristics because the material of the resonator element (crystal resonator elements 10A, 10B, 10C) is crystal. A vibrating piece can be obtained.

  The package may include a flat package base and a lid having a recess. The package may have a recess in both the package base and the lid. These configurations can also be applied to the following embodiments and modifications.

Further, the step portions 23 a, 24 a, and 25 a may be formed not on the entire circumference of the electrode pads 23 and 24 and the pillow portion 25 but on a part thereof.
Specifically, for example, in the electrode pad 23, of the side surfaces connecting the step portions 23b and 23c, the side surface facing the side surfaces 23d and 23e is integrated with the side surface connecting the inner bottom surface 21a of the package base 21 and the step portion 23b. As shown in FIG. 1A, the stepped portion in this portion may be removed by moving the stepped portion 23c diagonally upward to the left in the drawing or increasing the area of the stepped portion 23c. The same applies to the electrode pad 24 and the pillow portion 25.

Here, a modification of the first embodiment will be described.
(Modification 1)
FIG. 4 is a schematic plan view of an essential part of the crystal resonator of the first modification. In addition, about a common part with 1st Embodiment, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part.

  As shown in FIG. 4, the crystal unit 4 of Modification 1 includes a side surface 23 f and a step portion 24 b that are part of the side surface connecting the step portions 23 b and 23 c of the step portions 23 a and 24 a of the electrode pads 23 and 24. , 24c, which is a part of the side surface that connects between the two sides, extends along a direction intersecting the first direction (the long side direction of the package 20D) and the second direction (the short side direction of the package 20D). .

  Thus, the crystal resonator 4 is arranged in the long side direction of the package 20D by disposing the crystal vibrating piece D so that the corner portion of the base portion 11 is close to the side surfaces 23f and 24f of the step portion 23b and the step portion 24b. Crystal vibration having a size larger than the crystal vibrating piece 10A, smaller than the crystal vibrating pieces 10B and 10C, and a size of the package 20D in the short side direction being smaller than the crystal vibrating pieces 10A and 10B and larger than the crystal vibrating piece 10C. The piece 10D can be stored.

(Modification 2)
FIG. 5 is a schematic plan view of an essential part of the crystal resonator of the second modification. In addition, about a common part with 1st Embodiment, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part.

As shown in FIG. 5, the crystal resonator 5 of Modification 2 includes a side surface 23 g and a step portion 24 b which are part of the side surface connecting the step portions 23 b and 23 c of the step portions 23 a and 24 a of the electrode pads 23 and 24. , 24c are side surfaces 24g that are part of the side surfaces that connect between the side surfaces 23d and 24d and extend along the short side direction of the package 20E. The side surfaces 23e and 24e are bent to extend along the long side direction of the package 20E.
Thereby, step part 23c, 24c is formed in L shape (reverse L shape) in planar view.

According to this, in the crystal resonator 5, the corner portion of the base portion 11 is close to the L-shaped (reverse L-shaped) bent portion formed by the side surfaces 23g, 23h, 24g, and 24h of the step portions 23b and 24b. By disposing the crystal vibrating piece E on the surface, the size of the package 20E in the long side direction is larger than the crystal vibrating piece 10A and smaller than the crystal vibrating pieces 10B and 10C, and the size of the package 20E in the short side direction is crystal vibration. A crystal vibrating piece 10E smaller than the pieces 10A and 10B and larger than the crystal vibrating piece 10C can be accommodated.
Further, the crystal resonator 5 can easily position the crystal resonator element 10E in the long side direction and the short side direction of the package 20E as compared with the other crystal resonators due to the arrangement of the crystal resonator element 10E.

(Modification 3)
FIG. 6 is a schematic plan view of an essential part of the crystal resonator of the third modification. In addition, about a common part with 1st Embodiment, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part.
Here, for convenience, three types of quartz crystal vibrating pieces having different sizes are shown together.

As shown in FIG. 6, the quartz crystal resonator 6 of Modification 3 includes two pillow portions 25, and each pillow portion 25 is the other end of the crystal vibrating piece 10 </ b> A and the crystal vibrating piece 10 </ b> B (illustrated by a two-dot chain line). It is arranged at a position facing both corners of the part 13.
More specifically, the side surface 25e side of the first step portion 25b of the stepped portion 25a of each pillow portion 25 faces both corner portions of the other end portion 13 of the crystal vibrating piece 10A. The second step portion 25 c of the step portion 25 a of each pillow portion 25 faces both corner portions of the other end portion 13.

According to this, in the crystal resonator 6, the vibration of the vibrating portion 12 of the crystal vibrating pieces 10 </ b> A and 10 </ b> B is compared with the case where the pillow portion 25 is disposed at a position facing the central portion of the other end portion 13. Further away from the region (referred to as an elliptical shape in plan view).
From this, the quartz crystal resonator 6 can minimize the influence on the vibration characteristics at the time of contact with the quartz crystal vibrating pieces 10 </ b> A and 10 </ b> B such as when the pillow portion 25 is dropped.

  The crystal resonator 6 has a crystal resonator element on the side surface 25j side of the first step portion 25b of the step portion 25a of the two pillow portions 25 that extends along the long side direction of the package 20F and faces each other. By facing both corners of the other end 13 of 10F (illustrated by a one-dot chain line), the size of the long side direction of the package 20F is larger than the crystal vibrating piece 10A and smaller than the crystal vibrating piece 10B, and the package 20F Can accommodate a quartz crystal vibrating piece 10F whose size in the short side direction is smaller than that of the quartz crystal vibrating pieces 10A and 10B.

Note that any of the first embodiment and each modification may be used for the electrode pad of the crystal unit 6.
Further, the crystal unit 6 may not have the one pillow portion 25.

(Second Embodiment)
Next, a crystal oscillator as a vibration device including an oscillation circuit in the crystal resonator of the first embodiment and each modification will be described.
FIG. 7 is a schematic cross-sectional view showing a schematic configuration of the crystal oscillator of the second embodiment. In addition, about a common part with 1st Embodiment, the same code | symbol is attached | subjected, detailed description is abbreviate | omitted, and it demonstrates centering on a different part. Note that the cutting position in the cross-sectional view conforms to FIG.

As shown in FIG. 7, the crystal oscillator 7 includes a crystal vibrating piece (10A as an example), a package 120 that houses the crystal vibrating piece 10A, and an IC chip 40 as an oscillation circuit that drives the crystal vibrating piece 10A. I have.
The IC chip 40 is disposed and fixed in the recess 121b of the inner bottom surface 121a of the package base 121, and a connection pad (not shown) is connected to the internal terminal 121c provided in the recess 121b by the metal wire 50.
The internal terminal 121c is connected to the electrode pads 23 and 24, the external terminals 27 and 28, etc. by internal wiring (not shown).
The internal terminal 121c is made of a metal film obtained by laminating a film of Ni, Au or the like on a metallized layer of W or the like by plating or the like, like the electrode pads 23 and 24.
The package base 121 has a three-layer structure in order to provide the recess 121b.

In the crystal oscillator 7, the crystal vibrating piece 10A is excited (driven) by a drive signal from the IC chip 40, and oscillates (resonates) at a predetermined frequency.
In the IC chip 40, the connection pads and the internal terminals 121c may be connected by a flip chip mounting method in an inverted posture with respect to FIG.

  As described above, since the crystal oscillator 7 is configured to include the IC chip 40 in the crystal resonator of the first embodiment and each modification, the crystal oscillator 7 is described in any one of the first embodiment and each modification. It is possible to provide an oscillator that achieves the above effect.

(Third embodiment)
Next, a mobile phone will be described as an example of an electronic device including the above-described crystal resonator or crystal oscillator.
FIG. 8 is a schematic perspective view showing the mobile phone of the third embodiment.
A cellular phone 700 is a cellular phone using any one of the crystal resonators of the first embodiment and the modified examples and the crystal oscillator of the second embodiment.
A cellular phone 700 illustrated in FIG. 8 uses the above-described crystal resonator (1 or the like) or the crystal oscillator 7 as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and a reception. A mouth 703 and a mouthpiece 704 are provided.

  The above-described vibrating devices such as the crystal oscillator and the crystal oscillator are not limited to the above mobile phone, but an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a car navigation device, a pager, an electronic notebook, a calculator, An electronic device that can be suitably used as a timing device such as a word processor, a workstation, a videophone, a POS terminal, or a device equipped with a touch panel, and in any case, an electronic device that exhibits the effects described in the above embodiments and modifications. Can be provided.

The shape of the resonator element is not limited to the illustrated flat plate type, but the central part is thick and the peripheral part is thin (convex type, bevel type, mesa type). Conversely, the central part is thin and the peripheral part is thick. It may be a type (reverse mesa type).
The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate A piezoelectric material such as lead (PZT), zinc oxide (ZnO), and aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the thickness shear vibration may be electrostatic driving by Coulomb force in addition to the piezoelectric effect of the piezoelectric body.

  DESCRIPTION OF SYMBOLS 1-6 ... Crystal oscillator as a vibration device, 7 ... Crystal oscillator as a vibration device, 10A-10F ... Crystal vibration piece as a vibration piece, 11 ... Base part as one end part, 12 ... Vibration part, 13 ... Other end 14, one main surface, 15, the other main surface, 16, excitation electrode, 16 a, extraction electrode as a junction, 17, excitation electrode, 17 a, extraction electrode as a junction, 20, 20 D, 20 E, 20F ... Package, 21 ... Package base, 21a ... Inner bottom surface, 22 ... Lid, 23 ... Electrode pad, 23a ... Step portion, 23b ... First step portion, 23c ... Second step portion, 23d-23h ... Side surface, 24 ... electrode pad, 24a ... step portion, 24b ... first step portion, 24c ... second step portion, 24d-24h ... side surface, 25 ... pillow portion, 25a ... step portion, 25b ... 1 step Eye step, 25c ... Steps of steps, 25d, 25e, 25j ... side surfaces, 26 ... outer bottom surface, 27, 28 ... external terminals, 29 ... bonding material, 30 ... conductive adhesive, 40 ... IC chip as oscillation circuit, 50 ... metal Wire 120, Package 121, Package base 121 a, Inner bottom surface 121 b, Recessed portion, 121 c, Internal terminal, 700 Mobile phone, 701 Liquid crystal display, 702 Operation button, 703 Earpiece, 704 Transmission mouth.

Claims (7)

A vibrating piece having one end and the other end parallel to the one end;
A vibration device comprising a package for housing the vibration piece,
The vibrating piece has a joint at the one end,
The package includes an electrode pad to which the joint portion of the vibrating piece is joined, and a pillow portion at a position facing the other end portion of the vibrating piece,
The electrode pad and the pillow part are provided with a stepped part,
The step portion includes a plurality of step portions,
A part of the side surface connecting the step portions extends in a first direction connecting the electrode pad and the pillow part in a plan view, and another part of the side surface is in a plan view. Extending along a second direction intersecting the first direction;
The vibrating piece is bridged between the stepped portion of the stepped portion of the electrode pad and the stepped portion of the stepped portion of the pillow portion, selected according to the planar size of the vibrating piece, A vibrating device, wherein the vibrating device is arranged so as to be parallel to a bottom surface of the package.   The vibrating device according to claim 1, wherein at least one of the stepped portions is provided on the entire circumference of the electrode pad or the pillow portion.   The vibrating device according to claim 1, wherein the pillow portion is disposed at at least one of positions facing both corner portions of the other end portion of the vibrating piece.   The vibrating device according to any one of claims 1 to 3, wherein the electrode pad and the pillow portion are formed using the same kind of material.   The vibrating device according to claim 1, wherein a material of the vibrating piece is quartz.   The vibration device according to claim 1, further comprising an oscillation circuit that drives the vibration piece.   An electronic apparatus comprising the vibration device according to any one of claims 1 to 6.

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