JP2013157701A - Package, vibration device and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package capable of improving air permeability between an internal space and an external space, and a vibration device and an electronic device including the package.SOLUTION: A package 20 of a crystal oscillator 1 includes: a recessed part 28a provided, on a bottom surface 28b, with a through-hole 28c for communicating an internal space S and an external space; and a spherical sealing material 28d mounted inside the recessed part 28a, for sealing the through-hole 28c by being heated and fused. The through-hole 28c is formed into a circular shape in the plan view, and on the bottom surface 28b of the recessed part 28a, an inclination part 28g is provided so that the spherical sealing material 28d is brought into contact with an inner wall 28f of the recessed part 28a.

Description

  The present invention relates to a package, a vibration device including the package, and an electronic apparatus.

Conventionally, as a configuration of a sealing portion that seals the internal space of a vibration device represented by a piezoelectric vibrator or the like, a small-diameter first through hole having an opening on the inner side (internal space side) of the package, A spherical sealing material larger than the diameter of the first through-hole is placed in a step hole made of a large-diameter second through-hole having an opening on the outside (external space side), and melted to melt the first through-hole. The structure which seals a hole is known (for example, refer patent document 1).
Moreover, the structure which made the shape of the sealing hole equivalent to the said 1st through-hole elliptical by planar view is known (for example, refer patent document 2).
Further, a plurality of through-holes corresponding to the first through-hole are formed so that the area of the opening on the package external (external space) side is larger than the area of the opening on the package internal (internal space) side. The structure formed in the shape of a substantially pyramid using the slope is known (for example, refer patent document 3).

JP 2005-223612 A JP 2004-274657 A JP 2005-64024 A

  In the configuration of Patent Document 1, when a spherical sealing material is placed in a step hole, the internal space of the package is depressurized (when the vacuum is made high by suction using a vacuum pump or the like), the sealing is performed. There is a possibility that the stop material is fitted into the first through-hole and the pressure cannot be reduced smoothly due to insufficient ventilation, and the fitted sealing material may jump out of the step hole with a reduced pressure.

  As a countermeasure for this problem, for example, as in Patent Document 2, the shape of the sealing hole (through hole) is elliptical in a plan view, and even if a spherical sealing material is fitted into the through hole, It is conceivable that the internal space of the package and the outside (external space) can be ventilated by a gap generated by the difference in shape between the through hole and the spherical sealing material.

However, in the configuration of Patent Document 2, in order to further improve the air permeability between the internal space of the package and the outside, it is necessary to enlarge the elliptical through hole. However, since the area of the through hole increases when the through hole is enlarged, it is necessary to enlarge the spherical sealing material for sealing the through hole. Thereby, in the structure of patent document 2, the clearance gap between an elliptical through-hole and a spherical sealing material cannot be made so large.
As a result, in the configuration of Patent Document 2, there is a possibility that it is difficult to improve the air permeability between the internal space of the package and the outside.

As another countermeasure, for example, as in Patent Document 3, a plurality of inclined surfaces are formed so that the area of the opening on the outside of the package is larger than the area of the opening on the inside of the package. It is possible to use a configuration that is formed into a substantially pyramid shape.
According to the configuration of Patent Document 3, since a gap is formed between the substantially pyramid-shaped through hole and the spherical sealing material placed in the through hole, ventilation between the internal space of the package and the outside is possible. It becomes.

  However, in the configuration of Patent Document 3, in addition to the same problem as that of Patent Document 2, depending on the risk that the processing of a plurality of slopes constituting the substantially pyramid-shaped through-holes may take time and the slope of the slope, There is room for improvement as countermeasures such as a sharp shape at the tip of the hole on the inner space side of the package and the possibility of breakage.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A package according to this application example includes a recess having a through hole communicating with an inner space and an outer space provided on a bottom surface, and the through hole is formed in a circular shape in plan view, The bottom surface is provided with an inclined portion so that a spherical sealing material that seals the through-hole when heated and melted contacts the inner wall of the recess.

According to this, the package includes a concave portion provided with a circular through hole, and a spherical sealing material that seals the through hole by being heated and melted contacts the inner wall of the concave portion on the bottom surface of the concave portion. An inclined portion is provided.
Thereby, for example, even if a spherical sealing material is placed in the vicinity of the through-hole, the sealing material rolls by the inclined portion on the bottom surface of the recess and contacts the inner wall of the recess. Can be reliably avoided from being fitted into the through hole.
As a result, the package can reliably improve the air permeability between the internal space and the external space.
At this time, since the spherical sealing material is in contact with the inner wall of the recess, the package ensures a sufficient gap between the through hole and the sealing material. The problem of insufficient gap between the material and the through hole can be avoided.
In addition, since the through-hole is a simple circular shape, the package may have a man-hour required for processing the through-hole, or the tip of the through-hole on the inner space side may be easily damaged. Can be avoided.

  Application Example 2 In the package according to the application example, the inclined portion has a through hole forming portion in which the through hole is formed projecting toward the external space, and a region surrounding the through hole forming portion is in the concave portion. It is preferable that the depth on the through hole forming portion side is shallow and the depth is formed so as to be deep on the inner wall side.

According to this, the package has an inclined portion on the bottom surface, a through hole forming portion in which the through hole is formed protrudes to the external space side, and a region surrounding the through hole forming portion is a depth on the through hole forming portion side in the recess Is shallow and is inclined so that the depth on the inner wall side is deep.
Thereby, as for the package, the area | region surrounding the through-hole formation part of a bottom face is formed in cone shape, for example.
As a result, for example, even when a spherical sealing material is placed in the vicinity of the through hole, the package rolls on the inclined portion and comes into contact with the inner wall of the recess, so that the sealing material fits into the through hole. Can be surely avoided, and a sufficient gap is ensured between the through hole and the sealing material, and the air permeability between the internal space and the external space can be reliably improved.

  Application Example 3 In the package according to the application example described above, the inclined portion is formed in a slope shape so that the depth on one side facing the through hole in the recess is shallow and the depth on the other side is deep. It is preferable that

According to this, the package is formed in a slope shape so that the inclined portion of the bottom surface has a shallow depth on one side facing the through hole in the recess and a deep depth on the other side.
Thereby, for example, even when a spherical sealing material is placed in the vicinity of the through hole, the package rolls on the inclined portion and contacts the inner wall on the other side of the concave portion, so that the sealing material fits into the through hole. In addition to being able to reliably avoid clogging, a sufficient gap is ensured between the through hole and the sealing material, and the air permeability between the internal space and the external space can be reliably improved.

  Application Example 4 In the package according to the application example described above, it is preferable that the through hole is provided to be offset toward the one side of the recess.

  According to this, since the through hole is provided on one side of the concave portion in the package, a sufficient gap is ensured between the sealing material in contact with the inner wall on the other side and the through hole. The air permeability between the internal space and the external space can be improved more reliably.

  Application Example 5 In the package according to the application example, the recess and the through hole are formed concentrically, and the diameter of the spherical sealing material is larger than the radius of the recess, and the recess It is preferable that it is a size which covers a part of the through-hole in a plan view in a state where it is in contact with the inner wall.

According to this, in the package, the concave portion and the through hole are formed concentrically, the diameter of the spherical sealing material is larger than the radius of the concave portion, and in contact with the inner wall of the concave portion. The size covers a part of the through hole.
As a result, the package secures a gap between the sealing material and the through-hole while setting the diameter of the concave portion to be less than twice the diameter of the sealing material. The air permeability between the internal space and the external space can be improved without increasing the size.
As a result, the package can be reduced in size while improving the air permeability between the internal space and the external space.

  Application Example 6 A vibration device according to this application example includes the package according to any one of the application examples described above, and a vibration piece housed in the internal space of the package, and sealing the through hole. It is characterized by being sealed with a material.

  According to this, the vibration device of this configuration includes the package according to any one of the application examples described above, and the vibration piece housed in the internal space of the package, and the through hole is sealed with a sealing material. From the above, it is possible to provide a vibrating device in which the effect described in any of the above application examples is reflected.

  Application Example 7 In the vibration device according to the application example described above, it is preferable that the vibration device further includes an oscillation circuit that drives the vibration piece.

  According to this, since the vibration device further includes an oscillation circuit that drives the vibration piece, it is possible to provide an oscillator as a vibration device in which the effect described in any of the application examples is reflected.

  Application Example 8 An electronic apparatus according to this application example includes the vibration device according to any one of the application examples.

  According to this, since the electronic apparatus of this configuration includes the vibration device according to any one of the application examples, it is possible to provide an electronic apparatus in which the effect according to any of the application examples is reflected. it can.

It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is a schematic top view seen from the cover body side, (b) is a schematic cross section in the AA of (a), c) A schematic plan view seen from the bottom side. FIG. 2 is an upside down schematic enlarged view of a portion B in FIG. The principal part model enlarged plan view which showed the dimensional relationship of the component of the sealing part of a package. It is a schematic diagram which shows schematic structure of the crystal oscillator of 2nd Embodiment, (a) is a schematic top view seen from the cover body side, (b) is a schematic cross section in the AA of (a), c) A schematic plan view seen from the bottom side. FIG. 5 is a schematic enlarged view of a part B in FIG. The vertical inversion schematic expanded sectional view of the sealing part of a package. It is a schematic diagram which shows schematic structure of the crystal oscillator of 3rd Embodiment, (a) is a schematic top view seen from the cover body side, (b) is a schematic cross section in the AA line of (a), (c ) Is a schematic plan view seen from the bottom side. The model perspective view which shows the mobile telephone of 4th Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a crystal resonator as an example of a vibrating device including a package and a vibrating piece housed in the internal space of the package will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. FIG. 1A is a schematic plan view seen from the lid side, FIG. 1B is a schematic cross-sectional view taken along the line AA in FIG. 1A, and FIG. It is the model top view seen from the bottom face side. FIG. 2 is an upside down schematic enlarged view of a portion B in FIG. In addition, the cover body is abbreviate | omitted in Fig.1 (a). In the following drawings, the dimensional ratios of the constituent elements are different from actual ones for easy understanding.

  As shown in FIGS. 1 and 2, the crystal resonator 1 according to the first embodiment includes a crystal resonator element 10 as a resonator element, and a package 20 in which the crystal resonator element 10 is housed in an internal space S. Yes.

The quartz crystal vibrating piece 10 is a tuning fork type quartz crystal vibrating piece cut out at a predetermined angle from, for example, a quartz crystal or the like that is a piezoelectric material, and a pair of vibrating arms 11 and 12 that oscillate bending vibration, and a pair of vibrations. The base 13 that connects the arms 11 and 12 to each other is formed in a substantially tuning fork shape in plan view.
In the crystal vibrating piece 10, excitation electrodes (not shown) are formed on the pair of vibrating arms 11 and 12, and extraction electrodes 14 and 15 extracted from the excitation electrodes are formed at the end of the base portion 13.
The lead electrodes 14 and 15 are formed on both main surfaces 16 and 17 of the base portion 13 of the crystal vibrating piece 10. The excitation electrode and extraction electrodes 14 and 15 are metal films having a structure in which, for example, Cr (chromium) is used as a base layer, and Au (gold) is stacked thereon.

The package 20 includes a base portion 21 having a substantially rectangular planar shape and provided with a recess 24, and a flat lid 22 that covers the recess 24 (the crystal vibrating piece 10) and is joined (fixed) to the base portion 21. It is configured in a substantially rectangular parallelepiped shape. The package 20 has an internal space S formed by airtightly covering the concave portion 24 of the base portion 21 with a lid 22 via a joining member 29 described later.
In the base portion 21, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, etc., which are formed by stacking and firing ceramic green sheets Insulating materials such as quartz and glass are used.
For the lid 22, a metal such as Kovar, 42 alloy, stainless steel, or an insulating material that is the same material as the base portion 21 is used.

On the bottom surface 24a of the recess 24 of the base portion 21 (the bottom surface of the base portion 21 on the internal space S side) 24a are substantially rectangular internal terminals 23a and 23b at positions facing the lead electrodes 14 and 15 of the quartz crystal vibrating piece 10. Is provided.
In the quartz crystal resonator element 10, the lead electrodes 14 and 15 are bonded to the internal terminals 23 a and 23 b through a conductive adhesive 30 such as epoxy, silicone, or polyimide that is mixed with a conductive material such as a metal filler. (Fixed).

A pair of substantially rectangular external terminals 26 and 27 are provided on the bottom surface 25 of the base portion 21 opposite to the concave portion 24 (the bottom surface of the base portion 21 on the external space side) 25.
The internal terminals 23a and 23b are electrically connected to the external terminals 26 and 27 by internal wiring (not shown). For example, the internal terminal 23 a is connected to the external terminal 26, and the internal terminal 23 b is connected to the external terminal 27.
The internal terminals 23a and 23b and the external terminals 26 and 27 are made of a metal paste obtained by adding an organic binder and a solvent to a metal powder such as W (tungsten), Mo (molybdenum), or Mn (manganese), for example, a screen. After printing (coating) using a printing method, coatings such as Ni (nickel) and Au (gold) are laminated by plating or the like on the surface of the metallized layer formed by heat treatment.

The base portion 21 is provided with a sealing portion 28 for reducing the internal space S and sealing hermetically.
In the sealing portion 28, the crystal vibrating piece 10 is joined to the internal terminals 23 a and 23 b, the concave portion 24 of the base portion 21 is covered with the lid body 22, and the base portion 21 and the lid body 22 are sealed rings, brazing materials, low After being joined by a joining member 29 such as a melting point glass and the internal space S is depressurized, the internal space S is hermetically sealed.
In addition, in the internal space S before decompression, outgas generated from the atmosphere, the conductive adhesive 30, or the like exists. Since these are factors that obstruct the normal bending vibration of the quartz crystal vibrating piece 10, it is necessary to discharge it to the external space (outside) by reducing the pressure (to bring it into a high vacuum state) and to reliably remove it.

  The sealing portion 28 includes a concave portion 28a having a circular planar shape provided on the bottom surface 25 of the base portion 21, a through hole 28c provided on the bottom surface 28b of the concave portion 28a, and connecting the internal space S and the external space ( In other words, a through hole 28c that communicates the internal space S and the external space is placed in the concave portion 28a provided in the bottom surface 28b), and the spherical shape that seals the through hole 28c by being heated and melted. Sealing material 28d.

The through hole 28c is formed in a circular shape concentric with the concave portion 28a in plan view. The size (diameter) of the through hole 28 c is preferably smaller than the diameter of the sealing material 28 d so that the sealing material 28 d does not enter the internal space S of the package 20.
For the spherical sealing material 28d, Au (gold) / Ge (germanium) alloy, Au (gold) / Sn (tin) alloy, silver brazing, or the like is used.

The bottom surface 28b of the recess 28a is provided with an inclined portion 28g so that when the spherical sealing material 28d is placed in the recess 28a, it rolls and contacts the inner wall 28f of the recess 28a.
More specifically, the inclined portion 28g of the bottom surface 28b has a region in which the through-hole forming portion 28e in which the through-hole 28c is formed protrudes to the external space side (upward in the drawing in FIG. 2), The recesses 28a are inclined so that the depth H1 on the through hole forming portion 28e side is shallow and the depth H2 on the inner wall 28f side is deep.

Thereby, as for the sealing part 28, the area | region surrounding the through-hole formation part 28e of the bottom face 28b is formed in the gentle cone shape, for example.
As a result, for example, even when the spherical sealing material 28d is placed in the vicinity of the through hole 28c, the sealing portion 28 rolls on the inclined portion 28g and contacts the inner wall 28f of the recess 28a. It is possible to reliably avoid the fitting of 28d into the through hole 28c, and a sufficient gap (substantial opening area of the through hole 28c) between the through hole 28c and the sealing material 28d is ensured.
Thereby, as shown by the arrow in FIG. 2, the package 20 can reliably improve the air permeability between the internal space S and the external space.
The degree of inclination of the inclined portion 28g is appropriately set in consideration of the size and weight of the sealing material 28d, the surface roughness of the bottom surface 28b of the recess 28a, the level of the apparatus on which the package 20 is placed, and the like.

The spherical sealing material 28d is heated and melted by irradiation with a laser beam or an electron beam after the internal space S of the package 20 is depressurized (in a high vacuum state) in a vacuum chamber (not shown) or the like. It spreads as shown by a two-dot chain line in the recess 28a, and the through hole 28c is hermetically sealed.
The inner wall 28f and the bottom surface 28b of the recess 28a have Ni (nickel), Au (gold), etc. on the surface of the metallized layer such as W or Mo in order to smoothly wet and spread the sealing material 28d that has been heated and melted. A metal film (not shown) is formed by laminating these plating layers.

The crystal resonator 1 includes a pair of vibrating arms 11 and 12 of the crystal vibrating piece 10 in accordance with a drive signal applied from the outside via external terminals 26 and 27, internal terminals 23a and 23b, lead electrodes 14 and 15 and excitation electrodes. 12 is excited by bending vibration to resonate (oscillate) at a predetermined frequency (for example, about 32 kHz), and output an oscillation signal from the external terminals 26 and 27.
Thereby, the crystal unit 1 functions as a timing device, for example.

As described above, in the crystal resonator 1 according to the first embodiment, the package 20 has the concave portion 28a provided with the circular through hole 28c and the spherical sealing that seals the through hole 28c by being heated and melted. 28d. An inclined portion 28g is provided on the bottom surface 28b of the recess 28a of the package 20 so that the spherical sealing material 28d contacts the inner wall 28f of the recess 28a.
Thereby, even if the spherical sealing material 28d is placed in the vicinity of the through hole 28c of the recess 28a, for example, the package 20 is rolled by the inclined portion 28g of the bottom surface 28b of the recess 28a. Since it contacts the inner wall 28f of 28a, it can avoid reliably that the sealing material 28d fits into the through-hole 28c.
As a result, the package 20 can reliably improve the air permeability between the internal space S and the external space.

At this time, since the spherical sealing material 28d is in contact with the inner wall 28f of the recess 28a in the package 20, a sufficient gap is ensured between the through hole 28c and the sealing material 28d. The problem of insufficient gap between the sealing material 28d and the through hole 28c as in Document 2 can be avoided.
In addition, since the through-hole 28c has a simple circular shape in the package 20, there is a risk that the processing of the through-hole 28c may take time as in the above-described Patent Document 3, and the tip of the through-hole 28c on the inner space S side. It is possible to avoid the possibility that the portion is easily damaged.

Further, the package 20 has an inclined portion 28g of the bottom surface 28b of the recess 28a, specifically, a through hole forming portion 28e in which the through hole 28c is formed projecting toward the external space, and a region surrounding the through hole forming portion 28e. The recesses 28a are inclined so that the depth H1 on the through hole forming portion 28e side is shallow and the depth H2 on the inner wall 28f side is deep.
Thereby, as for the package 20, the area | region surrounding the through-hole formation part 28e of the bottom face 28b of the recessed part 28a is formed in the cone shape, for example.
As a result, even if the spherical sealing material 28d is placed in the vicinity of the through hole 28c of the recess 28a, the package 20 rolls on the inclined portion 28g and contacts the inner wall 28f of the recess 28a. Can be surely avoided from being fitted into the through hole 28c, and a sufficient gap is ensured between the through hole 28c and the sealing material 28d, and the air permeability between the internal space S and the external space can be reliably improved. it can.

In addition, the component of the sealing part 28 of the package 20 is good also as a dimensional relationship as shown in FIG. FIG. 3 is a main part schematic enlarged plan view showing the dimensional relationship of the components of the sealing part of the package.
As shown in FIG. 3, the concave portion 28a and the through hole 28c of the sealing portion 28 of the package 20 are formed concentrically. The diameter D1 of the spherical sealing material 28d is larger than the radius of the recess 28a, and exceeds the center O of the concentric circle in plan view in a state where the sealing material 28d is in contact with the inner wall 28f of the recess 28a. The size may cover a part of the through hole 28c (in other words, the entire through hole 28c is not covered).

According to this, since the package 20 secures a gap between the sealing material 28d and the through hole 28c while making the diameter D2 of the recess 28a less than twice the diameter D1 of the sealing material 28d, The air permeability between the internal space S and the external space can be improved without increasing the size of the recess 28a relative to the material 28d.
As a result, the package 20 can be reduced in size while improving the air permeability between the internal space S and the external space.

The crystal resonator 1 can provide a highly reliable crystal resonator (vibration device) that reflects the effect of the package 20 described above.
The package 20 may be provided with a recess 24 in the lid 22, and may be provided with a recess 24 in both the base portion 21 and the lid 22.
Further, the sealing portion 28 may be provided on the lid body 22 instead of the base portion 21.
The quartz crystal resonator element 10 may include a support arm on the base 13 and lead electrodes 14 and 15 provided on the support arm.

(Second Embodiment)
Next, a description will be given of a crystal resonator as another example of a vibration device including a package and a resonator element housed in the internal space of the package.
FIG. 4 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the second embodiment. 4 (a) is a schematic plan view seen from the lid side, FIG. 4 (b) is a schematic cross-sectional view taken along the line AA of FIG. 4 (a), and FIG. It is the model top view seen from the bottom face side. FIG. 5 is an upside down schematic enlarged view of part B of FIG. In FIG. 4A, the lid is omitted. Also, common parts with the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and description will be made centering on parts different from the first embodiment.

As shown in FIGS. 4 and 5, the crystal resonator 2 of the second embodiment is different in the configuration of the sealing portion 128 of the package 120 from the first embodiment.
In the crystal unit 2, the inclined portion 128g of the bottom surface 28b of the concave portion 28a of the sealing portion 128 of the package 120 has a shallow depth L1 on one side facing the through hole 28c in the concave portion 28a and a depth L2 on the other side. It is formed in a slope shape so as to be deep.

According to this, even if the spherical sealing material 28d is placed in the vicinity of the through hole 28c of the recess 28a, the package 120 rolls on the inclined portion 128g and contacts the other inner wall 28f of the recess 28a. In addition, the sealing material 28d can be reliably avoided from fitting into the through hole 28c, and a sufficient gap is ensured between the through hole 28c and the sealing material 28d.
Thereby, the package 120 can reliably improve the air permeability between the internal space S and the external space, as indicated by arrows in FIG.
The diameter of the through hole 28c, the diameter of the sealing material 28d, and the inclination angle of the inclined portion 128g are fitted into the through hole 28c in the middle when the sealing material 28d rolls from one side of the inclined portion 128g to the other side. It is set appropriately so that there is no.

As shown in the upside down schematic enlarged cross-sectional view of the sealing portion of the package of FIG. 6, the package 120 has a through hole 28c on one side of the recess 28a (depth L1 side, that is, the depth in the recess 28a is shallow). It may be provided to be offset (eccentric).
According to this, in the package 120, since the through hole 28c is provided so as to be offset toward one side of the recess 28a, there is a gap between the sealing material 28d in contact with the inner wall 28f on the other side and the through hole 28c. This ensures sufficient air permeability between the internal space S and the external space.

The crystal resonator 2 can provide a highly reliable crystal resonator (vibration device) that reflects the effect of the package 120 described above.
The package 120 may be provided with a recess 24 in the lid 22, or may be provided with a recess 24 in both the base portion 21 and the lid 22.
Further, the sealing portion 128 may be provided on the lid body 22 instead of the base portion 21.
The quartz crystal resonator element 10 may include a support arm on the base 13 and lead electrodes 14 and 15 provided on the support arm.

(Third embodiment)
Next, a crystal oscillator as an example of a vibration device further including an oscillation circuit for driving a crystal resonator element in the configuration of the crystal resonator according to the first embodiment or the second embodiment will be described.
FIG. 7 is a schematic diagram showing a schematic configuration of the crystal oscillator of the third embodiment. FIG. 7A is a schematic plan view seen from the lid side, FIG. 7B is a schematic cross-sectional view taken along the line AA of FIG. 7A, and FIG. It is the model top view seen from the bottom face side. In FIG. 7A, the lid is omitted.
Also, common parts with the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and description will be made centering on parts different from the first embodiment.

  As shown in FIG. 7, the crystal oscillator 5 of the third embodiment includes an IC chip 40 as an oscillation circuit that drives (oscillates) the crystal resonator element 10 to the crystal resonator 1 described in the first embodiment. Further, the configuration is further provided.

On the bottom surface 24 a of the recess 24 of the base portion 21 of the crystal oscillator 5, a recess 24 b that houses the IC chip 40 is provided. A plurality of internal connection terminals 24d are provided on the bottom surface 24c of the recess 24b.
The IC chip 40 incorporating the oscillation circuit is fixed to the bottom surface 24c of the recess 24b of the base portion 21 using an adhesive (not shown).
In the IC chip 40, a connection pad (not shown) is connected to the internal connection terminal 24d by a metal wire 41 such as Au (gold) or Al (aluminum).

Similarly to the internal terminals 23a and 23b, the internal connection terminal 24d is formed by laminating each film such as Ni (nickel) or Au (gold) on the surface of a metallized layer such as W (tungsten) or Mo (molybdenum) by a plating method or the like. And is electrically connected to external terminals 26a, 26b, 27a, 27b, internal terminals 23a, 23b and the like provided at the four corners of the bottom surface 25 of the package 20 via internal wiring (not shown). Yes.
In addition, for the connection between the connection pad of the IC chip 40 and the internal connection terminal 24d, in addition to the connection method by wire bonding using the metal wire 41, a connection method by flip chip mounting with the IC chip 40 inverted is used. May be.

  The crystal oscillator 5 causes the pair of vibrating arms 11 and 12 of the crystal vibrating piece 10 to bend and vibrate by a drive signal applied to the excitation electrode from the IC chip 40 via the internal connection terminal 24d and the internal terminals 23a and 23b. It is excited and resonates (oscillates) at a predetermined frequency (for example, about 32 kHz). Then, the crystal oscillator 5 outputs an oscillation signal generated along with this oscillation to the outside from, for example, the external terminals 26a and 27b via the IC chip 40 and the internal connection terminal 24d. Thereby, the crystal oscillator 5 functions as a timing device including an oscillation circuit, for example.

As described above, the crystal oscillator 5 of the third embodiment further includes the IC chip 40 as an oscillation circuit that drives (oscillates) the crystal resonator element 10 in the crystal resonator 1 of the first embodiment. Therefore, it is possible to provide a highly reliable crystal oscillator (vibration device) in which the effects described in the first embodiment are reflected.
The crystal oscillator 5 may use the crystal resonator 2 of the second embodiment instead of the crystal resonator 1 of the first embodiment. According to this, the crystal oscillator 5 can provide a highly reliable crystal oscillator in which the effects described in the second embodiment are reflected.
The crystal oscillator 5 has a module structure in which the IC chip 40 is not built in the package 20 (120) but is externally attached (for example, a structure in which a crystal resonator and an IC chip are individually mounted on one substrate). ).

(Fourth embodiment)
Next, a mobile phone will be described as an example of an electronic apparatus including the above-described vibrating device such as a crystal resonator or a crystal oscillator.
FIG. 8 is a schematic perspective view showing the mobile phone of the fourth embodiment.
A mobile phone 700 according to the fourth embodiment shown in FIG. 8 is a mobile phone including the above-described crystal resonator (1 or 2) or crystal oscillator 5.
The cellular phone 700 uses the above-described crystal resonator (1 or 2) or crystal oscillator 5 as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and an earpiece 703. , And a mouthpiece 704. The form of the mobile phone 700 is not limited to the illustrated type, and may be a so-called smartphone type.

  The above-described vibrating devices such as the crystal resonators 1 and 2 and the crystal oscillator 5 are not limited to the mobile phone such as the mobile phone 700, but are an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, and a navigation. It can be suitably used as a timing device such as an apparatus, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, or a device equipped with a touch panel. In any case, the vibration device can provide a highly reliable electronic device in which the effects described in the above embodiments are reflected.

The vibrating piece is not limited to a tuning fork type quartz vibrating piece, but may be an AT cut type quartz vibrating piece or a SAW (surface acoustic wave) vibrating piece.
The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate A piezoelectric material such as lead acid (PZT), zinc oxide (ZnO), and aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the resonator element may be electrostatic driving using a Coulomb force in addition to the piezoelectric effect of the piezoelectric body.

  DESCRIPTION OF SYMBOLS 1,2 ... Crystal resonator as a vibration device, 5 ... Crystal oscillator as a vibration device, 10 ... Quartz vibration piece as a vibration piece, 11, 12 ... Vibrating arm, 13 ... Base, 14, 15 ... Extraction electrode, 16 , 17 ... Main surface, 20 ... Package, 21 ... Base part, 22 ... Lid, 23a, 23b ... Internal terminal, 24 ... Recess, 24a ... Bottom, 24b ... Recess, 24c ... Bottom, 24d ... Internal connection terminal, 25 ... bottom surface, 26, 26a, 26b, 27, 27a, 27b ... external terminal, 28 ... sealing portion, 28a ... concave portion, 28b ... bottom surface, 28c ... through hole, 28d ... sealing material, 28e ... through hole forming portion, 28f ... inner wall, 28g ... inclined portion, 29 ... bonding member, 30 ... conductive adhesive, 40 ... IC chip as an oscillation circuit, 41 ... metal wire, 120 ... package, 128 ... sealing portion, 128g ... inclined portion 700 ... mobile phone, 701 ... liquid crystal display device, 702 ... operation button, 703 ... earpiece, 704 ... mouthpiece, S ... internal space.

Claims (8)

A through hole that communicates the internal space and the external space is provided with a recess provided on the bottom surface,
The through hole is formed in a circular shape in plan view,
The package is characterized in that an inclined portion is provided on the bottom surface of the concave portion so that a spherical sealing material that seals the through-hole when heated and melted contacts the inner wall of the concave portion. The package of claim 1, wherein
The inclined portion has a through hole forming portion in which the through hole is formed protruding toward the external space side,
The package surrounding the through hole forming portion is formed so as to be inclined so that the depth of the concave portion on the through hole forming portion side is shallow and the depth on the inner wall side is deep. The package of claim 1, wherein
The package is characterized in that the inclined portion is formed in an inclined shape so that a depth on one side facing the through hole in the recess is shallow and a depth on the other side is deep. The package of claim 3,
The package, wherein the through hole is provided to be offset toward the one side of the recess. In the package according to any one of claims 1 to 3,
The recess and the through hole are formed concentrically,
The diameter of the spherical sealing material is larger than the radius of the recess, and has a size that covers a part of the through hole in a plan view in a state in contact with the inner wall of the recess. Package. A package according to any one of claims 1 to 5;
A vibrating piece housed in the internal space of the package;
The vibrating device is characterized in that the through hole is sealed with the sealing material. The vibrating device according to claim 6,
An oscillating device further comprising an oscillating circuit for driving the oscillating piece.   An electronic apparatus comprising the vibration device according to claim 6.

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