CN107743022A - Ceramic CSP package substrate constructions - Google Patents
Ceramic CSP package substrate constructions Download PDFInfo
- Publication number
- CN107743022A CN107743022A CN201710978860.6A CN201710978860A CN107743022A CN 107743022 A CN107743022 A CN 107743022A CN 201710978860 A CN201710978860 A CN 201710978860A CN 107743022 A CN107743022 A CN 107743022A
- Authority
- CN
- China
- Prior art keywords
- hole
- turntable
- substrate
- line layer
- package substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
Abstract
The present invention relates to a kind of ceramic CSP package substrate constructions, including first line layer, intermediate layer and the second line layer；The first line layer includes first substrate, and the first substrate is provided with some first through hole；The intermediate layer includes second substrate, and the second substrate is provided with some second through holes；Second line layer includes the 3rd substrate, the signal panels being arranged on the 3rd substrate and shielding piece；3rd substrate is provided with some third through-holes, and the third through-hole is in shift to install with second through hole.Above-mentioned ceramic CSP package substrate constructions, first through hole, the second through hole and third through-hole can prevent welding leakage tin in shifting to install, ensure the air-tightness and stability of welding；Signal panels are set using three polarity, be can be suitably used for differential signal transmission and are transmitted with non-differential signal, and the shielding piece of sheet is set around signal panels, strengthen antijamming capability, it is ensured that the stability of signal transmission.
Description
Technical field
The present invention relates to electron device package manufacturing technology field, more particularly to a kind of ceramic CSP package substrate constructions.
Background technology
SAW device is a kind of device for carrying out simulation process to electric signal using surface acoustic wave.With the hair of technology
Exhibition, requirement to SAW device also more and more higher, does not require nothing more than dependable performance, and for the volume of SAW device
Also require more to minimize, therefore, the encapsulation of SAW device encapsulates also from the Metal Packaging of beginning to SMD, develops into existing
CSP encapsulate (Chip Scale Package, wafer-level package), widened its application field significantly.
The CSP package substrates that the country uses at present when emphasizing Miniaturization Design, ask by the air-tightness that have ignored package substrate
Topic, easily occur rosin joint dry joint phenomenon when the component of SAW device is welded on CSP package substrates, it is good to reduce product
Rate.
The content of the invention
Based on this, the present invention provides a kind of ceramic CSP package substrate constructions, reasonable in design, ensures the airtight of welding
Property and stability, it is ensured that signal transmission stability.
In order to realize the purpose of the present invention, the present invention adopts the following technical scheme that：
A kind of ceramic CSP package substrate constructions, for encapsulating SAW device, it is characterised in that the ceramic CSP envelopes
Dress board structure include first line layer, the first line layer that is sticked intermediate layer and be attached at the intermediate layer away from institute
The second line layer of the one side of first line layer is stated, second line layer is used for the chip for connecting the SAW device；
The first line layer includes first substrate, and the first substrate is provided with some first through hole；The intermediate layer includes second
Substrate, the second substrate are provided with some second through holes, and each second through hole corresponds to and connects each described first respectively to be led to
Hole；Second line layer includes threeth substrate corresponding with the second substrate, is arranged at the 3rd substrate away from institute
State some signal panels in the one side in intermediate layer and enclose the shielding piece for setting the signal panels；The shielding piece is described for connecting
The ground signalling position of chip；3rd substrate is provided with some third through-holes, and the third through-hole is in second through hole
Shift to install；The signal panels are set using three polarity, including an input signal disk and two output signal disks；It is non-when selecting
When differential signal exports, the input signal disk is used to connect external input signal, and an output signal disk is used to connect institute
The output signal position of chip is stated, another output signal disk is used for the ground signalling position for connecting the chip；When selection difference
During signal output, the input signal disk is used to connect the external input signal, and the two output signal disks are used to connect
The output signal position of the chip.
Above-mentioned ceramic CSP package substrate constructions, first through hole, the second through hole and third through-hole are in shifting to install, in electronics
Component can prevent welding leakage tin when welding, ensure the air-tightness and stability of welding；Meanwhile signal panels are set using three polarity
Put, can be suitably used for differential signal transmission and transmitted with non-differential signal, and the shielding piece of sheet is set around signal panels, enhancing
Antijamming capability, it is ensured that the stability of signal transmission.
In one of the embodiments, the first line layer also includes being arranged at the first substrate away from the centre
Some welded discs on of layer and be arranged at the first substrate connect the intermediate layer while on some first in
Rotating disk；Each first turntable corresponds with each welded disc；The first through hole extends through mutually corresponding institute
State welded disc and first turntable.
In one of the embodiments, if the intermediate layer also includes being respectively arranged at the second substrate opposing sides
Dry second turntable and some 3rd turntables；3rd turntable corresponds with second turntable；Described second
Through hole extends through mutually corresponding second turntable and the 3rd turntable；Second turntable and described first
Turntable corresponds.
In one of the embodiments, respectively state third through-hole extend through mutually corresponding to the 4th turntable it is each described
Signal panels, mutually corresponding 4th turntable and the shielding piece；4th turntable and the 3rd turntable one
One correspondence.
In one of the embodiments, first turntable is closely sticked second turntable, the 3rd transfer
Disk is closely sticked the 4th turntable；One end of second through hole abuts the 4th turntable, the third through-hole
One end abuts the 3rd turntable.
In one of the embodiments, the hole wall of the first through hole, second through hole and the third through-hole plates
There is the second conductive layer, first line layer, the intermediate layer and second line layer described in electrical communication.
In one of the embodiments, the welded disc, the exposed part of the 3rd turntable, the 4th turntable
Exposed part, the signal panels and it is described shielding piece be coated with second conductive layer.
In one of the embodiments, the first line layer, the intermediate layer and the thickness model of second line layer
It is 0.08mm-0.12mm to enclose；The first through hole, the pore diameter range of second through hole and the third through-hole are
1.26mm-1.28mm。
In one of the embodiments, the first line layer, the intermediate layer and the thickness of second line layer are equal
For 0.1mm；The first through hole, the aperture of second through hole and the third through-hole are 1.27mm.
In one of the embodiments, the first line layer uses HTCC with the intermediate layer, second line layer
One overall structure of Integration ofTechnology.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the ceramic CSP package substrate constructions of a better embodiment of the invention；
Fig. 2 is the schematic perspective view at another visual angle of ceramic CSP package substrate constructions shown in Fig. 1；
Fig. 3 is the decomposing schematic representation of ceramic CSP package substrate constructions shown in Fig. 1；
Fig. 4 is the decomposing schematic representation at another visual angle of ceramic CSP package substrate constructions shown in Fig. 3；
Fig. 5 is the top view of ceramic CSP package substrate constructions shown in Fig. 1；
Fig. 6 is the sectional view shown in Fig. 5 at A-A；
Accompanying drawing marks explanation：
10- first line layers, 11- first substrates, 12- welded discs, the turntables of 13- first, 14- first through hole；
20- intermediate layers, 21- second substrates, the turntables of 22- second, the turntables of 23- the 3rd, the through holes of 24- second；
The line layers of 30- second, the substrates of 31- the 3rd, the turntables of 32- the 4th, 33- signal panels, 331- input signal disks, 332-
Output signal disk, 34- shielding pieces, 35- third through-holes.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Fig. 1 to Fig. 6 is referred to, for the ceramic CSP package substrate constructions of a better embodiment of the invention, including First Line
Road floor 10, the first line floor 10 that is sticked intermediate layer 20 and be attached at the intermediate layer 20 away from the first line floor
10 the second line layer 30.The first line layer 10 uses HTCC with the intermediate layer 20, second line layer 30
(High-temperature co-fired ceramics, HTCC) one overall structure of Integration ofTechnology.
The first line layer 10 includes first substrate 11, is arranged at the first substrate 11 away from the intermediate layer 20
Some welded discs 12 on and be arranged at the first substrate 11 connect the intermediate layer 20 while on some first
Turntable 13, each first turntable 13 correspond with each welded disc 12.In the present embodiment, the welded disc 12
Quantity, the quantity of first turntable 13 be five.
The position that the welded disc 12 is corresponded on the first substrate 11 is provided with some first through hole 14, and each described first is logical
Hole 14 is respectively arranged at the side inside the corresponding welded disc 12.The first through hole 14 extends through mutually corresponding institute
State welded disc 12 and first turntable 13.
In the present embodiment, the quantity in the intermediate layer 20 is one；In other embodiments, the quantity in the intermediate layer 20
Can also be two or more.The intermediate layer 20 includes second substrate 21 and is respectively arranged at the second substrate 21 relative two
Some second turntables 22 in face and some 3rd turntables 23, each 3rd turntable 23 and each second turntable 22
Correspond.In the present embodiment, the quantity of second turntable 22, the quantity of the 3rd turntable 23 are five.
The position that second turntable 22 is corresponded on the second substrate 21 is provided with some second through holes 24, and described second
Through hole 24 is respectively arranged at the side inside corresponding second turntable 22.Second through hole 24 extends through mutually right
Second turntable 22 answered and the 3rd turntable 23.
In the present embodiment, each second turntable 22 corresponds with each first turntable 13, and each described
Two through holes 24 are corresponded and connected with each first through hole 14.
In the present embodiment, second line layer 30 connects the chip of SAW device.Second line layer 30
Including threeth substrate 31 corresponding with the second substrate 21, it is arranged at the 3rd substrate 31 and connects the intermediate layer 20
Some 4th turntables 32 on, be arranged at the 3rd substrate 31 away from the intermediate layer 20 while on some letters
Dialer 33 and enclose the shielding piece 34 for setting the signal panels 33.In the present embodiment, the quantity of the 4th turntable 32 is five,
The quantity of the signal panels 33 is three.In the signal panels 33 and the described 4th of the close opposite two ends of 3rd substrate 31 the
Rotating disk 34 is corresponding.
In the present embodiment, the signal panels 33 are set using three polarity, including an input signal disk 331 and two it is defeated
Go out signal panels 332.When selecting non-differential signal output, the input signal disk 331 is used to connect external input signal, one
The output signal disk 332 is used for the output signal position for connecting the chip, and another described output signal disk 332 is used to connect
The ground signalling position of the chip；When selecting differential signal output, the input signal disk 331 is used to connect external input letter
Number, the two output signal disks 332 are used to connect the output signal position of the chip.The signal panels 33 are set using three polarity
The versatility of the ceramic CSP package substrate constructions can be greatly improved by putting.
In the present embodiment, the shielding piece 34 connects the ground signalling position of the chip.The shielding piece 34 has big
Area is set, and effectively strengthens the function of shielding of the ceramic CSP package substrate constructions.In the present embodiment, the signal panels 33,
Connection between the shielding piece 34 and the chip is using plant gold goal face-down bonding mode.
The position that each 4th turntable 32 is corresponded on 3rd substrate 31 is provided with some third through-holes 35.In this reality
Apply in example, the quantity of the third through-hole 35 is seven, wherein four the described 3rd positioned at the centre position of the 3rd substrate 31
Through hole 35 is through mutually corresponding 4th turntable 32 and shielding piece 34, and third through-hole 35 described in the other three is through mutual
Corresponding 4th turntable 32 and the signal panels 33.
Further, please refer to Fig. 5 and Fig. 6, in the present embodiment, the third through-hole 35 and second through hole
24 in shifting to install so that one end of the third through-hole 35 is closely sticked the 3rd turntable 23, second through hole 24
One end be closely sticked the 4th turntable 33.
In the present embodiment, the first substrate 11, the second substrate 21 and the 3rd substrate 31 are ceramic material
Material is made.
In the present embodiment, the first time line layer 10, the intermediate layer 20 and the thickness of second line layer 30
Scope is 0.08-0.12mm, it is preferably to is 0.1mm；The first through hole 14, second through hole 24 and the third through-hole
35 pore diameter range is 1.26mm-1.28mm, it is preferably to which 1.27mm (is equal to 50mil) after conversion.
When the ceramic CSP package substrate constructions of the present embodiment are manufactured, the first substrate 11, second substrate are taken respectively
21 and the 3rd substrate 31 pass through a series of printing flow, obtain it is preliminary made of the first line layer 10 and the intermediate layer
20th, second line layer 30, in this flow, the first conductive layer is electroplated in hole metallization and whole plate plating, i.e., now described
Welded disc 12, the first turntable 13, the hole wall of first through hole 14, second turntable 22, the 3rd turntable 23, the second through hole
24 hole wall, the 4th turntable 32, the signal panels 33, the shielding piece 34 and the hole wall of the third through-hole 35 plate
There is first conductive layer.
Then the first line layer 10 made of again will be preliminary uses with the intermediate layer 20, second line layer 30
HTCC Integration ofTechnologies are an overall structure so that each first turntable 13 is closely sticked each second turntable 22,
Each first through hole 14 is corresponding to connect each second through hole 24, and the 3rd turntable 23 is closely sticked the 4th transfer
Disk 32, the hole wall of described one end of second through hole 24 abut the 4th turntable 32, the hole of described one end of third through-hole 35
Wall abuts the 3rd turntable 23, realizes the first line layer 10 and the intermediate layer 20 and second line layer 30
Electrical communication, obtain the ceramic CSP package substrate constructions of semi-finished product.
Further, the ceramic CSP package substrate constructions of semi-finished product electroplate upper second conductive layer, by the institute of semi-finished product
State exposed first conductive layer of ceramic CSP package substrate constructions and be replaced into second conductive layer, i.e., described welded disc 12,
The hole wall of first through hole 14, the hole wall of the second through hole 24, the exposed part of the 3rd turntable 23, the exposed portion of the 4th turntable 32
Point, the signal panels 33, the shielding piece 34 and the hole wall of the third through-hole 35 be replaced into second conductive layer.Herein
Place, the erosion of stinging that first conductive layer occurs with second conductive layer are ignored.
In the present embodiment, first conductive layer is silver layer, and second conductive layer is layer gold；First conductive layer
Thickness with second conductive layer is 0.0254mm (being equal to 0.1mil after conversion).
In the present embodiment, the third through-hole 35 and second through hole 24, the first through hole 14 are in shift to install,
The third through-hole 35 is overcome to cause with second through hole 24, the first through hole 14 in welding leakage tin when directly connecting setting
The defects of rosin joint dry joint phenomenon, ensure the air-tightness and stability of welding, improve product yield.
Yet further, the ceramic CSP package substrate constructions can also design not according to different demands in production
The hole position of the present embodiment and the parameter setting of pad are same as, to be adapted to different SAW devices, improves the ceramic CSP
The versatility of package substrate construction.
Above-mentioned ceramic CSP package substrate constructions, first through hole 14, the second through hole 24 are in shift to install with third through-hole 35,
Welding leakage tin can be prevented when electronic component welds, ensures the air-tightness and stability of welding；Meanwhile signal panels 33 use three
Polarity is set, and be can be suitably used for differential signal transmission and is transmitted with non-differential signal, and the screen of sheet is set around signal panels 33
Piece 34 is covered, strengthens antijamming capability, it is ensured that the stability of signal transmission.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. ceramic CSP package substrate constructions, for encapsulating SAW device, it is characterised in that the ceramic CSP encapsulation Board structure include first line layer, the first line layer that is sticked intermediate layer and be attached at the intermediate layer away from described Second line layer of the one side of first line layer, second line layer are used for the chip for connecting the SAW device；Institute Stating first line layer includes first substrate, and the first substrate is provided with some first through hole；The intermediate layer includes the second base Plate, the second substrate are provided with some second through holes, and each second through hole corresponds to and connects each first through hole respectively； Second line layer includes threeth substrate corresponding with the second substrate, is arranged at the 3rd substrate away from described Some signal panels in the one side of interbed and enclose the shielding piece for setting the signal panels；The shielding piece is used to connect the chip Ground signalling position；3rd substrate is provided with some third through-holes, and the third through-hole is with second through hole in dislocation Set；The signal panels are set using three polarity, including an input signal disk and two output signal disks；It is non-differential when selecting During signal output, the input signal disk is used to connect external input signal, and an output signal disk is used to connect the core The output signal position of piece, another output signal disk are used for the ground signalling position for connecting the chip；When selection differential signal During output, the input signal disk is used to connect the external input signal, and the two output signal disks are used to described in connection The output signal position of chip.
- 2. ceramic CSP package substrate constructions according to claim 1, it is characterised in that the first line layer also includes Some welded discs for being arranged in one side of the first substrate away from the intermediate layer and it is arranged at the first substrate connection Some first turntables in the one side in the intermediate layer；Each first turntable corresponds with each welded disc；Institute State first through hole and extend through the mutually corresponding welded disc and first turntable.
- 3. ceramic CSP package substrate constructions according to claim 2, it is characterised in that the intermediate layer also includes difference It is arranged at some second turntables of the second substrate opposing sides and some 3rd turntables；3rd turntable and institute State the second turntable one-to-one corresponding；Second through hole is extended through in mutually corresponding second turntable and the described 3rd Rotating disk；Second turntable corresponds with first turntable.
- 4. ceramic CSP package substrate constructions according to claim 3, it is characterised in that respectively state third through-hole and extend through 4th the turntable each signal panels, mutually corresponding 4th turntable and the shielding piece corresponding to mutually；Institute The 4th turntable is stated to correspond with the 3rd turntable.
- 5. ceramic CSP package substrate constructions according to claim 4, it is characterised in that first turntable closely pastes If second turntable, the 3rd turntable is closely sticked the 4th turntable；One end of second through hole abuts 4th turntable, one end of the third through-hole abut the 3rd turntable.
- 6. ceramic CSP package substrate constructions according to claim 5, it is characterised in that the first through hole, described second The hole wall of through hole and the third through-hole is coated with the second conductive layer, first line layer described in electrical communication, the intermediate layer with Second line layer.
- 7. ceramic CSP package substrate constructions according to claim 6, it is characterised in that in the welded disc, the described 3rd The exposed part of rotating disk, the exposed part of the 4th turntable, the signal panels and the shielding piece are coated with described second Conductive layer.
- 8. ceramic CSP package substrate constructions according to claim 1, it is characterised in that the first line layer, it is described in The thickness range of interbed and second line layer is 0.08mm-0.12mm；The first through hole, second through hole and institute The pore diameter range for stating third through-hole is 1.26mm-1.28mm.
- 9. ceramic CSP package substrate constructions according to claim 8, it is characterised in that the first line layer, it is described in The thickness of interbed and second line layer is 0.1mm；The first through hole, second through hole and the third through-hole Aperture is 1.27mm.
- 10. ceramic CSP package substrate constructions according to claim 1, it is characterised in that the first line layer with it is described Intermediate layer, second line layer use one overall structure of HTCC Integration ofTechnologies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710978860.6A CN107743022A (en) | 2017-10-19 | 2017-10-19 | Ceramic CSP package substrate constructions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710978860.6A CN107743022A (en) | 2017-10-19 | 2017-10-19 | Ceramic CSP package substrate constructions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107743022A true CN107743022A (en) | 2018-02-27 |
Family
ID=61237860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710978860.6A Pending CN107743022A (en) | 2017-10-19 | 2017-10-19 | Ceramic CSP package substrate constructions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107743022A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029375A (en) * | 2019-11-25 | 2020-04-17 | 云谷（固安）科技有限公司 | Display screen and display device |
| CN116455343A (en) * | 2023-05-15 | 2023-07-18 | 烟台明德亨电子科技有限公司 | Processing method of ceramic base for crystal oscillator |
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| CN116455343B (en) * | 2023-05-15 | 2024-01-23 | 烟台明德亨电子科技有限公司 | Processing method of ceramic base for crystal oscillator |
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