JP2016129288A - Electronic device, electronic apparatus and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing short circuit of electrode pads via a conductive bonding member, and problems on the mounting of an electronic element.SOLUTION: A crystal oscillator 1 includes a package base 31 having a recess 35, a thermistor 20 housed in the recess 35, and a plurality of electrode pads 36a, 36b provided on the inner bottom surface 36 of the recess 35, and to which the thermistor 20 is bonded via a conductive bonding member 41. At least one (e.g., 36a) of a pair of opposite electrode pads 36a, 36b includes a notch K at a part overlapping the thermistor 20 in the plan view, on the side opposite to the other electrode pad 36b, and includes a shrunk width part H, where the width in a direction perpendicular to the arrangement direction of the pair of opposite electrode pads 36a, 36b becomes narrower as receding from the thermistor 20, at a part on the side opposite from the side facing the other electrode pad 36b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device, an electronic apparatus including the electronic device, and a moving object.

  2. Description of the Related Art Conventionally, as an example of an electronic device, a piezoelectric vibration element, a temperature-sensitive component, a first housing portion that houses a piezoelectric vibration element, and a container that has a second housing portion that houses a temperature-sensitive component are provided. The container has a first insulating substrate having a through-hole constituting the second accommodating portion and having a plurality of mounting terminals at the bottom, and is laminated and fixed to the first insulating substrate, and has a piezoelectric vibration element mounted on the surface. A first electrode pad for mounting, a second insulating substrate having a second electrode pad for mounting a temperature-sensitive component on the back surface, and a laminated fixing on the surface of the second insulating substrate, There is known a piezoelectric device including a third substrate that constitutes a housing portion (see, for example, Patent Document 1).

  Further, as another example, a housing, a substrate housed in the housing and having a pad, a component having a mounting surface facing the substrate and having an electrode on an edge, a side surface of the component, and a pad A conductive member that is applied over a portion and electrically connects the pad and the electrode, and the pad has a first application region that is positioned away from between the mounting surface of the component and the substrate. And a second pad portion that is located between the component mounting surface and the substrate and has a shape protruding from the first pad portion on the center side of the mounting surface. It is known (see, for example, Patent Document 2).

JP 2013-102315 A JP 2014-3101A

In the piezoelectric device disclosed in Patent Document 1, a temperature-sensitive component is mounted on the second electrode pad via a conductive bonding member such as solder.
According to FIG. 1 and the like of Patent Document 1, the planar shape of the second electrode pad of the piezoelectric device is rectangular (square).
In the piezoelectric device, since the temperature-sensitive component is accommodated in the concave second accommodating portion, for example, paste such as cream solder to the second electrode pad provided on the bottom surface of the second accommodating portion It is difficult to use screen printing for applying the conductive conductive bonding member, and a local application device such as a dispenser is used.

In a coating method using a local coating device such as a dispenser, it is difficult to accurately control the coating amount of a conductive bonding member such as cream solder on the second electrode pad, as compared with screen printing.
As a result, since the application amount of the conductive bonding member such as cream solder is likely to vary, the piezoelectric device may cause a short circuit (solder bridge) between the second electrode pads via the conductive bonding member. .

For example, the pad configuration shown in FIG. 7 of Patent Document 2 is effective as a countermeasure.
By adopting the configuration in which a part of the pair of pads facing each other is cut away, the piezoelectric device of Patent Document 1 has a partially widened gap between the second electrode pads facing each other. Short circuit through the conductive bonding member (conductive member) can be reduced.

However, the planar shape of the pad shown in FIG. 7 and the like of Patent Document 2 remains a rectangular shape except for a part of the pair of pads facing each other (a notched recess).
For this reason, in the pad configuration shown in FIG. 7 of Patent Document 2, the bonding failure of the temperature sensitive component due to the variation in the application amount of the conductive bonding member such as cream solder in the piezoelectric device, or the temperature sensitive component There is room for improvement in mounting problems of temperature-sensitive components such as the rising phenomenon (Manhattan phenomenon) and temperature-sensitive component displacement.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic device according to this application example is provided with a substrate provided with a recess, an electronic element accommodated in the recess, and an inner bottom surface of the recess, and an electrode of the electronic element is electrically conductive. A plurality of electrode pads bonded via a bonding member, wherein at least one of the pair of electrode pads facing each other among the plurality of electrode pads is a side facing the other electrode pad, A notch is provided in a portion overlapping the electronic element in a plan view, and the pair of electrode pads is formed on a part opposite to the side facing the other electrode pad as the distance from the electronic element increases. It includes a reduced width portion having a narrow width along a direction orthogonal to the line-up direction.

According to this, in the electronic device, at least one of the pair of electrode pads facing each other is on the side facing the other electrode pad, and the cutout portion is provided in a portion overlapping the electronic element in a plan view, and In addition, the portion opposite to the side facing the other electrode pad includes a reduced width portion whose width decreases along the direction orthogonal to the direction in which the pair of electrode pads are arranged as the distance from the electronic element increases.
As a result, the electronic device has a wide gap between the opposing sides of the pair of electrode pads, and even when the application amount of the conductive bonding member such as cream solder is reduced, the conductive bonding is performed at the time of reflow mounting. The members easily gather at the center of the electrode pad.
As a result, the electronic device can reduce short-circuiting between the electrode pads through the conductive bonding member, and the wetting and spreading of the conductive bonding member is controlled during reflow mounting, so that the electronic device can be stabilized on the side surface of the electrode. This makes it easier to form a fillet (a hem-spread shape) and increases the self-alignment effect (autonomous position repair phenomenon during reflow mounting using a conductive bonding member such as cream solder on the external substrate of the electronic device). it can.
As a result, the electronic device can reduce inconveniences in mounting the electronic element such as defective bonding of the electronic element, a rising phenomenon of the electronic element, and a positional deviation of the electronic element.

  Application Example 2 In the electronic device according to the application example described above, the reduced-width portion has an outer shape that is obtained by cutting two corners adjacent to each other along the orthogonal direction of the virtual rectangle in plan view. It is preferable that it is satisfied.

According to this, since the outer shape of the reduced width portion is composed of a shape after cutting two adjacent corner portions along the orthogonal direction of the virtual rectangle in plan view, the reduced size portion is reduced. The width portion is tapered.
As a result, in the electronic device, the fillet is more easily formed on the side surface of the electrode (electrode terminal) of the electronic element, and the self-alignment effect can be further increased.

  Application Example 3 In the electronic device according to the application example described above, the reduced width portion is 1/2 or more and 2/3 or less with respect to a portion exposed from the electronic element before corner cutting of the virtual rectangle. It is preferable that it is an area.

According to this, in the electronic device, the reduced width portion has an area of 1/2 or more and 2/3 or less with respect to the portion exposed from the electronic element before the corner cut of the virtual rectangle. For example, even when the application amount of the conductive bonding member such as cream solder is reduced, the conductive bonding member is more likely to gather at the center of the electrode pad during reflow mounting.
Thereby, in the electronic device, the wetting and spreading of the conductive bonding member is controlled during reflow mounting, the fillet is more stably formed on the side surface of the electrode of the electronic element, and the self-alignment effect can be further increased.

  Application Example 4 In the electronic device according to the application example described above, it is preferable that the electronic device further includes a resonator element mounted on the substrate and functions as a vibrator.

  According to this, since the electronic device further includes the resonator element mounted on the substrate and functions as a vibrator, it is possible to provide a highly reliable vibrator with reduced defects in mounting the electronic element. it can.

  Application Example 5 In the electronic device according to the application example, it is preferable that the electronic element is a temperature sensitive element.

According to this, since the electronic device is a temperature sensitive element, the temperature in the vicinity of the resonator element can be detected by the temperature sensitive element.
As a result, since the electronic device can correct the frequency of the resonator element based on the temperature detected by the temperature sensing element, it is possible to provide a vibrator having excellent frequency temperature characteristics.

  Application Example 6 In the electronic device according to the application example, it is preferable that the temperature sensing element is a thermistor or a temperature measuring semiconductor.

  According to this, since the temperature sensing element is a thermistor or a temperature measuring semiconductor, the electronic device can accurately detect the ambient temperature based on the characteristics of the thermistor and the temperature measuring semiconductor.

  Application Example 7 An electronic apparatus according to this application example includes the electronic device according to any one of the application examples described above.

  According to this, since the electronic apparatus of this configuration includes the electronic device described in any one of the above application examples, the effect described in any one of the above application examples is achieved, and excellent performance is achieved. It can be demonstrated.

  Application Example 8 A moving object according to this application example includes the electronic device according to any one of the application examples described above.

  According to this, since the mobile body of this configuration includes the electronic device described in any one of the above application examples, the effect described in any one of the above application examples is achieved, and excellent performance is achieved. It can be demonstrated.

It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is a top view seen from the lid (lid body) side, (b) is sectional drawing in the AA of (a). (C) is the top view seen from the bottom face side. The model enlarged view of the B section of Drawing 1 (c). The circuit diagram in connection with the drive of the crystal oscillator containing the temperature sensing element as an electronic element accommodated in the crystal oscillator of 1st Embodiment. (A), (b) is a schematic top view which shows the shape variation of an electrode pad. It is a schematic diagram which shows schematic structure of the crystal resonator of the modification of 1st Embodiment, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (C) is the top view seen from the bottom face side. It is a schematic diagram which shows schematic structure of the crystal oscillator of 2nd Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of 3rd Embodiment, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. The model perspective view which shows the mobile telephone as an electronic device. The model perspective view which shows the motor vehicle as a moving body.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a crystal resonator as an example of an electronic device will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. 1A is a plan view seen from the lid (lid) side, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. These are the top views seen from the bottom face side. FIG. 2 is a schematic enlarged view of a portion B in FIG.
In addition, the lid is omitted in the following plan views including the lid side including FIG. In addition, for easy understanding, the dimensional ratio of each component is different from the actual one.
FIG. 3 is a circuit diagram relating to driving of a crystal unit including a temperature sensitive element as an electronic element housed in the crystal unit of the first embodiment.

  As shown in FIG. 1, the crystal resonator 1 accommodates a crystal resonator element 10 as a resonator element, a thermistor 20 as an example of a temperature sensitive element as an electronic element, and the crystal resonator element 10 and the thermistor 20. Package 30.

The quartz crystal vibrating piece 10 is, for example, an AT-cut type quartz substrate cut out at a predetermined angle from a quartz crystal or the like, and has a vibrating portion 11 having a planar shape formed in a substantially rectangular shape and excited by thickness shear vibration. A base portion 12 connected to the vibration portion 11 is integrally provided.
The quartz crystal resonator element 10 has a base 12 formed with lead electrodes 15 a and 16 a drawn from substantially rectangular excitation electrodes 15 and 16 formed on one main surface 13 and the other main surface 14 of the vibration portion 11. Yes.

The lead electrode 15 a is drawn from the excitation electrode 15 on one main surface 13 to the base portion 12 along the longitudinal direction (left and right direction on the paper surface) of the crystal vibrating piece 10, and to the other main surface 14 along the side surface of the base portion 12. It wraps around and extends to the other main surface 14 of the base 12.
The lead electrode 16 a is drawn from the excitation electrode 16 on the other main surface 14 to the base portion 12 along the longitudinal direction of the quartz crystal vibrating piece 10, wraps around the one main surface 13 along the side surface of the base portion 12, and One main surface 13 is extended.
The excitation electrodes 15 and 16 and the extraction electrodes 15a and 16a are, for example, metal films having a structure in which Cr (chromium) is used as a base layer and Au (gold) or a metal mainly composed of Au is laminated thereon. Yes.

The thermistor 20 is, for example, a chip-type (cuboid-shaped) temperature sensing element (temperature sensing resistance element), and has electrodes 21 and 22 at both ends, and is a resistance having a large electrical resistance change with respect to a temperature change. Is the body.
As the thermistor 20, for example, a thermistor called an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature is used. NTC thermistors are often used as temperature sensors because the relationship between changes in temperature and resistance value is linear.
The thermistor 20 is housed in the package 30 and detects the temperature in the vicinity of the quartz crystal vibrating piece 10, thereby serving as a temperature sensor that contributes to correction of frequency fluctuations associated with the temperature change of the quartz crystal vibrating piece 10.

The package 30 is a substantially flat plate having a substantially rectangular planar shape, and includes a package base 31 as a substrate having a first main surface 33 and a second main surface 34 that are in a front-back relationship with each other, And a flat lid 32 that covers the first main surface 33 side, and is configured in a substantially rectangular parallelepiped shape.
The package base 31 has a flat plate-like first layer 31a whose one surface becomes the first main surface 33, an opening in the center, and is laminated on the opposite side of the first layer 31a from the first main surface 33. A second layer 31b whose surface opposite to the laminated surface is the second main surface 34, and a frame-like third layer 31c laminated on the first main surface 33 side of the first layer 31a. I have.
The first layer 31a and the second layer 31b of the package base 31 are formed of an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide material, which are formed by stacking and firing ceramic green sheets. Ceramic-based insulating materials such as sintered bodies and glass-ceramic sintered bodies, or crystals, glass, silicon (high resistance silicon), and the like are used.
The third layer 31c and the lid 32 of the package base 31 are made of the same material as the package base 31, or a metal such as Kovar or 42 alloy.

Internal terminals 33 a and 33 b are provided on the first main surface 33 of the package base 31 at positions facing the extraction electrodes 15 a and 16 a of the crystal vibrating piece 10.
In the quartz crystal resonator element 10, the lead electrodes 15a and 16a are joined to the internal terminals 33a and 33b via a conductive adhesive 40 such as an epoxy, silicone, or polyimide based material mixed with a conductive material such as a metal filler. Has been. As a result, the crystal vibrating piece 10 is mounted on the package base 31.

In the crystal resonator 1, the third layer 31 c of the package base 31 is covered with the lid 32 in a state where the crystal vibrating piece 10 is bonded to the internal terminals 33 a and 33 b of the package base 31, and the package base 31 and the lid 32 are separated from each other. The inner space S including the first layer 31a, the third layer 31c, and the lid 32 of the package base 31 is hermetically sealed by being joined by a joint member such as seam welding, low-melting glass, or adhesive. It has been stopped.
In FIG. 1, the metal 3rd layer 31c and the metal lid 32 are joined by seam welding as an example. In this case, the third layer 31c is brazed to the metallized layer (not shown) of the first layer 31a.
The airtightly sealed internal space S of the package 30 is in a reduced vacuum state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon.

On the second main surface 34 side of the package base 31, a recess 35 is provided by the opening of the second layer 31b and the laminated surface of the first layer 31a. The planar shape of the recess 35 is, for example, a track shape.
Electrode pads 36a and 36b are provided on the inner bottom surface 36 of the recess 35 (the laminated surface of the first layer 31a on the second layer 31b side) at positions facing the electrodes 21 and 22 of the thermistor 20, respectively.
The thermistor 20 is reflow-mounted through a conductive bonding member 41 such as cream solder applied to the electrode pads 36a and 36b using a local application device such as a dispenser, so that the electrodes 21 and 22 are connected to the electrode pads 36a. , 36b. As a result, the thermistor 20 is accommodated in the recess 35 of the package base 31.
The thermistor 20 is arranged at a substantially central portion of the recess 35 such that the longitudinal direction (direction connecting the electrode 21 and the electrode 22) is along the longitudinal direction of the package base 31 (left and right direction on the paper surface).

As shown in FIGS. 1 and 2, the electrode pads 36 a and 36 b are formed larger than the electrodes 21 and 22 of the thermistor 20, and at least one of the pair of electrode pads 36 a and 36 b facing each other (here, both) is A notch K that cuts into the inner side of the electrode pads 36a, 36b is provided on the side facing the other electrode pad (36b for 36a, 36a for 36b) and overlapping the thermistor 20 in plan view. Yes.
The cutout portion K cuts the electrode pads 36a and 36b into a rectangular shape in plan view. Thereby, the space | interval of the electrode pad 36a and the electrode pad 36b is partially wide (as much as the notch part K).

In addition, the electrode pads 36a and 36b are opposite to the notch K side (sides facing each other) and are exposed from the thermistor 20 in a plan view, as they move away from the thermistor 20, It includes a reduced width portion H in which the width along the direction orthogonal to the direction in which the electrode pads 36a and 36b are arranged is narrow.
The outer shape of the reduced width portion H is formed by cutting the two adjacent corner portions along the orthogonal direction in the temporary electrode pads 36a ′ and 36b ′ as virtual rectangles in plan view. . Accordingly, the hypotenuses H1 and H2 of the reduced width portion H are straight lines.
The reduced width portion H is 1/2 or more to the portion R (the hatched portion in FIG. 2) exposed from the thermistor 20 before the corner cutting of the temporary electrode pads 36a ′ and 36b ′. The area is 3 or less.

Electrode terminals 37a, 37b, 37c, and 37d are provided at the four corners of the second main surface 34 of the package base 31, respectively.
Among the four electrode terminals 37a to 37d, for example, two electrode terminals 37b and 37d located on one diagonal are conductive vias (conductive electrodes in which a through hole is filled with a metal or a conductive material). The internal terminals 33a and 33b connected to the extraction electrodes 15a and 16a of the quartz crystal resonator element 10 are connected by internal wiring.
The remaining two electrode terminals 37a and 37c located on the other diagonal are connected to the electrode 21 of the thermistor 20 through the conductive vias V1 and V2 and the internal wirings P1 and P2 that penetrate the second layer 31b of the package base 31. , 22 are connected to electrode pads 36a, 36b.

The four electrode terminals 37a to 37d are formed in a shape in which a planar shape is rectangular and a part on the concave portion 35 side is notched.
The electrode terminal 37c is not shown in FIG. 1 provided at the corners on the outer side of the conductive via V3 and the internal wiring P2 penetrating the first layer 31a of the package base 31 or the package base 31, as shown by broken lines. It is preferable from the viewpoint of improving the shielding property that the conductive layer formed in the castellation (concave portion) is electrically connected to the lid 32 via the third layer 31c. In the case where the third layer 31c is made of an insulating material, a conductive via is also provided in the third layer 31c.
Further, the crystal resonator 1 can further improve the shielding property by grounding the electrode terminal 37c as a ground terminal (GND terminal).

  The internal terminals 33a and 33b, the electrode pads 36a and 36b, and the electrode terminals 37a to 37d are, for example, plated with a coating of Ni (nickel) or Au on a metallized layer such as W (tungsten) or Mo (molybdenum). It consists of the metal film laminated | stacked by.

As shown in FIG. 3, the crystal resonator 1 is configured such that, for example, a crystal vibration is generated by a drive signal applied via an electrode terminal 37 b or 37 d from an oscillation circuit 61 integrated in an IC chip 70 of an electronic device. The piece 10 is excited by the thickness shear vibration and resonates (oscillates) at a predetermined frequency, and outputs a resonance signal (oscillation signal) from the electrode terminals 37b and 37d.
At this time, in the crystal resonator 1, the thermistor 20 detects the temperature in the vicinity of the crystal vibrating piece 10 as a temperature sensor, converts it into a change in voltage value supplied from the power source 62, and detects it from the electrode terminal 37a as a detection signal. Output.

The output detection signal is A / D converted by, for example, an A / D conversion circuit 63 integrated in an IC chip 70 of an electronic device, and input to a temperature compensation circuit 64 that is also integrated in the IC chip 70. Is done. Then, the temperature compensation circuit 64 outputs a correction signal based on the temperature compensation data to the oscillation circuit 61 in accordance with the input detection signal.
The oscillation circuit 61 applies a drive signal corrected based on the input correction signal to the crystal vibrating piece 10 and corrects the resonance frequency of the crystal vibrating piece 10 that fluctuates with a temperature change to a predetermined frequency. To do. The oscillation circuit 61 amplifies the oscillation signal having the corrected frequency and outputs it to the outside.

  As described above, in the crystal resonator 1 of the first embodiment, at least one (here, both) of the pair of electrode pads 36a, 36b facing each other and the other electrode pad (36b if 36a, 36a if 36b). A cutout portion K is provided on the opposite side, which overlaps the thermistor 20 in plan view. In addition, in the crystal unit 1, at least one of the electrode pads 36a and 36b (here, both) is opposite to the side facing the other electrode pad (36b for 36a, 36a for 36b), The portion exposed from the thermistor 20 in plan view includes a reduced width portion H in which the width along the direction orthogonal to the direction in which the electrode pads 36a and 36b are arranged becomes narrower as the distance from the thermistor 20 increases. Yes.

From this, the crystal resonator 1 can be used at the time of reflow mounting even when the gap between the electrode pad 36a and the electrode pad 36b is partially widened and the application amount of the conductive bonding member 41 such as cream solder is reduced. The conductive bonding member 41 is likely to gather at the center of the electrode pads 36a and 36b.
As a result, the crystal unit 1 can reduce the short circuit between the electrode pads 36a and 36b via the conductive bonding member 41, and the wetting and spreading of the conductive bonding member 41 can be controlled during reflow mounting. Fillet can be easily formed stably on the side surfaces of the 20 electrodes 21 and 22, and the self-alignment effect can be increased.
As a result, the crystal unit 1 can reduce problems in mounting the thermistor 20 such as a bonding failure of the thermistor 20, a rising phenomenon of the thermistor 20, and a position shift of the thermistor 20.

Further, the crystal resonator 1 has an outer shape of the reduced width portion H having a shape after cutting two corners adjacent to each other along the orthogonal direction in the temporary electrode pads 36a ′ and 36b ′ in plan view. Therefore, the reduced width portion H has a tapered shape constituted by the linear hypotenuses H1 and H2.
As a result, in the crystal resonator 1, fillets can be more easily formed on the side surfaces of the electrodes 21 and 22 of the thermistor 20, and the self-alignment effect can be further increased.

Further, the crystal resonator 1 has an area of 1/2 or more and 2/3 or less of the portion R where the reduced width portion H is exposed from the thermistor 20 before the corners of the temporary electrode pads 36a ′ and 36b ′. Therefore, for example, even when the application amount of the conductive bonding member 41 such as cream solder is reduced, the conductive bonding member 41 is more likely to gather at the center of the electrode pads 36a and 36b during reflow mounting. .
As a result, in the crystal resonator 1, the wetting and spreading of the conductive bonding member 41 such as cream solder is controlled during reflow mounting, and the fillet is more easily formed on the side surfaces of the electrodes 21 and 22 of the thermistor 20. The self-alignment effect can be further increased.
In the crystal resonator 1, when the area is less than ½, the bonding strength of the thermistor 20 is weak, and when it exceeds 2/3, a fillet is hardly formed.

  Further, since the crystal resonator 1 includes the crystal resonator element 10 mounted on the package base 31 and functions as a resonator, a short circuit or a thermistor via the conductive bonding member 41 between the electrode pads 36a and 36b. Thus, it is possible to provide a highly reliable vibrator in which the mounting problems of the thermistor 20 such as the bonding failure 20, the rising phenomenon of the thermistor 20, and the misalignment of the thermistor 20 are reduced.

Further, since the electronic element is a temperature sensitive element, the crystal resonator 1 can detect the temperature in the vicinity of the quartz crystal vibrating piece 10 with the temperature sensitive element.
As a result, the crystal resonator 1 can correct the frequency of the crystal resonator element 10 based on the temperature detected by the temperature sensing element, and thus can provide a resonator having excellent frequency temperature characteristics.

Further, since the temperature sensitive element is the thermistor 20, the crystal resonator 1 can accurately detect the ambient temperature based on the characteristics of the thermistor 20. Note that a temperature measuring semiconductor may be used as the temperature sensing element instead of the thermistor 20, and the ambient temperature can be accurately detected by the characteristics of the temperature measuring semiconductor. Examples of the temperature measuring semiconductor include a diode or a transistor.
More specifically, in the case of a diode, the temperature is detected by measuring a forward voltage that changes depending on the temperature by using a forward characteristic of the diode and passing a constant current from the anode terminal to the cathode terminal of the diode. can do. In the case of a transistor, the temperature can be detected in the same manner as described above by short-circuiting the base and the collector and causing the collector and the emitter to function as a diode.
The crystal resonator 1 can reduce noise superposition by using a diode or a transistor as a temperature sensitive element.

  Note that the package base 31 of the crystal unit 1 can be distinguished from the conductive bonding member 41 such as cream solder even when the image recognition apparatus performs black and white binarization processing when the thermistor 20 is mounted. It is preferable to have a color tone. Specifically, the color tone of the package base 31 is preferably white.

The electrode pads 36a and 36b may have a shape as shown in a schematic plan view showing variations in the shape of the electrode pads in FIG.
For example, as shown in FIG. 4A, the electrode pads 36a and 36b may have a shape in which the notch K is cut out in a wedge shape.
Further, as shown in FIG. 4B, the electrode pads 36a and 36b have a reduced width portion H having a curved shape (for example, an arc shape) in which the hypotenuses H1 and H2 are curved outward, and the notch portion K has a notch portion K. It is good also as a shape notched in circular arc shape.

In addition, the electrode pads 36a and 36b may have a shape obtained by arbitrarily combining the shapes of the cutout portion K and the reduced width portion H of FIGS. 1C, 4A, and 4B.
Note that the cutout portion K and the reduced width portion H may be provided in only one of the electrode pads 36a and 36b. Even in this case, the crystal unit 1 can achieve the same effects as described above.
In addition, the shape variation of the said electrode pads 36a and 36b is applicable also to the following modifications and each embodiment.

(Modification)
Next, a modification of the first embodiment will be described.
FIG. 5 is a schematic diagram illustrating a schematic configuration of a crystal resonator according to a modification of the first embodiment. 5A is a plan view seen from the lid side, FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 5, the crystal resonator 2 of the modified example is different in the arrangement direction of the thermistor 20 compared to the first embodiment.
In the crystal unit 2, the longitudinal direction of the thermistor 20 (the direction connecting the electrodes 21 and 22) intersects the longitudinal direction of the package base 31 (the left-right direction on the paper) (in this case, the direction is orthogonal). A thermistor 20 is arranged.

Thereby, in addition to the effect of the first embodiment, the crystal resonator 2 has a fixed strength (bonding strength) of the thermistor 20 due to the warp of the package base 31 that tends to be warped in the longitudinal direction. Reduction can be reduced.
It should be noted that the configuration of the modified example can also be applied to the following embodiments.

(Second Embodiment)
Next, another configuration of the crystal resonator as the electronic device will be described.
FIG. 6 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the second embodiment. 6A is a plan view seen from the lid side, FIG. 6B is a cross-sectional view taken along line AA in FIG. 6A, and FIG. 6C is a bottom side. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 6, the crystal resonator 3 of the second embodiment is different in the configuration of the package base 31 and the lid 32 from the first embodiment.
In the crystal unit 3, the third layer 31 c of the package base 31 is removed, and a bonding member 39 with the lid 32 is disposed instead.
The lid 32 is made of a metal such as Kovar or 42 alloy, and is formed in a cap shape with a collar portion 32a provided on the entire circumference.
In the crystal resonator 3, an internal space S in which the crystal resonator element 10 is accommodated is secured by the swelling of the cap portion of the lid 32.

The lid 32 is joined to the first main surface 33 of the package base 31 through a joining member 39 having a collar portion 32a having conductivity such as a seam ring, a brazing material, and a conductive adhesive.
As a result, the lid 32 is electrically connected to the electrode terminal 37c via the conductive vias V2 and V3, the internal wiring P2 and the like in the package base 31, and the shielding effect is exhibited.
Note that the lid 32 may be electrically connected to the electrode terminal 37 c via a conductive film formed in a castellation (not shown) provided at the outer corner of the bonding member 39 and the package base 31.

As described above, in the crystal resonator 3 of the second embodiment, since the third layer 31c of the package base 31 is removed, the manufacture of the package base 31 is facilitated as compared with the first embodiment.
In the crystal resonator 3, the lid 32 may not be electrically connected to the electrode terminal 37c as long as there is no problem with the shield. Thereby, the joining member 39 may be insulative.
The configuration of the second embodiment can also be applied to the following embodiments.

(Third embodiment)
Next, another configuration of the crystal resonator as the electronic device will be described.
FIG. 7 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the third embodiment. 7A is a plan view seen from the lid side, FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 7, the crystal resonator 4 of the third embodiment differs from the first embodiment in the formation position of the recess 35.
In the crystal resonator 4, an opening is provided in the first layer 31a, and a recess 35 is provided by the opening of the first layer 31a and the laminated surface of the flat plate-like second layer 31b.
As a result, the inner bottom surface 36 of the recess 35 becomes a laminated surface on the first layer 31a side in the second layer 31b.
In addition, since the second layer 31b has a flat plate shape, the four electrode terminals 37a to 37d have a rectangular shape without a notch.

As described above, in the crystal resonator 4 of the third embodiment, the thermistor 20 and the crystal vibrating piece 10 are the same because the thermistor 20 is accommodated in the recess 35 provided on the first layer 31a side. While being accommodated in the space (internal space S), they are closer to each other than in the first embodiment.
From this, the crystal resonator 4 has a small temperature difference between the temperature of the crystal vibrating piece 10 and the temperature detected by the thermistor 20.
As a result, the quartz crystal resonator 4 can further accurately correct the frequency of the quartz crystal vibrating piece 10 based on the temperature detected by the thermistor 20, thereby providing a resonator having further excellent frequency temperature characteristics. Can do.

(Electronics)
Next, a mobile phone will be described as an example of an electronic apparatus including the above-described electronic device.
FIG. 8 is a schematic perspective view showing a mobile phone as an electronic apparatus.
A cellular phone 700 includes a crystal resonator as an electronic device described in the above embodiments and modifications.
A cellular phone 700 illustrated in FIG. 8 uses the above-described crystal resonator (any one of 1 to 4) as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and an incoming call. A mouth 703 and a mouthpiece 704 are provided. The form of the mobile phone is not limited to the illustrated type, and may be a so-called smartphone type.
According to this, since the mobile phone 700 includes the crystal resonator, the effects described in the above embodiments and modifications can be achieved, and excellent performance can be exhibited.

  The electronic devices such as the above-described crystal units are not limited to the above mobile phones, but are also electronic books, personal computers, televisions, digital still cameras, video cameras, video recorders, navigation devices, pagers, electronic notebooks, calculators, word processors, workstations. , Video phone, POS terminal, game device, medical device (eg electronic thermometer, blood pressure meter, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments, flight Provided is an electronic device that can be suitably used as a timing device of an electronic device including a simulator and the like, and in any case, the effects described in the above embodiments and modifications are provided, and exhibits excellent performance. it can.

(Moving body)
Next, an automobile will be described as an example of a moving object including the electronic device described above.
FIG. 9 is a schematic perspective view showing an automobile as a moving body.
The automobile 800 includes the crystal resonator as the electronic device described in the above embodiments and modifications.
The automobile 800 includes, for example, various electronically controlled devices (for example, an electronically controlled fuel injection device, an electronically controlled ABS device, an electronically controlled constant type) mounted on the above-described crystal resonator (any one of 1 to 4). It is used as a timing device such as a reference clock oscillation source of a speed traveling device.
According to this, since the automobile 800 includes the above-described crystal resonator, the effects described in the above embodiments and modifications can be achieved, and excellent performance can be exhibited.

  The electronic device such as the above-described crystal resonator is not limited to the automobile 800 described above, but the timing of a reference clock oscillation source of a mobile object including a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, an artificial satellite, and the like. It can be suitably used as a device, and in any case, the effects described in the above embodiments and modifications can be achieved, and a moving body that exhibits excellent performance can be provided.

  The shape of the resonator element of the crystal unit is not limited to the flat plate type shown in the figure, but the center part is thick and the peripheral part is thin (for example, convex type, bevel type, mesa type). It may be a type with a thin part and a thick peripheral part (for example, a reverse mesa type) or a tuning fork type.

The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate A piezoelectric material such as lead acid (PZT), zinc oxide (ZnO), and aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the thickness shear vibration may be electrostatic driving by Coulomb force in addition to the piezoelectric effect of the piezoelectric body.

  The electronic element is not limited to the temperature sensitive element, and may be a capacitive element such as a chip capacitor or a passive element such as a chip inductor (chip coil).

  DESCRIPTION OF SYMBOLS 1, 2, 3, 4 ... Crystal resonator as an electronic device, 10 ... Quartz vibrating piece as a vibrating piece, 11 ... Vibrating part, 12 ... Base part, 13 ... One main surface, 14 ... Other main surface, 15 , 16 ... Excitation electrodes, 15a, 16a ... Extraction electrodes, 20 ... Thermistors as examples of temperature sensitive elements as electronic elements, 21, 22 ... Electrodes, 30 ... Packages, 31 ... Package bases as substrates, 31a ... No. 1st layer, 31b ... 2nd layer, 31c ... 3rd layer, 32 ... Lid, 32a ... Collar part, 33 ... 1st main surface, 33a, 33b ... Internal terminal, 34 ... 2nd main surface, 35 ... Recessed part, 36 ... inner bottom surface, 36a, 36b ... electrode pad, 36a ', 36b' ... temporary electrode pad, 37a, 37b, 37c, 37d ... electrode terminal, 39 ... bonding member, 40 ... conductive adhesive, 41 ... conductive bonding member 61 oscillating circuit 6 ... Power source, 63 ... A / D conversion circuit, 64 ... Temperature compensation circuit, 70 ... IC chip, 700 ... Cell-phone as an electronic device, 701 ... Liquid crystal display device, 702 ... Operation button, 703 ... Earpiece, 704 ... Send Talk mouth, 800: Automobile as moving body, H: Reduced width portion, H1, H2 ... Oblique side, K ... Notch, P1, P2 ... Internal wiring, R ... Exposed from thermistor before corner cut of temporary electrode pad S, internal space, V1, V2, V3, conductive vias.

Claims (8)

A substrate provided with a recess,
An electronic element housed in the recess;
A plurality of electrode pads provided on the inner bottom surface of the recess, and the electrodes of the electronic element are bonded via a conductive bonding member,
Of the plurality of electrode pads, at least one of the pair of electrode pads facing each other is a side facing the other electrode pad, and a cutout portion is provided in a portion overlapping the electronic element in a plan view,
Further, the width of the portion opposite to the side facing the other electrode pad is reduced in width along the direction perpendicular to the direction in which the pair of electrode pads are arranged as the distance from the electronic element increases. An electronic device comprising a portion. In claim 1,
2. The electronic device according to claim 1, wherein an outer shape of the reduced width portion is formed by cutting a corner portion adjacent to each other along the orthogonal direction of a virtual rectangle in plan view. In claim 2,
The reduced width portion has an area of 1/2 or more and 2/3 or less with respect to a portion exposed from the electronic element before corner cutting of the virtual rectangle. In any one of Claims 1 to 3,
Further comprising a resonator element mounted on the substrate,
An electronic device that functions as a vibrator. In claim 4,
The electronic device is a temperature sensitive device. In claim 5,
The temperature sensing element is a thermistor or a temperature measuring semiconductor.   An electronic apparatus comprising the electronic device according to any one of claims 1 to 6.   A moving body comprising the electronic device according to any one of claims 1 to 6.

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