JP2013141738A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2013141738A JP2013141738A JP2012004067A JP2012004067A JP2013141738A JP 2013141738 A JP2013141738 A JP 2013141738A JP 2012004067 A JP2012004067 A JP 2012004067A JP 2012004067 A JP2012004067 A JP 2012004067A JP 2013141738 A JP2013141738 A JP 2013141738A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- mount
- cleaning water
- workpiece
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 88
- 238000004140 cleaning Methods 0.000 claims abstract description 40
- 238000005498 polishing Methods 0.000 description 38
- 238000003754 machining Methods 0.000 description 30
- 239000002699 waste material Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 15
- 238000005406 washing Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Abstract
【解決手段】加工手段3は、研削砥石4aが固着された研削ホイール4を着脱自在に支持する支持面30aを有するホイールマウント30と、支持面30aの反対側の面に連結された回転軸31と、回転軸31を回転可能に支持するハウジング32と、ハウジング32の外側に配設されホイールマウント30を覆うマウントカバー33とを備え、マウントカバー33には、洗浄水を供給する洗浄水流入口8が形成され、洗浄水流入口8は、マウントカバー33の内側とホイールマウント30の外側との間に形成される隙間7に連通している。洗浄水流入口8から洗浄水を流入させて放出させることにより、板状ワークWを加工する際に加工屑や加工屑の混入した加工水が隙間7に浸入することを防止することができる。
【選択図】図1
Description
2:保持手段 20:保持テーブル 20a:保持面 21:回転軸
3,3a:加工手段 30:ホイールマウント 30a:支持面 30b:上面
30c:側面 31:回転軸 32:ハウジング 33:マウントカバー 34:モータ
4:研削ホイール 4a:研削砥石
5:研磨パッド
6:ボルト
7:隙間
8:洗浄水流入口 80:洗浄水放出口
9:加工水供給流路
10:洗浄水供給源
11:加工水供給源
12:ノズル
13:研磨液供給流路
14:研磨液供給源
15:ノズル
W:板状ワーク
Claims (1)
- 板状ワークを保持する保持面を有する保持手段と、該保持手段に保持された板状ワークを加工する加工手段と、を少なくとも備える加工装置において、
該加工手段は、該保持面に対面する加工具を備えた加工ホイールを着脱自在に支持する支持面を有するホイールマウントと、
該支持面の反対側の面に連結させた回転軸と、
該回転軸を回転可能に支持するハウジングと、
該ハウジングの外側に配設され該ホイールマウントを覆うマウントカバーと、
を備え、
該マウントカバーには、洗浄水を流入させる洗浄水流入口が形成され、該洗浄水流入口は、該マウントカバーの内側と該ホイールマウントの外側との間に形成される隙間に連通している加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012004067A JP2013141738A (ja) | 2012-01-12 | 2012-01-12 | 加工装置 |
US13/710,928 US20130183890A1 (en) | 2012-01-12 | 2012-12-11 | Processing apparatus |
KR1020120147553A KR20130083372A (ko) | 2012-01-12 | 2012-12-17 | 가공 장치 |
CN201210559973XA CN103203689A (zh) | 2012-01-12 | 2012-12-21 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012004067A JP2013141738A (ja) | 2012-01-12 | 2012-01-12 | 加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013141738A true JP2013141738A (ja) | 2013-07-22 |
Family
ID=48751202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012004067A Pending JP2013141738A (ja) | 2012-01-12 | 2012-01-12 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130183890A1 (ja) |
JP (1) | JP2013141738A (ja) |
KR (1) | KR20130083372A (ja) |
CN (1) | CN103203689A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150115644A (ko) | 2014-04-04 | 2015-10-14 | 가부시기가이샤 디스코 | 연삭휠 및 연삭실의 세정 방법 |
CN113103097A (zh) * | 2021-04-14 | 2021-07-13 | 浙江洋丽机械设备有限公司 | 一种棒状物料表面清洁及端部打磨机器 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180117726A1 (en) * | 2015-03-25 | 2018-05-03 | Ancora S.P.A. | Head for polishing ceramic items or natural stones |
JP6486752B2 (ja) * | 2015-04-08 | 2019-03-20 | 株式会社ディスコ | 乾式研磨装置 |
CN105538162B (zh) * | 2015-12-28 | 2017-10-27 | 宁波鑫晟工具有限公司 | 一种设置有散热装置的磨光机 |
DE102017215705A1 (de) * | 2017-09-06 | 2019-03-07 | Siltronic Ag | Vorrichtung und Verfahren zum doppelseitigen Schleifen von Halbleiterscheiben |
JP7396785B2 (ja) * | 2018-02-20 | 2023-12-12 | 株式会社ディスコ | 研削装置 |
KR102017013B1 (ko) * | 2018-03-14 | 2019-09-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
KR101994608B1 (ko) * | 2019-05-23 | 2019-07-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
JP7351669B2 (ja) * | 2019-08-06 | 2023-09-27 | 株式会社ディスコ | スピンドルユニット |
JP7383118B2 (ja) * | 2020-03-06 | 2023-11-17 | 東京エレクトロン株式会社 | 研削装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05309566A (ja) * | 1992-04-21 | 1993-11-22 | Sony Corp | 研削液供給構造 |
JP2002059361A (ja) * | 2000-08-21 | 2002-02-26 | Mitsubishi Electric Corp | 半導体製造装置及びその製造方法 |
US20080057836A1 (en) * | 2003-10-24 | 2008-03-06 | Applied Materials, Inc. | Pad conditioning head for cmp process |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3148488A (en) * | 1961-12-11 | 1964-09-15 | Sun Tool And Machine Company | Coolant splash shield and support |
CN2038830U (zh) * | 1988-09-08 | 1989-06-07 | 铁道部戚墅堰机车车辆工艺研究所 | 磨抛机 |
JP3106418B2 (ja) * | 1996-07-30 | 2000-11-06 | 株式会社東京精密 | 研磨装置 |
US6722962B1 (en) * | 1997-04-22 | 2004-04-20 | Sony Corporation | Polishing system, polishing method, polishing pad, and method of forming polishing pad |
JPH1190762A (ja) * | 1997-05-27 | 1999-04-06 | Chiron Werke Gmbh & Co Kg | 工作機械 |
US6139406A (en) * | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
IL125469A (en) * | 1998-07-23 | 2001-07-24 | Sherez Shaul | Hand held cutting tool |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
US6110012A (en) * | 1998-12-24 | 2000-08-29 | Lucent Technologies Inc. | Chemical-mechanical polishing apparatus and method |
JP3316483B2 (ja) * | 1999-05-27 | 2002-08-19 | 三洋電機株式会社 | 流体の被除去物除去装置 |
ATE409546T1 (de) * | 2004-12-06 | 2008-10-15 | Vetrox Ag | Vorrichtung zum schleifen von harten oberflächen, insbesondere von glasflächen |
JP5405727B2 (ja) * | 2006-08-31 | 2014-02-05 | 株式会社ニデック | 眼鏡レンズ周縁加工用の研削水処理装置 |
JP2010188433A (ja) * | 2009-02-16 | 2010-09-02 | Disco Abrasive Syst Ltd | 回転工具を備えた加工装置 |
-
2012
- 2012-01-12 JP JP2012004067A patent/JP2013141738A/ja active Pending
- 2012-12-11 US US13/710,928 patent/US20130183890A1/en not_active Abandoned
- 2012-12-17 KR KR1020120147553A patent/KR20130083372A/ko not_active Application Discontinuation
- 2012-12-21 CN CN201210559973XA patent/CN103203689A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05309566A (ja) * | 1992-04-21 | 1993-11-22 | Sony Corp | 研削液供給構造 |
JP2002059361A (ja) * | 2000-08-21 | 2002-02-26 | Mitsubishi Electric Corp | 半導体製造装置及びその製造方法 |
US20080057836A1 (en) * | 2003-10-24 | 2008-03-06 | Applied Materials, Inc. | Pad conditioning head for cmp process |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150115644A (ko) | 2014-04-04 | 2015-10-14 | 가부시기가이샤 디스코 | 연삭휠 및 연삭실의 세정 방법 |
US9731400B2 (en) | 2014-04-04 | 2017-08-15 | Disco Corporation | Grinding wheel and cleaning method for grinding chamber |
CN113103097A (zh) * | 2021-04-14 | 2021-07-13 | 浙江洋丽机械设备有限公司 | 一种棒状物料表面清洁及端部打磨机器 |
Also Published As
Publication number | Publication date |
---|---|
KR20130083372A (ko) | 2013-07-22 |
US20130183890A1 (en) | 2013-07-18 |
CN103203689A (zh) | 2013-07-17 |
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