KR20130083372A - 가공 장치 - Google Patents
가공 장치 Download PDFInfo
- Publication number
- KR20130083372A KR20130083372A KR1020120147553A KR20120147553A KR20130083372A KR 20130083372 A KR20130083372 A KR 20130083372A KR 1020120147553 A KR1020120147553 A KR 1020120147553A KR 20120147553 A KR20120147553 A KR 20120147553A KR 20130083372 A KR20130083372 A KR 20130083372A
- Authority
- KR
- South Korea
- Prior art keywords
- processing
- washing water
- mount
- plate
- wheel
- Prior art date
Links
- 238000003754 machining Methods 0.000 title description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 87
- 238000005406 washing Methods 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims description 30
- 238000005498 polishing Methods 0.000 description 40
- 239000007788 liquid Substances 0.000 description 20
- 239000002699 waste material Substances 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
본 발명의 가공 장치에서, 가공 수단(3)은, 연삭 지석(4a)이 고착된 연삭 휠(4)을 착탈 가능하게 지지하는 지지면(30a)을 갖는 휠 마운트(30)와, 지지면(30a)의 반대측의 면에 연결된 회전축(31)과, 회전축(31)을 회전 가능하게 지지하는 하우징(32)과, 하우징(32)의 외측에 설치되며 휠 마운트(30)를 덮는 마운트 커버(33)를 구비하고, 마운트 커버(33)에는, 세정수를 공급하는 세정수 유입구(8)가 형성되며, 세정수 유입구(8)는, 마운트 커버(33)의 내측과 휠 마운트(30)의 외측 사이에 형성되는 간극(7)에 연통하고 있다. 세정수 유입구(8)로부터 세정수를 유입시켜 방출시킴으로써, 판형 워크(W)를 가공할 때에 가공 부스러기나 가공 부스러기가 혼입된 가공수가 간극(7)에 침입하는 것을 방지할 수 있다.
Description
도 2는 가공 장치의 제2 예를 나타내는 단면도이다.
도 3은 가공 장치의 제1 예에 따른 연삭 상태를 나타내는 단면도이다.
도 4는 가공 장치의 제2 예에 따른 연마 상태를 나타내는 단면도이다.
20 : 유지 테이블 20a : 유지면
21 : 회전축 3, 3a : 가공 수단
30 : 휠 마운트 30a : 지지면
30b : 상면 30c : 측면
31 : 회전축 32 : 하우징
33 : 마운트 커버 34 : 모터
4 : 연삭 휠 4a : 연삭 지석
5 : 연마 패드 6 : 볼트
7 : 간극 8 : 세정수 유입구
80 : 세정수 방출구 9 : 가공수 공급 유로
10 : 세정수 공급원 11 : 가공수 공급원
12 : 노즐 13 : 연마액 공급 유로
14 : 연마액 공급원 15 : 노즐
W : 판형 워크
Claims (1)
- 판형 워크를 유지하는 유지면을 갖는 유지 수단과, 이 유지 수단에 유지된 판형 워크를 가공하는 가공 수단을 적어도 구비하는 가공 장치에 있어서,
상기 가공 수단은, 상기 유지면에 대면하는 가공구를 구비한 가공 휠을 착탈 가능하게 지지하는 지지면을 갖는 휠 마운트와,
상기 지지면의 반대측의 면에 연결시킨 회전축과,
상기 회전축을 회전 가능하게 지지하는 하우징과,
상기 하우징의 외측에 설치되어 상기 휠 마운트를 덮는 마운트 커버
를 구비하고,
상기 마운트 커버에는, 세정수를 유입시키는 세정수 유입구가 형성되며, 상기 세정수 유입구는, 상기 마운트 커버의 내측과 상기 휠 마운트의 외측 사이에 형성되는 간극에 연통되어 있는 것인 가공 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012004067A JP2013141738A (ja) | 2012-01-12 | 2012-01-12 | 加工装置 |
JPJP-P-2012-004067 | 2012-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130083372A true KR20130083372A (ko) | 2013-07-22 |
Family
ID=48751202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120147553A KR20130083372A (ko) | 2012-01-12 | 2012-12-17 | 가공 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130183890A1 (ko) |
JP (1) | JP2013141738A (ko) |
KR (1) | KR20130083372A (ko) |
CN (1) | CN103203689A (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160120656A (ko) * | 2015-04-08 | 2016-10-18 | 가부시기가이샤 디스코 | 건식 연마 장치 |
KR101994608B1 (ko) * | 2019-05-23 | 2019-07-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
KR20190100023A (ko) * | 2018-02-20 | 2019-08-28 | 가부시기가이샤 디스코 | 연삭 장치 |
KR102017013B1 (ko) * | 2018-03-14 | 2019-09-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6353684B2 (ja) | 2014-04-04 | 2018-07-04 | 株式会社ディスコ | 研削ホイール及び研削室の洗浄方法 |
CN107530861A (zh) * | 2015-03-25 | 2018-01-02 | 安柯拉股份公司 | 用于抛光陶瓷物品或天然石料的头 |
CN105538162B (zh) * | 2015-12-28 | 2017-10-27 | 宁波鑫晟工具有限公司 | 一种设置有散热装置的磨光机 |
DE102017215705A1 (de) * | 2017-09-06 | 2019-03-07 | Siltronic Ag | Vorrichtung und Verfahren zum doppelseitigen Schleifen von Halbleiterscheiben |
JP7351669B2 (ja) * | 2019-08-06 | 2023-09-27 | 株式会社ディスコ | スピンドルユニット |
JP7383118B2 (ja) * | 2020-03-06 | 2023-11-17 | 東京エレクトロン株式会社 | 研削装置 |
CN113103097A (zh) * | 2021-04-14 | 2021-07-13 | 浙江洋丽机械设备有限公司 | 一种棒状物料表面清洁及端部打磨机器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3148488A (en) * | 1961-12-11 | 1964-09-15 | Sun Tool And Machine Company | Coolant splash shield and support |
CN2038830U (zh) * | 1988-09-08 | 1989-06-07 | 铁道部戚墅堰机车车辆工艺研究所 | 磨抛机 |
JPH05309566A (ja) * | 1992-04-21 | 1993-11-22 | Sony Corp | 研削液供給構造 |
JP3106418B2 (ja) * | 1996-07-30 | 2000-11-06 | 株式会社東京精密 | 研磨装置 |
US6722962B1 (en) * | 1997-04-22 | 2004-04-20 | Sony Corporation | Polishing system, polishing method, polishing pad, and method of forming polishing pad |
JPH1190762A (ja) * | 1997-05-27 | 1999-04-06 | Chiron Werke Gmbh & Co Kg | 工作機械 |
US6139406A (en) * | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
IL125469A (en) * | 1998-07-23 | 2001-07-24 | Sherez Shaul | Hand held cutting tool |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
US6110012A (en) * | 1998-12-24 | 2000-08-29 | Lucent Technologies Inc. | Chemical-mechanical polishing apparatus and method |
JP3316483B2 (ja) * | 1999-05-27 | 2002-08-19 | 三洋電機株式会社 | 流体の被除去物除去装置 |
JP4131898B2 (ja) * | 2000-08-21 | 2008-08-13 | 三菱電機株式会社 | 半導体製造装置及びその製造方法 |
US7288165B2 (en) * | 2003-10-24 | 2007-10-30 | Applied Materials, Inc. | Pad conditioning head for CMP process |
WO2006061172A2 (de) * | 2004-12-06 | 2006-06-15 | Vetrox Ag | Vorrichtung zum schleifen von harten oberflächen, insbesondere von glasflächen |
JP5405727B2 (ja) * | 2006-08-31 | 2014-02-05 | 株式会社ニデック | 眼鏡レンズ周縁加工用の研削水処理装置 |
JP2010188433A (ja) * | 2009-02-16 | 2010-09-02 | Disco Abrasive Syst Ltd | 回転工具を備えた加工装置 |
-
2012
- 2012-01-12 JP JP2012004067A patent/JP2013141738A/ja active Pending
- 2012-12-11 US US13/710,928 patent/US20130183890A1/en not_active Abandoned
- 2012-12-17 KR KR1020120147553A patent/KR20130083372A/ko not_active Application Discontinuation
- 2012-12-21 CN CN201210559973XA patent/CN103203689A/zh active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160120656A (ko) * | 2015-04-08 | 2016-10-18 | 가부시기가이샤 디스코 | 건식 연마 장치 |
KR20190100023A (ko) * | 2018-02-20 | 2019-08-28 | 가부시기가이샤 디스코 | 연삭 장치 |
KR102017013B1 (ko) * | 2018-03-14 | 2019-09-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
KR101994608B1 (ko) * | 2019-05-23 | 2019-07-02 | 주식회사 싸이텍 | 폴리싱 장치용 교환형 연마부재 |
Also Published As
Publication number | Publication date |
---|---|
CN103203689A (zh) | 2013-07-17 |
JP2013141738A (ja) | 2013-07-22 |
US20130183890A1 (en) | 2013-07-18 |
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