JP2013131592A - リード端子およびこれを用いた半導体装置 - Google Patents

リード端子およびこれを用いた半導体装置 Download PDF

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Publication number
JP2013131592A
JP2013131592A JP2011279295A JP2011279295A JP2013131592A JP 2013131592 A JP2013131592 A JP 2013131592A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2013131592 A JP2013131592 A JP 2013131592A
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JP
Japan
Prior art keywords
bonding
semiconductor device
lead terminal
main conductive
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011279295A
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English (en)
Japanese (ja)
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JP2013131592A5 (https=
Inventor
Hiroaki Tatsumi
裕章 巽
Kenichi Hayashi
建一 林
Taketsugu Otsu
健嗣 大津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2011279295A priority Critical patent/JP2013131592A/ja
Publication of JP2013131592A publication Critical patent/JP2013131592A/ja
Publication of JP2013131592A5 publication Critical patent/JP2013131592A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Pressure Welding/Diffusion-Bonding (AREA)
JP2011279295A 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置 Pending JP2013131592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011279295A JP2013131592A (ja) 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011279295A JP2013131592A (ja) 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置

Publications (2)

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JP2013131592A true JP2013131592A (ja) 2013-07-04
JP2013131592A5 JP2013131592A5 (https=) 2014-01-09

Family

ID=48908934

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JP2011279295A Pending JP2013131592A (ja) 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置

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JP (1) JP2013131592A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JPWO2016159070A1 (ja) * 2015-04-03 2017-06-22 三菱電機株式会社 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材
JP2019071448A (ja) * 2014-10-21 2019-05-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 電子装置、及び電子装置を製造する方法
CN112041972A (zh) * 2018-04-27 2020-12-04 日东电工株式会社 半导体装置制造方法
DE102022124463A1 (de) 2021-11-16 2023-05-17 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2023190180A1 (ja) * 2022-03-30 2023-10-05 ローム株式会社 半導体装置
US12315838B2 (en) 2020-03-13 2025-05-27 Fuji Electric Co., Ltd. Wiring structure and semiconductor module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742967U (ja) * 1993-12-28 1995-08-11 新電元工業株式会社 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013135105A (ja) * 2011-12-27 2013-07-08 Mitsubishi Electric Corp 電力用半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742967U (ja) * 1993-12-28 1995-08-11 新電元工業株式会社 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013135105A (ja) * 2011-12-27 2013-07-08 Mitsubishi Electric Corp 電力用半導体装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2019071448A (ja) * 2014-10-21 2019-05-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 電子装置、及び電子装置を製造する方法
JPWO2016159070A1 (ja) * 2015-04-03 2017-06-22 三菱電機株式会社 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材
CN112041972A (zh) * 2018-04-27 2020-12-04 日东电工株式会社 半导体装置制造方法
EP3787011A4 (en) * 2018-04-27 2022-06-08 Nitto Denko Corporation SEMICONDUCTOR DEVICE MANUFACTURING PROCESS
US11594513B2 (en) 2018-04-27 2023-02-28 Nitto Denko Corporation Manufacturing method for semiconductor device
CN112041972B (zh) * 2018-04-27 2024-11-19 日东电工株式会社 半导体装置制造方法
US12315838B2 (en) 2020-03-13 2025-05-27 Fuji Electric Co., Ltd. Wiring structure and semiconductor module
DE102022124463A1 (de) 2021-11-16 2023-05-17 Mitsubishi Electric Corporation Halbleitervorrichtung
JP7657529B2 (ja) 2021-11-16 2025-04-07 三菱電機株式会社 半導体装置
US12476159B2 (en) 2021-11-16 2025-11-18 Mitsubishi Electric Corporation Semiconductor device
WO2023190180A1 (ja) * 2022-03-30 2023-10-05 ローム株式会社 半導体装置

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