JP2013131533A5 - - Google Patents

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Publication number
JP2013131533A5
JP2013131533A5 JP2011278311A JP2011278311A JP2013131533A5 JP 2013131533 A5 JP2013131533 A5 JP 2013131533A5 JP 2011278311 A JP2011278311 A JP 2011278311A JP 2011278311 A JP2011278311 A JP 2011278311A JP 2013131533 A5 JP2013131533 A5 JP 2013131533A5
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JP
Japan
Prior art keywords
test
normal
input
semiconductor chip
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011278311A
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English (en)
Japanese (ja)
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JP2013131533A (ja
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Publication date
Application filed filed Critical
Priority to JP2011278311A priority Critical patent/JP2013131533A/ja
Priority claimed from JP2011278311A external-priority patent/JP2013131533A/ja
Priority to US13/720,863 priority patent/US8957695B2/en
Publication of JP2013131533A publication Critical patent/JP2013131533A/ja
Publication of JP2013131533A5 publication Critical patent/JP2013131533A5/ja
Withdrawn legal-status Critical Current

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JP2011278311A 2011-12-20 2011-12-20 半導体装置 Withdrawn JP2013131533A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011278311A JP2013131533A (ja) 2011-12-20 2011-12-20 半導体装置
US13/720,863 US8957695B2 (en) 2011-12-20 2012-12-19 Semiconductor device having plural semiconductor chip stacked with one another

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011278311A JP2013131533A (ja) 2011-12-20 2011-12-20 半導体装置

Publications (2)

Publication Number Publication Date
JP2013131533A JP2013131533A (ja) 2013-07-04
JP2013131533A5 true JP2013131533A5 (enExample) 2014-12-25

Family

ID=48609213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011278311A Withdrawn JP2013131533A (ja) 2011-12-20 2011-12-20 半導体装置

Country Status (2)

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US (1) US8957695B2 (enExample)
JP (1) JP2013131533A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866303B2 (en) * 2010-06-17 2014-10-21 Conversant Intellectual Property Management Inc. Semiconductor device with configurable through-silicon vias
US9859199B2 (en) 2013-12-18 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor package using carbon nano material in molding compound
KR20160025957A (ko) * 2014-08-28 2016-03-09 에스케이하이닉스 주식회사 집적회로
CN107305861B (zh) * 2016-04-25 2019-09-03 晟碟信息科技（上海）有限公司 半导体装置及其制造方法
US10079049B2 (en) 2016-06-08 2018-09-18 Micron Technology, Inc. Stack access control for memory device
US10008287B2 (en) * 2016-07-22 2018-06-26 Micron Technology, Inc. Shared error detection and correction memory
US9792964B1 (en) * 2016-09-20 2017-10-17 Micron Technology, Inc. Apparatus of offset voltage adjustment in input buffer
US10282264B1 (en) 2017-11-09 2019-05-07 Micron Technology, Inc. Apparatus and methods for repairing memory devices including a plurality of memory die and an interface
KR102504332B1 (ko) * 2018-02-21 2023-02-28 삼성전자주식회사 서로 이격되어 배치되는 범프 어레이들을 포함하는 메모리 장치 및 이를 포함하는 전자 장치
US10664432B2 (en) 2018-05-23 2020-05-26 Micron Technology, Inc. Semiconductor layered device with data bus inversion
CN109244058A (zh) * 2018-09-19 2019-01-18 深圳铨力半导体有限公司 半导体封装结构及其制备方法
US10964702B2 (en) 2018-10-17 2021-03-30 Micron Technology, Inc. Semiconductor device with first-in-first-out circuit
KR102674029B1 (ko) 2018-10-26 2024-06-13 삼성전자주식회사 테스트 패드를 포함하는 반도체 패키지
US11239203B2 (en) * 2019-11-01 2022-02-01 Xilinx, Inc. Multi-chip stacked devices
JP7561563B2 (ja) * 2020-10-05 2024-10-04 三菱電機エンジニアリング株式会社 半導体装置
KR20240006569A (ko) * 2021-05-10 2024-01-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20240061935A (ko) * 2022-11-01 2024-05-08 삼성전자주식회사 테스트 패드를 갖는 반도체 패키지

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008140530A (ja) * 2006-12-05 2008-06-19 Toshiba Corp 半導体装置およびそのテスト方法
KR100909969B1 (ko) 2007-06-28 2009-07-29 삼성전자주식회사 반도체 소자 및 그 제조 방법, 및 반도체 소자를 포함하는스택 모듈, 카드 및 시스템

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