JP2013062578A - 水晶振動片及び水晶デバイス - Google Patents

水晶振動片及び水晶デバイス Download PDF

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Publication number
JP2013062578A
JP2013062578A JP2011198094A JP2011198094A JP2013062578A JP 2013062578 A JP2013062578 A JP 2013062578A JP 2011198094 A JP2011198094 A JP 2011198094A JP 2011198094 A JP2011198094 A JP 2011198094A JP 2013062578 A JP2013062578 A JP 2013062578A
Authority
JP
Japan
Prior art keywords
vibrating piece
convex portion
crystal vibrating
axis side
convex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011198094A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013062578A5 (enExample
Inventor
Shuichi Mizusawa
周一 水沢
Takehiro Takahashi
岳寛 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2011198094A priority Critical patent/JP2013062578A/ja
Priority to US13/597,261 priority patent/US8907545B2/en
Publication of JP2013062578A publication Critical patent/JP2013062578A/ja
Publication of JP2013062578A5 publication Critical patent/JP2013062578A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2011198094A 2011-09-12 2011-09-12 水晶振動片及び水晶デバイス Pending JP2013062578A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011198094A JP2013062578A (ja) 2011-09-12 2011-09-12 水晶振動片及び水晶デバイス
US13/597,261 US8907545B2 (en) 2011-09-12 2012-08-29 Crystal element and crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011198094A JP2013062578A (ja) 2011-09-12 2011-09-12 水晶振動片及び水晶デバイス

Publications (2)

Publication Number Publication Date
JP2013062578A true JP2013062578A (ja) 2013-04-04
JP2013062578A5 JP2013062578A5 (enExample) 2014-10-16

Family

ID=47829222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011198094A Pending JP2013062578A (ja) 2011-09-12 2011-09-12 水晶振動片及び水晶デバイス

Country Status (2)

Country Link
US (1) US8907545B2 (enExample)
JP (1) JP2013062578A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016136010A1 (ja) * 2015-02-23 2016-09-01 株式会社村田製作所 水晶振動デバイス
JP2016167885A (ja) * 2016-06-09 2016-09-15 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、発振器、及び電子機器
KR20170004208A (ko) * 2015-07-01 2017-01-11 삼성전기주식회사 수정 진동자
JP2017060124A (ja) * 2015-09-18 2017-03-23 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片及び圧電振動子
JP2021164071A (ja) * 2020-03-31 2021-10-11 シチズンファインデバイス株式会社 厚みすべり水晶振動片

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102684636B (zh) 2011-03-09 2015-12-16 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
JP5708089B2 (ja) * 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
JP2013165336A (ja) * 2012-02-09 2013-08-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP6390836B2 (ja) 2014-07-31 2018-09-19 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP6755108B2 (ja) * 2016-03-23 2020-09-16 日本電波工業株式会社 水晶振動子
JP2017183808A (ja) * 2016-03-28 2017-10-05 京セラ株式会社 水晶素子および水晶デバイス
JP2017192032A (ja) * 2016-04-13 2017-10-19 日本電波工業株式会社 水晶振動子

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256867A (ja) * 1997-01-07 1998-09-25 Matsushita Electric Ind Co Ltd 振動子とその製造方法とその振動子を用いた電子機器
JP2003273679A (ja) * 2002-03-14 2003-09-26 Seiko Epson Corp 圧電振動片の製造方法、フォトマスク、圧電振動片および圧電デバイス
JP2009010864A (ja) * 2007-06-29 2009-01-15 Daishinku Corp 圧電振動デバイスの本体筐体部材、圧電振動デバイス、および圧電振動デバイスの製造方法
WO2009020022A1 (ja) * 2007-08-03 2009-02-12 Daishinku Corporation 圧電振動子
JP2011019213A (ja) * 2009-06-12 2011-01-27 Nippon Dempa Kogyo Co Ltd 水晶振動子の製造方法
JP2011097369A (ja) * 2009-10-29 2011-05-12 Kyocera Kinseki Corp 水晶振動素子
JP2012074860A (ja) * 2010-09-28 2012-04-12 Kyocera Kinseki Corp 水晶振動素子
JP2012249099A (ja) * 2011-05-27 2012-12-13 Daishinku Corp 圧電振動片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066166A (ja) 1992-06-24 1994-01-14 Meidensha Corp 圧電振動子
JP5123962B2 (ja) * 2009-02-10 2013-01-23 日本電波工業株式会社 音叉型圧電振動片、圧電フレーム、圧電デバイス及び音叉型圧電振動片並びに圧電フレームの製造方法
JP5059897B2 (ja) * 2010-02-24 2012-10-31 日本電波工業株式会社 圧電振動片の製造方法
JP5296113B2 (ja) * 2010-02-25 2013-09-25 日本電波工業株式会社 圧電振動片の製造方法、圧電振動片及び圧電デバイス
CN102386871A (zh) * 2010-09-02 2012-03-21 日本电波工业株式会社 台面型at切割水晶振动片及水晶装置
JP2012175492A (ja) * 2011-02-23 2012-09-10 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013021667A (ja) * 2011-03-23 2013-01-31 Nippon Dempa Kogyo Co Ltd 水晶デバイス

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256867A (ja) * 1997-01-07 1998-09-25 Matsushita Electric Ind Co Ltd 振動子とその製造方法とその振動子を用いた電子機器
JP2003273679A (ja) * 2002-03-14 2003-09-26 Seiko Epson Corp 圧電振動片の製造方法、フォトマスク、圧電振動片および圧電デバイス
JP2009010864A (ja) * 2007-06-29 2009-01-15 Daishinku Corp 圧電振動デバイスの本体筐体部材、圧電振動デバイス、および圧電振動デバイスの製造方法
WO2009020022A1 (ja) * 2007-08-03 2009-02-12 Daishinku Corporation 圧電振動子
JP2011019213A (ja) * 2009-06-12 2011-01-27 Nippon Dempa Kogyo Co Ltd 水晶振動子の製造方法
JP2011097369A (ja) * 2009-10-29 2011-05-12 Kyocera Kinseki Corp 水晶振動素子
JP2012074860A (ja) * 2010-09-28 2012-04-12 Kyocera Kinseki Corp 水晶振動素子
JP2012249099A (ja) * 2011-05-27 2012-12-13 Daishinku Corp 圧電振動片

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016136010A1 (ja) * 2015-02-23 2016-09-01 株式会社村田製作所 水晶振動デバイス
KR20170004208A (ko) * 2015-07-01 2017-01-11 삼성전기주식회사 수정 진동자
KR102117475B1 (ko) * 2015-07-01 2020-06-01 삼성전기주식회사 수정 진동자
JP2017060124A (ja) * 2015-09-18 2017-03-23 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片及び圧電振動子
JP2016167885A (ja) * 2016-06-09 2016-09-15 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、発振器、及び電子機器
JP2021164071A (ja) * 2020-03-31 2021-10-11 シチズンファインデバイス株式会社 厚みすべり水晶振動片
JP7393283B2 (ja) 2020-03-31 2023-12-06 シチズンファインデバイス株式会社 厚みすべり水晶振動片

Also Published As

Publication number Publication date
US8907545B2 (en) 2014-12-09
US20130063002A1 (en) 2013-03-14

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