JP2013049921A - シアン化物非含有ホワイトブロンズの接着促進 - Google Patents
シアン化物非含有ホワイトブロンズの接着促進 Download PDFInfo
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- JP2013049921A JP2013049921A JP2012181697A JP2012181697A JP2013049921A JP 2013049921 A JP2013049921 A JP 2013049921A JP 2012181697 A JP2012181697 A JP 2012181697A JP 2012181697 A JP2012181697 A JP 2012181697A JP 2013049921 A JP2013049921 A JP 2013049921A
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- Prior art keywords
- copper
- layer
- void
- white bronze
- metal
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-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】銅下層を被覆する空隙抑制層上に、シアン化物非含有スズ/銅浴からホワイトブロンズが電気めっきされる。この空隙抑制金属層は1種以上の空隙抑制金属を含む。
【選択図】図1
Description
クリーニングされた黄銅パネル基体(70%Cu/30%Zn)5cm×5cmが、標準的な条件下で、カパーグリーム(COPPER GLEAM(商標))DL900高平滑酸銅電気めっき液(マサチューセッツ州マルボロのロームアンドハースエレクトロニックマテリアルズLLCから入手可能)からの銅でめっきされた。この銅層は8〜10μmの厚さであった。水ですすいだ後、次いで、この銅層は表1に示される配合を有する水性亜鉛浴からの亜鉛で電気めっきされた。
空隙抑制層が、以下の表3に開示される水性銅/亜鉛配合物から電気めっきされた銅/亜鉛合金(4%Zn)であったことを除いて、同じタイプの黄銅パネル基体を用いて実施例1に記載された方法が繰り返された。
銅下層上にホワイトブロンズを電気めっきする前に空隙抑制金属層が堆積されなかったことを除いて、実施例1に記載された方法が繰り返された。銅電気めっき液とホワイトブロンズ配合物、並びにめっきパラメータは実施例1におけるのと同じであった。
空隙抑制層が、以下の表4に開示される水性ニッケル配合物から電気めっきされたニッケル堆積物であったことを除いて、同じタイプの黄銅パネル基体を用いて実施例1に記載された方法が繰り返された。
空隙抑制層が、以下の表5に開示される水性配合物から電気めっきされた銅/ビスマス(10%Bi)堆積物であったことを除いて、同じタイプの黄銅パネル基体を用いて実施例1に記載された方法が繰り返された。
Claims (9)
- a)銅含有層に隣接して、1種以上の空隙抑制金属を含む金属層を堆積させ、および
b)前記1種以上の空隙抑制金属を含む金属層に隣接して、シアン化物非含有スズ/銅電気めっき浴からスズ/銅合金層を電気めっきする、
ことを含む方法。 - 前記1種以上の空隙抑制金属が、亜鉛、亜鉛合金、ビスマス、ビスマス合金およびニッケルから選択される請求項1に記載の方法。
- 前記亜鉛合金が少なくとも4%の亜鉛を含む請求項2に記載の方法。
- 前記ビスマス合金が少なくとも10%のビスマスを含む請求項2に記載の方法。
- 前記1種以上の空隙抑制金属を含む金属層が少なくとも0.02μmの厚さである請求項1に記載の方法。
- 前記金属層が0.05μm〜10μmの厚さを有する請求項5に記載の方法。
- 前記スズ/銅層が少なくとも0.01μm〜20μmの厚さである請求項1に記載の方法。
- 請求項1の方法に従って製造された物品。
- 前記物品が電子デバイスの部品または装飾部品である請求項8に記載の物品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161529088P | 2011-08-30 | 2011-08-30 | |
US61/529,088 | 2011-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013049921A true JP2013049921A (ja) | 2013-03-14 |
JP6054676B2 JP6054676B2 (ja) | 2016-12-27 |
Family
ID=47022457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012181697A Expired - Fee Related JP6054676B2 (ja) | 2011-08-30 | 2012-08-20 | シアン化物非含有ホワイトブロンズの接着促進 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9145617B2 (ja) |
EP (3) | EP2738290A1 (ja) |
JP (1) | JP6054676B2 (ja) |
KR (1) | KR102032891B1 (ja) |
CN (1) | CN102965700B (ja) |
TW (1) | TWI449815B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014122410A (ja) * | 2012-12-24 | 2014-07-03 | Ishihara Chemical Co Ltd | スズ又はスズ合金メッキ浴 |
JP2016074979A (ja) * | 2014-09-30 | 2016-05-12 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 銅(i)イオンに基づくホワイトブロンズ用のシアン化物非含有電気めっき浴 |
JP2016522327A (ja) * | 2013-06-04 | 2016-07-28 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 銀−スズ合金の電気めっき浴 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10633754B2 (en) | 2013-07-05 | 2020-04-28 | The Boeing Company | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
EP3081673A1 (en) * | 2015-04-16 | 2016-10-19 | COVENTYA S.p.A. | Electroplated product having a precious metal finishing layer and improved corrosion resistance, method for its production and uses thereof |
BR112017027295A2 (pt) * | 2015-06-16 | 2018-09-04 | 3M Innovative Properties Co | galvanização de bronze sobre lâminas de polímero |
JP7273170B2 (ja) * | 2019-02-08 | 2023-05-12 | アヴニ | コバルト又は銅合金の電着、及びマイクロエレクトロニクスにおける使用 |
FR3092589A1 (fr) * | 2019-02-08 | 2020-08-14 | Aveni | Electrodéposition d’un alliage de cobalt et utilisation en microélectronique |
FR3118067B1 (fr) * | 2020-12-18 | 2023-05-26 | Linxens Holding | Procédé de dépôt d’un alliage de bronze sur un circuit imprimé et circuit imprimé obtenu par ce procédé |
US20220361336A1 (en) * | 2021-05-07 | 2022-11-10 | Aplus Semiconductor Technologies Co., Ltd. | Metal Circuit Structure Based on FPC and Method of Making the Same |
SE545031C2 (en) * | 2021-07-15 | 2023-03-07 | Seolfor Ab | Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof |
Citations (8)
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JPS5839795A (ja) * | 1981-09-03 | 1983-03-08 | Mitsubishi Electric Corp | 黄銅めつき方法 |
JPS61166994A (ja) * | 1985-01-16 | 1986-07-28 | Kobe Steel Ltd | 光沢錫めつき層或いは光沢錫合金めつき層を有する銅または銅合金線条体 |
JPH02145794A (ja) * | 1988-11-28 | 1990-06-05 | Kobe Steel Ltd | 耐熱剥離性に優れたリフロー錫またははんだめっき銅または銅合金材料 |
JPH03271394A (ja) * | 1990-03-19 | 1991-12-03 | Mitsubishi Electric Corp | はんだめっき銅合金材 |
JPH10204683A (ja) * | 1997-01-17 | 1998-08-04 | Bridgestone Metalpha Kk | 伸線加工性に優れためっき鋼線材およびその製造方法 |
JP2004091824A (ja) * | 2002-08-29 | 2004-03-25 | Ishihara Chem Co Ltd | スズホイスカーの防止方法 |
US6974767B1 (en) * | 2002-02-21 | 2005-12-13 | Advanced Micro Devices, Inc. | Chemical solution for electroplating a copper-zinc alloy thin film |
JP2010248616A (ja) * | 2009-03-26 | 2010-11-04 | Kobe Steel Ltd | 耐熱性に優れるSnめっき付き銅又は銅合金及びその製造方法 |
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DE69603209T2 (de) | 1995-02-15 | 1999-11-11 | Atotech Usa Inc | Elektrogalvanisierungsverfahren auf Zinksulfatbasis mit hoher Stromdichte sowie die zugehörige Zusammensetzung |
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-
2012
- 2012-08-17 EP EP14156872.5A patent/EP2738290A1/en not_active Withdrawn
- 2012-08-17 EP EP13178824.2A patent/EP2660360A1/en not_active Withdrawn
- 2012-08-17 EP EP20120180894 patent/EP2565297A3/en not_active Withdrawn
- 2012-08-20 JP JP2012181697A patent/JP6054676B2/ja not_active Expired - Fee Related
- 2012-08-23 TW TW101130602A patent/TWI449815B/zh not_active IP Right Cessation
- 2012-08-29 KR KR1020120095175A patent/KR102032891B1/ko active IP Right Grant
- 2012-08-29 CN CN201210312655.3A patent/CN102965700B/zh not_active Expired - Fee Related
- 2012-08-30 US US13/599,620 patent/US9145617B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5839795A (ja) * | 1981-09-03 | 1983-03-08 | Mitsubishi Electric Corp | 黄銅めつき方法 |
JPS61166994A (ja) * | 1985-01-16 | 1986-07-28 | Kobe Steel Ltd | 光沢錫めつき層或いは光沢錫合金めつき層を有する銅または銅合金線条体 |
JPH02145794A (ja) * | 1988-11-28 | 1990-06-05 | Kobe Steel Ltd | 耐熱剥離性に優れたリフロー錫またははんだめっき銅または銅合金材料 |
JPH03271394A (ja) * | 1990-03-19 | 1991-12-03 | Mitsubishi Electric Corp | はんだめっき銅合金材 |
JPH10204683A (ja) * | 1997-01-17 | 1998-08-04 | Bridgestone Metalpha Kk | 伸線加工性に優れためっき鋼線材およびその製造方法 |
US6974767B1 (en) * | 2002-02-21 | 2005-12-13 | Advanced Micro Devices, Inc. | Chemical solution for electroplating a copper-zinc alloy thin film |
JP2004091824A (ja) * | 2002-08-29 | 2004-03-25 | Ishihara Chem Co Ltd | スズホイスカーの防止方法 |
JP2010248616A (ja) * | 2009-03-26 | 2010-11-04 | Kobe Steel Ltd | 耐熱性に優れるSnめっき付き銅又は銅合金及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014122410A (ja) * | 2012-12-24 | 2014-07-03 | Ishihara Chemical Co Ltd | スズ又はスズ合金メッキ浴 |
JP2016522327A (ja) * | 2013-06-04 | 2016-07-28 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 銀−スズ合金の電気めっき浴 |
JP2016074979A (ja) * | 2014-09-30 | 2016-05-12 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 銅(i)イオンに基づくホワイトブロンズ用のシアン化物非含有電気めっき浴 |
Also Published As
Publication number | Publication date |
---|---|
US9145617B2 (en) | 2015-09-29 |
EP2565297A3 (en) | 2013-04-24 |
CN102965700A (zh) | 2013-03-13 |
TW201319329A (zh) | 2013-05-16 |
EP2738290A1 (en) | 2014-06-04 |
JP6054676B2 (ja) | 2016-12-27 |
EP2565297A2 (en) | 2013-03-06 |
US20130236742A1 (en) | 2013-09-12 |
KR102032891B1 (ko) | 2019-10-16 |
CN102965700B (zh) | 2016-08-03 |
TWI449815B (zh) | 2014-08-21 |
KR20130024845A (ko) | 2013-03-08 |
EP2660360A1 (en) | 2013-11-06 |
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