JP2013034025A - 発光素子パッケージ及びその製造方法 - Google Patents
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
【解決手段】 実装用溝が形成された第1面と、第1面と反対側の面である第2面とを備え、第1極性の領域を備えるパッケージ構造物と、パッケージ構造物の第2面上に位置し、第1極性とは反対の第2極性を備え、ツェナダイオードを形成する一つの拡散領域と、絶縁膜を介してパッケージ構造物と絶縁された第1電極及び第2電極と、を備え、第1電極及び第2電極は、それぞれ、パッケージ構造物の第1面に位置する上部電極とパッケージ構造物の第2面に位置する下部電極とを含み、パッケージ構造物は、拡散領域以外の全領域が第1極性を有し、第1電極は、第2極性を有する拡散領域に電気的に接続され、第2電極は、第1極性を有するパッケージ構造物に電気的に接続されている発光素子パッケージ。
【選択図】 図4
Description
110 実装用溝
121 拡散層
122 拡散層
130 絶縁膜
141 第1電極
142 第2電極
300 発光素子
440 半田
450 モルディング部
Claims (18)
- 実装用溝が形成された第1面と、前記第1面と反対側の面である第2面とを備え、第1極性の領域を備えるパッケージ構造物と、
前記パッケージ構造物の第2面上に位置し、前記第1極性とは反対の第2極性を備え、ツェナダイオードを形成する一つの拡散領域と、
絶縁膜を介して前記パッケージ構造物と絶縁された第1電極及び第2電極と、を備え、
前記第1電極及び第2電極は、それぞれ、前記パッケージ構造物の第1面に位置する上部電極と前記パッケージ構造物の第2面に位置する下部電極とを含み、
前記パッケージ構造物は、前記拡散領域以外の全領域が第1極性を有し、
前記第1電極は、前記第2極性を有する拡散領域に電気的に接続され、
前記第2電極は、前記第1極性を有するパッケージ構造物に電気的に接続されていることを特徴とする発光素子パッケージ。 - 前記パッケージ構造物は、シリコン、セラミック及びプラスチックの少なくとも一つを含むことを特徴とする請求項1に記載の発光素子パッケージ。
- 前記実装用溝は、傾斜した側面を有することを特徴とする請求項1に記載の発光素子パッケージ。
- 前記実装用溝に備わり、前記第1電極及び第2電極と電気的に接続された発光素子をさらに含む請求項3に記載の発光素子パッケージ。
- 前記第1電極及び前記第2電極は、前記実装用溝上に位置することを特徴とする請求項4に記載の発光素子パッケージ。
- 前記発光素子は、半田を介して前記実装用溝にフリップチップボンディングによって接合されていることを特徴とする請求項4に記載の発光素子パッケージ。
- 前記発光素子は、前記パッケージ構造物と前記少なくとも一つの拡散領域を含む前記ツェナダイオードに並列に接続されていることを特徴とする請求項1に記載の発光素子パッケージ。
- 前記実装用溝を充填するモルディング部をさらに含む請求項4に記載の発光素子パッケージ。
- 前記モルディング部は、複合樹脂粉末と、蛍光体パウダーと、を含む混合物を含むことを特徴とする請求項8に記載の発光素子パッケージ。
- 前記絶縁膜は、前記少なくとも一つの拡散領域が形成されていない前記パッケージ構造物の実質的に表面全体に形成されていることを特徴とする請求項1に記載の発光素子パッケージ。
- 前記上部電極と前記下部電極とは、電気的に接続されていることを特徴とする請求項1に記載の発光素子パッケージ。
- 前記上部電極と前記下部電極は、前記パッケージ構造物の側面で接続されていることを特徴とする請求項11に記載の発光素子パッケージ。
- 前記第1電極と前記第2電極は、高い反射率を有する材料を含むことを特徴とする請求項1に記載の発光素子パッケージ。
- 前記モルディング部は、前記パッケージ構造物を密封することを特徴とする請求項8に記載の発光素子パッケージ。
- 第1極性の領域を有する基板の第1面と第2面にマスクを配置し、前記基板に露光し、実装用溝と貫通ホールを形成するために前記基板を選択的にエッチングする段階と、
前記基板の第2面に、前記第1極性とは反対の第2極性を有し、ツェナダイオードを形成するための一つの拡散層を形成する段階と、
前記第1面と第2面に第1電極と第2電極とを形成し、前記第1電極が前記基板から絶縁され、前記一つの拡散層に電気的に接続され、前記第2電極が前記基板から絶縁され、前記基板の一部分に電気的に接続されるように、前記貫通ホールを介して前記第1電極と第2電極が形成される段階と、
前記第1電極及び第2電極と電気的に接続されるように、半田を介して前記実装用溝に発光素子を接合する段階と、を含み、
前記基板は、前記拡散層以外の全領域が第1極性を有し、
前記第1電極は、前記第2極性を有する拡散層に電気的に接続され、
前記第2電極は、前記第1極性を有する基板に電気的に接続されることを特徴とする発光素子パッケージの製造方法。 - 前記実装用溝は、傾斜した側面を有することを特徴とする請求項15に記載の発光素子パッケージの製造方法。
- 前記発光素子パッケージを個別の発光素子パッケージに区分する段階をさらに含む請求項15に記載の発光素子パッケージの製造方法。
- 前記エッチングする段階は、バルクマイクロマシニング工程で湿式エッチングすることで、前記発光素子パッケージを個別の発光素子パッケージに区分するための前記貫通ホールと、各発光素子パッケージの前記実装用溝と、を形成することを特徴とする請求項15に記載の発光素子パッケージの製造方法。
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KR100767681B1 (ko) | 2006-12-04 | 2007-10-17 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
KR101283282B1 (ko) * | 2007-07-25 | 2013-07-11 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 제조방법 |
KR100877881B1 (ko) * | 2007-09-06 | 2009-01-08 | 엘지이노텍 주식회사 | 발광다이오드 패키지 및 그 제조방법 |
KR100896282B1 (ko) | 2007-11-01 | 2009-05-08 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
KR101349409B1 (ko) | 2007-11-05 | 2014-02-13 | 엘지이노텍 주식회사 | 발광장치 및 그 제조방법 |
KR100999760B1 (ko) | 2008-09-26 | 2010-12-08 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
KR101114592B1 (ko) * | 2009-02-17 | 2012-03-09 | 엘지이노텍 주식회사 | 발광 디바이스 패키지 및 그 제조방법 |
KR101064098B1 (ko) * | 2009-02-23 | 2011-09-08 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
KR20100097434A (ko) * | 2009-02-26 | 2010-09-03 | 삼성전자주식회사 | 색 온도를 조절할 수 있는 발광 패키지 및 그 제조 방법, 상기 발광 패키지의 색 온도 조절 방법 |
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US20070200131A1 (en) | 2007-08-30 |
US7738764B2 (en) | 2010-06-15 |
EP1826834A2 (en) | 2007-08-29 |
CN101030617A (zh) | 2007-09-05 |
JP2007235137A (ja) | 2007-09-13 |
EP1826834B1 (en) | 2020-05-06 |
KR100746783B1 (ko) | 2007-08-06 |
EP1826834A3 (en) | 2013-11-27 |
CN101030617B (zh) | 2011-05-18 |
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