JP2012530376A - ウェーハ加工用シート - Google Patents
ウェーハ加工用シート Download PDFInfo
- Publication number
- JP2012530376A JP2012530376A JP2012515974A JP2012515974A JP2012530376A JP 2012530376 A JP2012530376 A JP 2012530376A JP 2012515974 A JP2012515974 A JP 2012515974A JP 2012515974 A JP2012515974 A JP 2012515974A JP 2012530376 A JP2012530376 A JP 2012530376A
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- wafer processing
- meth
- wafer
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 27
- 230000000903 blocking effect Effects 0.000 claims abstract description 8
- 238000000227 grinding Methods 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 104
- 239000000178 monomer Substances 0.000 claims description 60
- 239000010410 layer Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 54
- -1 ester acrylate Chemical class 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 230000009477 glass transition Effects 0.000 claims description 23
- 229920000058 polyacrylate Polymers 0.000 claims description 21
- 229920006158 high molecular weight polymer Polymers 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical group OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000000623 heterocyclic group Chemical group 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000012461 cellulose resin Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 32
- 238000005520 cutting process Methods 0.000 abstract description 18
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 93
- 230000000704 physical effect Effects 0.000 description 18
- 238000001723 curing Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 230000035882 stress Effects 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229920005862 polyol Polymers 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 150000003077 polyols Chemical class 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 241000251468 Actinopterygii Species 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 239000006188 syrup Substances 0.000 description 2
- 235000020357 syrup Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 description 1
- IEORSVTYLWZQJQ-UHFFFAOYSA-N 2-(2-nonylphenoxy)ethanol Chemical compound CCCCCCCCCC1=CC=CC=C1OCCO IEORSVTYLWZQJQ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- BANNERIEAWNZHY-UHFFFAOYSA-N 2-(4-fluorophenoxy)ethyl prop-2-enoate Chemical compound FC1=CC=C(OCCOC(=O)C=C)C=C1 BANNERIEAWNZHY-UHFFFAOYSA-N 0.000 description 1
- JWOACSMESNKGGJ-UHFFFAOYSA-N 2-ethenyl-2-(hydroxymethyl)propane-1,3-diol Chemical group OCC(CO)(CO)C=C JWOACSMESNKGGJ-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- JYSWMLAADBQAQX-UHFFFAOYSA-N 2-prop-2-enoyloxyacetic acid Chemical compound OC(=O)COC(=O)C=C JYSWMLAADBQAQX-UHFFFAOYSA-N 0.000 description 1
- YAHLUTXNMRWKSM-UHFFFAOYSA-N 2-prop-2-enoyloxybutanoic acid Chemical compound CCC(C(O)=O)OC(=O)C=C YAHLUTXNMRWKSM-UHFFFAOYSA-N 0.000 description 1
- CUTWSDAQYCQTGD-UHFFFAOYSA-N 2-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)C(C)OC(=O)C=C CUTWSDAQYCQTGD-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- SORGEQQSQGNZFI-UHFFFAOYSA-N [azido(phenoxy)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(=O)(N=[N+]=[N-])OC1=CC=CC=C1 SORGEQQSQGNZFI-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- LBDSXVIYZYSRII-IGMARMGPSA-N alpha-particle Chemical compound [4He+2] LBDSXVIYZYSRII-IGMARMGPSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- JLSIEHRMXULWOA-UHFFFAOYSA-N carboxyoxy 3-ethyloctan-3-yl carbonate Chemical compound CCCCCC(CC)(CC)OC(=O)OOC(O)=O JLSIEHRMXULWOA-UHFFFAOYSA-N 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- VIBDJEWPNNCFQO-UHFFFAOYSA-N ethane-1,1,2-triol Chemical compound OCC(O)O VIBDJEWPNNCFQO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000002757 morpholinyl group Chemical group 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical compound CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
しかし、特許文献1を含めて、現在まで知られた技術では、前述したように多様に要求される物性を兼備するウェーハ加工用シートが提示されていない。
本発明において使用される基材の種類は、特に制限されない。本発明においては、ウェーハ加工用シートなどに使用される基材として、切断性、耐熱性、寸法安定性及び応力緩和性などに優れていて、フィッシュアイなどの突出部位がない均一な平面を有するものなら、いずれの種類の基材も使用することができる。
<ブロッキング防止層の製造>
メチルメタアクリレート(MMA)90重量部及びヒドロキシエチルメタアクリレート(HEMA)10重量部を含む単量体混合物を重合させて、固形分の含量が20重量%であるアクリル重合体を製造した。次いで、製造されたアクリル重合体100重量部に対して、イソシアネート硬化剤(TDI)10重量部を配合し、コーティング液を製造した。その後、製造されたコーティング液を乾燥後の厚さが2μmとなるようにポリエステル系離型フィルム上にバーコーターを用いてコーティングし、適正条件で乾燥及び熟成させて、ブロッキング防止層を製造した。
窒素ガスが還流され、温度調節が容易となるように冷却装置を設置した1L反応器に2−エチルヘキシルアクリレート(2−HEA)70重量部、イソボニルアクリレート(IBOA)27重量部及びヒドロキシエチルアクリレート(2−HEA)3重量部の単量体混合物を投入し、酸素除去のために窒素ガスをパージングした。その後、温度を60℃に維持した状態で混合物を均一にした後、反応開始剤としてジエチルヘキシルペルオキシジカルボネートを0.015重量部、連鎖移動剤であるn−ドデシルメルカプタン(n−DDM)を0.04重量部投入して反応させて、部分重合されたアクリル系シロップを製造した。その後、上記部分重合されたアクリル系シロップ70重量部及び追加的な希釈単量体成分としてイソボニルアクリレート(IBOA)30重量部を混合し、さらに光開始剤としてイガキュア184(1−ヒドロキシシクロヘキシルフェニルケトン)0.5重量部を投入、混合及び脱泡し、光硬化性組成物を製造した。次いで、製造された組成物を上記で形成されたブロッキング防止層上に硬化後の厚さが約160μmとなるようにバーコーターを用いてコーティングした。その後、酸素との接触を遮断するために、上記コーティング層にポリエステル系離型フィルムを追加に積層し、金属ハライドランプを使用して光量が800mJ/cm2となるように光(UV−A領域)を照射し、基材を形成した。
2−エチルヘキシルアクリレート(2−EHA)95重量部及び2−ヒドロキシエチルアクリレート5重量部を重合された形態で含むアクリル系重合体をメタクリロイルオキシエチルイソシアネート(MOI)と反応させた反応物を離型フィルム上に適用し、厚さ約20μmの粘着剤層を形成し、これを上記基材のブロッキング防止層の反対面にラミネートし、ウェーハ加工用シートを製作した。
ブロッキング防止層の製造時にイソシアネート硬化剤(TDI)を配合せず、未硬化状態のアクリル重合体を含むブロッキング防止層を形成したことを除いて、実施例1と同様に、ウェーハ加工用シートを製造した。
実施例1のブロッキング防止層の製造において、アクリル系重合体及び硬化剤の混合物の代わりにセルロースアセテート樹脂を使用して未硬化状態の樹脂を含むブロッキング防止層を形成したことを除いて、実施例1と同様に、ウェーハ加工用シートを製造した。
実施例1のブロッキング防止層の製造において、アクリル系重合体及び硬化剤の混合物の代わりにポリイミドを使用して未硬化状態の樹脂を含むブロッキング防止層を形成したことを除いて、実施例1と同様に、ウェーハ加工用シートを製造した。
ブロッキング防止層を形成しないことを除いて、実施例1と同様に、ウェーハ加工用シートを製造した。
ジペンタエリスリトールヘキサアクリレート(DPPA)及び光開始剤であるイガキュア184(1−ヒドロキシシクロヘキシルフェニルケトン)を含む光硬化性組成物を使用して、UV硬化方式でブロッキング防止層を形成したことを除いて、実施例1と同様に、ウェーハ加工用シートを製造した。
ブロッキング防止層のガラス転移温度は、DSC(Differential Scanning Calorimeter、TA instruments(製))を使用して、昇温速度を10℃/分に設定して評価した。
ウェーハマウンター(Wafer Mounter)を使用して8インチシリコンウェーハ(Si−ウェーハ)を製造されたウェーハ加工用シートに付着させる。次いで、ウェーハに付着したシートを80℃雰囲気のオーブン内でステンレスプレート上にブロッキング防止層面が接触するように載置し、その上で200gの荷重を印加した状態で5分間維持する。上記で、比較例1の場合、基材面がプレートと接触するように位置させる。その後、上記ステンレスプレートからウェーハ加工用シートが付着したウェーハを剥離しつつ、下記基準によってブロッキング防止性を測定した。
○:ステンレスプレートからウェーハ加工用シートが付着したウェーハが、ブロッキングなしに容易に分離される場合
×:ステンレスプレートからウェーハ加工用シートが付着したウェーハを剥離する時に、ブロッキングが発生する場合
ウェーハマウンター(Wafer Mounter)で実施例及び比較例のウェーハ加工用シートに8インチシリコンウェーハ(Si−Wafer)を付着させ、エキスパンダ(expender、HS−1810、Hugle electronics Inc)でフィルムをウェーハ形状に沿って切断した。次いで、ステージ(stage)の高さを3に調整し、粘着フィルムの切断面を観察した。具体的に切断の開始地点及び中間部分を顕微鏡(Optical Microscope)で観測し、切断面のバリ生成程度と切断時に破断された部分の面積から下記基準によって切断性を評価した。
○:フィルムの切断開始部位を50倍率で観測する時、解像度640×480の面積部分で観測される、フィルムの全面積に対する破断によって生成された部分の面積の比率が3%未満の場合
△:フィルムの切断開始部位を50倍率で観測する時、解像度640×480の面積部分で観測される、フィルムの全面積に対する破断によって生成された部分の面積の比率が4%〜7%の場合
×:フィルムの切断開始部位を50倍率で観測する時、解像度640×480の面積部分で観測される、全面積に対する破断によって生成された部分の面積の比率が8%以上の場合
ウェーハマウンター(Wafer Mounter;DS Precision Inc. DYWMDS−8’)を使用して、8インチのシリコンウェーハにウェーハ加工用シートを付着し、付着したウェーハの表面を観察し、ラミネーション気泡が発生した部分を計数した後、下記基準によって付着性を評価した。
〔付着性評価基準〕
○:発生気泡の数が3個以下
△:発生気泡の数が4個〜7個
×:発生気泡の数が8個以上
ウェーハ加工用シートに、ウェーハマウンター(Wafer Mounter;DS Precision Inc.、DYWMDS−8’)で8インチシリコンウェーハ(Si−Wafer)を付着させ、エキスパンダ(Expender)でフィルムをウェーハ形状に沿って切断し、ウェーハ裏面研削器(SVG−502MKII8)を使用して研削しながら、ウェーハの反り、損傷及びクラックの発生頻度に応じた下記基準によってウェーハ研削性を評価した。
○:ウェーハの反り、損傷及びクラック発生なし
△:ウェーハの反りが約1〜5mm程度発生するか、またはウェーハの損傷及びクラックが弱く発生
×:ウェーハの反りが5mm以上に発生するか、またはウェーハの損傷及びクラックが多量発生
11 基材
12 ブロッキング防止層
13 粘着剤層
Claims (15)
- 基材と、
上記基材上に形成され、熱硬化状態の樹脂成分または未硬化状態の樹脂成分を含むブロッキング防止層と、を備えるウェーハ加工用シート。 - 前記基材は、ガラス転移温度が−20℃〜45℃であることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記基材は、23℃での靱性数値が10Kg・mm〜250Kg・mmであることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記基材は、高分子量重合体及び単量体成分を含む光硬化性組成物の光硬化物であることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記光硬化性組成物は、(メタ)アクリル酸エステル系単量体を含む単量体混合物の部分重合物を含むことを特徴とする請求項4に記載のウェーハ加工用シート。
- 前記高分子量重合体がウレタン系アクリレート、エステル系アクリレート、エーテル系アクリレートまたはエポキシ系アクリレートであることを特徴とする請求項4に記載のウェーハ加工用シート。
- 前記単量体成分が(メタ)アクリル酸エステル系単量体、極性官能基を有する単量体、多官能性アクリレート、アルコキシ基含有単量体、芳香族基含有単量体またはヘテロ環含有単量体を含むことを特徴とする請求項6に記載のウェーハ加工用シート。
- 前記ブロッキング防止層は、ガラス転移温度が80℃以上であることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記ブロッキング防止層は、ガラス転移温度が100℃以上であることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記熱硬化状態の樹脂成分は、多官能性架橋剤により架橋されたアクリル系重合体を含むことを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記未硬化状態の樹脂成分は、アクリル系重合体、ポリイミド及びセルロース樹脂よりなる群から選択された1つ以上の樹脂を含むことを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記ブロッキング防止層は、厚さが0.01μm〜20μmであることを特徴とする請求項1に記載のウェーハ加工用シート。
- 前記基材上に形成された粘着剤層をさらに備えることを特徴とする請求項1に記載のウェーハ加工用シート。
- 半導体ウェーハの一面に請求項1に記載のウェーハ加工用シートを付着させる段階と、
前記ウェーハ加工用シートが付着したウェーハを加工する段階と、を含むウェーハ加工方法。 - 前記ウェーハの加工段階がバックグラインディング段階またはダイシング段階であることを特徴とする請求項14に記載のウェーハ加工方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0052948 | 2009-06-15 | ||
KR20090052948 | 2009-06-15 | ||
PCT/KR2010/003836 WO2010147363A2 (ko) | 2009-06-15 | 2010-06-15 | 웨이퍼 가공용 시트 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012530376A true JP2012530376A (ja) | 2012-11-29 |
JP5743110B2 JP5743110B2 (ja) | 2015-07-01 |
Family
ID=43356890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012515974A Active JP5743110B2 (ja) | 2009-06-15 | 2010-06-15 | ウェーハ加工用シート |
Country Status (7)
Country | Link |
---|---|
US (1) | US9165815B2 (ja) |
EP (1) | EP2444994B1 (ja) |
JP (1) | JP5743110B2 (ja) |
KR (2) | KR101385866B1 (ja) |
CN (1) | CN102460655B (ja) |
TW (1) | TWI507501B (ja) |
WO (1) | WO2010147363A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010147356A2 (ko) * | 2009-06-15 | 2010-12-23 | (주)Lg화학 | 웨이퍼 가공용 기재 |
CN103492433B (zh) * | 2011-02-14 | 2016-12-14 | 株式会社Lg化学 | 无溶剂组合物及其制备方法 |
EP2676991B1 (en) * | 2011-02-14 | 2020-07-15 | LG Chem, Ltd. | Substrate film and method for manufacturing same |
KR102085533B1 (ko) * | 2012-03-23 | 2020-03-06 | 린텍 가부시키가이샤 | 필름, 워크 가공용 시트 기재 및 워크 가공용 시트 |
JP6098289B2 (ja) | 2013-03-28 | 2017-03-22 | デクセリアルズ株式会社 | 熱伝導性シート |
KR102012687B1 (ko) * | 2016-03-03 | 2019-08-22 | 주식회사 엘지화학 | 반도체 공정용 기재 필름 및 이의 제조방법 |
EP3760423A1 (en) * | 2019-07-02 | 2021-01-06 | Essilor International | Method for making optical lenses using 3d printed functional wafers |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05148457A (ja) * | 1991-11-12 | 1993-06-15 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
JPH1149811A (ja) * | 1997-08-01 | 1999-02-23 | Soken Chem & Eng Co Ltd | 光重合性モノマーの部分重合物の製造方法 |
JP2000178516A (ja) * | 1998-12-21 | 2000-06-27 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
JP2004256595A (ja) * | 2003-02-24 | 2004-09-16 | Lintec Corp | 粘着シートおよびその使用方法 |
WO2004109786A1 (ja) * | 2003-06-06 | 2004-12-16 | Hitachi Chemical Co., Ltd. | 接着シート、ダイシングテープ一体型接着シート、及び半導体装置の製造方法 |
JP2005303068A (ja) * | 2004-04-13 | 2005-10-27 | Nitto Denko Corp | 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法 |
JP2006049507A (ja) * | 2004-08-03 | 2006-02-16 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いた半導体装置製造方法 |
JP2006148096A (ja) * | 2005-11-04 | 2006-06-08 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
JP2006342330A (ja) * | 2005-05-12 | 2006-12-21 | Nitto Denko Corp | ダイシング用粘着シート、及びそれを用いたダイシング方法 |
JP2008031213A (ja) * | 2006-07-26 | 2008-02-14 | Furukawa Electric Co Ltd:The | ダイシング用粘着テープ |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301239A (en) * | 1979-12-05 | 1981-11-17 | E. I. Du Pont De Nemours And Company | Antistatic backing layer for unsubbed polyester film |
JP2703467B2 (ja) * | 1992-10-27 | 1998-01-26 | 呉羽化学工業株式会社 | ウェハ貼着用粘着シート用基材およびウェハ貼着用粘着シート |
JP3177149B2 (ja) * | 1996-03-15 | 2001-06-18 | リンテック株式会社 | 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法 |
TW496881B (en) * | 1997-05-13 | 2002-08-01 | Teijin Ltd | Release film |
JP4392732B2 (ja) * | 2000-02-07 | 2010-01-06 | リンテック株式会社 | 半導体チップの製造方法 |
JP3963631B2 (ja) * | 2000-03-30 | 2007-08-22 | 電気化学工業株式会社 | 半導体ウエハ固定用シート |
JP2002141306A (ja) * | 2000-11-02 | 2002-05-17 | Lintec Corp | ダイシングシート |
KR100647132B1 (ko) * | 2001-08-27 | 2006-11-17 | 히다치 가세고교 가부시끼가이샤 | 접착시트 및 반도체장치 및 그 제조방법 |
JP2003147300A (ja) * | 2001-11-12 | 2003-05-21 | Lintec Corp | ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法 |
US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
CN1472597A (zh) * | 2002-07-16 | 2004-02-04 | 东洋纺织株式会社 | Ir烧蚀用层压体 |
KR20040081250A (ko) * | 2003-03-14 | 2004-09-21 | 주식회사 코오롱 | 폴리이미드 점착테이프 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
US20050244631A1 (en) | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
JP4776189B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP4954569B2 (ja) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
JP2007314636A (ja) * | 2006-05-24 | 2007-12-06 | Nitto Denko Corp | 粘着シート |
WO2008015759A1 (en) * | 2006-08-04 | 2008-02-07 | Hitachi Chemical Co., Ltd. | Film adhesive, adhesive sheet, and semiconductor device using the same |
JP4767144B2 (ja) * | 2006-10-04 | 2011-09-07 | 日東電工株式会社 | レーザ加工用粘着シート |
KR100886732B1 (ko) * | 2006-11-10 | 2009-03-04 | 닛토덴코 가부시키가이샤 | 자동 롤링 적층 시트 및 자동 롤링 감압성 접착제 시트 |
KR101140512B1 (ko) * | 2007-03-01 | 2012-04-30 | 닛토덴코 가부시키가이샤 | 열경화형 다이본드 필름 |
US20090017248A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
US20090017323A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
JP5087372B2 (ja) * | 2007-11-19 | 2012-12-05 | 日東電工株式会社 | 樹脂積層体、粘着シート、該粘着シートを用いた被着体の加工方法、及びその剥離装置 |
CN102015937B (zh) * | 2008-04-21 | 2014-11-12 | Lg化学株式会社 | 压敏粘合剂膜和使用该压敏粘合剂膜的背磨方法 |
US20110139347A1 (en) * | 2008-05-14 | 2011-06-16 | Lg Chem Ltd. | Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer |
WO2010147356A2 (ko) * | 2009-06-15 | 2010-12-23 | (주)Lg화학 | 웨이퍼 가공용 기재 |
-
2010
- 2010-06-15 WO PCT/KR2010/003836 patent/WO2010147363A2/ko active Application Filing
- 2010-06-15 EP EP10789690.4A patent/EP2444994B1/en active Active
- 2010-06-15 KR KR1020100056434A patent/KR101385866B1/ko active IP Right Grant
- 2010-06-15 CN CN201080035330.4A patent/CN102460655B/zh active Active
- 2010-06-15 JP JP2012515974A patent/JP5743110B2/ja active Active
- 2010-06-15 TW TW099119499A patent/TWI507501B/zh active
-
2011
- 2011-12-14 US US13/326,103 patent/US9165815B2/en active Active
-
2012
- 2012-09-03 KR KR1020120096931A patent/KR101483076B1/ko active IP Right Grant
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05148457A (ja) * | 1991-11-12 | 1993-06-15 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
JPH1149811A (ja) * | 1997-08-01 | 1999-02-23 | Soken Chem & Eng Co Ltd | 光重合性モノマーの部分重合物の製造方法 |
JP2000178516A (ja) * | 1998-12-21 | 2000-06-27 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
JP2004256595A (ja) * | 2003-02-24 | 2004-09-16 | Lintec Corp | 粘着シートおよびその使用方法 |
WO2004109786A1 (ja) * | 2003-06-06 | 2004-12-16 | Hitachi Chemical Co., Ltd. | 接着シート、ダイシングテープ一体型接着シート、及び半導体装置の製造方法 |
JP2005303068A (ja) * | 2004-04-13 | 2005-10-27 | Nitto Denko Corp | 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法 |
JP2006049507A (ja) * | 2004-08-03 | 2006-02-16 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いた半導体装置製造方法 |
JP2006342330A (ja) * | 2005-05-12 | 2006-12-21 | Nitto Denko Corp | ダイシング用粘着シート、及びそれを用いたダイシング方法 |
JP2006148096A (ja) * | 2005-11-04 | 2006-06-08 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
JP2008031213A (ja) * | 2006-07-26 | 2008-02-14 | Furukawa Electric Co Ltd:The | ダイシング用粘着テープ |
Also Published As
Publication number | Publication date |
---|---|
CN102460655A (zh) | 2012-05-16 |
TW201116607A (en) | 2011-05-16 |
EP2444994A2 (en) | 2012-04-25 |
CN102460655B (zh) | 2015-05-13 |
KR20120099358A (ko) | 2012-09-10 |
WO2010147363A3 (ko) | 2011-03-03 |
US20120202337A1 (en) | 2012-08-09 |
KR101385866B1 (ko) | 2014-04-17 |
TWI507501B (zh) | 2015-11-11 |
EP2444994A4 (en) | 2015-05-13 |
KR101483076B1 (ko) | 2015-01-16 |
KR20100134530A (ko) | 2010-12-23 |
EP2444994B1 (en) | 2021-05-26 |
JP5743110B2 (ja) | 2015-07-01 |
WO2010147363A2 (ko) | 2010-12-23 |
US9165815B2 (en) | 2015-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5783540B2 (ja) | ウェーハ加工用基材 | |
JP5743110B2 (ja) | ウェーハ加工用シート | |
JP5740490B2 (ja) | ウエハ加工フィルム用粘着剤組成物 | |
KR20120093102A (ko) | 기재 필름 및 그의 제조방법 | |
KR20130142111A (ko) | 전자부품의 제조방법 | |
JP2011132354A (ja) | 紫外線硬化型粘着フィルム | |
KR20170109390A (ko) | 반도체 웨이퍼 표면 보호용 점착 필름 | |
JP5468523B2 (ja) | 粘着剤、粘着シート及び電子部品の製造方法。 | |
JP7428059B2 (ja) | 耐熱性粘着テープ | |
TW202126769A (zh) | 黏著片材 | |
JP5307069B2 (ja) | 放射線硬化性半導体ウエハ表面保護用粘着テープ | |
TW202101550A (zh) | 工件加工用片材 | |
JP6714004B2 (ja) | 粘着シート | |
JP5367996B2 (ja) | 粘着シートの基材フィルムおよび粘着シート | |
KR102460037B1 (ko) | 점착 시트 | |
KR101682720B1 (ko) | 반도체 웨이퍼 가공 방법 | |
JP7538018B2 (ja) | 半導体加工用粘着シート及び半導体装置の製造方法 | |
TW202134372A (zh) | 黏著片材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130806 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140303 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140603 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140901 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150105 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150204 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150413 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150421 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5743110 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |