WO2010147363A3 - 웨이퍼 가공용 시트 - Google Patents

웨이퍼 가공용 시트 Download PDF

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Publication number
WO2010147363A3
WO2010147363A3 PCT/KR2010/003836 KR2010003836W WO2010147363A3 WO 2010147363 A3 WO2010147363 A3 WO 2010147363A3 KR 2010003836 W KR2010003836 W KR 2010003836W WO 2010147363 A3 WO2010147363 A3 WO 2010147363A3
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WO
WIPO (PCT)
Prior art keywords
wafer processing
present
processing sheet
sheet
wafer
Prior art date
Application number
PCT/KR2010/003836
Other languages
English (en)
French (fr)
Other versions
WO2010147363A2 (ko
Inventor
김세라
주효숙
장석기
심정섭
Original Assignee
(주)Lg화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)Lg화학 filed Critical (주)Lg화학
Priority to CN201080035330.4A priority Critical patent/CN102460655B/zh
Priority to EP10789690.4A priority patent/EP2444994B1/en
Priority to JP2012515974A priority patent/JP5743110B2/ja
Publication of WO2010147363A2 publication Critical patent/WO2010147363A2/ko
Publication of WO2010147363A3 publication Critical patent/WO2010147363A3/ko
Priority to US13/326,103 priority patent/US9165815B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

본 발명은 웨이퍼 가공용 시트에 관한 것이다. 본 발명에서는, 내열성 및 치수 안정성이 우수하며, 응력 완화성이 뛰어나 잔류 응력 또는 불균일한 압력의 인가에 의한 웨이퍼의 손상 또는 비산 등을 억제할 수 있고, 탁월한 절단성을 보이는 웨이퍼 가공용 시트를 제공할 수 있다. 또한, 본 발명에서는 웨이퍼 가공 과정 등에서 발생하는 블로킹 현상을 효과적으로 억제할 수 있는 시트를 제공할 수 있다. 이에 따라 본 발명의 기재는, 다이싱, 백그라인딩 또는 픽업 등을 포함한 각종 웨이퍼 가공 공정에서의 가공용 시트로서 효과적으로 사용될 수 있다.
PCT/KR2010/003836 2009-06-15 2010-06-15 웨이퍼 가공용 시트 WO2010147363A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201080035330.4A CN102460655B (zh) 2009-06-15 2010-06-15 晶片处理薄片
EP10789690.4A EP2444994B1 (en) 2009-06-15 2010-06-15 Wafer processing sheet
JP2012515974A JP5743110B2 (ja) 2009-06-15 2010-06-15 ウェーハ加工用シート
US13/326,103 US9165815B2 (en) 2009-06-15 2011-12-14 Wafer processing sheet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20090052948 2009-06-15
KR10-2009-0052948 2009-06-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/326,103 Continuation US9165815B2 (en) 2009-06-15 2011-12-14 Wafer processing sheet

Publications (2)

Publication Number Publication Date
WO2010147363A2 WO2010147363A2 (ko) 2010-12-23
WO2010147363A3 true WO2010147363A3 (ko) 2011-03-03

Family

ID=43356890

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003836 WO2010147363A2 (ko) 2009-06-15 2010-06-15 웨이퍼 가공용 시트

Country Status (7)

Country Link
US (1) US9165815B2 (ko)
EP (1) EP2444994B1 (ko)
JP (1) JP5743110B2 (ko)
KR (2) KR101385866B1 (ko)
CN (1) CN102460655B (ko)
TW (1) TWI507501B (ko)
WO (1) WO2010147363A2 (ko)

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WO2010147356A2 (ko) * 2009-06-15 2010-12-23 (주)Lg화학 웨이퍼 가공용 기재
CN103492433B (zh) * 2011-02-14 2016-12-14 株式会社Lg化学 无溶剂组合物及其制备方法
EP2676991B1 (en) * 2011-02-14 2020-07-15 LG Chem, Ltd. Substrate film and method for manufacturing same
JP6035325B2 (ja) * 2012-03-23 2016-11-30 リンテック株式会社 ワーク加工用シート基材およびワーク加工用シート
JP6098289B2 (ja) * 2013-03-28 2017-03-22 デクセリアルズ株式会社 熱伝導性シート
KR102012687B1 (ko) * 2016-03-03 2019-08-22 주식회사 엘지화학 반도체 공정용 기재 필름 및 이의 제조방법
EP3760423A1 (en) * 2019-07-02 2021-01-06 Essilor International Method for making optical lenses using 3d printed functional wafers

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Also Published As

Publication number Publication date
KR101483076B1 (ko) 2015-01-16
US20120202337A1 (en) 2012-08-09
TWI507501B (zh) 2015-11-11
EP2444994B1 (en) 2021-05-26
KR101385866B1 (ko) 2014-04-17
JP5743110B2 (ja) 2015-07-01
KR20100134530A (ko) 2010-12-23
CN102460655A (zh) 2012-05-16
TW201116607A (en) 2011-05-16
CN102460655B (zh) 2015-05-13
KR20120099358A (ko) 2012-09-10
EP2444994A4 (en) 2015-05-13
EP2444994A2 (en) 2012-04-25
US9165815B2 (en) 2015-10-20
WO2010147363A2 (ko) 2010-12-23
JP2012530376A (ja) 2012-11-29

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