WO2012121547A3 - 웨이퍼 가공 필름용 점착제 조성물 - Google Patents

웨이퍼 가공 필름용 점착제 조성물 Download PDF

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WO2012121547A3
WO2012121547A3 PCT/KR2012/001672 KR2012001672W WO2012121547A3 WO 2012121547 A3 WO2012121547 A3 WO 2012121547A3 KR 2012001672 W KR2012001672 W KR 2012001672W WO 2012121547 A3 WO2012121547 A3 WO 2012121547A3
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wafer processing
adhesive composition
processing film
wafer
film
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PCT/KR2012/001672
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French (fr)
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WO2012121547A2 (ko
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김장순
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(주)엘지하우시스
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Application filed by (주)엘지하우시스 filed Critical (주)엘지하우시스
Priority to CN201280008380.2A priority Critical patent/CN104204126B/zh
Priority to EP12754318.9A priority patent/EP2684928B1/en
Priority to US13/980,170 priority patent/US9153471B2/en
Priority to JP2013552475A priority patent/JP5740490B2/ja
Publication of WO2012121547A2 publication Critical patent/WO2012121547A2/ko
Publication of WO2012121547A3 publication Critical patent/WO2012121547A3/ko

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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

본 발명은, 웨이퍼 가공 필름용 점착제 조성물, 웨이퍼 가공 필름 및 반도체 웨이퍼 가공 방법에 관한 것이다. 본 발명에서는 다이싱 공정 또는 백그라인딩 공정 등의 반도체 웨이퍼 가공 공정에서, 피착체인 웨이퍼에 대한 박리력을 효과적으로 감소시킬 수 있어서, 공정 효율을 높이고, 웨이퍼의 휘어짐이나 균열과 같은 손상을 방지할 수 있는 웨이퍼 가공 필름용 점착제 조성물, 웨이퍼 가공 필름 및 반도체 웨이퍼 가공 방법을 제공할 수 있다.
PCT/KR2012/001672 2011-03-08 2012-03-07 웨이퍼 가공 필름용 점착제 조성물 WO2012121547A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201280008380.2A CN104204126B (zh) 2011-03-08 2012-03-07 用于晶圆加工薄膜的粘合剂组合物
EP12754318.9A EP2684928B1 (en) 2011-03-08 2012-03-07 Adhesive composition for a wafer processing film
US13/980,170 US9153471B2 (en) 2011-03-08 2012-03-07 Adhesive composition for a wafer processing film
JP2013552475A JP5740490B2 (ja) 2011-03-08 2012-03-07 ウエハ加工フィルム用粘着剤組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110020509A KR20120104450A (ko) 2011-03-08 2011-03-08 웨이퍼 가공 필름용 점착제 조성물
KR10-2011-0020509 2011-03-08

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WO2012121547A2 WO2012121547A2 (ko) 2012-09-13
WO2012121547A3 true WO2012121547A3 (ko) 2012-11-15

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US (1) US9153471B2 (ko)
EP (1) EP2684928B1 (ko)
JP (1) JP5740490B2 (ko)
KR (1) KR20120104450A (ko)
CN (1) CN104204126B (ko)
TW (1) TWI585179B (ko)
WO (1) WO2012121547A2 (ko)

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EP3040411B1 (en) * 2013-08-30 2019-07-03 JSR Corporation Adherend recovery method and adherend recovery device
KR101722137B1 (ko) 2014-01-03 2017-03-31 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
WO2015102342A1 (ko) * 2014-01-03 2015-07-09 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
WO2015152158A1 (ja) * 2014-03-31 2015-10-08 株式会社Ｊｏｌｅｄ 積層体および積層体の剥離方法ならびに可撓性デバイスの製造方法
CN104559852B (zh) * 2014-12-31 2018-02-27 深圳市化讯半导体材料有限公司 一种用于薄晶圆加工的临时键合胶及其制备方法
CN104804682B (zh) * 2015-04-16 2017-05-24 深圳市化讯半导体材料有限公司 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法
CN110809815B (zh) * 2017-07-03 2023-10-20 琳得科株式会社 隐形切割用粘着片及半导体装置的制造方法
WO2019008808A1 (ja) * 2017-07-03 2019-01-10 リンテック株式会社 ステルスダイシング用粘着シートおよび半導体装置の製造方法
WO2019008809A1 (ja) * 2017-07-03 2019-01-10 リンテック株式会社 ステルスダイシング用粘着シートおよび半導体装置の製造方法
WO2019008807A1 (ja) * 2017-07-03 2019-01-10 リンテック株式会社 ステルスダイシング用粘着シートおよび半導体装置の製造方法
CN110429058B (zh) * 2019-07-29 2022-05-24 日月新半导体(苏州)有限公司 集成电路制程用胶带及晶圆背面刷胶工艺
CN114316886B (zh) * 2020-09-29 2023-12-22 上海飞凯材料科技股份有限公司 一种可激光拆解的光敏胶及其应用和应用方法

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US9153471B2 (en) 2015-10-06
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TWI585179B (zh) 2017-06-01
CN104204126B (zh) 2017-04-12
JP2014509450A (ja) 2014-04-17
US20130295747A1 (en) 2013-11-07
EP2684928A4 (en) 2014-10-15
EP2684928A2 (en) 2014-01-15
EP2684928B1 (en) 2018-09-12
WO2012121547A2 (ko) 2012-09-13
TW201237136A (en) 2012-09-16

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