WO2010147356A3 - 웨이퍼 가공용 기재 - Google Patents
웨이퍼 가공용 기재 Download PDFInfo
- Publication number
- WO2010147356A3 WO2010147356A3 PCT/KR2010/003827 KR2010003827W WO2010147356A3 WO 2010147356 A3 WO2010147356 A3 WO 2010147356A3 KR 2010003827 W KR2010003827 W KR 2010003827W WO 2010147356 A3 WO2010147356 A3 WO 2010147356A3
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- WO
- WIPO (PCT)
- Prior art keywords
- base
- present
- wafer processing
- wafer
- provides
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
- C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
- C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/006—Presence of epoxy resin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
- C09J2471/006—Presence of polyether in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Abstract
본 발명은 웨이퍼 가공용 기재에 관한 것이다. 본 발명에서는, 우수한 내열성 및 치수 안정성을 나타내는 기재를 제공할 수 있다. 또한, 본 발명은, 응력 완화성이 탁월하여 잔류 응력에 의한 웨이퍼의 파손을 방지할 수 있고, 웨이퍼 가공 과정에서의 불균일한 압력의 인가에 의한 웨이퍼의 손상이나 비산 등을 억제할 수 있으며, 탁월한 절단성을 보이는 기재를 제공한다. 이에 따라 본 발명의 기재는, 다이싱, 백그라인딩 또는 픽업 등을 포함한 각종 웨이퍼 가공 공정에서의 가공용 시트로서 효과적으로 사용될 수 있다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012515973A JP5783540B2 (ja) | 2009-06-15 | 2010-06-15 | ウェーハ加工用基材 |
CN201080026824.6A CN102804344B (zh) | 2009-06-15 | 2010-06-15 | 晶片加工用基材 |
EP10789683.9A EP2444995A4 (en) | 2009-06-15 | 2010-06-15 | TREE TREATMENT BASE |
US13/316,264 US9905450B2 (en) | 2009-06-15 | 2011-12-09 | Wafer processing base |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20090052945 | 2009-06-15 | ||
KR10-2009-0052945 | 2009-06-15 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/316,264 Continuation US9905450B2 (en) | 2009-06-15 | 2011-12-09 | Wafer processing base |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010147356A2 WO2010147356A2 (ko) | 2010-12-23 |
WO2010147356A3 true WO2010147356A3 (ko) | 2011-03-31 |
Family
ID=43356886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/003827 WO2010147356A2 (ko) | 2009-06-15 | 2010-06-15 | 웨이퍼 가공용 기재 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9905450B2 (ko) |
EP (1) | EP2444995A4 (ko) |
JP (1) | JP5783540B2 (ko) |
KR (1) | KR101127152B1 (ko) |
CN (1) | CN102804344B (ko) |
TW (1) | TWI425068B (ko) |
WO (1) | WO2010147356A2 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI507501B (zh) * | 2009-06-15 | 2015-11-11 | Lg Chemical Ltd | 用於處理晶圓的薄片 |
TW201341199A (zh) * | 2011-12-12 | 2013-10-16 | Nitto Denko Corp | 積層片材以及使用積層片材之半導體裝置之製造方法 |
JP6169067B2 (ja) * | 2014-12-24 | 2017-07-26 | 古河電気工業株式会社 | 電子部品加工用粘着テープ |
JP6967908B2 (ja) * | 2016-09-09 | 2021-11-17 | ニッタ株式会社 | 感温性粘着シートおよびこれを用いるウエハの製造方法 |
KR102487395B1 (ko) * | 2016-09-20 | 2023-01-11 | 동우 화인켐 주식회사 | 점착제 조성물 및 그를 이용한 점착 시트 |
KR102239210B1 (ko) | 2018-06-04 | 2021-04-09 | 주식회사 엘지화학 | 백 그라인딩 테이프 |
TWI727299B (zh) * | 2019-04-03 | 2021-05-11 | 奇美實業股份有限公司 | 板材單元、用以裁切其之裁切裝置、及其製造與加工方法 |
JP7474146B2 (ja) | 2019-10-15 | 2024-04-24 | マクセル株式会社 | ダイシングテープ用溶液流延型基材フィルム及びダイシングテープ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010019894A (ko) * | 1999-08-31 | 2001-03-15 | 성재갑 | 잔류응력 완화효과가 우수한 아크릴계 점착제 조성물 |
JP2006335860A (ja) * | 2005-06-01 | 2006-12-14 | Lintec Corp | 接着シート |
JP2007045965A (ja) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | 粘着シートとその製造方法、及び、製品の加工方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002141306A (ja) * | 2000-11-02 | 2002-05-17 | Lintec Corp | ダイシングシート |
JP4519409B2 (ja) | 2003-02-24 | 2010-08-04 | リンテック株式会社 | 粘着シートおよびその使用方法 |
CA2530132A1 (en) * | 2003-07-08 | 2005-01-13 | Kaneka Corporation | Curing composition |
US7186629B2 (en) * | 2003-11-19 | 2007-03-06 | Advanced Materials Sciences, Inc. | Protecting thin semiconductor wafers during back-grinding in high-volume production |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US20050244631A1 (en) | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
JP4452127B2 (ja) * | 2004-06-01 | 2010-04-21 | 三井化学株式会社 | 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法 |
JP4592535B2 (ja) * | 2005-02-23 | 2010-12-01 | 日東電工株式会社 | 多層シートとその製造方法及びこの多層シートを用いた粘着シート |
CA2644773C (en) * | 2006-03-10 | 2015-01-27 | Teijin Chemicals Ltd. | Laminate |
US7935424B2 (en) * | 2006-04-06 | 2011-05-03 | Lintec Corporation | Adhesive sheet |
US8114520B2 (en) * | 2006-12-05 | 2012-02-14 | Lintec Corporation | Laser dicing sheet and process for producing chip body |
US20090261084A1 (en) * | 2006-12-05 | 2009-10-22 | Lintec Corporation | Laser Dicing Sheet and Manufacturing Method For Chip Body |
JP4968912B2 (ja) * | 2007-03-30 | 2012-07-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
US20090017323A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
JP5087372B2 (ja) * | 2007-11-19 | 2012-12-05 | 日東電工株式会社 | 樹脂積層体、粘着シート、該粘着シートを用いた被着体の加工方法、及びその剥離装置 |
CN102027088B (zh) * | 2008-05-14 | 2014-11-26 | 日东电工株式会社 | 涂膜保护用粘合片 |
TWI507501B (zh) * | 2009-06-15 | 2015-11-11 | Lg Chemical Ltd | 用於處理晶圓的薄片 |
-
2010
- 2010-06-15 KR KR1020100056433A patent/KR101127152B1/ko active IP Right Grant
- 2010-06-15 EP EP10789683.9A patent/EP2444995A4/en not_active Withdrawn
- 2010-06-15 JP JP2012515973A patent/JP5783540B2/ja active Active
- 2010-06-15 WO PCT/KR2010/003827 patent/WO2010147356A2/ko active Application Filing
- 2010-06-15 TW TW099119500A patent/TWI425068B/zh active
- 2010-06-15 CN CN201080026824.6A patent/CN102804344B/zh active Active
-
2011
- 2011-12-09 US US13/316,264 patent/US9905450B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010019894A (ko) * | 1999-08-31 | 2001-03-15 | 성재갑 | 잔류응력 완화효과가 우수한 아크릴계 점착제 조성물 |
JP2006335860A (ja) * | 2005-06-01 | 2006-12-14 | Lintec Corp | 接着シート |
JP2007045965A (ja) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | 粘着シートとその製造方法、及び、製品の加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102804344B (zh) | 2016-03-09 |
KR101127152B1 (ko) | 2012-03-20 |
JP5783540B2 (ja) | 2015-09-24 |
CN102804344A (zh) | 2012-11-28 |
JP2012530375A (ja) | 2012-11-29 |
KR20100134529A (ko) | 2010-12-23 |
US20120202036A1 (en) | 2012-08-09 |
TWI425068B (zh) | 2014-02-01 |
EP2444995A4 (en) | 2016-04-06 |
EP2444995A2 (en) | 2012-04-25 |
TW201116608A (en) | 2011-05-16 |
US9905450B2 (en) | 2018-02-27 |
WO2010147356A2 (ko) | 2010-12-23 |
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