JP2012527400A5 - - Google Patents

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Publication number
JP2012527400A5
JP2012527400A5 JP2012512055A JP2012512055A JP2012527400A5 JP 2012527400 A5 JP2012527400 A5 JP 2012527400A5 JP 2012512055 A JP2012512055 A JP 2012512055A JP 2012512055 A JP2012512055 A JP 2012512055A JP 2012527400 A5 JP2012527400 A5 JP 2012527400A5
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JP
Japan
Prior art keywords
brittle material
passing
material sheet
predetermined path
laser beam
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JP2012512055A
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English (en)
Japanese (ja)
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JP2012527400A (ja
JP6018503B2 (ja
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Priority claimed from US12/469,794 external-priority patent/US8269138B2/en
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Publication of JP2012527400A5 publication Critical patent/JP2012527400A5/ja
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Publication of JP6018503B2 publication Critical patent/JP6018503B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012512055A 2009-05-21 2010-05-21 脆性材料シートの分割方法 Expired - Fee Related JP6018503B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/469,794 2009-05-21
US12/469,794 US8269138B2 (en) 2009-05-21 2009-05-21 Method for separating a sheet of brittle material
PCT/US2010/035715 WO2010135616A2 (en) 2009-05-21 2010-05-21 Method for separating a sheet of brittle material

Publications (3)

Publication Number Publication Date
JP2012527400A JP2012527400A (ja) 2012-11-08
JP2012527400A5 true JP2012527400A5 (https=) 2013-05-30
JP6018503B2 JP6018503B2 (ja) 2016-11-02

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JP2012512055A Expired - Fee Related JP6018503B2 (ja) 2009-05-21 2010-05-21 脆性材料シートの分割方法

Country Status (7)

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US (1) US8269138B2 (https=)
EP (1) EP2432616B1 (https=)
JP (1) JP6018503B2 (https=)
KR (1) KR101581992B1 (https=)
CN (1) CN102458754B (https=)
TW (1) TWI415811B (https=)
WO (1) WO2010135616A2 (https=)

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WO2015178358A1 (ja) * 2014-05-23 2015-11-26 日本電気硝子株式会社 パネルの製造方法
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
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WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
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