JP2012514340A5 - - Google Patents

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Publication number
JP2012514340A5
JP2012514340A5 JP2011543974A JP2011543974A JP2012514340A5 JP 2012514340 A5 JP2012514340 A5 JP 2012514340A5 JP 2011543974 A JP2011543974 A JP 2011543974A JP 2011543974 A JP2011543974 A JP 2011543974A JP 2012514340 A5 JP2012514340 A5 JP 2012514340A5
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JP
Japan
Prior art keywords
solder
chip mounting
region
partial
contact
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JP2011543974A
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English (en)
Japanese (ja)
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JP5766122B2 (ja
JP2012514340A (ja
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Priority claimed from DE102008063325A external-priority patent/DE102008063325A1/de
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Publication of JP2012514340A publication Critical patent/JP2012514340A/ja
Publication of JP2012514340A5 publication Critical patent/JP2012514340A5/ja
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Publication of JP5766122B2 publication Critical patent/JP5766122B2/ja
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JP2011543974A 2008-12-30 2009-11-27 発光手段の製造方法 Active JP5766122B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008063325A DE102008063325A1 (de) 2008-12-30 2008-12-30 Verfahren zur Fertigung von Leuchtmitteln
DE102008063325.9 2008-12-30
PCT/DE2009/001693 WO2010075831A1 (de) 2008-12-30 2009-11-27 Verfahren zur fertigung von leuchtmitteln

Publications (3)

Publication Number Publication Date
JP2012514340A JP2012514340A (ja) 2012-06-21
JP2012514340A5 true JP2012514340A5 (enExample) 2012-12-20
JP5766122B2 JP5766122B2 (ja) 2015-08-19

Family

ID=41725366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011543974A Active JP5766122B2 (ja) 2008-12-30 2009-11-27 発光手段の製造方法

Country Status (7)

Country Link
US (1) US8809082B2 (enExample)
EP (2) EP2544234A1 (enExample)
JP (1) JP5766122B2 (enExample)
KR (1) KR101681343B1 (enExample)
CN (1) CN102272925B (enExample)
DE (1) DE102008063325A1 (enExample)
WO (1) WO2010075831A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063325A1 (de) 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln
CN103201834B (zh) * 2011-11-04 2016-03-02 松下知识产权经营株式会社 半导体装置及其制造方法
DE102012215705B4 (de) * 2012-09-05 2021-09-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe
ITTR20120012A1 (it) * 2012-11-20 2013-02-19 Tecnologie E Servizi Innovativi T S I S R L Mpcb-led-sink20 - circuito stampato su base metallica con trasferimento diretto del calore dal pad termico dei led di potenza allo strato metallico della mpcb con capacita' di abbassare la temperatura della giunzione del led di ulteriori 20 °c rispet
DE102013201775A1 (de) * 2013-02-04 2014-08-07 Osram Gmbh Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
US9215794B2 (en) * 2013-05-06 2015-12-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Circuit board and display device
DE102013215588A1 (de) 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
JP2015176975A (ja) * 2014-03-14 2015-10-05 パナソニックＩｐマネジメント株式会社 半導体装置
CN109188631B (zh) * 2018-09-26 2022-06-24 昂纳信息技术（深圳）有限公司 一种尾纤的防脱落方法及光学装置
JP2021118350A (ja) * 2020-01-23 2021-08-10 富士電機株式会社 電子装置及び電子装置の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528000B2 (de) * 1975-06-24 1979-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen
US6546620B1 (en) * 2000-06-29 2003-04-15 Amkor Technology, Inc. Flip chip integrated circuit and passive chip component package fabrication method
US6660559B1 (en) * 2001-06-25 2003-12-09 Amkor Technology, Inc. Method of making a chip carrier package using laser ablation
DE10351120A1 (de) 2003-11-03 2005-06-09 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Lötstopbarriere
DE102004016697B4 (de) * 2004-02-27 2007-10-11 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Halbleiterchips umfassend ein Verbindungsverfahren, das Löten mit einem Lot umfasst, und Halbleiterchip
EP1575084B1 (en) * 2004-03-01 2010-05-26 Imec Method for depositing a solder material on a substrate
DE102005031336B4 (de) 2005-05-13 2008-01-31 Osram Opto Semiconductors Gmbh Projektionseinrichtung
CN100571353C (zh) 2005-05-13 2009-12-16 奥斯兰姆奥普托半导体有限责任公司 投影设备
KR100658939B1 (ko) 2005-05-24 2006-12-15 엘지전자 주식회사 발광 소자의 패키지
US20060289887A1 (en) 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
KR100699161B1 (ko) 2005-10-06 2007-03-22 엘지전자 주식회사 발광 소자 패키지 및 그의 제조 방법
KR20080007961A (ko) 2006-07-19 2008-01-23 알티전자 주식회사 엘이디 모듈의 냉각 장치 및 그 제조 방법
DE102006059127A1 (de) * 2006-09-25 2008-03-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Anordnung optoelektronischer Bauelemente und Anordnung optoelektronischer Bauelemente
CN101154656B (zh) 2006-09-30 2010-05-12 香港微晶先进封装技术有限公司 多芯片发光二极管模组结构及其制造方法
JP5145729B2 (ja) 2007-02-26 2013-02-20 富士電機株式会社 半田接合方法およびそれを用いた半導体装置の製造方法
CN101687718A (zh) * 2007-04-24 2010-03-31 陶瓷技术股份公司 具有金属化表面的陶瓷体的结构部件
DE102008063325A1 (de) 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln

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