JP2013504187A5 - - Google Patents
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- Publication number
- JP2013504187A5 JP2013504187A5 JP2012527265A JP2012527265A JP2013504187A5 JP 2013504187 A5 JP2013504187 A5 JP 2013504187A5 JP 2012527265 A JP2012527265 A JP 2012527265A JP 2012527265 A JP2012527265 A JP 2012527265A JP 2013504187 A5 JP2013504187 A5 JP 2013504187A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor body
- isolation layer
- metallized
- optoelectronic device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 16
- 238000002955 isolation Methods 0.000 claims 12
- 230000005693 optoelectronics Effects 0.000 claims 11
- 230000005855 radiation Effects 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 5
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009039890A DE102009039890A1 (de) | 2009-09-03 | 2009-09-03 | Optoelektronisches Bauelement mit einem Halbleiterkörper, einer Isolationsschicht und einer planaren Leitstruktur und Verfahren zu dessen Herstellung |
| DE102009039890.2 | 2009-09-03 | ||
| PCT/EP2010/061443 WO2011026709A1 (de) | 2009-09-03 | 2010-08-05 | Optoelektronisches bauelement mit einem halbleiterkörper, einer isolationsschicht und einer planaren leitstruktur und verfahren zu dessen herstellung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013504187A JP2013504187A (ja) | 2013-02-04 |
| JP2013504187A5 true JP2013504187A5 (enExample) | 2013-05-30 |
| JP5675816B2 JP5675816B2 (ja) | 2015-02-25 |
Family
ID=43086284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012527265A Expired - Fee Related JP5675816B2 (ja) | 2009-09-03 | 2010-08-05 | 半導体ボディとアイソレーション層と平面導体構造とを備えたオプトエレクトロニクス素子および該オプトエレクトロニクス素子の製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20120228663A1 (enExample) |
| EP (1) | EP2474048A1 (enExample) |
| JP (1) | JP5675816B2 (enExample) |
| KR (1) | KR20120055723A (enExample) |
| CN (1) | CN102484171B (enExample) |
| DE (1) | DE102009039890A1 (enExample) |
| TW (1) | TWI451599B (enExample) |
| WO (1) | WO2011026709A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130181351A1 (en) * | 2012-01-12 | 2013-07-18 | King Dragon International Inc. | Semiconductor Device Package with Slanting Structures |
| US20130181227A1 (en) * | 2012-01-12 | 2013-07-18 | King Dragon International Inc. | LED Package with Slanting Structure and Method of the Same |
| US20130214418A1 (en) * | 2012-01-12 | 2013-08-22 | King Dragon International Inc. | Semiconductor Device Package with Slanting Structures |
| TWI751809B (zh) | 2020-11-18 | 2022-01-01 | 隆達電子股份有限公司 | 增進接合良率的發光二極體結構 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2888385B2 (ja) * | 1991-08-22 | 1999-05-10 | 京セラ株式会社 | 受発光素子アレイのフリップチップ接続構造 |
| US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
| TWI249148B (en) * | 2004-04-13 | 2006-02-11 | Epistar Corp | Light-emitting device array having binding layer |
| US6885101B2 (en) * | 2002-08-29 | 2005-04-26 | Micron Technology, Inc. | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| US6876008B2 (en) * | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
| DE10353679A1 (de) | 2003-11-17 | 2005-06-02 | Siemens Ag | Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module |
| KR101047683B1 (ko) * | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
| TWI331406B (en) * | 2005-12-14 | 2010-10-01 | Advanced Optoelectronic Tech | Single chip with multi-led |
| KR100723247B1 (ko) * | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 ｌｅｄ 패키지 및 그 제조방법 |
| US7439548B2 (en) * | 2006-08-11 | 2008-10-21 | Bridgelux, Inc | Surface mountable chip |
| US20080121911A1 (en) * | 2006-11-28 | 2008-05-29 | Cree, Inc. | Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same |
| US9159888B2 (en) * | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| DE102007011123A1 (de) * | 2007-03-07 | 2008-09-11 | Osram Opto Semiconductors Gmbh | Licht emittierendes Modul und Herstellungsverfahren für ein Licht emittierendes Modul |
| TWI372478B (en) * | 2008-01-08 | 2012-09-11 | Epistar Corp | Light-emitting device |
-
2009
- 2009-09-03 DE DE102009039890A patent/DE102009039890A1/de not_active Withdrawn
-
2010
- 2010-08-05 WO PCT/EP2010/061443 patent/WO2011026709A1/de not_active Ceased
- 2010-08-05 KR KR1020127008647A patent/KR20120055723A/ko not_active Ceased
- 2010-08-05 JP JP2012527265A patent/JP5675816B2/ja not_active Expired - Fee Related
- 2010-08-05 CN CN201080039409.4A patent/CN102484171B/zh not_active Expired - Fee Related
- 2010-08-05 EP EP10742132A patent/EP2474048A1/de not_active Withdrawn
- 2010-08-05 US US13/394,058 patent/US20120228663A1/en not_active Abandoned
- 2010-09-01 TW TW099129447A patent/TWI451599B/zh not_active IP Right Cessation
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