JP2012513667A5 - - Google Patents
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- Publication number
- JP2012513667A5 JP2012513667A5 JP2011541081A JP2011541081A JP2012513667A5 JP 2012513667 A5 JP2012513667 A5 JP 2012513667A5 JP 2011541081 A JP2011541081 A JP 2011541081A JP 2011541081 A JP2011541081 A JP 2011541081A JP 2012513667 A5 JP2012513667 A5 JP 2012513667A5
- Authority
- JP
- Japan
- Prior art keywords
- projection device
- contact layer
- semiconductor body
- optoelectronic
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008062933.2 | 2008-12-23 | ||
| DE102008062933.2A DE102008062933B4 (de) | 2008-12-23 | 2008-12-23 | Optoelektronische Projektionsvorrichtung |
| PCT/DE2009/001694 WO2010072191A1 (de) | 2008-12-23 | 2009-11-27 | Optoelektronische projektionsvorrichtung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012513667A JP2012513667A (ja) | 2012-06-14 |
| JP2012513667A5 true JP2012513667A5 (enExample) | 2012-12-13 |
| JP5657563B2 JP5657563B2 (ja) | 2015-01-21 |
Family
ID=42009639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011541081A Expired - Fee Related JP5657563B2 (ja) | 2008-12-23 | 2009-11-27 | オプトエレクトロニクス投影装置およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8716724B2 (enExample) |
| EP (1) | EP2368269B1 (enExample) |
| JP (1) | JP5657563B2 (enExample) |
| KR (1) | KR101601348B1 (enExample) |
| CN (1) | CN102265399B (enExample) |
| DE (1) | DE102008062933B4 (enExample) |
| WO (1) | WO2010072191A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3848970A1 (en) | 2007-01-22 | 2021-07-14 | Cree, Inc. | Multiple light emitting diode emitter |
| DE102010025320B4 (de) | 2010-06-28 | 2021-11-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| TWI557934B (zh) * | 2010-09-06 | 2016-11-11 | 晶元光電股份有限公司 | 半導體光電元件 |
| DE102011003684A1 (de) * | 2011-02-07 | 2012-08-09 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchip |
| US9362455B2 (en) * | 2011-02-24 | 2016-06-07 | Cree, Inc. | Semiconductor light emitting diodes having multiple bond pads and current spreading structures |
| US8492182B2 (en) | 2011-04-29 | 2013-07-23 | Osram Opto Semiconductors Gmbh | Method for the producing of a light-emitting semiconductor chip, method for the production of a conversion die and light-emitting semiconductor chip |
| US11251348B2 (en) | 2011-06-24 | 2022-02-15 | Creeled, Inc. | Multi-segment monolithic LED chip |
| US12002915B2 (en) | 2011-06-24 | 2024-06-04 | Creeled, Inc. | Multi-segment monolithic LED chip |
| US9653643B2 (en) | 2012-04-09 | 2017-05-16 | Cree, Inc. | Wafer level packaging of light emitting diodes (LEDs) |
| KR101868537B1 (ko) * | 2011-11-07 | 2018-06-19 | 엘지이노텍 주식회사 | 발광소자 및 이를 포함하는 발광 소자 패키지 |
| DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| DE102012101892B4 (de) | 2012-03-06 | 2021-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements |
| DE102012105176B4 (de) | 2012-06-14 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
| US11160148B2 (en) | 2017-06-13 | 2021-10-26 | Ideal Industries Lighting Llc | Adaptive area lamp |
| US8816383B2 (en) * | 2012-07-06 | 2014-08-26 | Invensas Corporation | High performance light emitting diode with vias |
| DE102012112302A1 (de) | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| DE102012112530A1 (de) * | 2012-12-18 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| DE102013102667A1 (de) * | 2013-03-15 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung |
| KR102098110B1 (ko) * | 2013-04-11 | 2020-04-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
| DE102013104046A1 (de) * | 2013-04-22 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Optische Anordnung und Anzeigegerät |
| KR102098135B1 (ko) * | 2013-07-12 | 2020-04-08 | 엘지이노텍 주식회사 | 발광소자 |
| DE102013111918B4 (de) | 2013-10-29 | 2020-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| CN105684171B (zh) | 2013-10-29 | 2018-09-07 | 欧司朗光电半导体有限公司 | 波长转换元件、制造方法和具有波长转换元件的发光半导体部件 |
| DE102013112881A1 (de) * | 2013-11-21 | 2015-05-21 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102014100542A1 (de) | 2014-01-20 | 2015-07-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer lateral strukturierten Schicht und optoelektronisches Halbleiterbauteil mit einer solchen Schicht |
| DE102014102029A1 (de) * | 2014-02-18 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement |
| JP6425921B2 (ja) * | 2014-06-12 | 2018-11-21 | 株式会社ジャパンディスプレイ | 画像表示装置 |
| DE102014108373A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| KR102212666B1 (ko) | 2014-06-27 | 2021-02-05 | 엘지이노텍 주식회사 | 발광소자 |
| TWI625868B (zh) | 2014-07-03 | 2018-06-01 | 晶元光電股份有限公司 | 光電元件及其製造方法 |
| DE102015103055A1 (de) * | 2014-12-04 | 2016-06-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| JP6156402B2 (ja) * | 2015-02-13 | 2017-07-05 | 日亜化学工業株式会社 | 発光装置 |
| DE102015122627A1 (de) * | 2015-05-28 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung und Tiefenerfassungssystem |
| KR102480220B1 (ko) | 2016-04-08 | 2022-12-26 | 삼성전자주식회사 | 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널 |
| US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
| CN106131519A (zh) * | 2016-06-15 | 2016-11-16 | 联想(北京)有限公司 | 一种信息处理方法及电子设备 |
| DE102016116986B4 (de) * | 2016-09-09 | 2025-07-31 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement zur Darstellung eines Piktogramms und Verfahren zur Herstellung eines Bauelements |
| DE102016221481B4 (de) * | 2016-11-02 | 2021-09-16 | Siemens Healthcare Gmbh | Strahlungsdetektor mit einer Zwischenschicht |
| DE102016123013A1 (de) * | 2016-11-29 | 2018-05-30 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte |
| DE102017102247A1 (de) | 2017-02-06 | 2018-08-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Herstellungsverfahren hierfür |
| US10734363B2 (en) | 2017-08-03 | 2020-08-04 | Cree, Inc. | High density pixelated-LED chips and chip array devices |
| KR102601620B1 (ko) | 2017-08-03 | 2023-11-15 | 크리엘이디, 인크. | 고밀도 픽셀화된 led 칩 및 칩 어레이 장치, 그리고 그 제조 방법 |
| US10529773B2 (en) | 2018-02-14 | 2020-01-07 | Cree, Inc. | Solid state lighting devices with opposing emission directions |
| US10903265B2 (en) | 2018-12-21 | 2021-01-26 | Cree, Inc. | Pixelated-LED chips and chip array devices, and fabrication methods |
| EP4052296A1 (en) | 2019-10-29 | 2022-09-07 | Creeled, Inc. | Texturing for high density pixelated-led chips |
| US11437548B2 (en) | 2020-10-23 | 2022-09-06 | Creeled, Inc. | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940683A (en) * | 1996-01-18 | 1999-08-17 | Motorola, Inc. | LED display packaging with substrate removal and method of fabrication |
| JP2001092381A (ja) | 1999-09-27 | 2001-04-06 | Nec Corp | 有機ｅｌディスプレイおよびその製造方法 |
| US6410940B1 (en) | 2000-06-15 | 2002-06-25 | Kansas State University Research Foundation | Micro-size LED and detector arrays for minidisplay, hyper-bright light emitting diodes, lighting, and UV detector and imaging sensor applications |
| US6891200B2 (en) | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| JP2004311677A (ja) * | 2003-04-07 | 2004-11-04 | Matsushita Electric Works Ltd | 半導体発光素子 |
| US7258450B2 (en) * | 2003-12-04 | 2007-08-21 | Sharp Kabushiki Kaisha | Projector optical system configuration, optical module, and projector, and also electronic equipment, vehicle, projection system, and showcase utilizing such projector |
| JP2005173238A (ja) * | 2003-12-11 | 2005-06-30 | Sharp Corp | 光学モジュール及び投影機並びに、この投影機を利用する電子機器、車両、投影システム及びショーケース |
| EP1825515B1 (en) | 2004-12-06 | 2015-11-25 | Koninklijke Philips N.V. | Single chip led as compact color variable light source |
| KR101197046B1 (ko) * | 2005-01-26 | 2012-11-06 | 삼성디스플레이 주식회사 | 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치 |
| WO2008060053A1 (en) | 2006-11-13 | 2008-05-22 | Electronics And Telecommunications Research Institute | Micro-sized semiconductor light-emitting diode having emitting layer including silicon nano-dot, semiconductor light-emitting diode array including the micro-sized semiconductor light-emitting diode, and method of fabricating the micro-sized semiconductor light-emitting diode |
| JP4481293B2 (ja) * | 2006-12-22 | 2010-06-16 | 株式会社沖データ | 発光表示装置 |
| KR100818466B1 (ko) * | 2007-02-13 | 2008-04-02 | 삼성전기주식회사 | 반도체 발광소자 |
| DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102008003451A1 (de) | 2007-08-08 | 2009-02-12 | Osram Opto Semiconductors Gmbh | Abbildungseinrichtung |
| DE102008011848A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102008033705A1 (de) | 2008-04-07 | 2009-10-08 | Osram Opto Semiconductors Gmbh | Optoelektronische Projektionsvorrichtung |
| JP4981005B2 (ja) * | 2008-09-12 | 2012-07-18 | ローム株式会社 | 半導体発光装置 |
-
2008
- 2008-12-23 DE DE102008062933.2A patent/DE102008062933B4/de active Active
-
2009
- 2009-11-27 EP EP09801388.1A patent/EP2368269B1/de active Active
- 2009-11-27 US US13/127,328 patent/US8716724B2/en active Active
- 2009-11-27 JP JP2011541081A patent/JP5657563B2/ja not_active Expired - Fee Related
- 2009-11-27 WO PCT/DE2009/001694 patent/WO2010072191A1/de not_active Ceased
- 2009-11-27 KR KR1020117017130A patent/KR101601348B1/ko active Active
- 2009-11-27 CN CN200980152067.4A patent/CN102265399B/zh active Active
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