JP2012508460A - フォイルからの半導体チップの剥離及び取外し方法 - Google Patents

フォイルからの半導体チップの剥離及び取外し方法 Download PDF

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Publication number
JP2012508460A
JP2012508460A JP2011535096A JP2011535096A JP2012508460A JP 2012508460 A JP2012508460 A JP 2012508460A JP 2011535096 A JP2011535096 A JP 2011535096A JP 2011535096 A JP2011535096 A JP 2011535096A JP 2012508460 A JP2012508460 A JP 2012508460A
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JP
Japan
Prior art keywords
semiconductor chip
chip
foil
gripper
needle
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011535096A
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English (en)
Japanese (ja)
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JP2012508460A5 (enExample
Inventor
ベーラー，シュテファン
Original Assignee
エセック アーゲー
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Publication date
Application filed by エセック アーゲー filed Critical エセック アーゲー
Publication of JP2012508460A publication Critical patent/JP2012508460A/ja
Publication of JP2012508460A5 publication Critical patent/JP2012508460A5/ja
Pending legal-status Critical Current

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    • H10P72/0442—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H10P72/3212—
    • H10P72/7402—
    • H10P72/7612—
    • H10P72/7622—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011535096A 2008-11-12 2009-11-03 フォイルからの半導体チップの剥離及び取外し方法 Pending JP2012508460A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11376108P 2008-11-12 2008-11-12
US61/113,761 2008-11-12
PCT/EP2009/064535 WO2010054957A1 (de) 2008-11-12 2009-11-03 Verfahren zum ablösen und entnehmen eines halbleiterchips von einer folie

Publications (2)

Publication Number Publication Date
JP2012508460A true JP2012508460A (ja) 2012-04-05
JP2012508460A5 JP2012508460A5 (enExample) 2012-12-06

Family

ID=41381913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011535096A Pending JP2012508460A (ja) 2008-11-12 2009-11-03 フォイルからの半導体チップの剥離及び取外し方法

Country Status (8)

Country Link
US (1) US8715457B2 (enExample)
EP (1) EP2359398B1 (enExample)
JP (1) JP2012508460A (enExample)
KR (1) KR20110086698A (enExample)
CN (1) CN102217052B (enExample)
MY (1) MY155371A (enExample)
TW (1) TWI543285B (enExample)
WO (1) WO2010054957A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397750B1 (ko) * 2012-07-25 2014-05-21 삼성전기주식회사 칩 이젝터 및 이를 이용한 칩 탈착 방법
JP2019029650A (ja) * 2017-07-26 2019-02-21 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置、半導体チップの実装装置および実装方法
CN107539596A (zh) * 2017-09-29 2018-01-05 常熟市荣达电子有限责任公司 一种芯片包装盒及其操作方法
US12020967B2 (en) * 2018-07-30 2024-06-25 Ulvac Techno, Ltd. Substrate lifting apparatus and substrate transferring method
CH715447B1 (de) * 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
CN111341717B (zh) * 2020-03-10 2023-02-07 长江存储科技有限责任公司 一种拾取装置和拾取方法
US12394642B2 (en) * 2021-07-30 2025-08-19 Micraft System Plus Co., Ltd. Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
JP7660459B2 (ja) * 2021-08-05 2025-04-11 東京エレクトロン株式会社 接合装置および接合方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6415000A (en) * 1987-07-09 1989-01-19 Sumitomo Electric Industries Chip packaging device
JPH05283506A (ja) * 1992-04-01 1993-10-29 Sharp Corp チップ突き上げ装置
JP2001118862A (ja) * 1999-11-09 2001-04-27 Nec Machinery Corp ペレットピックアップ装置
JP2005303308A (ja) * 2004-04-13 2005-10-27 Unaxis Internatl Trading Ltd 半導体チップをフォイルから取り外す方法、及び半導体チップを実装するための装置
JP2006005030A (ja) * 2004-06-16 2006-01-05 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ方法および装置
WO2008004270A1 (en) * 2006-07-03 2008-01-10 Canon Machinery Inc. Method of pickup and pickup apparatus
JP2008109119A (ja) * 2006-09-29 2008-05-08 Toray Eng Co Ltd ピックアップ装置及びピックアップ方法

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US4921564A (en) * 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
TW567574B (en) * 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
AU2003249592A1 (en) * 2002-07-17 2004-02-02 Matsushita Electric Industrial Co., Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
EP1424722A1 (de) * 2002-11-29 2004-06-02 Esec Trading S.A. Verfahren zum Aufnehmen von Halbleiterchips von einer Folie und Vorrichtung
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7240422B2 (en) 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
CH697213A5 (de) * 2004-05-19 2008-06-25 Alphasem Ag Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils.
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
KR101278236B1 (ko) 2006-09-12 2013-06-24 가부시키가이샤 에바라 세이사꾸쇼 연마장치 및 연마방법
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
US8221583B2 (en) * 2007-01-20 2012-07-17 Stats Chippac Ltd. System for peeling semiconductor chips from tape
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
CN102044404B (zh) * 2009-10-12 2015-12-09 桑迪士克科技公司 用于使经切分的半导体裸片与裸片贴胶带分离的系统

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6415000A (en) * 1987-07-09 1989-01-19 Sumitomo Electric Industries Chip packaging device
JPH05283506A (ja) * 1992-04-01 1993-10-29 Sharp Corp チップ突き上げ装置
JP2001118862A (ja) * 1999-11-09 2001-04-27 Nec Machinery Corp ペレットピックアップ装置
JP2005303308A (ja) * 2004-04-13 2005-10-27 Unaxis Internatl Trading Ltd 半導体チップをフォイルから取り外す方法、及び半導体チップを実装するための装置
JP2006005030A (ja) * 2004-06-16 2006-01-05 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ方法および装置
WO2008004270A1 (en) * 2006-07-03 2008-01-10 Canon Machinery Inc. Method of pickup and pickup apparatus
JP2008109119A (ja) * 2006-09-29 2008-05-08 Toray Eng Co Ltd ピックアップ装置及びピックアップ方法

Also Published As

Publication number Publication date
MY155371A (en) 2015-10-15
CN102217052B (zh) 2013-09-25
WO2010054957A1 (de) 2010-05-20
TWI543285B (zh) 2016-07-21
TW201029093A (en) 2010-08-01
CN102217052A (zh) 2011-10-12
KR20110086698A (ko) 2011-07-29
EP2359398A1 (de) 2011-08-24
EP2359398B1 (de) 2017-05-10
US8715457B2 (en) 2014-05-06
US20110214819A1 (en) 2011-09-08

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