JP2012164737A - サブマウント、サブマウント組立体及びサブマウント組立方法 - Google Patents

サブマウント、サブマウント組立体及びサブマウント組立方法 Download PDF

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Publication number
JP2012164737A
JP2012164737A JP2011022540A JP2011022540A JP2012164737A JP 2012164737 A JP2012164737 A JP 2012164737A JP 2011022540 A JP2011022540 A JP 2011022540A JP 2011022540 A JP2011022540 A JP 2011022540A JP 2012164737 A JP2012164737 A JP 2012164737A
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JP
Japan
Prior art keywords
submount
light emitting
layer
semiconductor
semiconductor light
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Pending
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JP2011022540A
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English (en)
Japanese (ja)
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JP2012164737A5 (enExample
Inventor
Hideki Watanabe
秀輝 渡邊
Rintaro Koda
倫太郎 幸田
Masaru Kuramoto
大 倉本
Ko Naganuma
香 長沼
Hiroyuki Yokoyama
弘之 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University
Sony Corp
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Tohoku University
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University, Sony Corp filed Critical Tohoku University
Priority to JP2011022540A priority Critical patent/JP2012164737A/ja
Priority to TW101102725A priority patent/TW201234643A/zh
Priority to IN237DE2012 priority patent/IN2012DE00237A/en
Priority to CN201210020425.XA priority patent/CN102629732B/zh
Priority to US13/364,957 priority patent/US8982920B2/en
Publication of JP2012164737A publication Critical patent/JP2012164737A/ja
Publication of JP2012164737A5 publication Critical patent/JP2012164737A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/17—Semiconductor lasers comprising special layers
    • H01S2301/176—Specific passivation layers on surfaces other than the emission facet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0265—Intensity modulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0287—Facet reflectivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
    • H01S5/0657—Mode locking, i.e. generation of pulses at a frequency corresponding to a roundtrip in the cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
    • H01S5/309—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer doping of barrier layers that confine charge carriers in the laser structure, e.g. the barriers in a quantum well structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/342—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers containing short period superlattices [SPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4006—Injection locking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biophysics (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
JP2011022540A 2011-02-04 2011-02-04 サブマウント、サブマウント組立体及びサブマウント組立方法 Pending JP2012164737A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011022540A JP2012164737A (ja) 2011-02-04 2011-02-04 サブマウント、サブマウント組立体及びサブマウント組立方法
TW101102725A TW201234643A (en) 2011-02-04 2012-01-20 Submount, submount assembly, and submount assembling method
IN237DE2012 IN2012DE00237A (enExample) 2011-02-04 2012-01-27
CN201210020425.XA CN102629732B (zh) 2011-02-04 2012-01-29 次载具、次载具组件和次载具装配方法
US13/364,957 US8982920B2 (en) 2011-02-04 2012-02-02 Submount, submount assembly, and submount assembling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022540A JP2012164737A (ja) 2011-02-04 2011-02-04 サブマウント、サブマウント組立体及びサブマウント組立方法

Publications (2)

Publication Number Publication Date
JP2012164737A true JP2012164737A (ja) 2012-08-30
JP2012164737A5 JP2012164737A5 (enExample) 2014-03-06

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JP2011022540A Pending JP2012164737A (ja) 2011-02-04 2011-02-04 サブマウント、サブマウント組立体及びサブマウント組立方法

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Country Link
US (1) US8982920B2 (enExample)
JP (1) JP2012164737A (enExample)
CN (1) CN102629732B (enExample)
IN (1) IN2012DE00237A (enExample)
TW (1) TW201234643A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014090097A (ja) * 2012-10-30 2014-05-15 Nippon Telegr & Teleph Corp <Ntt> 光半導体装置
JP2014135312A (ja) * 2013-01-08 2014-07-24 Ricoh Co Ltd 光学パッケージ、光学ユニット、光走査装置、画像形成装置
WO2018117251A1 (ja) * 2016-12-22 2018-06-28 古河電気工業株式会社 半導体レーザモジュールおよび半導体レーザモジュールの製造方法
JP2020136659A (ja) * 2019-02-15 2020-08-31 日亜化学工業株式会社 発光装置の製造方法、発光装置、又は、基部

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JP2010027935A (ja) * 2008-07-23 2010-02-04 Sony Corp 半導体レーザ、光ディスク装置および光ピックアップ
TW201428905A (zh) * 2013-01-04 2014-07-16 矽品精密工業股份有限公司 半導體封裝件及其製法
JP2014165328A (ja) * 2013-02-25 2014-09-08 Sony Corp 半導体発光素子及び表示装置
JP2014220404A (ja) * 2013-05-09 2014-11-20 ソニー株式会社 半導体レーザ装置組立体
CN103779783A (zh) * 2014-02-10 2014-05-07 中国科学院半导体研究所 Z字形自准直半导体光放大器热沉
CN104518425A (zh) * 2014-12-17 2015-04-15 中国科学院半导体研究所 斜腔半导体光放大器的耦合方法
US10686291B2 (en) * 2015-03-19 2020-06-16 Sony Corporation Semiconductor light emitting element and semiconductor light emitting element assembly
US20170146793A1 (en) * 2015-11-20 2017-05-25 Innovative Micro Technology Microfabricated optical apparatus with integrated turning surface
CN108604769B (zh) * 2016-02-12 2021-04-27 古河电气工业株式会社 激光模块
JP6665666B2 (ja) * 2016-04-28 2020-03-13 日亜化学工業株式会社 発光装置の製造方法、レーザモジュールの製造方法及び発光装置
WO2020183729A1 (ja) * 2019-03-14 2020-09-17 三菱電機株式会社 レーザ装置およびレーザ加工機
CN112968118B (zh) * 2020-11-13 2022-05-13 重庆康佳光电技术研究院有限公司 显示背板制作方法和显示背板
CN113300211B (zh) * 2021-06-24 2022-07-15 西安嘉合超亿光电科技有限公司 半导体激光器封装结构及其制备方法

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JPS59110185A (ja) * 1982-12-16 1984-06-26 Toshiba Corp 半導体レ−ザ装置端面保護膜の形成方法
JPS6284950U (enExample) * 1985-11-15 1987-05-30
JP2003017794A (ja) * 2001-06-29 2003-01-17 Ricoh Co Ltd サブマウント構造および光源ユニット製造方法
JP2006269846A (ja) * 2005-03-25 2006-10-05 Anritsu Corp サブマウント及びそれを用いた光半導体装置
JP2007088320A (ja) * 2005-09-26 2007-04-05 Fujifilm Corp 光源装置および光半導体素子
JP2010087209A (ja) * 2008-09-30 2010-04-15 Oki Electric Ind Co Ltd 集積化半導体レーザ及びその製造方法並びに実装方法

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JP3754995B2 (ja) * 1997-09-11 2006-03-15 三菱電機株式会社 半導体光素子
US6091755A (en) * 1997-11-21 2000-07-18 Sdl, Inc. Optically amplifying semiconductor diodes with curved waveguides for external cavities
JP3235571B2 (ja) * 1998-09-03 2001-12-04 日本電気株式会社 活性層と位置決めマークとの相対位置を測定する測定方法
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JPS577989A (en) * 1980-06-17 1982-01-16 Matsushita Electric Ind Co Ltd Mount for semiconductor laser
JPS59110185A (ja) * 1982-12-16 1984-06-26 Toshiba Corp 半導体レ−ザ装置端面保護膜の形成方法
JPS6284950U (enExample) * 1985-11-15 1987-05-30
JP2003017794A (ja) * 2001-06-29 2003-01-17 Ricoh Co Ltd サブマウント構造および光源ユニット製造方法
JP2006269846A (ja) * 2005-03-25 2006-10-05 Anritsu Corp サブマウント及びそれを用いた光半導体装置
JP2007088320A (ja) * 2005-09-26 2007-04-05 Fujifilm Corp 光源装置および光半導体素子
JP2010087209A (ja) * 2008-09-30 2010-04-15 Oki Electric Ind Co Ltd 集積化半導体レーザ及びその製造方法並びに実装方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014090097A (ja) * 2012-10-30 2014-05-15 Nippon Telegr & Teleph Corp <Ntt> 光半導体装置
JP2014135312A (ja) * 2013-01-08 2014-07-24 Ricoh Co Ltd 光学パッケージ、光学ユニット、光走査装置、画像形成装置
WO2018117251A1 (ja) * 2016-12-22 2018-06-28 古河電気工業株式会社 半導体レーザモジュールおよび半導体レーザモジュールの製造方法
JPWO2018117251A1 (ja) * 2016-12-22 2019-10-31 古河電気工業株式会社 半導体レーザモジュールおよび半導体レーザモジュールの製造方法
US11545814B2 (en) 2016-12-22 2023-01-03 Furukawa Electric Co., Ltd. Semiconductor laser module and method of manufacturing semiconductor laser module
JP7166932B2 (ja) 2016-12-22 2022-11-08 古河電気工業株式会社 半導体レーザモジュールおよび半導体レーザモジュールの製造方法
US11303095B2 (en) 2019-02-15 2022-04-12 Nichia Corporation Method of manufacturing light emitting device, light emitting device, and base member
EP3706262A2 (en) 2019-02-15 2020-09-09 Nichia Corporation Method of manufacturing light emitting device, light emitting device, and base member
JP2020136659A (ja) * 2019-02-15 2020-08-31 日亜化学工業株式会社 発光装置の製造方法、発光装置、又は、基部
JP7206494B2 (ja) 2019-02-15 2023-01-18 日亜化学工業株式会社 発光装置の製造方法、発光装置
US11664638B2 (en) 2019-02-15 2023-05-30 Nichia Corporation Light emitting device
US11962121B2 (en) 2019-02-15 2024-04-16 Nichia Corporation Light emitting device
JP2024138556A (ja) * 2019-02-15 2024-10-08 日亜化学工業株式会社 発光装置
JP7733336B2 (ja) 2019-02-15 2025-09-03 日亜化学工業株式会社 発光装置

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Publication number Publication date
TW201234643A (en) 2012-08-16
US8982920B2 (en) 2015-03-17
US20120201259A1 (en) 2012-08-09
CN102629732B (zh) 2017-04-12
CN102629732A (zh) 2012-08-08
IN2012DE00237A (enExample) 2015-06-26

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