JP2012156528A - 積層型半導体装置及び積層型半導体装置の製造方法 - Google Patents
積層型半導体装置及び積層型半導体装置の製造方法 Download PDFInfo
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
Abstract
【解決手段】積層型半導体装置60は、積層される複数の半導体装置61〜64と、前記半導体装置61〜64が接続され、端面に設けられた電極711〜732を含む複数の中継基板71〜73と、前記中継基板71〜73の端面に設けられた電極711〜732同士を接続する接続基板81,82とを含む。中継基板71〜73の端面に設けられた電極711〜732は、例えば導電性を有する接着剤又は異方性導電フィルムを介して接続基板81,82に接続される。これにより、複数の中継基板71〜73の端面に設けられた電極711〜732を接続基板81,82によって接続することで、接続があくまで端面のみで行われるので、接続基板81,82の折り曲げ部を設ける必要もないため、積層型半導体装置60の小型化にとって有効である。
【選択図】図3
Description
Claims (15)
- 複数の半導体装置と、
端面に設けられた電極を含み前記半導体装置を実装する複数の中継基板と、
前記中継基板の端面に設けられた電極同士を接続する接続基板とを含む積層型半導体装置。 - 前記中継基板の端面に設けられた電極は、切断されたビアホールによって形成されている請求項1に記載の積層型半導体装置。
- 前記中継基板の端面に設けられた電極は、切断され内部に導電性樹脂が充填されたビアホールによって形成されている請求項1に記載の積層型半導体装置。
- 前記中継基板の端面に設けられた電極は、導電性を有する接着剤又は異方性導電フィルムを介して前記接続基板に接続されている請求項1に記載の積層型半導体装置。
- 前記接続基板は、フレキシブル基板である請求項1に記載の積層型半導体装置。
- 前記接続基板は、配線層が単層又は多層で構成されているフレキシブル基板である請求項1に記載の積層型半導体装置。
- 前記中継基板の端面に設けられた電極と前記接続基板との接続が、前記中継基板の複数辺になされている請求項1に記載の積層型半導体装置。
- 前記接続基板の内側に搭載される電子部品をさらに含む請求項1乃至請求項7のいずれか一項に記載の積層型半導体装置。
- 前記中継基板は、下段の半導体装置に固定されている請求項1に記載の積層型半導体装置。
- 前記中継基板は、下段の半導体装置に接着剤を介して固定されている請求項1に記載の積層型半導体装置。
- 前記接着剤は、フィルム状の接着剤である請求項10に記載の積層型半導体装置。
- それぞれ電極が端面に設けられた複数の中継基板に半導体装置を実装する工程と、
前記各中継基板の端面に設けられた電極同士を、接続基板を介して接続する工程とを含む積層型半導体装置の製造方法。 - 前記中継基板を含みビアホールを持つ基板を該ビアホールに沿って切断することで前記中継基板の端面に設けられた電極を形成する工程をさらに含む請求項12に記載の積層型半導体装置の製造方法。
- 前記中継基板を含み導電性樹脂が充填されたビアホールを持つ基板を該ビアホールに沿って切断することで前記中継基板の端面に設けられた電極を形成する工程をさらに含む請求項12に記載の積層型半導体装置の製造方法。
- 前記中継基板を含み金属膜が内部に施されたビアホールを持つ基板を該ビアホールに沿って切断することで前記中継基板の端面に設けられた電極を形成する工程と、
前記電極に導電性接着剤又は異方性導電性フィルムを供給する工程とをさらに含む請求項12に記載の積層型半導体装置の製造方法。
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US9324696B2 (en) | 2013-08-29 | 2016-04-26 | Samsung Electronics Co., Ltd. | Package-on-package devices, methods of fabricating the same, and semiconductor packages |
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JPH03506105A (ja) * | 1989-05-19 | 1991-12-26 | トローブ・テクノロジー・インコーポレーテッド | 改善された三次元的回路構成要素組立体およびこれに対応する方法 |
JPH06333983A (ja) * | 1993-05-19 | 1994-12-02 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH0823047A (ja) * | 1994-07-06 | 1996-01-23 | Hitachi Cable Ltd | Bga型半導体装置 |
JPH08279588A (ja) * | 1995-04-05 | 1996-10-22 | Sony Corp | 半導体集積回路装置及び半導体集積回路装置の製造方法 |
JP2001326441A (ja) * | 2000-05-17 | 2001-11-22 | Sony Corp | 複合配線板及びその製造方法 |
JP2002246417A (ja) * | 2001-02-15 | 2002-08-30 | Nippon Avionics Co Ltd | フリップチップ実装方法 |
JP2003142652A (ja) * | 2001-11-01 | 2003-05-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03506105A (ja) * | 1989-05-19 | 1991-12-26 | トローブ・テクノロジー・インコーポレーテッド | 改善された三次元的回路構成要素組立体およびこれに対応する方法 |
JPH06333983A (ja) * | 1993-05-19 | 1994-12-02 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH0823047A (ja) * | 1994-07-06 | 1996-01-23 | Hitachi Cable Ltd | Bga型半導体装置 |
JPH08279588A (ja) * | 1995-04-05 | 1996-10-22 | Sony Corp | 半導体集積回路装置及び半導体集積回路装置の製造方法 |
JP2001326441A (ja) * | 2000-05-17 | 2001-11-22 | Sony Corp | 複合配線板及びその製造方法 |
JP2002246417A (ja) * | 2001-02-15 | 2002-08-30 | Nippon Avionics Co Ltd | フリップチップ実装方法 |
JP2003142652A (ja) * | 2001-11-01 | 2003-05-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
Cited By (1)
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US9324696B2 (en) | 2013-08-29 | 2016-04-26 | Samsung Electronics Co., Ltd. | Package-on-package devices, methods of fabricating the same, and semiconductor packages |
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