JP2012148569A5 - - Google Patents
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- Publication number
- JP2012148569A5 JP2012148569A5 JP2012076609A JP2012076609A JP2012148569A5 JP 2012148569 A5 JP2012148569 A5 JP 2012148569A5 JP 2012076609 A JP2012076609 A JP 2012076609A JP 2012076609 A JP2012076609 A JP 2012076609A JP 2012148569 A5 JP2012148569 A5 JP 2012148569A5
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- JP
- Japan
- Prior art keywords
- resin
- resin layer
- layer
- mol
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 102
- 239000011347 resin Substances 0.000 claims description 102
- 239000002184 metal Substances 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000004962 Polyamide-imide Substances 0.000 claims description 42
- 229920002312 polyamide-imide Polymers 0.000 claims description 42
- 239000011888 foil Substances 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 19
- 229920001169 thermoplastic Polymers 0.000 claims description 19
- 239000004416 thermosoftening plastic Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 229920006015 heat resistant resin Polymers 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 10
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 9
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 9
- 239000012948 isocyanate Substances 0.000 claims description 8
- 150000002513 isocyanates Chemical class 0.000 claims description 8
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 74
- 239000000853 adhesive Substances 0.000 description 24
- 230000001070 adhesive effect Effects 0.000 description 24
- 150000001412 amines Chemical class 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 9
- 238000010030 laminating Methods 0.000 description 9
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 125000001624 naphthyl group Chemical group 0.000 description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 5
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000006358 imidation reaction Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920003055 poly(ester-imide) Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- BDBMKUGEVIQCGQ-UHFFFAOYSA-N 4-(4-aminophenyl)-2,3-dimethylaniline Chemical group C1=C(N)C(C)=C(C)C(C=2C=CC(N)=CC=2)=C1 BDBMKUGEVIQCGQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012076609A JP5532069B2 (ja) | 2007-11-12 | 2012-03-29 | フレキシブル金属積層体の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007292992 | 2007-11-12 | ||
| JP2007292992 | 2007-11-12 | ||
| JP2012076609A JP5532069B2 (ja) | 2007-11-12 | 2012-03-29 | フレキシブル金属積層体の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008288541A Division JP5176886B2 (ja) | 2007-11-12 | 2008-11-11 | フレキシブル金属積層体及びフレキシブルプリント基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012148569A JP2012148569A (ja) | 2012-08-09 |
| JP2012148569A5 true JP2012148569A5 (enExample) | 2013-02-21 |
| JP5532069B2 JP5532069B2 (ja) | 2014-06-25 |
Family
ID=40871598
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008288541A Expired - Fee Related JP5176886B2 (ja) | 2007-11-12 | 2008-11-11 | フレキシブル金属積層体及びフレキシブルプリント基板 |
| JP2012076609A Active JP5532069B2 (ja) | 2007-11-12 | 2012-03-29 | フレキシブル金属積層体の製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008288541A Expired - Fee Related JP5176886B2 (ja) | 2007-11-12 | 2008-11-11 | フレキシブル金属積層体及びフレキシブルプリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP5176886B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5432640B2 (ja) * | 2009-08-26 | 2014-03-05 | パナソニック株式会社 | 金属箔付き樹脂シート、フレキシブルプリント配線板 |
| WO2011152178A1 (ja) * | 2010-05-31 | 2011-12-08 | 東洋紡績株式会社 | フレキシブル金属張積層体 |
| JP5886027B2 (ja) * | 2011-12-21 | 2016-03-16 | 新日鉄住金化学株式会社 | 両面金属張積層板およびその製造方法 |
| JP2014150133A (ja) * | 2013-01-31 | 2014-08-21 | Panasonic Corp | 樹脂付き金属箔、プリント配線板、及びプリント配線板の製造方法 |
| JP6589887B2 (ja) * | 2015-01-09 | 2019-10-16 | 東洋紡株式会社 | ポリマーブレンド組成物、フレキシブル金属積層体およびフレキシブルプリント基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3318035B2 (ja) * | 1993-04-07 | 2002-08-26 | 三井化学株式会社 | フレキシブル両面金属積層板の製造法 |
| JP2002050850A (ja) * | 2000-08-02 | 2002-02-15 | Hitachi Chem Co Ltd | 絶縁被覆電線及びこれを用いたマルチワイヤ配線板 |
| JP4085650B2 (ja) * | 2002-02-28 | 2008-05-14 | 日立化成工業株式会社 | 配線板の製造方法及び配線板 |
| JP4543314B2 (ja) * | 2003-09-01 | 2010-09-15 | 東洋紡績株式会社 | ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体 |
| JP4507707B2 (ja) * | 2004-06-03 | 2010-07-21 | 日立化成工業株式会社 | 印刷配線板用基板、印刷配線板及び印刷配線板の製造方法 |
| JP2006272886A (ja) * | 2005-03-30 | 2006-10-12 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体およびフレキシブルプリント基板 |
| JP2007204714A (ja) * | 2006-02-06 | 2007-08-16 | Toyobo Co Ltd | ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板 |
-
2008
- 2008-11-11 JP JP2008288541A patent/JP5176886B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-29 JP JP2012076609A patent/JP5532069B2/ja active Active
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