JP5176886B2 - フレキシブル金属積層体及びフレキシブルプリント基板 - Google Patents

フレキシブル金属積層体及びフレキシブルプリント基板 Download PDF

Info

Publication number
JP5176886B2
JP5176886B2 JP2008288541A JP2008288541A JP5176886B2 JP 5176886 B2 JP5176886 B2 JP 5176886B2 JP 2008288541 A JP2008288541 A JP 2008288541A JP 2008288541 A JP2008288541 A JP 2008288541A JP 5176886 B2 JP5176886 B2 JP 5176886B2
Authority
JP
Japan
Prior art keywords
resin
resin layer
layer
flexible metal
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008288541A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009141337A (ja
Inventor
翔子 永田
勝也 示野
智晴 栗田
知裕 青山
晃 西本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP2008288541A priority Critical patent/JP5176886B2/ja
Publication of JP2009141337A publication Critical patent/JP2009141337A/ja
Application granted granted Critical
Publication of JP5176886B2 publication Critical patent/JP5176886B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2008288541A 2007-11-12 2008-11-11 フレキシブル金属積層体及びフレキシブルプリント基板 Expired - Fee Related JP5176886B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008288541A JP5176886B2 (ja) 2007-11-12 2008-11-11 フレキシブル金属積層体及びフレキシブルプリント基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007292992 2007-11-12
JP2007292992 2007-11-12
JP2008288541A JP5176886B2 (ja) 2007-11-12 2008-11-11 フレキシブル金属積層体及びフレキシブルプリント基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012076609A Division JP5532069B2 (ja) 2007-11-12 2012-03-29 フレキシブル金属積層体の製造方法

Publications (2)

Publication Number Publication Date
JP2009141337A JP2009141337A (ja) 2009-06-25
JP5176886B2 true JP5176886B2 (ja) 2013-04-03

Family

ID=40871598

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008288541A Expired - Fee Related JP5176886B2 (ja) 2007-11-12 2008-11-11 フレキシブル金属積層体及びフレキシブルプリント基板
JP2012076609A Active JP5532069B2 (ja) 2007-11-12 2012-03-29 フレキシブル金属積層体の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012076609A Active JP5532069B2 (ja) 2007-11-12 2012-03-29 フレキシブル金属積層体の製造方法

Country Status (1)

Country Link
JP (2) JP5176886B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5432640B2 (ja) * 2009-08-26 2014-03-05 パナソニック株式会社 金属箔付き樹脂シート、フレキシブルプリント配線板
WO2011152178A1 (ja) * 2010-05-31 2011-12-08 東洋紡績株式会社 フレキシブル金属張積層体
JP5886027B2 (ja) * 2011-12-21 2016-03-16 新日鉄住金化学株式会社 両面金属張積層板およびその製造方法
JP2014150133A (ja) * 2013-01-31 2014-08-21 Panasonic Corp 樹脂付き金属箔、プリント配線板、及びプリント配線板の製造方法
JP6589887B2 (ja) * 2015-01-09 2019-10-16 東洋紡株式会社 ポリマーブレンド組成物、フレキシブル金属積層体およびフレキシブルプリント基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3318035B2 (ja) * 1993-04-07 2002-08-26 三井化学株式会社 フレキシブル両面金属積層板の製造法
JP2002050850A (ja) * 2000-08-02 2002-02-15 Hitachi Chem Co Ltd 絶縁被覆電線及びこれを用いたマルチワイヤ配線板
JP4085650B2 (ja) * 2002-02-28 2008-05-14 日立化成工業株式会社 配線板の製造方法及び配線板
JP4543314B2 (ja) * 2003-09-01 2010-09-15 東洋紡績株式会社 ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP4507707B2 (ja) * 2004-06-03 2010-07-21 日立化成工業株式会社 印刷配線板用基板、印刷配線板及び印刷配線板の製造方法
JP2006272886A (ja) * 2005-03-30 2006-10-12 Tomoegawa Paper Co Ltd フレキシブル金属積層体およびフレキシブルプリント基板
JP2007204714A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板

Also Published As

Publication number Publication date
JP5532069B2 (ja) 2014-06-25
JP2012148569A (ja) 2012-08-09
JP2009141337A (ja) 2009-06-25

Similar Documents

Publication Publication Date Title
JP5273545B2 (ja) ポリアミドイミド樹脂、それから得られるフレキシブル金属張積層体および配線板
US10844175B2 (en) Polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board
JP4883432B2 (ja) フレキシブル金属張積層体
JP2001072781A (ja) ポリイミドフィルムおよびそれを用いた電気・電子機器用基板
JP5626326B2 (ja) ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP4543314B2 (ja) ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP2017165909A (ja) ポリイミド、樹脂フィルム及び金属張積層板
WO2016013627A1 (ja) 多層ポリイミドフィルム、多層ポリイミドフィルムの製造方法、それを用いたポリイミド積層体、及びそれらに用いられる共重合ポリイミド
JP5532069B2 (ja) フレキシブル金属積層体の製造方法
JP5240204B2 (ja) 金属積層体
JP4640409B2 (ja) 金属張積層体
JP7195848B2 (ja) ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層体及びその製造方法
JP6589887B2 (ja) ポリマーブレンド組成物、フレキシブル金属積層体およびフレキシブルプリント基板
JP4765769B2 (ja) 無色透明フレキシブル金属張積層体およびそれを用いた無色透明フレキシブルプリント配線板
KR101690058B1 (ko) 슬립성이 우수한 열가소성 폴리이미드 접착 필름 및 이를 적용한 연성 동박적층판
JP5152028B2 (ja) ポリマーブレンド組成物、フィルム、及び金属積層体
JP5040254B2 (ja) ポリイミド系樹脂およびそれを用いたフレキシブル配線板
JP7252728B2 (ja) 樹脂フィルム及び金属張積層体
JP2025138045A (ja) 樹脂フィルム、金属張積層板、回路基板、電子デバイス及び電子機器
JP2000022290A (ja) フレキシブルプリント基板
JP2025075328A (ja) 金属張積層板、回路基板、電子デバイス及び電子機器
JP2025075327A (ja) 金属張積層板、回路基板、電子デバイス及び電子機器
JP2024052391A (ja) 積層板の製造方法、及び保護フィルム付き積層体のロール
JP2007313854A (ja) 銅張積層板
JP2007320083A (ja) 銅張積層板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101129

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120405

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121109

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121211

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121224

R151 Written notification of patent or utility model registration

Ref document number: 5176886

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160118

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees