JP2012117063A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012117063A5 JP2012117063A5 JP2011260178A JP2011260178A JP2012117063A5 JP 2012117063 A5 JP2012117063 A5 JP 2012117063A5 JP 2011260178 A JP2011260178 A JP 2011260178A JP 2011260178 A JP2011260178 A JP 2011260178A JP 2012117063 A5 JP2012117063 A5 JP 2012117063A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- flux composition
- hydrogen
- curable flux
- electrical contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 claims 12
- 239000000203 mixture Substances 0.000 claims 12
- 239000001257 hydrogen Substances 0.000 claims 8
- 229910052739 hydrogen Inorganic materials 0.000 claims 8
- 125000000217 alkyl group Chemical group 0.000 claims 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims 3
- 150000002431 hydrogen Chemical class 0.000 claims 3
- 150000002334 glycols Chemical class 0.000 claims 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims 1
- 239000002738 chelating agent Substances 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- -1 glycol ethers Chemical class 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 239000006224 matting agent Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 125000000466 oxiranyl group Chemical group 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000003208 petroleum Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000002562 thickening agent Substances 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- 0 CC(C)(C(CC1)CCC1(C)N(*)*)N(*)* Chemical compound CC(C)(C(CC1)CCC1(C)N(*)*)N(*)* 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/958,473 US8070043B1 (en) | 2010-12-02 | 2010-12-02 | Curable flux composition and method of soldering |
| US12/958,473 | 2010-12-02 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012117063A JP2012117063A (ja) | 2012-06-21 |
| JP2012117063A5 true JP2012117063A5 (enExample) | 2015-01-22 |
| JP5957213B2 JP5957213B2 (ja) | 2016-07-27 |
Family
ID=45034313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011260178A Expired - Fee Related JP5957213B2 (ja) | 2010-12-02 | 2011-11-29 | 硬化性フラックス組成物およびはんだ付け方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8070043B1 (enExample) |
| JP (1) | JP5957213B2 (enExample) |
| KR (1) | KR101905533B1 (enExample) |
| CN (1) | CN102554512B (enExample) |
| DE (1) | DE102011120404B4 (enExample) |
| FR (1) | FR2968230B1 (enExample) |
| TW (2) | TWI492918B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8070047B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| US8434666B2 (en) * | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| KR102360487B1 (ko) * | 2014-02-24 | 2022-02-10 | 세키스이가가쿠 고교가부시키가이샤 | 접속 구조체의 제조 방법 |
| WO2015133343A1 (ja) * | 2014-03-07 | 2015-09-11 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| JP5952849B2 (ja) * | 2014-03-25 | 2016-07-13 | 岡村製油株式会社 | フラックス及びソルダペースト |
| JP5943136B1 (ja) * | 2015-12-28 | 2016-06-29 | 千住金属工業株式会社 | フラックスコートボール、はんだ継手およびフラックスコートボールの製造方法 |
| WO2019203048A1 (ja) * | 2018-04-16 | 2019-10-24 | 住友ベークライト株式会社 | 電子装置の製造方法 |
| CN110238561A (zh) * | 2019-05-21 | 2019-09-17 | 李涛伶 | 一种免清洗阻燃助焊剂及其制备方法 |
Family Cites Families (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2632022A (en) | 1950-07-07 | 1953-03-17 | Rohm & Haas | Method of preparing 1, 8-diamino-p-menthane |
| US2897179A (en) | 1956-07-18 | 1959-07-28 | Union Carbide Corp | Hardener for epoxy resin composition |
| US3488831A (en) * | 1967-04-14 | 1970-01-13 | Continental Can Co | Fluxing materials for soldering metal surfaces |
| BE786932A (fr) * | 1971-07-28 | 1973-01-29 | Int Nickel Ltd | Fondants de soudage |
| US3814638A (en) * | 1972-05-05 | 1974-06-04 | Int Nickel Co | Soldering fluxes |
| US4028143A (en) * | 1974-12-30 | 1977-06-07 | Chevron Research Company | Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering |
| US4165244A (en) * | 1977-10-21 | 1979-08-21 | Jacobs Norman L | Soldering flux and method of using same |
| US4196024A (en) * | 1978-11-02 | 1980-04-01 | E. I. Du Pont De Nemours And Company | Alkyl phosphate soldering fluxes |
| US4360144A (en) * | 1981-01-21 | 1982-11-23 | Basf Wyandotte Corporation | Printed circuit board soldering |
| USRE32309E (en) * | 1983-10-31 | 1986-12-16 | Scm Corporation | Fusible powdered metal paste |
| JPH0613600B2 (ja) * | 1986-05-14 | 1994-02-23 | 旭電化工業株式会社 | 硬化性エポキシ樹脂組成物 |
| US5145722A (en) * | 1989-04-11 | 1992-09-08 | Hughes Aircraft Company | Method and composition for protecting and enhancing the solderability of metallic surfaces |
| US5011546A (en) * | 1990-04-12 | 1991-04-30 | International Business Machines Corporation | Water soluble solder flux and paste |
| US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
| US5615827A (en) | 1994-05-31 | 1997-04-01 | International Business Machines Corporation | Flux composition and corresponding soldering method |
| US5571340A (en) | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
| JP3787857B2 (ja) * | 1995-03-10 | 2006-06-21 | タムラ化研株式会社 | 回路基板はんだ付け用フラックス及び回路基板 |
| JP3498427B2 (ja) * | 1995-06-19 | 2004-02-16 | ソニー株式会社 | 成形はんだ用フラックス |
| US5851311A (en) | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| US5958151A (en) | 1996-07-22 | 1999-09-28 | Ford Global Technologies, Inc. | Fluxing media for non-VOC, no-clean soldering |
| US5814401A (en) | 1997-02-04 | 1998-09-29 | Motorola, Inc. | Selectively filled adhesive film containing a fluxing agent |
| US6367150B1 (en) | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
| US6234381B1 (en) * | 1998-04-14 | 2001-05-22 | Denso Corporation | Water-base binder for aluminum material brazing, brazing composition, and method of brazing with the composition |
| JP4343354B2 (ja) * | 1999-11-02 | 2009-10-14 | Agcセイミケミカル株式会社 | 半田用フラックス這い上がり防止剤組成物とその用途 |
| US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
| US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
| JP2001300766A (ja) * | 2000-04-27 | 2001-10-30 | Tamura Kaken Co Ltd | 回路基板はんだ付用フラックス及び回路基板 |
| US6627683B1 (en) * | 2000-09-05 | 2003-09-30 | Henkel Loctite Corporation | Reworkable thermosetting resin compositions and compounds useful therein |
| CN1276490C (zh) * | 2000-11-14 | 2006-09-20 | 亨凯尔公司 | 硅晶片应用的助焊和填缝材料,和用其制造的层状电子组件 |
| US6926849B2 (en) * | 2000-11-29 | 2005-08-09 | Senju Metal Industry Co., Ltd. | Solder paste |
| US6794761B2 (en) * | 2001-04-26 | 2004-09-21 | Intel Corporation | No-flow underfill material |
| US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
| TWI228132B (en) | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
| CN1194595C (zh) * | 2001-12-28 | 2005-03-23 | 全懋精密科技股份有限公司 | 一种高密度多层电路板的结构及其制作方法 |
| US20060043157A1 (en) * | 2004-08-25 | 2006-03-02 | Harima Chemicals, Inc. | Flux for soldering, soldering method, and printed circuit board |
| JP4142312B2 (ja) * | 2002-02-28 | 2008-09-03 | ハリマ化成株式会社 | 析出型はんだ組成物及びはんだ析出方法 |
| US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| EP1533070B1 (en) * | 2002-06-17 | 2013-05-01 | Sumitomo Light Metal Industries, Ltd. | Water-base aluminum-brazing composition and process of brazing |
| US7022410B2 (en) * | 2003-12-16 | 2006-04-04 | General Electric Company | Combinations of resin compositions and methods of use thereof |
| US20050170188A1 (en) * | 2003-09-03 | 2005-08-04 | General Electric Company | Resin compositions and methods of use thereof |
| US7026376B2 (en) * | 2003-06-30 | 2006-04-11 | Intel Corporation | Fluxing agent for underfill materials |
| US7276673B2 (en) | 2003-09-26 | 2007-10-02 | Tdk Corporation | Solder bonding method and solder bonding device |
| TWI262041B (en) | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| JP2005169495A (ja) * | 2003-11-18 | 2005-06-30 | Yoshihiro Miyano | プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法 |
| US7671114B2 (en) * | 2004-01-26 | 2010-03-02 | Henkel Corporation | Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder |
| MY148568A (en) * | 2004-12-09 | 2013-04-30 | Lonza Ag | Quaternary ammonium salts as a conversion coating or coating enhancement |
| US20060147683A1 (en) * | 2004-12-30 | 2006-07-06 | Harima Chemicals, Inc. | Flux for soldering and circuit board |
| US20060272747A1 (en) | 2005-06-03 | 2006-12-07 | Renyi Wang | Fluxing compositions |
| US20060275608A1 (en) | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
| US7780801B2 (en) | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
| US20080051524A1 (en) * | 2006-08-28 | 2008-02-28 | Henkel Corporation | Epoxy-Based Compositions Having Improved Impact Resistance |
| US20080063871A1 (en) * | 2006-09-11 | 2008-03-13 | Jung Ki S | Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
| US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
| US7569164B2 (en) * | 2007-01-29 | 2009-08-04 | Harima Chemicals, Inc. | Solder precoating method |
| JP5066935B2 (ja) * | 2007-02-22 | 2012-11-07 | 富士通株式会社 | 電子部品および電子装置の製造方法 |
| KR20100132480A (ko) | 2007-07-23 | 2010-12-17 | 헨켈 리미티드 | 땜납 플럭스 |
| CN101587847B (zh) * | 2009-06-15 | 2011-01-12 | 美新半导体(无锡)有限公司 | 利用pcb基板进行垂直互连的多芯片组件封装方法 |
| CN101733585B (zh) * | 2010-02-10 | 2012-09-19 | 北京海斯迪克新材料有限公司 | 一种晶圆级芯片封装凸点保护层及其形成工艺 |
| CN101894772B (zh) * | 2010-06-28 | 2012-05-23 | 华为终端有限公司 | 增强芯片焊点可靠性的方法、印刷电路板及电子设备 |
-
2010
- 2010-12-02 US US12/958,473 patent/US8070043B1/en not_active Expired - Fee Related
-
2011
- 2011-11-29 JP JP2011260178A patent/JP5957213B2/ja not_active Expired - Fee Related
- 2011-12-01 TW TW100144128A patent/TWI492918B/zh not_active IP Right Cessation
- 2011-12-01 TW TW104100911A patent/TWI495628B/zh not_active IP Right Cessation
- 2011-12-02 KR KR1020110128202A patent/KR101905533B1/ko not_active Expired - Fee Related
- 2011-12-02 FR FR1161089A patent/FR2968230B1/fr not_active Expired - Fee Related
- 2011-12-02 DE DE102011120404.4A patent/DE102011120404B4/de active Active
- 2011-12-02 CN CN201110463043.XA patent/CN102554512B/zh not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012117063A5 (enExample) | ||
| JP2012135814A5 (enExample) | ||
| JP2012135815A5 (enExample) | ||
| JP2012135813A5 (enExample) | ||
| KR102066454B1 (ko) | 폴리아민, 카복실산 플럭스 조성물 및 솔더링 방법 | |
| KR102060978B1 (ko) | 경화성 플럭스 조성물 및 솔더링 방법 | |
| WO2015017370A3 (en) | Flux for laser welding | |
| CN102554513B (zh) | 多胺助焊剂组合物和焊接方法 | |
| CN102554517B (zh) | 可固化的胺类助焊剂组合物和焊接方法 | |
| CN105813795A (zh) | 焊剂配制剂 | |
| JP5957213B2 (ja) | 硬化性フラックス組成物およびはんだ付け方法 | |
| KR101923965B1 (ko) | 플럭스 조성물 및 솔더링 방법 | |
| JP2012148337A5 (enExample) | ||
| CN103429378A (zh) | 助焊剂 | |
| TW201636147A (zh) | 助焊劑用活性劑、助焊劑及焊料 | |
| JP6012956B2 (ja) | アミンフラックス組成物およびはんだ付け方法 | |
| KR101992639B1 (ko) | 아민, 카복실산 플럭스 조성물 및 솔더링 방법 | |
| JP6058959B2 (ja) | 硬化性アミン、カルボン酸フラックス組成物およびはんだ付け方法 | |
| JP6071378B2 (ja) | フラックス組成物およびはんだ付け方法 | |
| CN102922179B (zh) | 锡铋低温锡丝用无卤素助焊剂及其制备方法 | |
| CN102248317A (zh) | 一种无卤素无铅焊锡丝 |