JP2012135814A5 - - Google Patents

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Publication number
JP2012135814A5
JP2012135814A5 JP2011260167A JP2011260167A JP2012135814A5 JP 2012135814 A5 JP2012135814 A5 JP 2012135814A5 JP 2011260167 A JP2011260167 A JP 2011260167A JP 2011260167 A JP2011260167 A JP 2011260167A JP 2012135814 A5 JP2012135814 A5 JP 2012135814A5
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JP
Japan
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group
substituted
alkyl
aryl
hydrogen
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JP2011260167A
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Japanese (ja)
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JP6012955B2 (ja
JP2012135814A (ja
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Priority claimed from US12/958,487 external-priority patent/US8070045B1/en
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Publication of JP2012135814A5 publication Critical patent/JP2012135814A5/ja
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Publication of JP6012955B2 publication Critical patent/JP6012955B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011260167A 2010-12-02 2011-11-29 硬化性アミンフラックス組成物およびはんだ付け方法 Expired - Fee Related JP6012955B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/958,487 2010-12-02
US12/958,487 US8070045B1 (en) 2010-12-02 2010-12-02 Curable amine flux composition and method of soldering

Publications (3)

Publication Number Publication Date
JP2012135814A JP2012135814A (ja) 2012-07-19
JP2012135814A5 true JP2012135814A5 (enExample) 2015-01-22
JP6012955B2 JP6012955B2 (ja) 2016-10-25

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ID=45034315

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JP2011260167A Expired - Fee Related JP6012955B2 (ja) 2010-12-02 2011-11-29 硬化性アミンフラックス組成物およびはんだ付け方法

Country Status (7)

Country Link
US (1) US8070045B1 (enExample)
JP (1) JP6012955B2 (enExample)
KR (1) KR101885582B1 (enExample)
CN (1) CN102554517B (enExample)
DE (1) DE102011120044A1 (enExample)
FR (1) FR2968227B1 (enExample)
TW (1) TWI419860B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2723493C (en) * 2009-12-22 2013-08-06 Dow Global Technologies, Inc. Novel diamino-alcohol compounds, their manufacture and use in high solids mineral slurries
CA2723359C (en) * 2009-12-22 2015-03-17 Dow Global Technologies, Inc. Diamino-alcohol compounds, their manufacture and use in epoxy resins
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8430293B2 (en) * 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8430294B2 (en) * 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
KR101606360B1 (ko) * 2014-07-17 2016-03-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
JP2017080757A (ja) 2015-10-26 2017-05-18 株式会社弘輝 フラックス、及び、はんだ組成物
CN106425168B (zh) * 2016-09-30 2018-02-23 东莞永安科技有限公司 激光用焊锡膏
EP3607012A4 (en) * 2017-04-05 2020-12-09 Averatek Corporation TREATMENT OF A PRINTABLE SURFACE FOR ALUMINUM BONDES
US20230201945A1 (en) * 2018-11-20 2023-06-29 Averatek Corporation Printable surface treatment for aluminum bonding

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE860795C (de) * 1939-03-23 1952-12-22 Hoechst Ag Verfahren zur Herstellung von aliphatischen Dinitroalkoholen
US2475996A (en) * 1946-11-02 1949-07-12 Shell Dev Dinitro alcohols and process of producing the same from unsaturated aldehydes
US2632022A (en) 1950-07-07 1953-03-17 Rohm & Haas Method of preparing 1, 8-diamino-p-menthane
US2941004A (en) * 1955-05-19 1960-06-14 Pfizer & Co C 1, 5-bis-dimethylamino-3-pentanol diethobromide
US2897179A (en) 1956-07-18 1959-07-28 Union Carbide Corp Hardener for epoxy resin composition
US3488831A (en) * 1967-04-14 1970-01-13 Continental Can Co Fluxing materials for soldering metal surfaces
BE786932A (fr) * 1971-07-28 1973-01-29 Int Nickel Ltd Fondants de soudage
US3814638A (en) * 1972-05-05 1974-06-04 Int Nickel Co Soldering fluxes
US4028143A (en) * 1974-12-30 1977-06-07 Chevron Research Company Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering
US4165244A (en) * 1977-10-21 1979-08-21 Jacobs Norman L Soldering flux and method of using same
US4196024A (en) * 1978-11-02 1980-04-01 E. I. Du Pont De Nemours And Company Alkyl phosphate soldering fluxes
US4360144A (en) * 1981-01-21 1982-11-23 Basf Wyandotte Corporation Printed circuit board soldering
USRE32309E (en) * 1983-10-31 1986-12-16 Scm Corporation Fusible powdered metal paste
GB8900381D0 (en) * 1989-01-09 1989-03-08 Cookson Group Plc Flux composition
US5145722A (en) * 1989-04-11 1992-09-08 Hughes Aircraft Company Method and composition for protecting and enhancing the solderability of metallic surfaces
US5011546A (en) * 1990-04-12 1991-04-30 International Business Machines Corporation Water soluble solder flux and paste
JPH0457899A (ja) * 1990-06-27 1992-02-25 Arakawa Chem Ind Co Ltd ロジン系ハンダフラックスの洗浄剤および該洗浄剤を用いてなるロジン系ハンダフラックスの洗浄方法
CA2121914C (en) * 1990-09-11 1998-09-29 Chou-Hong Tann Process for preparing albuterol, acetal, hemi-acetal, and hydrates of arylglyoxal intermediates thereof
CN1223250A (zh) * 1990-09-11 1999-07-21 先灵公司 乙缩醛和半乙缩醛及乙二醛水合物的制备方法
US5128746A (en) 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5436339A (en) * 1991-03-06 1995-07-25 Abbott Laboratories Process for the preparation of a substituted diaminoalcohol
US5615827A (en) 1994-05-31 1997-04-01 International Business Machines Corporation Flux composition and corresponding soldering method
US5599894A (en) * 1994-06-07 1997-02-04 Shin-Etsu Chemical Co., Ltd. Silicone gel compositions
US5571340A (en) 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス
US5851311A (en) 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
JPH108022A (ja) * 1996-06-25 1998-01-13 Toray Dow Corning Silicone Co Ltd 光メモリ素子用シリコーン系接着剤、光メモリ素子、および光メモリ素子の製造方法
US5958151A (en) 1996-07-22 1999-09-28 Ford Global Technologies, Inc. Fluxing media for non-VOC, no-clean soldering
JPH1099991A (ja) * 1996-08-05 1998-04-21 Hitachi Ltd はんだペーストおよびはんだ用フラックス
US6063898A (en) * 1996-12-18 2000-05-16 Daicel Chemical Industries, Ltd. Compounds, polymers of them, processes for the preparation of both, and compositions containing the compounds
CN1140378C (zh) * 1997-07-15 2004-03-03 清美化学股份有限公司 防止焊剂蠕流的组合物及使用其的焊接方法和焊接产品
US6367150B1 (en) 1997-09-05 2002-04-09 Northrop Grumman Corporation Solder flux compatible with flip-chip underfill material
US6234381B1 (en) * 1998-04-14 2001-05-22 Denso Corporation Water-base binder for aluminum material brazing, brazing composition, and method of brazing with the composition
JP4343354B2 (ja) * 1999-11-02 2009-10-14 Ａｇｃセイミケミカル株式会社 半田用フラックス這い上がり防止剤組成物とその用途
US6402013B2 (en) * 1999-12-03 2002-06-11 Senju Metal Industry Co., Ltd Thermosetting soldering flux and soldering process
US6217671B1 (en) 1999-12-14 2001-04-17 International Business Machines Corporation Composition for increasing activity of a no-clean flux
WO2001044344A1 (en) * 1999-12-17 2001-06-21 Daicel Chemical Industries, Ltd. Curable resin composition, process for producing the same, and coated object made with the same
US7012120B2 (en) * 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US20050288458A1 (en) * 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
JP2001300766A (ja) * 2000-04-27 2001-10-30 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及び回路基板
JP2002103085A (ja) 2000-10-03 2002-04-09 Fujifilm Arch Co Ltd 還元型フラックス組成物
US6667194B1 (en) * 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
CN1276490C (zh) * 2000-11-14 2006-09-20 亨凯尔公司 硅晶片应用的助焊和填缝材料,和用其制造的层状电子组件
US6926849B2 (en) * 2000-11-29 2005-08-09 Senju Metal Industry Co., Ltd. Solder paste
US6794761B2 (en) * 2001-04-26 2004-09-21 Intel Corporation No-flow underfill material
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
TWI228132B (en) 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
US7009009B1 (en) * 2001-10-09 2006-03-07 Henkel Corporation Fluxing underfill compositions
US20060043157A1 (en) * 2004-08-25 2006-03-02 Harima Chemicals, Inc. Flux for soldering, soldering method, and printed circuit board
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
US6887319B2 (en) * 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
EP1533070B1 (en) * 2002-06-17 2013-05-01 Sumitomo Light Metal Industries, Ltd. Water-base aluminum-brazing composition and process of brazing
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US7022410B2 (en) * 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050170188A1 (en) * 2003-09-03 2005-08-04 General Electric Company Resin compositions and methods of use thereof
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
US20050048291A1 (en) * 2003-08-14 2005-03-03 General Electric Company Nano-filled composite materials with exceptionally high glass transition temperature
US20050266263A1 (en) * 2002-11-22 2005-12-01 General Electric Company Refractory solid, adhesive composition, and device, and associated method
JP4288940B2 (ja) * 2002-12-06 2009-07-01 日亜化学工業株式会社 エポキシ樹脂組成物
WO2010019832A2 (en) * 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7026376B2 (en) 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
US7276673B2 (en) 2003-09-26 2007-10-02 Tdk Corporation Solder bonding method and solder bonding device
TWI262041B (en) 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
US7279223B2 (en) * 2003-12-16 2007-10-09 General Electric Company Underfill composition and packaged solid state device
US7671114B2 (en) * 2004-01-26 2010-03-02 Henkel Corporation Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
US8900376B2 (en) * 2004-07-21 2014-12-02 Nissan Chemical Industries, Ltd. Heat-resistant water-soluble flux composition for soldering
MY148568A (en) * 2004-12-09 2013-04-30 Lonza Ag Quaternary ammonium salts as a conversion coating or coating enhancement
US20060147683A1 (en) * 2004-12-30 2006-07-06 Harima Chemicals, Inc. Flux for soldering and circuit board
DE602005015766D1 (de) * 2005-01-04 2009-09-10 Dow Corning Organosiliciumfunktionelle bor-amin-katalysatorkomplexe und daraus hergestellte härtbare zusammensetzungen
US20060192280A1 (en) * 2005-02-28 2006-08-31 General Electric Company Method of forming electronic devices
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US20060272747A1 (en) 2005-06-03 2006-12-07 Renyi Wang Fluxing compositions
US20060275952A1 (en) * 2005-06-07 2006-12-07 General Electric Company Method for making electronic devices
US20060275608A1 (en) * 2005-06-07 2006-12-07 General Electric Company B-stageable film, electronic device, and associated process
JP2007169602A (ja) * 2005-11-01 2007-07-05 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
JP5101026B2 (ja) * 2005-11-04 2012-12-19 富士フイルム株式会社 導電膜形成方法、導電性パターン形成方法、及び多層配線板の製造方法
JP3957729B1 (ja) * 2006-03-11 2007-08-15 株式会社エヌティ・サクセス ハンダ付け方法及び電子部品
JP2007297556A (ja) * 2006-05-02 2007-11-15 Shin Etsu Chem Co Ltd 半田フラックスが存在する箇所に適用し硬化させるのに用いられる硬化性シリコーンゲル組成物、該組成物を用いるシリコーンゲルの耐フラックス性向上方法及び耐フラックス性シリコーンゲルの形成方法
US7780801B2 (en) 2006-07-26 2010-08-24 International Business Machines Corporation Flux composition and process for use thereof
US20080039560A1 (en) * 2006-08-11 2008-02-14 General Electric Company Syneretic composition, associated method and article
US20080039542A1 (en) * 2006-08-11 2008-02-14 General Electric Company Composition and associated method
US7838197B2 (en) * 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
US20080156852A1 (en) * 2006-12-29 2008-07-03 Prakash Anna M Solder flux composition and process of using same
US7569164B2 (en) * 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
CN101542392B (zh) * 2007-03-29 2013-08-14 太阳控股株式会社 光固化性树脂组合物、干膜、固化物以及印刷线路板
KR20100132480A (ko) 2007-07-23 2010-12-17 헨켈 리미티드 땜납 플럭스
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8008419B2 (en) * 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
GB0817795D0 (en) * 2008-09-30 2008-11-05 3M Innovative Properties Co Fast curing oil-uptaking epozxy-based structural adhesives
CN101596656B (zh) * 2009-07-02 2011-11-02 东莞市中实焊锡有限公司 一种无铅焊接用水清洗助焊剂及其制备方法
CA2791226C (en) * 2009-12-22 2014-04-15 Dow Global Technologies, Inc. Novel diamino-alcohol compounds and processes for their manufacture
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering

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