JP2012109536A - 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法 - Google Patents

基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法 Download PDF

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Publication number
JP2012109536A
JP2012109536A JP2011205215A JP2011205215A JP2012109536A JP 2012109536 A JP2012109536 A JP 2012109536A JP 2011205215 A JP2011205215 A JP 2011205215A JP 2011205215 A JP2011205215 A JP 2011205215A JP 2012109536 A JP2012109536 A JP 2012109536A
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JP
Japan
Prior art keywords
substrate
substrate holder
guide bar
link
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011205215A
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English (en)
Japanese (ja)
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JP2012109536A5 (enExample
Inventor
Kazuto Watanabe
和人 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2011205215A priority Critical patent/JP2012109536A/ja
Priority to US13/276,667 priority patent/US20120107072A1/en
Publication of JP2012109536A publication Critical patent/JP2012109536A/ja
Priority to US14/284,985 priority patent/US20140250678A1/en
Publication of JP2012109536A5 publication Critical patent/JP2012109536A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2011205215A 2010-10-28 2011-09-20 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法 Pending JP2012109536A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011205215A JP2012109536A (ja) 2010-10-28 2011-09-20 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法
US13/276,667 US20120107072A1 (en) 2010-10-28 2011-10-19 Substrate transport apparatus, electronic device manufacturing system, and electronic device manufacturing method
US14/284,985 US20140250678A1 (en) 2010-10-28 2014-05-22 Substrate transport apparatus, electronic device manufacturing system, and electronic device manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010242619 2010-10-28
JP2010242619 2010-10-28
JP2011205215A JP2012109536A (ja) 2010-10-28 2011-09-20 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2012109536A true JP2012109536A (ja) 2012-06-07
JP2012109536A5 JP2012109536A5 (enExample) 2014-10-02

Family

ID=45996959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011205215A Pending JP2012109536A (ja) 2010-10-28 2011-09-20 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法

Country Status (2)

Country Link
US (2) US20120107072A1 (enExample)
JP (1) JP2012109536A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020119927A (ja) * 2019-01-21 2020-08-06 東京エレクトロン株式会社 搬送装置
JP2023184575A (ja) * 2019-11-29 2023-12-28 東京エレクトロン株式会社 基板搬送装置及び基板処理システム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082801B2 (en) 2012-09-05 2015-07-14 Industrial Technology Research Institute Rotatable locating apparatus with dome carrier and operating method thereof
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
JP6349947B2 (ja) * 2013-11-19 2018-07-04 株式会社ジェイテクト 搬送装置
CN106607887A (zh) * 2015-10-22 2017-05-03 佛山市禾才科技服务有限公司 一种多臂机器人
US10453725B2 (en) * 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
NL2020044B1 (en) * 2017-12-08 2019-06-19 Vdl Enabling Tech Group B V A planar multi-joint robot arm system
FR3086570B1 (fr) * 2018-10-01 2021-01-15 Univ Le Havre Normandie Systeme robotise, comprenant un bras articule
CN110980116B (zh) * 2019-12-31 2021-06-01 安徽倍发来纺织科技有限公司 一种袜子出厂自动化处理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186346A (ja) * 1984-02-09 1985-09-21 フルト・フエルヴアルツングス−ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 操作装置
JPH11313477A (ja) * 1998-02-26 1999-11-09 Bks Lab:Kk 複数軸動力伝達装置およびウエハ搬送用アームリンク
JPH11514303A (ja) * 1995-10-27 1999-12-07 ブルックス オートメーション インコーポレイテッド ２つの基板ホルダを備えた基板移送装置
JP2001185596A (ja) * 1999-12-22 2001-07-06 Jel:Kk 搬送アーム
JP2003231076A (ja) * 2002-02-08 2003-08-19 Jel:Kk 搬送アーム
JP2005116665A (ja) * 2003-10-06 2005-04-28 Tokyo Electron Ltd 基板搬送装置および基板処理システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
TW471084B (en) * 1999-12-22 2002-01-01 Jel Kk Transfer arm

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186346A (ja) * 1984-02-09 1985-09-21 フルト・フエルヴアルツングス−ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 操作装置
JPH11514303A (ja) * 1995-10-27 1999-12-07 ブルックス オートメーション インコーポレイテッド ２つの基板ホルダを備えた基板移送装置
JPH11313477A (ja) * 1998-02-26 1999-11-09 Bks Lab:Kk 複数軸動力伝達装置およびウエハ搬送用アームリンク
JP2001185596A (ja) * 1999-12-22 2001-07-06 Jel:Kk 搬送アーム
JP2003231076A (ja) * 2002-02-08 2003-08-19 Jel:Kk 搬送アーム
JP2005116665A (ja) * 2003-10-06 2005-04-28 Tokyo Electron Ltd 基板搬送装置および基板処理システム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020119927A (ja) * 2019-01-21 2020-08-06 東京エレクトロン株式会社 搬送装置
JP7202902B2 (ja) 2019-01-21 2023-01-12 東京エレクトロン株式会社 搬送装置
JP2023184575A (ja) * 2019-11-29 2023-12-28 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP7586618B2 (ja) 2019-11-29 2024-11-19 東京エレクトロン株式会社 基板搬送装置及び基板処理システム

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Publication number Publication date
US20120107072A1 (en) 2012-05-03
US20140250678A1 (en) 2014-09-11

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