JP2012074674A - 半導体集積回路装置 - Google Patents

半導体集積回路装置 Download PDF

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Publication number
JP2012074674A
JP2012074674A JP2011138894A JP2011138894A JP2012074674A JP 2012074674 A JP2012074674 A JP 2012074674A JP 2011138894 A JP2011138894 A JP 2011138894A JP 2011138894 A JP2011138894 A JP 2011138894A JP 2012074674 A JP2012074674 A JP 2012074674A
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JP
Japan
Prior art keywords
circuit
conductive pattern
oscillation
semiconductor integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011138894A
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English (en)
Japanese (ja)
Other versions
JP2012074674A5 (https=
Inventor
Masanobu Omura
昌伸 大村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011138894A priority Critical patent/JP2012074674A/ja
Priority to US13/196,321 priority patent/US8970247B2/en
Priority to CN201110251651.4A priority patent/CN102404002B/zh
Publication of JP2012074674A publication Critical patent/JP2012074674A/ja
Publication of JP2012074674A5 publication Critical patent/JP2012074674A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H10W42/405—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering using active circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
    • H03K3/03—Astable circuits
    • H03K3/0315—Ring oscillators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/19—Monitoring patterns of pulse trains

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Storage Device Security (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2011138894A 2010-09-02 2011-06-22 半導体集積回路装置 Pending JP2012074674A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011138894A JP2012074674A (ja) 2010-09-02 2011-06-22 半導体集積回路装置
US13/196,321 US8970247B2 (en) 2010-09-02 2011-08-02 Semiconductor integrated circuit device with protection against tampering
CN201110251651.4A CN102404002B (zh) 2010-09-02 2011-08-30 半导体集成电路装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010197143 2010-09-02
JP2010197143 2010-09-02
JP2011138894A JP2012074674A (ja) 2010-09-02 2011-06-22 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JP2012074674A true JP2012074674A (ja) 2012-04-12
JP2012074674A5 JP2012074674A5 (https=) 2014-08-07

Family

ID=45770240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011138894A Pending JP2012074674A (ja) 2010-09-02 2011-06-22 半導体集積回路装置

Country Status (3)

Country Link
US (1) US8970247B2 (https=)
JP (1) JP2012074674A (https=)
CN (1) CN102404002B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021501419A (ja) * 2017-11-02 2021-01-14 レイセオン カンパニー 警護領域の物理的又は電磁的侵入を検出するためのマルチＧＨｚ警護センサ
JP2021524117A (ja) * 2018-10-04 2021-09-09 リドル アンド コード ゲーエムベーハー 電子マーキング

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10140570B2 (en) * 2015-08-18 2018-11-27 William P Gulas Microprocessor-controlled tamper detection system
US9959496B2 (en) * 2015-08-18 2018-05-01 Franklin J. Camper Microprocessor-controlled tamper detection system
CN108701193B (zh) * 2016-02-12 2022-08-30 汉阳大学校产学协力团 安全半导体芯片及其工作方法
FR3057088A1 (fr) * 2016-09-30 2018-04-06 Stmicroelectronics (Rousset) Sas Detecteur laser picosecondes
KR102837893B1 (ko) * 2020-01-29 2025-07-25 삼성전자주식회사 반도체 장치의 테스트 방법
TWI755771B (zh) * 2020-06-24 2022-02-21 新唐科技股份有限公司 處理電路及處理方法
USD1003738S1 (en) * 2021-02-26 2023-11-07 Zhejiang Orient Gene Biotech Co., LTD Calibrator device
IT202100030482A1 (it) * 2021-12-01 2023-06-01 St Microelectronics Srl Rilevatore di crepe per piastrine a semiconduttore

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH10270644A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体集積回路装置
JP2002319010A (ja) * 2001-01-13 2002-10-31 Koninkl Philips Electronics Nv 電気回路または電子回路の配置並びにこの回路配置を不正操作および／または悪用から保護する方法
JP2005072514A (ja) * 2003-08-28 2005-03-17 Matsushita Electric Ind Co Ltd 保護回路および半導体装置
JP2006012159A (ja) * 2001-08-07 2006-01-12 Renesas Technology Corp 半導体装置およびｉｃカード
JP2009277085A (ja) * 2008-05-15 2009-11-26 Nippon Telegr & Teleph Corp <Ntt> 情報削除機能付きｌｓｉ

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KR940009250B1 (ko) * 1991-12-18 1994-10-01 삼성전자 주식회사 복수개의 동작전압에 대응하는 리프레쉬 타이머
EP0558879B1 (en) * 1992-03-04 1997-05-14 Astra Aktiebolag Disposable inhaler
JPH08115267A (ja) 1994-10-19 1996-05-07 Tech Res & Dev Inst Of Japan Def Agency 情報秘匿機構
AU6502896A (en) * 1995-07-20 1997-02-18 Dallas Semiconductor Corporation Single chip microprocessor, math co-processor, random number generator, real-time clock and ram having a one-wire interface
US5815043A (en) * 1997-02-13 1998-09-29 Apple Computer, Inc. Frequency controlled ring oscillator having by passable stages
JP2000174616A (ja) 1998-12-04 2000-06-23 Fujitsu Ltd 半導体集積回路
US20040212017A1 (en) 2001-08-07 2004-10-28 Hirotaka Mizuno Semiconductor device and ic card
KR20040060993A (ko) 2001-11-28 2004-07-06 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 반도체 장치, 시스템, 카드, 반도체 장치 초기화 방법,반도체 장치 신뢰성 조사 방법, 반도체 장치 식별 방법
JP3592316B2 (ja) * 2002-06-21 2004-11-24 株式会社半導体理工学研究センター 半導体特性評価装置
US7489204B2 (en) * 2005-06-30 2009-02-10 International Business Machines Corporation Method and structure for chip-level testing of wire delay independent of silicon delay
US7986193B2 (en) * 2007-01-03 2011-07-26 Apple Inc. Noise reduction within an electronic device using automatic frequency modulation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270644A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体集積回路装置
JP2002319010A (ja) * 2001-01-13 2002-10-31 Koninkl Philips Electronics Nv 電気回路または電子回路の配置並びにこの回路配置を不正操作および／または悪用から保護する方法
JP2006012159A (ja) * 2001-08-07 2006-01-12 Renesas Technology Corp 半導体装置およびｉｃカード
JP2005072514A (ja) * 2003-08-28 2005-03-17 Matsushita Electric Ind Co Ltd 保護回路および半導体装置
JP2009277085A (ja) * 2008-05-15 2009-11-26 Nippon Telegr & Teleph Corp <Ntt> 情報削除機能付きｌｓｉ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021501419A (ja) * 2017-11-02 2021-01-14 レイセオン カンパニー 警護領域の物理的又は電磁的侵入を検出するためのマルチＧＨｚ警護センサ
JP2021524117A (ja) * 2018-10-04 2021-09-09 リドル アンド コード ゲーエムベーハー 電子マーキング
JP6996826B2 (ja) 2018-10-04 2022-01-17 リドル アンド コード ゲーエムベーハー 電子マーキング
US11809940B2 (en) 2018-10-04 2023-11-07 Riddle & Code Gmbh Electronic marking

Also Published As

Publication number Publication date
CN102404002B (zh) 2015-09-23
CN102404002A (zh) 2012-04-04
US8970247B2 (en) 2015-03-03
US20120056639A1 (en) 2012-03-08

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