JP2012060114A - 電子部品を接触させるための接触手段および方法 - Google Patents
電子部品を接触させるための接触手段および方法 Download PDFInfo
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- JP2012060114A JP2012060114A JP2011190564A JP2011190564A JP2012060114A JP 2012060114 A JP2012060114 A JP 2012060114A JP 2011190564 A JP2011190564 A JP 2011190564A JP 2011190564 A JP2011190564 A JP 2011190564A JP 2012060114 A JP2012060114 A JP 2012060114A
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- peroxide
- group
- tert
- paste
- metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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Abstract
【解決手段】本発明のプリフォームは、硬化したペーストを含有する少なくとも1つの構造化要素を有する表面を有する担体を含み、この硬化したペーストは、(a)少なくとも1つの有機化合物を含有するコーティングを有する金属粒子、ならびに(b)(b1)有機過酸化物、(b2)無機過酸化物、(b3)無機酸、(b4)1〜4個の炭素原子を有する有機酸の塩、(b5)1〜4個の炭素原子を有する有機酸のエステル、および(b6)カルボニル錯体からなる群から選択される少なくとも1つの焼結助剤を含有し、硬化したペーストを有するこの担体の表面は、当該ペーストの構成成分と反応性ではない。
【選択図】なし
Description
(i)硬化したペーストを含有する少なくとも1つの構造化要素を有する表面を有する担体を含む焼結プリフォームを準備することであって、この硬化したペーストは、(a)少なくとも1つの有機化合物を含有するコーティングを有する金属粒子、ならびに(b)(b1)有機過酸化物、(b2)無機過酸化物、(b3)無機酸、(b4)1〜4個の炭素原子を有する有機酸の塩、(b5)1〜4個の炭素原子を有する有機酸のエステル、および(b6)カルボニル錯体からなる群から選択される少なくとも1つの焼結助剤を含有し、この硬化したペーストを有する担体の表面は、当該ペーストの構成成分と反応性ではない、ことと、
(ii)接続対象の表面を有する少なくとも1つの第1の部品および接続対象の表面を有する第2の部品を準備することと、
(iii)この第1の部品と、上記担体と接触して存在する少なくとも1つの構造化要素とから構成される構成物を作成するために、上記焼結プリフォームの担体の表面上の少なくとも1つの構造化要素を、前記接続対象の第1の部品の表面と接触させることと、
(iv)この第1の部品および少なくとも1つの構造化要素から構成される構成物を担体から取り外すことと、
(v)この第1の部品、第2の部品、およびそれらの間に置かれる構造化要素から構成される焼結構成物を作成するために、接続対象の第2の部品の表面を、第1の部品と少なくとも1つの構造化要素とから構成される構成物の少なくとも1つの構造化要素と接触させることと、
(vi)この焼結構成物を焼結することと、
を含む方法によって、成し遂げられる。
(a)少なくとも1つの有機化合物を含有するコーティングを有する金属粒子を含有し、
(b)(b1)有機過酸化物、(b2)無機過酸化物、(b3)無機酸、(b4)1〜4個の炭素原子を有する有機酸の塩、(b5)1〜4個の炭素原子を有する有機酸のエステル、および(b6)カルボニル錯体からなる群から選択される少なくとも1つの焼結助剤
を含有し、この硬化したペーストを有する担体の表面は、当該ペーストの構成成分と反応性ではない。
R−COOH 式(I)
式中、Rは有機基を表す。
R−COOX 式(II)
式中、Xは、いずれかのカチオン性成分を表す。
以下の組成を有する混合物を撹拌することにより、均一な金属ペーストを製造し、これらをペースト1〜4と名づけた。
DCB基板とチップとの間の、実施例1で得た接触層のせん断強度を従来のせん断試験を使用して判定した。
以下の組成を有する混合物を撹拌することにより、均一な金属ペーストを製造し、これらをペースト5および6と名づけた。
DCB基板とチップとの間の、実施例2で得た接触層のせん断強度を従来のせん断試験を使用して判定した。
Claims (15)
- 硬化したペーストを含有する少なくとも1つの構造化要素を有する表面を有する担体を含む焼結プリフォームであって、前記硬化したペーストは、
(a)少なくとも1つの有機化合物を含有するコーティングを有する金属粒子を含有し、
(b)(b1)有機過酸化物、(b2)無機過酸化物、(b3)無機酸、(b4)1〜4個の炭素原子を有する有機酸の塩、(b5)1〜4個の炭素原子を有する有機酸のエステル、および(b6)カルボニル錯体からなる群から選択される少なくとも1つの焼結助剤を含有し、
前記硬化したペーストを有する前記担体の前記表面は、前記ペーストの構成成分と反応性ではない、
焼結プリフォーム。 - 前記金属粒子は銀粒子である、請求項1に記載の焼結プリフォーム。
- 前記コーティングの前記少なくとも1つの有機化合物は、脂肪酸、脂肪酸塩、および脂肪酸エステルからなる群から選択される、請求項1または請求項2に記載の焼結プリフォーム。
- 前記コーティングの中に含有される有機化合物に対する焼結助剤のモル比は1:1〜150:1の範囲にある、請求項1から請求項3のいずれか1項に記載の焼結プリフォーム。
- 前記有機過酸化物は、ジイソブチリルペルオキシド、ペルオキシネオデカン酸クメン、ペルオキシネオデカン酸1,1,3,3−テトラメチルブチル、ジ−n−プロピルペルオキシジカーボネート、ペルオキシネオデカン酸tert−アミル、ジ−(2−エチルヘキシル)−ペルオキシジカーボネート、ペルオキシネオデカン酸tert−ブチル、ジ−n−ブチルペルオキシジカーボネート、ペルオキシピバル酸1,1,3,3−テトラメチルブチル、ペルオキシネオペプタン酸tert−ブチル、ペルオキシピバル酸tert−アミル、ペルオキシピバル酸tert−ブチル、ジ−(3,5,5−トリメチルヘキサノイル)ペルオキシド、ペルオキシ−2−エチルヘキサン酸tert−ブチル、ペルオキシイソ酪酸tert−ブチル、1,1−ジ−(tert−ブチルペルオキシ)−3,3,5−トリメチルシクロヘキサン、1,1−ジ−(tert−ブチルペルオキシ)−シクロヘキサン、ペルオキシ−3,5,5−トリメチルヘキサン酸tert−ブチル、2,2−ジ−(tert−ブチルペルオキシ)−ブタン、tert−ブチルペルオキシイソプロピルカーボネート、ペルオキシ酢酸tert−ブチル、2,5−ジメチル−2,5−ジ(2−エチルヘキサノイルペルオキシ)−ヘキサン、ペルオキシ−2−エチルヘキサン酸1,1,3,3−テトラメチルブチル、ペルオキシ−2−エチルヘキサン酸tert−アミル、ペルオキシジエチル酢酸tert−ブチル、tert−アミル−ペルオキシ−2−エチルヘキシルカーボネート、tert−ブチル−ペルオキシ−2−エチルヘキシルカーボネート、ペルオキシ安息香酸tert−ブチル、ジ−tert−アミルペルオキシド、2,5−ジメチル−2,5−ジ−(tert−ブチルペルオキシ)−ヘキサン、tert−ブチルクミルペルオキシド、2,5−ジメチル−2,5−ジ(tert−ブチルペルオキシ)ヘキシン−3、ジ−tert−ブチルペルオキシド、3,6,9−トリエチル−3,6,9−トリメチル−1,4,7−トリペルオキソナン、ジ−イソプロピルベンゼンモノヒドロペルオキシド、p−メンタンヒドロペルオキシド、クメンヒドロペルオキシド、ジクミルペルオキシド、および1,1,3,3−テトラメチルブチルヒドロペルオキシドからなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記無機過酸化物は、過酸化水素、過酸化アンモニウム、過酸化リチウム、過酸化ナトリウム、過酸化カリウム、過酸化マグネシウム、過酸化カルシウム、過酸化バリウム、およびペルオキソボレートからなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記無機酸はリン酸である、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記塩は、酢酸塩、炭酸塩、ギ酸塩、乳酸塩、およびシュウ酸塩からなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記塩は、ギ酸マグネシウム、ギ酸アルミニウム、ギ酸鉄(II)、ギ酸スズ(II)、ギ酸銅(II)、ギ酸銀(II)、およびギ酸マンガン(III)からなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記塩は、乳酸銅(II)および乳酸銀(I)からなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記エステルは、ギ酸メチル、ギ酸エチル、ギ酸プロピル、およびギ酸ブチルからなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 前記カルボニル錯体は金属カルボニルからなる群から選択される、請求項1から請求項4のいずれか1項に記載の焼結プリフォーム。
- 箔が、前記硬化したペーストを含有する少なくとも1つの構造化要素の上に付与されている、請求項1から請求項12のいずれか1項に記載の焼結プリフォーム。
- 少なくとも2つの部品を接続するための方法であって、
(i)請求項1から請求項13のいずれか1項に記載の焼結プリフォームを準備することと、
(ii)接続対象の表面を有する少なくとも1つの第1の部品および接続対象の表面を有する第2の部品を準備することと、
(iii)前記第1の部品と、前記担体と接触して存在する少なくとも1つの構造化要素とから構成される構成物を作成するために、前記焼結プリフォームの前記担体の表面上の少なくとも1つの構造化要素を、前記接続対象の第1の部品の表面と接触させることと、
(iv)前記第1の部品および前記少なくとも1つの構造化要素から構成される構成物を前記担体から取り外すことと、
(v)前記第1の部品、第2の部品、および前記第1の部品と前記第2の部品との間に置かれる構造化要素から構成される焼結構成物を作成するために、前記接続対象の第2の部品の表面を、前記第1の部品と前記少なくとも1つの構造化要素とから構成される前記構成物の前記少なくとも1つの構造化要素と接触させることと、
(vi)前記焼結構成物を焼結することと、
を含む方法。 - 工程(v)において、前記接続対象の第2の部品の表面は、前記第1の部品および前記少なくとも1つの構造化要素から構成される前記構成物の前記少なくとも1つの構造化要素に、前記第2の部品およびこの構造化要素から構成される構成物の一部分であるさらなる構造化要素を介して、接触させられる、請求項14に記載の方法。
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- 2011-09-01 CN CN201110264543.0A patent/CN102386149B/zh active Active
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- 2011-09-05 KR KR1020110089804A patent/KR101690336B1/ko active IP Right Grant
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JP2016536467A (ja) * | 2013-09-05 | 2016-11-24 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 金属焼結フィルム組成物 |
JP2017511601A (ja) * | 2014-03-26 | 2017-04-20 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 半導体素子への接続のための焼結可能な固化したペーストをそれぞれ有しているキャリアおよびクリップ、対応する焼結用ペースト、ならびに対応する製造方法および使用 |
US10347566B2 (en) | 2014-03-26 | 2019-07-09 | Heraeus Deutschland GmbH & Co. KG | Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use |
JP2017520907A (ja) * | 2014-05-05 | 2017-07-27 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 転写基板を用いて乾燥金属焼結化合物を電子部品用キャリア上へ適用する方法および対応するキャリアおよび電子部品との焼結結合のためのその使用 |
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JP2018530166A (ja) * | 2015-10-08 | 2018-10-11 | ヘラエウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | 基板アセンブリの製造方法、基板アセンブリ、及び基板アセンブリを電子部品に取り付ける方法 |
KR20180059913A (ko) * | 2015-10-08 | 2018-06-05 | 헤레우스 도이칠란트 게엠베하 운트 코. 카게 | 기판 배열체를 생산하는 방법, 기판 배열체, 및 기판 배열체를 전자 부품에 연결하는 방법 |
KR102085191B1 (ko) | 2015-10-08 | 2020-03-05 | 헤레우스 도이칠란트 게엠베하 운트 코. 카게 | 기판 배열체를 생산하는 방법, 기판 배열체, 및 기판 배열체를 전자 부품에 연결하는 방법 |
JP2020080279A (ja) * | 2018-11-14 | 2020-05-28 | 東洋インキScホールディングス株式会社 | 接合用ペースト、及び該接合用ペーストで接合されてなる物品 |
JP7238352B2 (ja) | 2018-11-14 | 2023-03-14 | 東洋インキScホールディングス株式会社 | 接合用ペースト、及び該接合用ペーストで接合されてなる物品 |
WO2021157125A1 (ja) * | 2020-02-04 | 2021-08-12 | 田中貴金属工業株式会社 | 導電性接合材料及び該導電性接合材料を備える接合部材、並びに接合方法 |
JP2021125522A (ja) * | 2020-02-04 | 2021-08-30 | 田中貴金属工業株式会社 | 導電性接合材料を備える接合部材及び接合方法 |
JP7023302B2 (ja) | 2020-02-04 | 2022-02-21 | 田中貴金属工業株式会社 | 導電性接合材料を備える接合部材及び接合方法 |
Also Published As
Publication number | Publication date |
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EP2428293B1 (de) | 2017-11-01 |
DE102010044329A1 (de) | 2012-03-08 |
KR20140014328A (ko) | 2014-02-06 |
US8925789B2 (en) | 2015-01-06 |
KR101690336B1 (ko) | 2016-12-27 |
JP5773429B2 (ja) | 2015-09-02 |
CN102386149A (zh) | 2012-03-21 |
CN102386149B (zh) | 2014-12-03 |
TWI455774B (zh) | 2014-10-11 |
TW201215469A (en) | 2012-04-16 |
SG178709A1 (en) | 2012-03-29 |
EP2428293A2 (de) | 2012-03-14 |
EP2428293A3 (de) | 2016-08-10 |
US20120055978A1 (en) | 2012-03-08 |
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