JP2017511601A - 半導体素子への接続のための焼結可能な固化したペーストをそれぞれ有しているキャリアおよびクリップ、対応する焼結用ペースト、ならびに対応する製造方法および使用 - Google Patents
半導体素子への接続のための焼結可能な固化したペーストをそれぞれ有しているキャリアおよびクリップ、対応する焼結用ペースト、ならびに対応する製造方法および使用 Download PDFInfo
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- JP2017511601A JP2017511601A JP2016558344A JP2016558344A JP2017511601A JP 2017511601 A JP2017511601 A JP 2017511601A JP 2016558344 A JP2016558344 A JP 2016558344A JP 2016558344 A JP2016558344 A JP 2016558344A JP 2017511601 A JP2017511601 A JP 2017511601A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000005245 sintering Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 22
- 229940100890 silver compound Drugs 0.000 claims abstract description 17
- 150000003379 silver compounds Chemical class 0.000 claims abstract description 17
- 239000013067 intermediate product Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000011230 binding agent Substances 0.000 claims description 18
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 16
- 239000000194 fatty acid Substances 0.000 claims description 16
- 229930195729 fatty acid Natural products 0.000 claims description 16
- 150000004665 fatty acids Chemical class 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000012876 carrier material Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 16
- WLGSIWNFEGRXDF-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O WLGSIWNFEGRXDF-UHFFFAOYSA-N 0.000 description 4
- KYYWBEYKBLQSFW-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCC(O)=O KYYWBEYKBLQSFW-UHFFFAOYSA-N 0.000 description 4
- RQFLGKYCYMMRMC-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O RQFLGKYCYMMRMC-UHFFFAOYSA-N 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- ZTUXEFFFLOVXQE-UHFFFAOYSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCC(O)=O ZTUXEFFFLOVXQE-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- HABLENUWIZGESP-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O.CCCCCCCCCC(O)=O HABLENUWIZGESP-UHFFFAOYSA-N 0.000 description 2
- AGDANEVFLMAYGL-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCCCCCC(O)=O AGDANEVFLMAYGL-UHFFFAOYSA-N 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 239000001761 ethyl methyl cellulose Substances 0.000 description 2
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- NHXTZGXYQYMODD-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCCCC(O)=O NHXTZGXYQYMODD-UHFFFAOYSA-N 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- CBYCSRICVDBHMZ-UHFFFAOYSA-N tetracosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCCCCCCCC(O)=O CBYCSRICVDBHMZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
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- H01L23/495—Lead-frames or other flat leads
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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Abstract
Description
Claims (13)
- 少なくとも1つの半導体素子用であり、かつ、当該半導素子への接続のための少なくとも1つの機能表面(10)を有しているキャリアであって、
前記キャリアの材料は金属からなり、銀および/または銀化合物と0.1〜2%の脂肪酸または有機結合剤とを含む焼結可能な固化したペーストの層(12)が、前記機能表面(10)上に配置され、前期キャリアと前記層(12)とが、前記半導体素子に接続することができる中間製品を形成している、ことを特徴とするキャリア。 - 少なくとも1つの端子(11)を有しており、
銀および/または銀化合物と0.1〜2%の脂肪酸または有機結合剤とを含んでおり、かつ、クリップ、特に請求項5に記載のクリップに接続可能である焼結可能な固化したペーストのさらなる層(12)が、前記機能表面(10)側において前記端子(11)上に配置されている、ことを特徴とする請求項1に記載のキャリア。 - 前記層(12)の厚さは、5μm〜100μm、特に5μm〜50μmである、ことを特徴とする請求項1または2に記載のキャリア。
- 前記層(12)は、200nm〜20μmの粒子サイズを有する銀粒子を含んでいる、ことを特徴とする請求項1〜3のいずれか一項に記載のキャリア。
- 半導体素子およびキャリア、特に請求項1に記載のキャリアに接続され、前記半導体素子への接続のための少なくとも1つの機能表面(10)を有しているクリップであって、
当該クリップの材料は金属からなり、銀および/または銀化合物と0.1〜2%の脂肪酸または有機結合剤とを含む焼結可能な固化したペーストの層(12)が、前記機能表面(10)上に配置され、前記クリップと前記層(12)とが、前記半導体素子に接続することができる中間製品を形成している、ことを特徴とするクリップ。 - 少なくとも1つの端子(11)を有しており、
銀および/または銀化合物と0.1〜2%の脂肪酸または有機結合剤とを含んでおり、かつ、キャリア、特に請求項1に記載のキャリアに接続可能である焼結可能な固化したペーストのさらなる層(12)が、前記機能表面(10)側において前記端子(11)上に配置されている、ことを特徴とする請求項5に記載のクリップ。 - 前記層(12)の厚さは、5μm〜100μm、特に5μm〜50μmである、ことを特徴とする請求項5または6に記載のクリップ。
- 前記層(12)は、200nm〜20μmの粒子サイズを有する銀粒子を含んでいる、ことを特徴とする請求項5〜7のいずれか一項に記載のキャリア。
- 少なくとも1つの半導体素子のためのキャリア、または半導体素子への接続のためのクリップを製造するための方法であって、
前記キャリアまたは前記クリップが構造付けられ、前記半導体素子への接続のための機能表面(10)が形成され、
焼結用ペースト、特に銀を含む焼結用ペーストが、前記機能表面(10)上に付着され、
前記焼結用ペーストが、乾燥および固化のために加熱される、方法。 - 前記機能表面(10)は、前記焼結用ペーストが付着される前に、結合剤、特に銀または銀化合物でコーティングされる、ことを特徴とする請求項5に記載の方法。
- 前記焼結用ペーストは、テンプレート印刷法、特にスプレー法またはディスペンス法によって付着される、ことを特徴とする請求項5または6に記載の方法。
- リードフレームパッケージを製造するための、請求項1に記載のキャリアおよび/または請求項5に記載のクリップの使用。
- キャリアおよび/またはクリップへの付着のための焼結用ペーストであって、
請求項1〜4のいずれか一項に記載のキャリアおよび/または請求項5〜8のいずれか一項に記載のクリップに付着可能であることを特徴とする焼結用ペースト。
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Application Number | Priority Date | Filing Date | Title |
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DE102014104272.7A DE102014104272A1 (de) | 2014-03-26 | 2014-03-26 | Träger und Clip jeweils für ein Halbleiterelement, Verfahren zur Herstellung, Verwendung und Sinterpaste |
DE102014104272.7 | 2014-03-26 | ||
PCT/EP2015/056596 WO2015144833A1 (de) | 2014-03-26 | 2015-03-26 | Träger und clip jeweils mit sinterbarer, verfestigter paste zur verbindung mit einem halbleiterelement, entsprechende sinterpaste und entsprechendes herstellungsverfahren und verwendung |
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- 2015-03-26 CN CN201580014541.2A patent/CN106170856A/zh active Pending
- 2015-03-26 KR KR1020167029739A patent/KR102025212B1/ko active IP Right Grant
- 2015-03-26 EP EP15713177.2A patent/EP3123500A1/de not_active Withdrawn
- 2015-03-26 JP JP2016558344A patent/JP6445584B2/ja active Active
- 2015-03-26 US US15/129,250 patent/US10347566B2/en active Active
- 2015-03-26 WO PCT/EP2015/056596 patent/WO2015144833A1/de active Application Filing
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JP2022053224A (ja) * | 2020-09-24 | 2022-04-05 | 株式会社東芝 | 半導体装置 |
JP7404208B2 (ja) | 2020-09-24 | 2023-12-25 | 株式会社東芝 | 半導体装置 |
Also Published As
Publication number | Publication date |
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EP3123500A1 (de) | 2017-02-01 |
WO2015144833A1 (de) | 2015-10-01 |
JP6445584B2 (ja) | 2018-12-26 |
KR20160139006A (ko) | 2016-12-06 |
KR102025212B1 (ko) | 2019-09-25 |
DE102014104272A1 (de) | 2015-10-01 |
US10347566B2 (en) | 2019-07-09 |
CN106170856A (zh) | 2016-11-30 |
US20170117209A1 (en) | 2017-04-27 |
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