TWI455774B - 用於接觸電子組件之接觸裝置及方法 - Google Patents

用於接觸電子組件之接觸裝置及方法 Download PDF

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Publication number
TWI455774B
TWI455774B TW100131825A TW100131825A TWI455774B TW I455774 B TWI455774 B TW I455774B TW 100131825 A TW100131825 A TW 100131825A TW 100131825 A TW100131825 A TW 100131825A TW I455774 B TWI455774 B TW I455774B
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Taiwan
Prior art keywords
component
peroxide
butyl
tert
formate
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TW100131825A
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English (en)
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TW201215469A (en
Inventor
Wolfgang Schmitt
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Heraeus Materials Tech Gmbh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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Claims (14)

  1. 一種燒結預製件，其包含有一表面具有至少一個含有硬化糊狀物之結構元件之載體，其特徵在於該硬化糊狀物(a)含有金屬粒子，該等金屬粒子具有含有至少一種有機化合物之塗層，該至少一種有機化合物選自由脂肪酸、脂肪酸鹽及脂肪酸酯組成之群，及(b)含有至少一種燒結助劑，該燒結助劑選自由下列組成之群：(b1)有機過氧化物，(b2)無機過氧化物，(b3)無機酸，(b4)有機酸之鹽，其中該等有機酸具有1個至4個碳原子，(b5)有機酸之酯，其中該等有機酸具有1個至4個碳原子，及(b6)羰基錯合物，且該載體之具有該硬化糊狀物之該表面不與該糊狀物之該等成份反應。
  2. 如請求項1之燒結預製件，其中該等金屬粒子係銀粒子。
  3. 如請求項1或2之燒結預製件，其中燒結助劑與該塗層中所含有之該等有機化合物之莫耳比率介於1：1至150：1範圍內。
  4. 如請求項1或2之燒結預製件，其中該有機過氧化物選自由下列組成之群：過氧化二異丁醯、過氧新癸酸異丙基苯酯、過氧新癸酸1,1,3,3-四甲基丁酯、過氧二碳酸二-正丙酯、過氧新癸酸第三戊酯、過氧二碳酸二-(2-乙基己基)酯、過氧新癸酸第三丁酯、過氧二碳酸二-正丁 酯、過氧新戊酸1,1,3,3-四甲基丁酯、過氧新庚酸第三丁酯、過氧新戊酸第三戊酯、過氧新戊酸第三丁酯、過氧化二-(3,5,5-三甲基己醯基)、過氧-2-乙基已酸第三丁酯、過氧異丁酸第三丁酯、1,1-二-(第三丁基過氧)-3,3,5-三甲基環己烷、1,1-二-(第三丁基過氧)-環己烷、過氧-3,5,5-三甲基已酸第三丁酯、2,2-二-(第三丁基過氧)-丁烷、過氧異丙基碳酸第三丁酯、過氧乙酸第三丁酯、2,5-二甲基-2,5-二(2-乙基己醯基過氧)-己烷、過氧-2-乙基已酸1,1,3,3-四甲基丁酯、過氧-2-乙基已酸第三戊酯、過氧二乙基乙酸第三丁酯、過氧-2-乙基己基碳酸第三戊酯、過氧-2-乙基己基碳酸第三丁酯、過氧苯甲酸第三丁酯、過氧化二-第三戊基、2,5-二甲基-2,5-二-(第三丁基過氧)-己烷、第三丁基過氧化異丙苯、2,5-二甲基-2,5-二(第三丁基過氧)己炔-3、過氧化二-第三丁基、3,6,9-三乙基-3,6,9-三甲基-1,4,7-三過氧壬烷、單氫過氧化二-異丙基苯、氫過氧化對薄荷烷、氫過氧化異丙基苯、過氧化二異丙基苯及氫過氧化1,1,3,3-四甲基丁基。
  5. 如請求項1或2之燒結預製件，其中該無機過氧化物選自由下列組成之群：過氧化氫、過氧化銨、過氧化鋰、過氧化鈉、過氧化鉀、過氧化鎂、過氧化鈣、過氧化鋇及過氧硼酸鹽。
  6. 如請求項1或2之燒結預製件，其中該無機酸係磷酸。
  7. 如請求項1或2之燒結預製件，其中該等鹽選自由下列組成之群：乙酸鹽、碳酸鹽、甲酸鹽、乳酸鹽及草酸鹽。
  8. 如請求項1或2之燒結預製件，其中該等鹽選自由下列組成之群：甲酸鎂、甲酸鋁、甲酸鐵(II)、甲酸錫(II)、甲酸銅(II)、甲酸銀(II)及甲酸錳(III)。
  9. 如請求項1或2之燒結預製件，其中該等鹽選自由乳酸銅(II)及乳酸銀(I)組成之群。
  10. 如請求項1或2之燒結預製件，其中該等酯選自由下列組成之群：甲酸甲酯、甲酸乙酯、甲酸丙酯及甲酸丁酯。
  11. 如請求項1或2之燒結預製件，其中該等羰基錯合物選自由金屬羰基化合物組成之群。
  12. 如請求項1或2之燒結預製件，其中將箔施加於該至少一個含有該硬化糊狀物之結構元件上。
  13. 一種連接至少兩個組件之方法，其中(i)提供如請求項1至12中任一項之燒結預製件，(ii)提供至少一個具有欲連接之表面之第一組件及具有欲連接之表面之第二組件，(iii)使該燒結預製件之載體表面上之至少一個結構元件與欲連接之該第一組件之該表面接觸，以產生由該第一組件及該至少一個結構元件構成之與該載體保持接觸之配置，(iv)自該載體移除由該第一組件及該至少一個結構元件構成之該配置，(v)使欲連接之該第二組件之該表面與由該第一組件及該至少一個結構元件構成之該配置的該至少一個結構元件接觸，以產生由該第一組件、第二組件及位於其間之 結構元件構成之燒結配置，且(vi)對該燒結配置進行燒結。
  14. 如請求項13之方法，其中在步驟(v)中使欲連接之該第二組件之該表面與由該第一組件及該至少一個結構元件構成之該配置之該至少一個結構元件經由另一結構元件接觸，該另一結構元件係由該第二組件及此結構元件構成之配置之一部分。
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