JP2012039126A - 銅積層体の剥離強度向上 - Google Patents
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Abstract
【解決手段】誘電体基板に積層するための銅箔であって、銅箔の表面に付着された層を含み、付着層が、クロム及び亜鉛のイオン又は酸化物から形成され、少なくとも0.5%のシランを含有する水溶液を用いて処理される。
【選択図】なし
Description
表面処理法1
図1は、本発明の第1の態様による、銅積層体の剥離強度を向上させるためのシステム10を示す図である。システム10は、本明細書でP2処理法と呼ばれる方法を用いて、クロム金属と亜鉛金属若しくはこれらの酸化物の混合物を銅箔14の表面に共付着させるための電解セル12と、シラン含有水溶液18に被覆銅箔14を浸漬させるシラン溶液槽16とを含む。シラン溶液槽16を出た後、銅箔14は、脱イオン(DI)水を使って洗浄され、次いで乾燥した後誘電体基板に積層させることができる。
次に図2を参照すると、本発明の第2の態様に従って、銅箔上に剥離強度向上コーティングを電着するための電解セル50を示す。電解セル50は、水性電解液52を含む槽20と、その間を銅箔14のストリップが通る陽極24とを含む。ガイドロール26を使って、電解セル50を通る銅箔14のストリップの移動を制御することができる。ガイドロール26は、電解液52と反応しない材料から製造される。好ましくは、ガイドロール26の少なくとも一方は、以下に詳述するように、銅箔14のストリップに電流を印可することができるように、ステンレス鋼などの導電材料から形成される。ガイドロール26は、以下に述べる所要時間の間、銅箔14が陽極24の間に位置するように、制御された速度で回転する。
Claims (28)
- 誘電体基板(62)に積層するための銅箔(14、60)であって、
前記銅箔(14、60)の表面に付着した剥離強度向上コーティング(64)を含み、前記剥離強度向上コーティング(64)が本質的に金属と金属酸化物の混合物からなり、前記金属と金属酸化物の混合物が、バナジウム、ニオブ、タンタル、クロム、モリブデン、タングステン、マンガン、テクネチウム、及びレニウムの1種以上から形成される上記銅箔(14、60)。 - 前記銅箔の表面が平滑である、請求項1に記載の銅箔(14、60)。
- 前記金属酸化物が、クロム、タングステン、及びモリブデンの元素から選択される、請求項1に記載の銅箔(14、60)。
- 前記剥離強度向上コーティング(64)の厚みが約20〜約200オングストロームである、請求項1に記載の銅箔(14、60)。
- 前記誘電体基板への積層前に、前記剥離強度向上コーティング(64)上にシランを付着させる、請求項1に記載の銅箔(14、60)。
- 誘電体基板(62)と、
前記誘電体基板に積層された、平滑な表面を有する銅箔(14、60)と、
前記銅箔(14、60)と前記誘電体基板(62)の間に付着した剥離強度向上コーティング(64)とを含み、
1/8インチの試験片を用いて4NのHClに60℃で6時間浸漬した後、IPC−TM−650法2.4.8.5に準拠して測定した場合、前記銅箔(14、60)の剥離強度の低下が10%以下である物品。 - 前記剥離強度向上コーティング(64)が、本質的に、バナジウム、ニオブ、タンタル、クロム、モリブデン、タングステン、マンガン、テクネチウム、及びレニウムの1種以上から形成される金属と金属酸化物の混合物からなる、請求項6に記載の物品。
- 前記金属酸化物が、クロム、タングステン、及びモリブデンの元素から選択される、請求項7に記載の物品。
- 前記剥離強度向上コーティング(64)の厚みが約20〜約200オングストロームである、請求項6に記載の物品。
- 前記剥離強度向上コーティング(64)は、4NのHClに60℃で6時間浸漬した後の縁部アンダーカットが10%以下である、請求項6に記載の物品。
- 1/8インチの試験片を用いて4NのHClに60℃で6時間浸漬した後、IPC−TM−650法2.4.8.5に準拠して測定した場合、前記銅箔(14、60)の剥離強度の低下が7%以下である、請求項6に記載の物品。
- 前記誘電体基板への積層前に、前記剥離強度向上コーティング(64)上にシランを付着させる、請求項6に記載の物品。
- 誘電体基板(62)に積層された銅箔(14、60)の剥離強度を上昇させる方法であって、
積層前に、前記銅箔(14、60)を、バナジウム、ニオブ、タンタル、クロム、モリブデン、タングステン、マンガン、テクネチウム、及びレニウムの1種以上から形成されたオキシアニオンを含有する水性電解液(52)に浸漬させるステップを含む方法。 - 前記金属が、クロム、モリブデン、及びタングステンの1種から選択される、請求項13に記載の方法。
- 前記水性電解液(52)が、クロム酸イオン、タングステン酸イオン、又はモリブデン酸イオンの脱イオン水を含有する、請求項13に記載の方法。
- 前記水溶液(52)が電解セル(50)中の電解液であり、前記方法が、約20〜約200オングストロームの厚みを有するコーティング(64)が前記銅箔(14、60)上に付着するように、前記銅箔(14、60)と前記電解液(52)に電流を流すステップをさらに含む、請求項13に記載の方法。
- 前記コーティング(64)を前記銅箔(14、60)上に付着させた後、前記銅箔(14、60)をシランに浸漬するステップをさらに含む、請求項16に記載の方法。
- 誘電体基板に積層するための銅箔(14、60)であって、
前記銅箔(14、60)の表面に付着された層(64)を含み、前記層(64)が、クロム及び亜鉛のイオン又は酸化物から形成され、少なくとも0.5%のシランを含有する水溶液を用いて処理される、上記銅箔(14、60)。 - 前記銅箔(14、60)の前記表面が平滑である、請求項18に記載の銅箔(14、60)。
- 前記層(64)の厚みが約10オングストローム〜約100オングストロームである、請求項18に記載の銅箔(14、60)。
- 誘電体基板(62)に積層された銅箔(14、60)の剥離強度を上昇させる方法であって、
積層前に、クロム及び亜鉛のイオン又は酸化物の混合物を、前記銅箔(14、60)の表面上に共付着させるステップと、
前記共付着ステップの後に、前記銅箔(14、60)を、少なくとも1秒間、少なくとも0.5%のシランの脱イオン水を含有する水溶液(18)に浸漬するステップと、
積層前に前記銅箔(14、60)を乾燥するステップと
を含む方法。 - 前記水溶液(18)が、本質的に0.5%のシランの脱イオン水からなる、請求項21に記載の方法。
- 前記水溶液(18)が、約15℃〜約30℃の温度である、請求項21に記載の方法。
- クロム及び亜鉛のイオン又は酸化物の混合物を共付着させる前記ステップが、
クロム及び亜鉛イオンを含有する電解液(22)中に配置された陽極(24)を有する電解セル(12)を設けるステップと、
陰極として前記銅箔(14、60)を設けるステップと、
前記クロム及び亜鉛イオンを前記銅箔(14、60)上に電着させるステップと
を含む、請求項21に記載の方法。 - 前記電解液(22)が、水酸化物イオン、約0.07g/l〜約7g/lの亜鉛イオン、及び約0.1g/l〜約100g/lの水溶性六価クロム塩を含有する塩基性溶液であり、前記亜鉛イオン濃度又は前記クロム(VI)イオン濃度或いはその両方が1.0未満であり、前記共付着ステップが、
前記銅箔(14、60)を前記電解液(22)に浸漬するステップと、
約1ミリアンペア/平方センチメートル〜約1アンペア/平方センチメートルの電流密度が得られるように、前記銅箔(14、60)及び前記電解液(22)に電流を流すステップと
を含む、請求項24に記載の方法。 - 前記電解液(22)が、本質的に、約10〜約35g/lのNaOH、約0.2〜約1.5g/lのZnO、及び約0.2〜約2g/lのNa2Cr2O7・2H2Oからなる、請求項25に記載の方法。
- 前記銅箔(14、60)上に付着された、前記クロム及び亜鉛のイオン又は酸化物から形成された層(64)の厚みが、約10オングストローム〜約100オングストロームである、請求項21に記載の方法。
- 前記浸漬ステップの後、かつ前記乾燥ステップの前に、前記銅箔(14、60)を洗浄するステップをさらに含む、請求項21に記載の方法。
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US43101302P | 2002-12-05 | 2002-12-05 | |
US60/431,013 | 2002-12-05 | ||
US10/727,920 US7749611B2 (en) | 2002-12-05 | 2003-12-04 | Peel strength enhancement of copper laminates |
US10/727,920 | 2003-12-04 |
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JP2009277618A Expired - Fee Related JP4966368B2 (ja) | 2002-12-05 | 2009-12-07 | 銅積層体の剥離強度向上 |
JP2011198477A Pending JP2012039126A (ja) | 2002-12-05 | 2011-09-12 | 銅積層体の剥離強度向上 |
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JP2009277618A Expired - Fee Related JP4966368B2 (ja) | 2002-12-05 | 2009-12-07 | 銅積層体の剥離強度向上 |
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US (1) | US7749611B2 (ja) |
EP (1) | EP1579031A4 (ja) |
JP (3) | JP4686194B2 (ja) |
KR (3) | KR101096638B1 (ja) |
CN (1) | CN1720350A (ja) |
AU (1) | AU2003298890A1 (ja) |
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KR20150029726A (ko) | 2012-06-29 | 2015-03-18 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 압연 구리박 및 그 제조 방법, 그리고 적층판 |
CN104476847A (zh) * | 2014-12-02 | 2015-04-01 | 广州方邦电子有限公司 | 一种高剥离强度挠性覆铜板及其制作方法 |
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US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
KR100974373B1 (ko) * | 2008-02-28 | 2010-08-05 | 엘에스엠트론 주식회사 | 인쇄회로용 동박의 표면처리 방법과 그 동박 및 도금장치 |
JP4682271B2 (ja) * | 2009-06-30 | 2011-05-11 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔 |
CN103125149B (zh) * | 2010-09-27 | 2016-09-14 | 吉坤日矿日石金属株式会社 | 印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板 |
KR101189132B1 (ko) | 2012-01-20 | 2012-10-10 | 엘에스엠트론 주식회사 | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 |
TWI539032B (zh) * | 2013-08-01 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method |
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- 2003-12-05 WO PCT/US2003/038592 patent/WO2004053193A1/en active Application Filing
- 2003-12-05 KR KR1020057010177A patent/KR101096638B1/ko not_active IP Right Cessation
- 2003-12-05 AU AU2003298890A patent/AU2003298890A1/en not_active Abandoned
- 2003-12-05 EP EP03796649A patent/EP1579031A4/en not_active Withdrawn
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- 2003-12-05 KR KR1020117009511A patent/KR20110050751A/ko not_active Application Discontinuation
- 2003-12-05 JP JP2004559288A patent/JP4686194B2/ja not_active Expired - Fee Related
- 2003-12-05 CN CNA2003801048563A patent/CN1720350A/zh active Pending
- 2003-12-05 KR KR1020127000451A patent/KR20120018222A/ko not_active Application Discontinuation
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JP4966368B2 (ja) | 2012-07-04 |
KR20050088409A (ko) | 2005-09-06 |
KR20120018222A (ko) | 2012-02-29 |
JP2010093281A (ja) | 2010-04-22 |
AU2003298890A1 (en) | 2004-06-30 |
TW200424356A (en) | 2004-11-16 |
EP1579031A1 (en) | 2005-09-28 |
WO2004053193A1 (en) | 2004-06-24 |
US20040180225A1 (en) | 2004-09-16 |
US7749611B2 (en) | 2010-07-06 |
KR101096638B1 (ko) | 2011-12-21 |
JP2006508837A (ja) | 2006-03-16 |
JP4686194B2 (ja) | 2011-05-18 |
CN1720350A (zh) | 2006-01-11 |
KR20110050751A (ko) | 2011-05-16 |
EP1579031A4 (en) | 2006-11-08 |
TWI337207B (en) | 2011-02-11 |
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