JP4966368B2 - 銅積層体の剥離強度向上 - Google Patents
銅積層体の剥離強度向上 Download PDFInfo
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- JP4966368B2 JP4966368B2 JP2009277618A JP2009277618A JP4966368B2 JP 4966368 B2 JP4966368 B2 JP 4966368B2 JP 2009277618 A JP2009277618 A JP 2009277618A JP 2009277618 A JP2009277618 A JP 2009277618A JP 4966368 B2 JP4966368 B2 JP 4966368B2
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- copper foil
- peel strength
- dielectric substrate
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- hcl
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12514—One component Cu-based
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
- Y10T428/12618—Plural oxides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Description
表面処理法1
図1は、本発明の第1の態様による、銅積層体の剥離強度を向上させるためのシステム10を示す図である。システム10は、本明細書でP2処理法と呼ばれる方法を用いて、クロム金属と亜鉛金属若しくはこれらの酸化物の混合物を銅箔14の表面に共付着させるための電解セル12と、シラン含有水溶液18に被覆銅箔14を浸漬させるシラン溶液槽16とを含む。シラン溶液槽16を出た後、銅箔14は、脱イオン(DI)水を使って洗浄され、次いで乾燥した後誘電体基板に積層させることができる。
次に図2を参照すると、本発明の第2の態様に従って、銅箔上に剥離強度向上コーティングを電着するための電解セル50を示す。電解セル50は、水性電解液52を含む槽20と、その間を銅箔14のストリップが通る陽極24とを含む。ガイドロール26を使って、電解セル50を通る銅箔14のストリップの移動を制御することができる。ガイドロール26は、電解液52と反応しない材料から製造される。好ましくは、ガイドロール26の少なくとも一方は、以下に詳述するように、銅箔14のストリップに電流を印可することができるように、ステンレス鋼などの導電材料から形成される。ガイドロール26は、以下に述べる所要時間の間、銅箔14が陽極24の間に位置するように、制御された速度で回転する。
Claims (6)
- 誘電体基板(62)と、
前記誘電体基板に積層された、Rzが約1μm未満の平滑な表面を有する銅箔(14,60)と、
前記銅箔の平滑な表面と前記誘電体基板(62)との間に付着した剥離強度向上コーティング(64)とを含み、前記剥離強度向上コーティング(64)が、金属と前記金属の酸化物との混合物であって、前記金属は、バナジウム、ニオブ、タンタル、クロム、モリブデン、タングステン、マンガン、テクネチウム、及びレニウムの1種以上から選択されるものであり、前記銅箔(14、60)が、1/8インチの試験片を用いて4NのHClに60℃で6時間浸漬した後、IPC−TM−650法2.4.8.5に準拠して測定した場合に、10%以下の剥離強度の低下を示す物品。 - 前記金属が、クロム、タングステン、及びモリブデンの1種から選択される、請求項1に記載の物品。
- 前記剥離強度向上コーティング(64)の厚みが約20〜約200オングストロームである、請求項1に記載の物品。
- 前記剥離強度向上コーティング(64)は、4NのHClに60℃で6時間浸漬した後の縁部アンダーカットが10%以下である、請求項1に記載の物品。
- 1/8インチの試験片を用いて4NのHClに60℃で6時間浸漬した後、IPC−TM−650法2.4.8.5に準拠して測定した場合、前記銅箔(14、60)の剥離強度の低下が7%以下である、請求項1に記載の物品。
- 前記誘電体基板への積層前に、前記剥離強度向上コーティング(64)上にシランを付着させる、請求項1に記載の物品。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43101302P | 2002-12-05 | 2002-12-05 | |
US60/431,013 | 2002-12-05 | ||
US10/727,920 | 2003-12-04 | ||
US10/727,920 US7749611B2 (en) | 2002-12-05 | 2003-12-04 | Peel strength enhancement of copper laminates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004559288A Division JP4686194B2 (ja) | 2002-12-05 | 2003-12-05 | 銅積層体の剥離強度向上 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011198477A Division JP2012039126A (ja) | 2002-12-05 | 2011-09-12 | 銅積層体の剥離強度向上 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010093281A JP2010093281A (ja) | 2010-04-22 |
JP4966368B2 true JP4966368B2 (ja) | 2012-07-04 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004559288A Expired - Fee Related JP4686194B2 (ja) | 2002-12-05 | 2003-12-05 | 銅積層体の剥離強度向上 |
JP2009277618A Expired - Fee Related JP4966368B2 (ja) | 2002-12-05 | 2009-12-07 | 銅積層体の剥離強度向上 |
JP2011198477A Pending JP2012039126A (ja) | 2002-12-05 | 2011-09-12 | 銅積層体の剥離強度向上 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004559288A Expired - Fee Related JP4686194B2 (ja) | 2002-12-05 | 2003-12-05 | 銅積層体の剥離強度向上 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011198477A Pending JP2012039126A (ja) | 2002-12-05 | 2011-09-12 | 銅積層体の剥離強度向上 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7749611B2 (ja) |
EP (1) | EP1579031A4 (ja) |
JP (3) | JP4686194B2 (ja) |
KR (3) | KR101096638B1 (ja) |
CN (1) | CN1720350A (ja) |
AU (1) | AU2003298890A1 (ja) |
TW (1) | TWI337207B (ja) |
WO (1) | WO2004053193A1 (ja) |
Families Citing this family (8)
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US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
KR100974373B1 (ko) * | 2008-02-28 | 2010-08-05 | 엘에스엠트론 주식회사 | 인쇄회로용 동박의 표면처리 방법과 그 동박 및 도금장치 |
JP4682271B2 (ja) * | 2009-06-30 | 2011-05-11 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔 |
WO2012043182A1 (ja) * | 2010-09-27 | 2012-04-05 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板 |
KR101189132B1 (ko) | 2012-01-20 | 2012-10-10 | 엘에스엠트론 주식회사 | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 |
JP5261595B1 (ja) | 2012-06-29 | 2013-08-14 | Jx日鉱日石金属株式会社 | 圧延銅箔及びその製造方法、並びに、積層板 |
TWI539032B (zh) | 2013-08-01 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method |
CN104476847B (zh) * | 2014-12-02 | 2017-05-17 | 广州方邦电子股份有限公司 | 一种高剥离强度挠性覆铜板及其制作方法 |
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ES2367838T3 (es) | 1998-09-10 | 2011-11-10 | JX Nippon Mining & Metals Corp. | Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación. |
US6346335B1 (en) * | 2000-03-10 | 2002-02-12 | Olin Corporation | Copper foil composite including a release layer |
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-
2003
- 2003-12-04 US US10/727,920 patent/US7749611B2/en not_active Expired - Fee Related
- 2003-12-05 KR KR1020057010177A patent/KR101096638B1/ko not_active IP Right Cessation
- 2003-12-05 WO PCT/US2003/038592 patent/WO2004053193A1/en active Application Filing
- 2003-12-05 KR KR1020127000451A patent/KR20120018222A/ko not_active Application Discontinuation
- 2003-12-05 TW TW92134380A patent/TWI337207B/zh not_active IP Right Cessation
- 2003-12-05 JP JP2004559288A patent/JP4686194B2/ja not_active Expired - Fee Related
- 2003-12-05 KR KR1020117009511A patent/KR20110050751A/ko not_active Application Discontinuation
- 2003-12-05 AU AU2003298890A patent/AU2003298890A1/en not_active Abandoned
- 2003-12-05 CN CNA2003801048563A patent/CN1720350A/zh active Pending
- 2003-12-05 EP EP03796649A patent/EP1579031A4/en not_active Withdrawn
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2009
- 2009-12-07 JP JP2009277618A patent/JP4966368B2/ja not_active Expired - Fee Related
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2011
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Also Published As
Publication number | Publication date |
---|---|
CN1720350A (zh) | 2006-01-11 |
EP1579031A4 (en) | 2006-11-08 |
KR101096638B1 (ko) | 2011-12-21 |
TW200424356A (en) | 2004-11-16 |
TWI337207B (en) | 2011-02-11 |
JP2006508837A (ja) | 2006-03-16 |
KR20050088409A (ko) | 2005-09-06 |
US7749611B2 (en) | 2010-07-06 |
WO2004053193A1 (en) | 2004-06-24 |
JP4686194B2 (ja) | 2011-05-18 |
EP1579031A1 (en) | 2005-09-28 |
JP2012039126A (ja) | 2012-02-23 |
KR20110050751A (ko) | 2011-05-16 |
AU2003298890A1 (en) | 2004-06-30 |
KR20120018222A (ko) | 2012-02-29 |
JP2010093281A (ja) | 2010-04-22 |
US20040180225A1 (en) | 2004-09-16 |
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