JP2012023245A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2012023245A JP2012023245A JP2010160825A JP2010160825A JP2012023245A JP 2012023245 A JP2012023245 A JP 2012023245A JP 2010160825 A JP2010160825 A JP 2010160825A JP 2010160825 A JP2010160825 A JP 2010160825A JP 2012023245 A JP2012023245 A JP 2012023245A
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- modified layer
- wiring
- insulating film
- semiconductor device
- wiring groove
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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Abstract
【解決手段】半導体装置100は、6員環構造の環状シロキサンを原料とする絶縁膜11と、絶縁膜11に形成された配線溝12と、配線溝12に金属膜(配線メタル)15が埋め込まれて構成される配線10と、を有する。半導体装置100では、配線溝12の底面において、絶縁膜11の内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層13が形成されている。
【選択図】図1
Description
6員環構造の環状シロキサンを原料とする絶縁膜と、
前記絶縁膜に形成された配線溝と、
前記配線溝に金属膜が埋め込まれて構成される配線と、
を有し、
前記配線溝の底面において、前記絶縁膜の内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層が形成されている、半導体装置
が提供される。
6員環構造の環状シロキサンを原料として絶縁膜を形成する工程と、
前記絶縁膜に配線溝を形成する工程と、
炭素原子、又は/及び、窒素原子を含むガスから発生されたプラズマにより前記配線溝の底面を処理して、前記配線溝の底面に改質層を形成する工程と、
前記配線溝を金属膜で埋め込んで配線を形成する工程と、
を含む、半導体装置の製造方法
が提供される。
図1は、第1の実施形態を示す半導体装置100の模式的な断面図である。
半導体装置100は、6員環構造の環状シロキサンを原料とする絶縁膜11と、絶縁膜11に形成された配線溝12と、配線溝12に金属膜(配線メタル)15が埋め込まれて構成される配線10と、を有する。半導体装置100では、配線溝12の底面において、絶縁膜11の内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層13が形成されている。
ターシャリーブチル基(−C(CH3)3)であることが望ましい。
ついで、フォトリソグラフィを行った後、ドライエッチングを行って絶縁膜11に配線溝12を形成する。(図2(a))。なお、配線溝12は、通常のダマシンプロセスを用いて形成させればよい。
図6は、第2の実施形態を示す半導体装置200の模式的な断面図である。図6(a)に示すように、半導体装置200は、6員環構造の環状シロキサンを原料とする層間絶縁膜11a、11b、11cと、層間絶縁膜11cに形成された配線溝12と、配線溝12に金属膜(配線メタル)15が埋め込まれて構成される上層配線10と、を有する。配線溝12の底面において、層間絶縁膜11cの内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層13が形成されている。また、半導体装置200は、絶縁膜11に形成されたデュアルダマシン溝22をさらに有する。デュアルダマシン溝22は、配線溝22bと配線溝22bの底面に接続しているビアホール22aとから構成される。具体的には、層間絶縁膜11bにはビアホール22aが形成され、層間絶縁膜11cには、配線溝22bが形成されている。ビアホール22a及び配線溝22bの側壁には、層間絶縁膜11cの内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層23が形成されている。
図1で示す構造体を作製した。絶縁膜11は、式(5)で示す化合物を用いて成膜した。改質層13は、配線溝12内の絶縁膜11をCO2ガスによるプラズマ処理することにより形成した。プラズマ発生条件は、CO2ガス流量500sccm、パワー500W、圧力6.7Pa(50mTorr)とし、厚み3nmの改質層13を作製した。
実施例1において、改質層の厚みを8.6nm、17nm、26nmとしたものをそれぞれ作製した。
実施例1において、CO2ガスによるプラズマ処理を行わなかった。
実施例1及び比較例1で得られた構造体を用い、X線光電子分光法により改質層13の表面からアルゴンエッチングを行い、深さ方向の炭素、酸素、及びシリコンについて元素分布を調べた。結果を図13に示す。
実施例2で得られたそれぞれの構造体について配線容量を測定した、結果を図14に示す。
11 絶縁膜
11a 層間絶縁膜
11b 層間絶縁膜
11c 層間絶縁膜
12 配線溝
13 改質層
14 バリアメタル膜
14a バリアメタル膜
14b バリアメタル膜
15 配線メタル
15a シード合金膜
15b めっき金属膜
16 バリア絶縁膜
16a バリア絶縁膜
16b バリア絶縁膜
17 ハードマスク
20 上層配線
21 接続プラグ
22 デュアルダマシン溝
22a ビアホール
22b 配線溝
23 改質層
24 バリアメタル膜
25 配線メタル
27 下層配線
28 ハードマスク
100 半導体装置
200 半導体装置
300 半導体装置
400 半導体装置
Claims (13)
- 6員環構造の環状シロキサンを原料とする絶縁膜と、
前記絶縁膜に形成された配線溝と、
前記配線溝に金属膜が埋め込まれて構成される配線と、
を有し、
前記配線溝の底面において、前記絶縁膜の内部よりも単位体積あたりの炭素原子数、又は/及び、窒素原子数が多い改質層が形成されている、半導体装置。 - 前記6員環構造の有機シロキサンが、シリコン及び酸素を骨格とし、シリコンに結合する側鎖の一方が不飽和炭化水素基であり、他方が炭素原子を2つ以上含む飽和炭化水素基を含んでいる、請求項1に記載の半導体装置。
- 前記絶縁膜に形成され、前記配線溝の底面に接続している接続孔をさらに有し、
前記接続孔の側壁に前記改質層が形成されている、請求項1又は2に記載の半導体装置。 - 前記配線溝の底面に形成された前記改質層の厚みが前記接続孔の側壁に形成された前記改質層の厚みよりも大きい、請求項3に記載の半導体装置。
- 前記配線溝の側壁において前記改質層が形成されており、
前記配線溝の側壁に形成された前記改質層の厚みが、前記配線溝の底面に形成された前記改質層の厚みよりも小さく、かつ、前記接続孔の側壁に形成された前記改質層の厚みよりも大きい、請求項4に記載の半導体装置。 - 前記配線溝の側壁において前記改質層が形成されており、
前記配線溝の底面に形成された前記改質層の厚みが前記配線溝の側壁に形成された前記改質層よりも厚い、請求項1乃至4いずれか1項に記載の半導体装置。 - 前記改質層における単位体積あたりの酸素原子数に対する炭素原子数の比率(C/O)が、前記絶縁膜の内部における単位体積あたりのC/Oよりも大きい、請求項1乃至6いずれか1項に記載の半導体装置。
- 前記改質層における単位体積あたりの炭素原子数に対するシリコン原子数の比率(Si/C)が、前記絶縁膜の内部における単位体積あたりのSi/Cよりも小さい、請求項1乃至7いずれか1項に記載の半導体装置。
- 6員環構造の環状シロキサンを原料として絶縁膜を形成する工程と、
前記絶縁膜に配線溝を形成する工程と、
炭素原子、又は/及び、窒素原子を含むガスから発生されたプラズマにより前記配線溝の底面を処理して、前記配線溝の底面に改質層を形成する工程と、
前記配線溝を金属膜で埋め込んで配線を形成する工程と、
を含む、半導体装置の製造方法。 - 前記絶縁膜に配線溝を形成する前記工程において、前記配線溝の側壁に前記改質層を形成させる、請求項9に記載の半導体装置の製造方法。
- 前記絶縁膜に接続孔を形成する工程を含み、
前記改質層を形成する前記工程において、前記配線溝の底面に前記改質層を形成させると同時に前記接続孔の底面に前記改質層を形成させ、
前記配線溝を形成する工程において、前記接続孔の上端に接続するように前記配線溝を形成する、請求項9又は10に記載の半導体装置の製造方法。 - 前記改質層を形成する前記工程の後に、前記改質層の表面を水素プラズマで処理する工程をさらに含む、請求項9乃至11いずれか1項に記載の半導体装置の製造方法。
- 炭素原子、又は/及び、窒素原子を含む前記ガスが、二酸化炭素ガス、窒素ガス、または、これらの混合ガスである、請求項9乃至12いずれか1項に記載の半導体装置の製造方法。
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