JP2012015480A - 光電素子 - Google Patents

光電素子 Download PDF

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Publication number
JP2012015480A
JP2012015480A JP2010259153A JP2010259153A JP2012015480A JP 2012015480 A JP2012015480 A JP 2012015480A JP 2010259153 A JP2010259153 A JP 2010259153A JP 2010259153 A JP2010259153 A JP 2010259153A JP 2012015480 A JP2012015480 A JP 2012015480A
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JP
Japan
Prior art keywords
semiconductor
semiconductor unit
unit
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010259153A
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English (en)
Japanese (ja)
Other versions
JP2012015480A5 (zh
Inventor
Hu Shen Cheng
シェン チェン−フ
Huaijin Cheng
ジン チャン−フェイ
Mn-Shun Shie
シエ ミン−シュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/830,059 external-priority patent/US9324691B2/en
Application filed by Epistar Corp filed Critical Epistar Corp
Publication of JP2012015480A publication Critical patent/JP2012015480A/ja
Publication of JP2012015480A5 publication Critical patent/JP2012015480A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/0008Devices characterised by their operation having p-n or hi-lo junctions
    • H01L33/0012Devices characterised by their operation having p-n or hi-lo junctions p-i-n devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Devices (AREA)
  • Photovoltaic Devices (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
JP2010259153A 2010-07-02 2010-11-19 光電素子 Pending JP2012015480A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/830,059 US9324691B2 (en) 2009-10-20 2010-07-02 Optoelectronic device
US12/830,059 2010-07-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015195552A Division JP6255372B2 (ja) 2010-07-02 2015-10-01 光電素子

Publications (2)

Publication Number Publication Date
JP2012015480A true JP2012015480A (ja) 2012-01-19
JP2012015480A5 JP2012015480A5 (zh) 2014-01-09

Family

ID=45349596

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2010259153A Pending JP2012015480A (ja) 2010-07-02 2010-11-19 光電素子
JP2015195552A Active JP6255372B2 (ja) 2010-07-02 2015-10-01 光電素子
JP2020047220A Active JP7001728B2 (ja) 2010-07-02 2020-03-18 光電素子

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015195552A Active JP6255372B2 (ja) 2010-07-02 2015-10-01 光電素子
JP2020047220A Active JP7001728B2 (ja) 2010-07-02 2020-03-18 光電素子

Country Status (5)

Country Link
JP (3) JP2012015480A (zh)
KR (4) KR101616098B1 (zh)
CN (2) CN105977272B (zh)
DE (1) DE102010060269B4 (zh)
TW (3) TWI446527B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096591A (ja) * 2012-11-09 2014-05-22 Lg Innotek Co Ltd 発光素子
JP2014131038A (ja) * 2012-12-27 2014-07-10 Lg Innotek Co Ltd 発光素子
JP2016021595A (ja) * 2010-07-02 2016-02-04 晶元光電股▲ふん▼有限公司 光電素子
JP2016039361A (ja) * 2014-08-07 2016-03-22 株式会社東芝 半導体発光素子
KR20180034017A (ko) * 2016-09-27 2018-04-04 서울바이오시스 주식회사 발광 다이오드

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633683B (zh) * 2013-08-27 2018-08-21 晶元光電股份有限公司 具有複數個發光結構之發光元件
TWI597864B (zh) 2013-08-27 2017-09-01 晶元光電股份有限公司 具有複數個發光結構之發光元件
CN110047865B (zh) * 2013-09-03 2024-02-23 晶元光电股份有限公司 具有多个发光结构的发光元件
CN104681575A (zh) * 2013-11-29 2015-06-03 晶元光电股份有限公司 发光二极管元件
CN110676286B (zh) * 2015-02-13 2024-01-19 首尔伟傲世有限公司 发光元件以及发光二极管
KR102480220B1 (ko) * 2016-04-08 2022-12-26 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널
KR101987196B1 (ko) * 2016-06-14 2019-06-11 삼성디스플레이 주식회사 픽셀 구조체, 픽셀 구조체를 포함하는 표시장치 및 그 제조 방법
KR102363036B1 (ko) * 2017-04-03 2022-02-15 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 및 이를 포함하는 반도체 소자 패키지
CN107516701B (zh) * 2017-07-14 2019-06-11 华灿光电(苏州)有限公司 一种高压发光二极管芯片及其制作方法
TWI731163B (zh) * 2017-09-13 2021-06-21 晶元光電股份有限公司 半導體元件

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126483A (zh) * 1974-08-29 1976-03-04 Mitsubishi Electric Corp
JPH10107316A (ja) * 1996-10-01 1998-04-24 Toyoda Gosei Co Ltd 3族窒化物半導体発光素子
JP2001345480A (ja) * 2000-03-31 2001-12-14 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
JP2004006582A (ja) * 2002-04-12 2004-01-08 Shiro Sakai 発光装置
JP2005085548A (ja) * 2003-09-05 2005-03-31 Nichia Chem Ind Ltd 光源装置及び車両用前照灯
JP2008235894A (ja) * 2007-03-19 2008-10-02 Seoul Opto Devices Co Ltd 交流駆動型の発光ダイオード
JP2009519604A (ja) * 2005-12-16 2009-05-14 ソウル オプト デバイス カンパニー リミテッド 改善された透明電極構造体を有する交流駆動型発光ダイオード
JP2009531839A (ja) * 2006-03-31 2009-09-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 光電式ヘッドライト、光電式ヘッドライトの製造方法と発光ダイオードチップ
JP2009231135A (ja) * 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
JP2010056195A (ja) * 2008-08-27 2010-03-11 Nichia Corp 半導体発光素子

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001073858A1 (en) * 2000-03-31 2001-10-04 Toyoda Gosei Co., Ltd. Group-iii nitride compound semiconductor device
US6547249B2 (en) * 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP4585014B2 (ja) * 2002-04-12 2010-11-24 ソウル セミコンダクター カンパニー リミテッド 発光装置
ES2362407T3 (es) * 2002-08-29 2011-07-04 Seoul Semiconductor Co., Ltd. Dispositivo emisor de luz provisto de diodos emisores de luz.
JP4415575B2 (ja) 2003-06-25 2010-02-17 日亜化学工業株式会社 半導体発光素子及びそれを用いた発光装置
JP4572604B2 (ja) * 2003-06-30 2010-11-04 日亜化学工業株式会社 半導体発光素子及びそれを用いた発光装置
EP1658642B1 (en) * 2003-08-28 2014-02-26 Panasonic Corporation Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
JP4160881B2 (ja) * 2003-08-28 2008-10-08 松下電器産業株式会社 半導体発光装置、発光モジュール、照明装置、および半導体発光装置の製造方法
JP2007517378A (ja) * 2003-12-24 2007-06-28 松下電器産業株式会社 半導体発光装置、照明モジュール、照明装置、表示素子、および半導体発光装置の製造方法
US20050274970A1 (en) * 2004-06-14 2005-12-15 Lumileds Lighting U.S., Llc Light emitting device with transparent substrate having backside vias
KR100665116B1 (ko) * 2005-01-27 2007-01-09 삼성전기주식회사 Esd 보호용 led를 구비한 질화갈륨계 발광 소자 및그 제조 방법
KR100833309B1 (ko) * 2006-04-04 2008-05-28 삼성전기주식회사 질화물계 반도체 발광소자
TWI440210B (zh) * 2007-01-22 2014-06-01 Cree Inc 使用發光裝置外部互連陣列之照明裝置及其製造方法
CN102779918B (zh) * 2007-02-01 2015-09-02 日亚化学工业株式会社 半导体发光元件
JP5229034B2 (ja) * 2008-03-28 2013-07-03 サンケン電気株式会社 発光装置
KR101025972B1 (ko) * 2008-06-30 2011-03-30 삼성엘이디 주식회사 교류 구동 발광 장치
US20110121329A1 (en) * 2008-08-06 2011-05-26 Helio Optoelectronics Corporation AC LED Structure
WO2010050694A2 (ko) * 2008-10-29 2010-05-06 서울옵토디바이스주식회사 발광 다이오드
US8963175B2 (en) * 2008-11-06 2015-02-24 Samsung Electro-Mechanics Co., Ltd. Light emitting device and method of manufacturing the same
KR101020910B1 (ko) * 2008-12-24 2011-03-09 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
JP4566267B1 (ja) * 2009-04-21 2010-10-20 シャープ株式会社 電源装置
US9324691B2 (en) * 2009-10-20 2016-04-26 Epistar Corporation Optoelectronic device
WO2011115361A2 (ko) * 2010-03-15 2011-09-22 서울옵토디바이스주식회사 복수개의 발광셀들을 갖는 발광 장치
TWI446527B (zh) * 2010-07-02 2014-07-21 Epistar Corp 光電元件
JP5997737B2 (ja) * 2014-03-28 2016-09-28 株式会社インフォシティ コンテンツ再生装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126483A (zh) * 1974-08-29 1976-03-04 Mitsubishi Electric Corp
JPH10107316A (ja) * 1996-10-01 1998-04-24 Toyoda Gosei Co Ltd 3族窒化物半導体発光素子
JP2001345480A (ja) * 2000-03-31 2001-12-14 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
JP2004006582A (ja) * 2002-04-12 2004-01-08 Shiro Sakai 発光装置
JP2005085548A (ja) * 2003-09-05 2005-03-31 Nichia Chem Ind Ltd 光源装置及び車両用前照灯
JP2009519604A (ja) * 2005-12-16 2009-05-14 ソウル オプト デバイス カンパニー リミテッド 改善された透明電極構造体を有する交流駆動型発光ダイオード
JP2009531839A (ja) * 2006-03-31 2009-09-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 光電式ヘッドライト、光電式ヘッドライトの製造方法と発光ダイオードチップ
JP2008235894A (ja) * 2007-03-19 2008-10-02 Seoul Opto Devices Co Ltd 交流駆動型の発光ダイオード
JP2009231135A (ja) * 2008-03-24 2009-10-08 Toshiba Lighting & Technology Corp 照明装置
JP2010056195A (ja) * 2008-08-27 2010-03-11 Nichia Corp 半導体発光素子

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016021595A (ja) * 2010-07-02 2016-02-04 晶元光電股▲ふん▼有限公司 光電素子
JP2020145432A (ja) * 2010-07-02 2020-09-10 晶元光電股▲ふん▼有限公司Epistar Corporation 光電素子
JP2014096591A (ja) * 2012-11-09 2014-05-22 Lg Innotek Co Ltd 発光素子
JP2014131038A (ja) * 2012-12-27 2014-07-10 Lg Innotek Co Ltd 発光素子
JP2016039361A (ja) * 2014-08-07 2016-03-22 株式会社東芝 半導体発光素子
KR20180034017A (ko) * 2016-09-27 2018-04-04 서울바이오시스 주식회사 발광 다이오드
KR102647673B1 (ko) * 2016-09-27 2024-03-14 서울바이오시스 주식회사 발광 다이오드

Also Published As

Publication number Publication date
DE102010060269A1 (de) 2012-01-05
KR101616098B1 (ko) 2016-04-27
JP6255372B2 (ja) 2017-12-27
KR20160048745A (ko) 2016-05-04
TW201203534A (en) 2012-01-16
JP2020145432A (ja) 2020-09-10
KR101929867B1 (ko) 2019-03-14
JP2016021595A (ja) 2016-02-04
KR20120003352A (ko) 2012-01-10
TW201519473A (zh) 2015-05-16
CN105977272B (zh) 2021-01-01
TWI446527B (zh) 2014-07-21
TWI533474B (zh) 2016-05-11
KR20170035357A (ko) 2017-03-30
CN105977272A (zh) 2016-09-28
KR20180006625A (ko) 2018-01-18
CN102315239A (zh) 2012-01-11
CN102315239B (zh) 2016-08-17
TWI466284B (zh) 2014-12-21
DE102010060269B4 (de) 2020-10-01
TW201203533A (en) 2012-01-16
JP7001728B2 (ja) 2022-01-20

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