JP2012009902A - 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 - Google Patents
表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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Abstract
【解決手段】表面に取り付け可能な発光ダイオード光源が、それぞれのリードフレーム接続部分の透明なプラスチック成形体の内部にチップ取り付け領域から発光ダイオード光源の取り付け面に向かってS型の湾曲部を有する。
【選択図】図1
Description
a)プラスチック成形材料60%以上、
b)変換物質0%より多く、40%以下、
c)付着助剤0%以上で3%以下、
d)離型剤0%以上で2%以下、
e)表面変性剤0%以上で5%以下、
f)酸化安定剤(例えば亜燐酸塩または立体障害フェノールを基礎とする)0%以上で5%以下、
g)紫外線安定剤0%以上で2%以下。
ニットーNT600(内部離型剤を有せず)
ニットーNT300H−10000(内部離型剤を有する)
ニットーNT300S−10000(内部離型剤を有する)
ニットーNT360−10000(内部離型剤を有する)
スミトモEME700L(内部離型剤を有せず)。
工具温度:150℃
注入時間:22.4秒
注入圧力:73−82バール(特に調節した材料の量に依存する)
硬化時間:120秒
結果として、気泡および空洞のないことにより際立った、きわめて均一の、硬化した成形材料を得ることができた。混合する前のきわめて細かい粉末への成形材料の粉砕が、粗粒の残留材料粉末を使用する場合より、気泡および空洞のないことに関してよりよい結果を生じることが一般に確認された。
Claims (3)
- リードフレーム(10)上にLEDチップ(1)が取り付けられ、リードフレーム(10)は一体の透明なプラスチック成形体(3)で取り囲むように形成され、該成形体の少なくとも2個の側面からそれぞれ1つのリードフレーム接続部分(11,12)が突出している、
表面に取り付け可能な発光ダイオード光源において、
それぞれのリードフレーム接続部分(11,12)の透明なプラスチック成形体(3)の内部にチップ取り付け領域(16)から発光ダイオード光源の取り付け面(13)に向かってS型の湾曲部(14,15)を有する
ことを特徴とする表面に取り付け可能な発光ダイオード光源。 - LEDチップ(1)を、チップ取り付け領域(16)内に、リードフレーム(10)上に取り付け、リードフレーム接続部分(11,12)と導電性に接続し、リードフレーム接続部分(11,12)に半導体LED(1)を取り付ける前または後にS型の湾曲部(14.15)を備え、半導体LED(1)を、リードフレーム(10)のS型の湾曲部(14,15)を含めて透明なプラスチック成形材料(3)で取り囲むように形成する
ことを特徴とする発光ダイオード光源の製造方法。 - 半導体LED(1)をリードフレーム(10)上に取り付け、透明なプラスチック成形材料(3)を変換物質(4)および場合により他の充填剤と混合し、成形材料を形成し、LED(1)が光の放射側で成形材料から包囲されるようにリードフレーム(10)を成形材料で取り囲むように形成することにより、紫外線領域または青のスペクトル領域で光の放射線が放射する
ことを特徴とする半導体LED(1)を基礎とする白色光源を製造する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19963806A DE19963806C2 (de) | 1999-12-30 | 1999-12-30 | Verfahren zum Herstellen einer Leuchtdioden-Weißlichtquelle, Verwendung einer Kunststoff-Preßmasse zum Herstellen einer Leuchtioden-Weißlichtquelle und oberflächenmontierbare Leuchtdioden-Weißlichtquelle |
DE19963806.3 | 1999-12-30 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2001550820A Division JP2003519929A (ja) | 1999-12-30 | 2000-12-28 | 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012009902A true JP2012009902A (ja) | 2012-01-12 |
JP2012009902A5 JP2012009902A5 (ja) | 2012-12-06 |
Family
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JP2001550820A Pending JP2003519929A (ja) | 1999-12-30 | 2000-12-28 | 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 |
JP2011223818A Pending JP2012009902A (ja) | 1999-12-30 | 2011-10-11 | 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 |
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JP2001550820A Pending JP2003519929A (ja) | 1999-12-30 | 2000-12-28 | 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7098588B2 (ja) |
EP (1) | EP1243031B9 (ja) |
JP (2) | JP2003519929A (ja) |
CN (1) | CN100375299C (ja) |
DE (2) | DE19964252A1 (ja) |
WO (1) | WO2001050540A1 (ja) |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPR570501A0 (en) * | 2001-06-15 | 2001-07-12 | Q1 (Pacific) Limited | Led lamp |
AUPQ818100A0 (en) | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
DE10131698A1 (de) | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
DE10134968A1 (de) * | 2001-07-23 | 2003-02-20 | Lite On Electronics Inc | Leuchtdiode und Verfahren zu deren Herstellung |
DE10147986A1 (de) * | 2001-09-28 | 2003-04-10 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbare Leuchtdioden-Lichtquelle und Verfahren zur Herstellung derselben |
DE10153615C1 (de) * | 2001-10-31 | 2003-07-24 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von elektronischen Bauteilen |
DE10213294B4 (de) | 2002-03-25 | 2015-05-13 | Osram Gmbh | Verwendung eines UV-beständigen Polymers in der Optoelektronik sowie im Außenanwendungsbereich, UV-beständiges Polymer sowie optisches Bauelement |
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Also Published As
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WO2001050540A1 (de) | 2001-07-12 |
DE19963806A1 (de) | 2001-07-19 |
US7098588B2 (en) | 2006-08-29 |
JP2003519929A (ja) | 2003-06-24 |
EP1243031B1 (de) | 2017-03-08 |
EP1243031B9 (de) | 2017-07-26 |
US7534634B2 (en) | 2009-05-19 |
DE19964252A1 (de) | 2002-06-06 |
CN100375299C (zh) | 2008-03-12 |
EP1243031A1 (de) | 2002-09-25 |
US20060244000A1 (en) | 2006-11-02 |
CN1421048A (zh) | 2003-05-28 |
US20020195935A1 (en) | 2002-12-26 |
DE19963806C2 (de) | 2002-02-07 |
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