JP2011530190A - 接点を冷却した電子機器匡体 - Google Patents

接点を冷却した電子機器匡体 Download PDF

Info

Publication number
JP2011530190A
JP2011530190A JP2011522056A JP2011522056A JP2011530190A JP 2011530190 A JP2011530190 A JP 2011530190A JP 2011522056 A JP2011522056 A JP 2011522056A JP 2011522056 A JP2011522056 A JP 2011522056A JP 2011530190 A JP2011530190 A JP 2011530190A
Authority
JP
Japan
Prior art keywords
heat
risers
layer
thermally
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011522056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011530190A5 (enExample
Inventor
ヒューズ，フィリップ，エヌ．
リップ，ロバート，ジェイ．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clustered Systems Co
Original Assignee
Clustered Systems Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clustered Systems Co filed Critical Clustered Systems Co
Publication of JP2011530190A publication Critical patent/JP2011530190A/ja
Publication of JP2011530190A5 publication Critical patent/JP2011530190A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2011522056A 2008-08-04 2009-08-04 接点を冷却した電子機器匡体 Pending JP2011530190A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8593108P 2008-08-04 2008-08-04
US61/085,931 2008-08-04
PCT/US2009/004462 WO2010016890A1 (en) 2008-08-04 2009-08-04 A contact cooled electronic enclosure

Publications (2)

Publication Number Publication Date
JP2011530190A true JP2011530190A (ja) 2011-12-15
JP2011530190A5 JP2011530190A5 (enExample) 2012-09-13

Family

ID=41608134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011522056A Pending JP2011530190A (ja) 2008-08-04 2009-08-04 接点を冷却した電子機器匡体

Country Status (5)

Country Link
US (2) US8270170B2 (enExample)
EP (1) EP2321607A1 (enExample)
JP (1) JP2011530190A (enExample)
CN (1) CN102112840A (enExample)
WO (1) WO2010016890A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012033559A (ja) * 2010-07-28 2012-02-16 J Devices:Kk 半導体装置
JP2014013849A (ja) * 2012-07-05 2014-01-23 Fujikura Ltd 電子装置用放熱構造
JP2014220537A (ja) * 2014-08-27 2014-11-20 株式会社ジェイデバイス 半導体装置
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Families Citing this family (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8270170B2 (en) 2008-08-04 2012-09-18 Clustered Systems Company Contact cooled electronic enclosure
US8027162B2 (en) * 2009-09-24 2011-09-27 International Business Machines Corporation Liquid-cooled electronics apparatus and methods of fabrication
CN201654652U (zh) * 2009-11-13 2010-11-24 鸿富锦精密工业（深圳）有限公司 电脑散热系统
CN102782331B (zh) * 2010-03-11 2015-04-22 株式会社岛津制作所 涡轮分子泵装置
US8477498B2 (en) 2010-03-25 2013-07-02 Curtiss-Wright Controls, Inc. Conduction-cooled apparatus and methods of forming said apparatus
US8300412B2 (en) * 2010-09-30 2012-10-30 Hamilton Sundstrand Corporation Heat exchanger for motor controller
US9119327B2 (en) * 2010-10-26 2015-08-25 Tdk-Lambda Corporation Thermal management system and method
CN102469742A (zh) * 2010-11-04 2012-05-23 鸿富锦精密工业（深圳）有限公司 电子装置
US8488312B2 (en) * 2011-02-14 2013-07-16 Adc Telecommunications, Inc. Systems and methods for thermal management for telecommunications enclosures using heat pipes
US8493738B2 (en) 2011-05-06 2013-07-23 International Business Machines Corporation Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
US9307674B2 (en) 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
US9027360B2 (en) 2011-05-06 2015-05-12 International Business Machines Corporation Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
US10966339B1 (en) * 2011-06-28 2021-03-30 Amazon Technologies, Inc. Storage system with removable solid state storage devices mounted on carrier circuit boards
CN102891116B (zh) 2011-07-20 2015-06-10 讯芯电子科技（中山）有限公司 内埋元件封装结构及制造方法
US8687364B2 (en) 2011-10-28 2014-04-01 International Business Machines Corporation Directly connected heat exchanger tube section and coolant-cooled structure
US9043035B2 (en) 2011-11-29 2015-05-26 International Business Machines Corporation Dynamically limiting energy consumed by cooling apparatus
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
US20130271918A1 (en) * 2012-04-16 2013-10-17 John Philip Neville Hughes Cold plate with reduced bubble effects
US9273906B2 (en) 2012-06-14 2016-03-01 International Business Machines Corporation Modular pumping unit(s) facilitating cooling of electronic system(s)
CN103517611A (zh) * 2012-06-19 2014-01-15 鸿富锦精密工业（深圳）有限公司 电子设备及其散热装置
US9110476B2 (en) 2012-06-20 2015-08-18 International Business Machines Corporation Controlled cooling of an electronic system based on projected conditions
US8913384B2 (en) 2012-06-20 2014-12-16 International Business Machines Corporation Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
US9879926B2 (en) 2012-06-20 2018-01-30 International Business Machines Corporation Controlled cooling of an electronic system for reduced energy consumption
TWI504852B (zh) * 2012-09-07 2015-10-21 仁寶電腦工業股份有限公司 散熱模組
EP2893787B1 (en) * 2012-09-07 2018-09-26 Thomson Licensing Set top box having heat sink pressure applying means
US9049811B2 (en) * 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
US9313930B2 (en) 2013-01-21 2016-04-12 International Business Machines Corporation Multi-level redundant cooling system for continuous cooling of an electronic system(s)
US9390994B2 (en) * 2013-08-07 2016-07-12 Oracle International Corporation Heat sinks with interdigitated heat pipes
US10788869B2 (en) * 2013-12-11 2020-09-29 Asia Vital Components Co., Ltd. Heat-conducting case unit for handheld electronic device
US10602642B2 (en) 2013-12-11 2020-03-24 Asia Vital Components Co., Ltd. Back cover unit applied to portable device and having heat conduction function
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
CN106031321A (zh) * 2014-01-08 2016-10-12 探戈科技公司 高功率便携装置和对接系统
CH709506A2 (it) * 2014-04-14 2015-10-15 Quantec Sa Dispositivo portatile di ricetrasmissione di flussi audio crittografati e metodo associato.
US9668334B2 (en) * 2014-05-23 2017-05-30 General Electric Company Thermal clamp apparatus for electronic systems
US10136558B2 (en) * 2014-07-30 2018-11-20 Dell Products L.P. Information handling system thermal management enhanced by estimated energy states
JP5854487B1 (ja) * 2014-10-28 2016-02-09 Ｎｅｃプラットフォームズ株式会社 外部機器の放熱構造、電子機器、及び外部機器
US9723753B2 (en) * 2014-10-28 2017-08-01 Hamilton Sundstrand Corporation Planar heat cup with confined reservoir for electronic power component
DE102015001148B4 (de) 2015-01-30 2019-04-11 e.solutions GmbH Anordnung und Verfahren zur elektromagnetischen Abschirmung
US9560737B2 (en) * 2015-03-04 2017-01-31 International Business Machines Corporation Electronic package with heat transfer element(s)
US11257527B2 (en) 2015-05-06 2022-02-22 SK Hynix Inc. Memory module with battery and electronic system having the memory module
KR20160131171A (ko) * 2015-05-06 2016-11-16 에스케이하이닉스 주식회사 배터리를 포함하는 메모리 모듈
US10220725B2 (en) * 2015-05-13 2019-03-05 Ge Global Sourcing Llc System and method for passively cooling an enclosure
CN106298688B (zh) * 2015-05-28 2018-11-06 台达电子工业股份有限公司 封装型功率电路模块
US10426037B2 (en) 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US10098235B2 (en) 2015-09-25 2018-10-09 International Business Machines Corporation Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US10172239B2 (en) 2015-09-25 2019-01-01 International Business Machines Corporation Tamper-respondent sensors with formed flexible layer(s)
US9894749B2 (en) 2015-09-25 2018-02-13 International Business Machines Corporation Tamper-respondent assemblies with bond protection
US9924591B2 (en) 2015-09-25 2018-03-20 International Business Machines Corporation Tamper-respondent assemblies
US10175064B2 (en) 2015-09-25 2019-01-08 International Business Machines Corporation Circuit boards and electronic packages with embedded tamper-respondent sensor
US9591776B1 (en) 2015-09-25 2017-03-07 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s)
US9578764B1 (en) 2015-09-25 2017-02-21 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US9911012B2 (en) 2015-09-25 2018-03-06 International Business Machines Corporation Overlapping, discrete tamper-respondent sensors
US10143090B2 (en) 2015-10-19 2018-11-27 International Business Machines Corporation Circuit layouts of tamper-respondent sensors
US9978231B2 (en) 2015-10-21 2018-05-22 International Business Machines Corporation Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)
KR102473586B1 (ko) * 2015-10-27 2022-12-05 삼성전자주식회사 방열장치를 포함하는 디스플레이 기기 및 전자 기기
EP3163989B1 (en) * 2015-10-27 2021-06-02 Samsung Electronics Co., Ltd. Display apparatus and electronic apparatus having heat sink assembly
US9913389B2 (en) 2015-12-01 2018-03-06 International Business Corporation Corporation Tamper-respondent assembly with vent structure
US10327343B2 (en) 2015-12-09 2019-06-18 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9555606B1 (en) 2015-12-09 2017-01-31 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9554477B1 (en) 2015-12-18 2017-01-24 International Business Machines Corporation Tamper-respondent assemblies with enclosure-to-board protection
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US9823718B2 (en) * 2016-01-13 2017-11-21 Microsoft Technology Licensing, Llc Device cooling
US9916744B2 (en) 2016-02-25 2018-03-13 International Business Machines Corporation Multi-layer stack with embedded tamper-detect protection
US10455735B2 (en) 2016-03-03 2019-10-22 Coolanyp, LLC Self-organizing thermodynamic system
US10327360B2 (en) 2016-04-11 2019-06-18 TechnoGuard Inc. Method for decreasing air leakage between adjacent elements in a data center
US9795055B1 (en) * 2016-04-18 2017-10-17 International Business Machines Corporation Electronics cooling assembly with multi-position, airflow-blocking mechanism
US9904811B2 (en) 2016-04-27 2018-02-27 International Business Machines Corporation Tamper-proof electronic packages with two-phase dielectric fluid
US10345874B1 (en) 2016-05-02 2019-07-09 Juniper Networks, Inc Apparatus, system, and method for decreasing heat migration in ganged heatsinks
US9881880B2 (en) 2016-05-13 2018-01-30 International Business Machines Corporation Tamper-proof electronic packages with stressed glass component substrate(s)
US9913370B2 (en) 2016-05-13 2018-03-06 International Business Machines Corporation Tamper-proof electronic packages formed with stressed glass
US9858776B1 (en) 2016-06-28 2018-01-02 International Business Machines Corporation Tamper-respondent assembly with nonlinearity monitoring
US10965333B2 (en) 2016-07-26 2021-03-30 Laird Technologies, Inc. Thermal management assemblies suitable for use with transceivers and other devices
US10389397B2 (en) * 2016-07-26 2019-08-20 Laird Technologies, Inc. Small form-factor pluggable (SFP) transceivers
US10321589B2 (en) 2016-09-19 2019-06-11 International Business Machines Corporation Tamper-respondent assembly with sensor connection adapter
US10299372B2 (en) 2016-09-26 2019-05-21 International Business Machines Corporation Vented tamper-respondent assemblies
US10271424B2 (en) 2016-09-26 2019-04-23 International Business Machines Corporation Tamper-respondent assemblies with in situ vent structure(s)
US9999124B2 (en) 2016-11-02 2018-06-12 International Business Machines Corporation Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
JP6620725B2 (ja) * 2016-11-14 2019-12-18 株式会社オートネットワーク技術研究所 電気接続箱
SE542115C2 (en) * 2016-12-21 2020-02-25 PrimeKey Solutions AB A computer circuit board cooling arrangement
US10327329B2 (en) 2017-02-13 2019-06-18 International Business Machines Corporation Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
US10591964B1 (en) * 2017-02-14 2020-03-17 Juniper Networks, Inc Apparatus, system, and method for improved heat spreading in heatsinks
DE102017103200A1 (de) 2017-02-16 2018-08-16 Fujitsu Technology Solutions Intellectual Property Gmbh Kühlvorrichtung zum passiven Kühlen eines Computersystems sowie Computersystem
US10566262B2 (en) 2017-09-12 2020-02-18 Laird Technologies, Inc. Thermal interface materials with wear-resisting layers and/or suitable for use between sliding components
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
US10555439B2 (en) * 2017-11-02 2020-02-04 Laird Technologies, Inc. Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components
US10306753B1 (en) 2018-02-22 2019-05-28 International Business Machines Corporation Enclosure-to-board interface with tamper-detect circuit(s)
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
US11122682B2 (en) 2018-04-04 2021-09-14 International Business Machines Corporation Tamper-respondent sensors with liquid crystal polymer layers
DE102018109920A1 (de) * 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlung von leistungselektronischen Schaltungen
US10595439B2 (en) * 2018-06-25 2020-03-17 Intel Corporation Movable heatsink utilizing flexible heat pipes
JP7143647B2 (ja) * 2018-06-27 2022-09-29 株式会社村田製作所 回路モジュール及び回路モジュールの製造方法
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US11467637B2 (en) 2018-07-31 2022-10-11 Wuxi Kalannipu Thermal Management Technology Co., Ltd. Modular computer cooling system
CN113196207A (zh) 2018-12-18 2021-07-30 康普技术有限责任公司 用于模块化电子装置的热管理
WO2021002787A1 (en) 2019-07-03 2021-01-07 Telefonaktiebolaget Lm Ericsson (Publ) Thermally resistant remote radio unit
US10806054B1 (en) * 2019-08-06 2020-10-13 Honeywell International Inc. Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures
US11483948B2 (en) * 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
US11415370B2 (en) 2019-09-04 2022-08-16 Toyota Motor Engineering & Manutacturing North America, Inc. Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices
CN111225544B (zh) * 2019-12-06 2021-11-05 法雷奥西门子新能源汽车(深圳)有限公司 用于电子元件的散热装置
CN110911368B (zh) * 2019-12-23 2021-10-01 深圳市中科领创实业有限公司 一种具有自动散热功能的集成电路
KR102772815B1 (ko) * 2020-04-29 2025-02-27 삼성전자주식회사 방열 시트를 포함하는 전자 장치
CN111949094B (zh) * 2020-07-15 2021-12-28 苏州浪潮智能科技有限公司 一种内存水冷散热结构
GB2597525A (en) * 2020-07-27 2022-02-02 Nexalus Ltd Cooling device for cooling components of a circuit board
US11457545B2 (en) * 2020-09-28 2022-09-27 Google Llc Thermal-control system of a media-streaming device and associated media-streaming devices
US11304338B1 (en) 2020-12-01 2022-04-12 Nan Chen System, method, and apparatus for a high-efficiency heat riser
US11477915B2 (en) * 2021-01-14 2022-10-18 Quanta Computer Inc. Systems for cooling electronic components in a sealed computer chassis
EP4305937A1 (en) * 2021-03-08 2024-01-17 Tesla, Inc. Cold plate with integrated sliding pedestal and processing system including the same
CN115443027A (zh) * 2021-06-02 2022-12-06 英业达科技有限公司 伺服装置
CN115437480A (zh) * 2021-06-03 2022-12-06 英业达科技有限公司 伺服装置
CN113453502B (zh) * 2021-06-17 2024-01-26 合肥智圣新创信息技术有限公司 一种网络安全设备防护系统
US11800687B2 (en) 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly
US11665856B2 (en) * 2021-10-26 2023-05-30 Eagle Technology, Llc Electronic device having flexible, heat conductive layer and associated methods
US12120856B2 (en) * 2022-01-14 2024-10-15 Nio Technology (Anhui) Co., Ltd. Serviceable and accessible liquid cooled modules
US12016111B2 (en) * 2022-04-20 2024-06-18 Western Digital Technologies, Inc. Protective enclosure for an electronic device
US12279360B2 (en) * 2022-09-27 2025-04-15 Prime World International Holdings Ltd. Optical transceiver including heat dissipation components thermally coupled to opposite sides of housing
TWM655842U (zh) * 2023-12-20 2024-05-21 強茂股份有限公司 兼具提高空間利用率及散熱效果的電源供應器

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496857U (enExample) * 1990-07-20 1992-08-21
JPH0566095A (ja) * 1991-04-09 1993-03-19 Akutoronikusu Kk 熱接続装置とその製造方法
JPH07106477A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> 熱伝導板付きヒートシンクアセンブリ
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
JPH11186472A (ja) * 1997-12-17 1999-07-09 Nec Eng Ltd モジュール内発熱素子の放熱構造
JP2000174179A (ja) * 1998-12-07 2000-06-23 Pioneer Electronic Corp 発熱素子の放熱構造
JP2000261175A (ja) * 1999-03-10 2000-09-22 Fujikura Ltd 電子機器の冷却装置
JP2002318084A (ja) * 2001-04-18 2002-10-31 Matsushita Electric Ind Co Ltd ヒートパイプ接続装置および電子機器の放熱装置
JP2004165281A (ja) * 2002-11-11 2004-06-10 Mitsubishi Electric Corp モールド樹脂封止型パワー半導体装置及びその製造方法
JP2005228954A (ja) * 2004-02-13 2005-08-25 Fujitsu Ltd 熱伝導機構、放熱システムおよび通信装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE469298B (sv) 1991-10-24 1993-06-14 Ericsson Telefon Ab L M Anordning foer kylning av elektronik medelst straalningsoeverfoering
KR100261634B1 (ko) * 1995-01-11 2000-07-15 모리시타 요이찌 그래파이트클래드구조체
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US5740018A (en) 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US6064572A (en) * 1996-11-27 2000-05-16 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5991155A (en) * 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US5818692A (en) 1997-05-30 1998-10-06 Motorola, Inc. Apparatus and method for cooling an electrical component
EP1742265B1 (en) 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
US6393853B1 (en) 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
JP2002280782A (ja) 2001-03-22 2002-09-27 Toshiba Corp 発熱部品放熱機構及び放送用送信装置
US6421240B1 (en) * 2001-04-30 2002-07-16 Hewlett-Packard Company Cooling arrangement for high performance electronic components
JP4706125B2 (ja) * 2001-05-24 2011-06-22 パナソニック株式会社 機能ユニットの放熱緩衝構造を備えた情報処理装置
CN1868736A (zh) * 2001-05-30 2006-11-29 霍尼韦尔国际公司 界面材料及其生产方法和应用
US20030178174A1 (en) 2002-03-21 2003-09-25 Belady Christian L. Thermal pouch interface
JP4057455B2 (ja) * 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
US7167366B2 (en) 2002-09-11 2007-01-23 Kioan Cheon Soft cooling jacket for electronic device
US7286355B2 (en) 2002-09-11 2007-10-23 Kioan Cheon Cooling system for electronic devices
US20040052052A1 (en) * 2002-09-18 2004-03-18 Rivera Rudy A. Circuit cooling apparatus
JP4199018B2 (ja) 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
US7063127B2 (en) 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
US20050280987A1 (en) * 2004-06-07 2005-12-22 Kwitek Benjamin J Phase change materials as a heat sink for computers
US20060070720A1 (en) * 2004-09-17 2006-04-06 Capp Joseph P Heat riser
US7168152B1 (en) * 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
PT1846949T (pt) * 2005-01-05 2018-11-29 Philips Lighting Holding Bv Aparelho termicamente e eletricamente condutor
US7218129B2 (en) * 2005-01-12 2007-05-15 International Business Machines Corporation System, apparatus and method for controlling temperature of an integrated circuit under test
US20070076376A1 (en) 2005-09-30 2007-04-05 Intel Corporation Method, apparatus and computer system for providing for the transfer of thermal energy
US7212409B1 (en) 2005-12-05 2007-05-01 Hewlett-Packard Development Company, L.P. Cam actuated cold plate
US7403393B2 (en) * 2005-12-28 2008-07-22 International Business Machines Corporation Apparatus and system for cooling heat producing components
NL1031206C2 (nl) * 2006-02-22 2007-08-24 Thales Nederland Bv Vlakke warmtebuis voor koeldoeleinden.
TWM299458U (en) * 2006-04-21 2006-10-11 Taiwan Microloops Corp Heat spreader with composite micro-structure
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
JP4764317B2 (ja) * 2006-11-28 2011-08-31 株式会社東芝 電子機器
US8284004B2 (en) 2006-11-29 2012-10-09 Honeywell International Inc. Heat pipe supplemented transformer cooling
US7965508B2 (en) * 2007-03-27 2011-06-21 Denso Corporation Cooling device for electronic component and power converter equipped with the same
CN101960937B (zh) 2007-12-19 2013-07-03 集群系统公司 用于接触冷却电子模块的冷却系统
US8270170B2 (en) 2008-08-04 2012-09-18 Clustered Systems Company Contact cooled electronic enclosure
CN101749979B (zh) * 2008-12-22 2012-11-21 富准精密工业(深圳)有限公司 散热鳍片、散热器及电子装置
JP5110049B2 (ja) * 2009-07-16 2012-12-26 株式会社デンソー 電子制御装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496857U (enExample) * 1990-07-20 1992-08-21
JPH0566095A (ja) * 1991-04-09 1993-03-19 Akutoronikusu Kk 熱接続装置とその製造方法
JPH07106477A (ja) * 1993-07-06 1995-04-21 Hewlett Packard Co <Hp> 熱伝導板付きヒートシンクアセンブリ
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
JPH11186472A (ja) * 1997-12-17 1999-07-09 Nec Eng Ltd モジュール内発熱素子の放熱構造
JP2000174179A (ja) * 1998-12-07 2000-06-23 Pioneer Electronic Corp 発熱素子の放熱構造
JP2000261175A (ja) * 1999-03-10 2000-09-22 Fujikura Ltd 電子機器の冷却装置
JP2002318084A (ja) * 2001-04-18 2002-10-31 Matsushita Electric Ind Co Ltd ヒートパイプ接続装置および電子機器の放熱装置
JP2004165281A (ja) * 2002-11-11 2004-06-10 Mitsubishi Electric Corp モールド樹脂封止型パワー半導体装置及びその製造方法
JP2005228954A (ja) * 2004-02-13 2005-08-25 Fujitsu Ltd 熱伝導機構、放熱システムおよび通信装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012033559A (ja) * 2010-07-28 2012-02-16 J Devices:Kk 半導体装置
US9059143B2 (en) 2010-07-28 2015-06-16 J-Devices Corporation Semiconductor device
JP2014013849A (ja) * 2012-07-05 2014-01-23 Fujikura Ltd 電子装置用放熱構造
JP2014220537A (ja) * 2014-08-27 2014-11-20 株式会社ジェイデバイス 半導体装置
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP2023060431A (ja) * 2021-10-18 2023-04-28 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Also Published As

Publication number Publication date
US20130208422A1 (en) 2013-08-15
CN102112840A (zh) 2011-06-29
US8270170B2 (en) 2012-09-18
WO2010016890A1 (en) 2010-02-11
US20100027220A1 (en) 2010-02-04
EP2321607A1 (en) 2011-05-18

Similar Documents

Publication Publication Date Title
JP2011530190A (ja) 接点を冷却した電子機器匡体
JP5204355B1 (ja) 液体ｄｉｍｍ冷却装置
US7254036B2 (en) High density memory module using stacked printed circuit boards
US7646093B2 (en) Thermal management of dies on a secondary side of a package
US6712621B2 (en) Thermally enhanced interposer and method
JP5165017B2 (ja) 電子機器の冷却構造
US7254027B2 (en) Processor module for system board
US20060198108A1 (en) Thermal management apparatus and method for a circuit substrate
US6101094A (en) Printed circuit board with integrated cooling mechanism
US7327569B2 (en) Processor module with thermal dissipation device
CN105593627A (zh) 散热设备
CN107078107A (zh) 散热构造体及其制造方法
EP3171680A1 (en) Mezzanine filler module apparatuses and methods for computing devices
CN113194607B (zh) 一种基于多层印制板盲插馈电的定位与散热结构
CN107078106A (zh) 散热结构
TWI339560B (en) Heat dissipation structure of expanded and laminated architecture
CN101990385B (zh) 盒式设备及其滑道
CN102279637A (zh) 扩充卡装置及其散热器
KR20090122026A (ko) 방열패턴을 갖는 인쇄회로기판 및 그 제조방법
CN1571629A (zh) 用于待冷却元件的电路布局及相应的冷却方法
CN120010626A (zh) 固态硬盘装置及电子装置
TWI440418B (zh) 提供加熱與散熱以維持電子元件工作溫度的多層電路板架構

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120726

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120726

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130730

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130820

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20131120

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20131128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140513

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140605

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140620

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150127