US20130208422A1 - Contact cooled electronic enclosure - Google Patents
Contact cooled electronic enclosure Download PDFInfo
- Publication number
- US20130208422A1 US20130208422A1 US13/588,836 US201213588836A US2013208422A1 US 20130208422 A1 US20130208422 A1 US 20130208422A1 US 201213588836 A US201213588836 A US 201213588836A US 2013208422 A1 US2013208422 A1 US 2013208422A1
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- Prior art keywords
- interface
- heat
- layer
- thermally conductive
- thermal
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present application relates generally to the cooling of compute and storage systems; and, in a specific exemplary embodiment, to a system and method for cooling electronic equipment in modularly deployed systems cooled by attachment to a cold plate.
- fluid-based cooling systems cool computers and other electronic equipment.
- fluid moves heat from a hard-to-cool location to a different area.
- a liquid circulation system consisting of a heat absorber, a pump and a heat dissipater could be employed to remove heat from hot electronic components to finned sides of a computer case where convective cooling with ambient air removes the heat without the use of forced air.
- Enterprise-based compute and storage systems are increasingly deployed as modular systems with standardized form factor electronic enclosure modules mounted in standardized support structures.
- the standardized electronic enclosure modules can be devoted to perform any of a number of different functions such as computing, storage, or networking.
- the enclosure modules are commonly mounted in standardized support structures such as 19 inch (approximately 0.482 m) or 24 inch (approximately 0.610 m) wide racks.
- Such enclosures are commonly industry standard 1 U (1.75 inch; approximately 4.45 cm), 2 U (3.5 inch; approximately 8.89 cm), 3 U (5.25 inch; approximately 13.3 cm), or 4 U (7 inch; approximately 17.8 cm) high.
- the reasons for the adoption of the larger 2 U, 3 U, or 4 U modules are to increase reliability of electronic components through improved airflow for cooling and to provide space for more adapter cards.
- Modular enclosures are frequently air-cooled.
- the enclosures draw air in from the room in which they are housed by means of fans that accelerate the air and force it over the enclosure's internal components, thus cooling the components.
- the resulting heated air is exhausted back into the room.
- the room air itself is cooled by chillers or other means.
- the cold plate means are typically complex. For example, an individual spring-loaded cold plate is used for each component. Each cold plate, in turn, is connected with individual flexible pipes. Each cold plate includes, at least, a temperature-controlled valve, temperature sensors, and controllers.
- no existing solution comprises a conventional, modularly deployed system with a high thermal conductivity connectable to all components. Further, no such system also includes high heat dissipation on a conventional motherboard, including removable daughter and memory cards, to a common cold plate. Moreover, such a system should also be readily serviceable. Additionally, no solution proposes thermally connecting all such high heat dissipation devices to a common cooling plate by thermal elevation and co-planarization to a side of the enclosure. None of the existing systems further includes an easily serviceable system accessible through a removable lid as part of the heat removal system.
- FIGS. 1A and 1B are a cross-sectional drawing illustrating an exemplary embodiment of an enclosure with heat risers and thermal interfaces, and a schematic representation of the thermal interface construction, respectively;
- FIG. 2 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader made from a highly thermally-conductive material such as a block of metal;
- FIG. 3 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader using heat pipes mounted in, for example, metal plates;
- FIG. 4 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader made from a flat heat pipe;
- FIG. 5 is a bottom and side view of an exemplary embodiment of spring heat riser
- FIGS. 6A and 6B are a front and side view of an exemplary embodiment of a heat riser usable with a DIMM, and a schematic representation of an embodiment of a coupling mechanism;
- FIG. 7 is a cross-sectional drawing illustrating an exemplary embodiment of an enclosure with an auxiliary card and a motherboard
- FIGS. 8A , 8 B, 8 C, and 8 D are an isometric view of an exemplary embodiment of a planarization thermal interface bag, a cross sectional view of an embodiment of a thermal interface bag, a cross sectional view of an embodiment of a thermal interface bag including a joined third layer, and a cross sectional view of an embodiment of the thermal interface bag encapsulating a third layer, respectively;
- FIG. 9 illustrates an exemplary embodiment of a grooved interface between a between heat riser and a lid.
- FIG. 10 is a schematic representation of a grooved support interface between a cold plate and a thermal interface.
- the term “or” may be construed in an inclusive or exclusive sense.
- the term “exemplary” may be construed merely to mean an example of something or an exemplar and not necessarily a preferred means of accomplishing a goal.
- various exemplary embodiments discussed below focus on a thermal cooling system for electronic components, the embodiments are merely given for clarity in disclosure. Thus, any type of thermal cooling application is considered as being within a scope of the present invention.
- the cold plate comprises a lid of the enclosure.
- the lid contacts an external cold plate therein taking at least a portion of the function of the cold plate itself.
- the electronic components, subassemblies, or similar components are thermally elevated, planarized, and coupled, by means of heat risers and/or thermal interfaces, to a proximate cold plate.
- the enclosures may be the common electronic enclosures described above, other form-factor enclosures, or unenclosed systems such as server blades or bare server motherboards. Each of these components are known independently in the art.
- the contact-cooled enclosure described herein can, among other things, comprise an instantiation of the contact-cooled enclosure referred to in a previously filed patent application by Lipp and Hughes.
- the patent application describes a rack mounted cold plate system is found in U.S. Provisional Patent Application No. 61/008,136, entitled “A Cooling System for Contact Cooled Electronic Modules,” filed Dec. 19, 2007, and U.S. Pat. No. 8,000,103, having the same title, filed Dec. 19, 2008 (issued Aug. 16, 2011), both of which are incorporated herein by reference in their entirety.
- a system to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure comprises a cold plate to mount on the electronic enclosure and thermally conduct heat.
- the cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. At least one of the plurality of electronic components are thermally coupled by one or more heat risers and/or thermal interfaces to the first surface of the cold plate.
- a system to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure comprises a cold plate to provide heat removal.
- the cold plate is configured to be mounted external to the electronic enclosure.
- One or more heat risers is configured to be thermally coupled on a first end to at least one of the plurality of electronic components.
- a lid configured to be mounted on the electronic enclosure, has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components.
- the lid has a plurality of holes positioned to accommodate the one or more heat risers to poke through the lid.
- a layer of thermal interface material thermally couples a second end of the one or more heat risers to the cold plate.
- the thermal interface material may be affixed in the same plane as the lid and held in place with a series of clips placed around the periphery of the thermal interface, as shown in FIG. 8 .
- tape e.g. metalized tape
- Another function of the lid is to provide a barrier against electromagnetic interference (EMI).
- EMI electromagnetic interference
- a method for thermally coupling a plurality of heat generating components in an electronic enclosure to a cold plate comprises calculating a power dissipation of each of the plurality of heat generating components, determining an acceptable temperature rise between the cold plate and the plurality of heat generating components, and determining an acceptable thermal impedance to maintain the acceptable temperature rise.
- a surface area of the cold plate needed to conduct heat from each of the plurality of heat generating components is calculated.
- a type of heat riser selected for each of a plurality of heat risers is determined based on the thermal impedance where at least one of the plurality of heat risers is associated with each of the plurality of heat generating components.
- a thermal interface to provide cooling to a plurality of electronic components comprises a first layer of a first thermal interface material.
- the first thermal interface material has a first thermal conductivity.
- a second layer of a second compliant thermal interface material is joined to the first layer.
- the second compliant thermal interface material has a second thermal conductivity being lower the first thermal conductivity.
- the first thermal interface material is laminated to the second complaint thermal interface material, and the edges sealed to form a bag.
- a thermally conductive fluid is encapsulated within the bag, as shown in FIG. 8A .
- a system for thermally coupling one or more heat generating components in a 1 U enclosure to, for example, the removable lid of the enclosure is disclosed.
- the lid can be further coupled to an external cold plate for additional heat removal.
- the actual descriptions provided herein are limited to 1 U enclosures, a skilled artisan will recognize that similar systems, methods, and means may be applied to other styles of enclosures of various styles and dimensions.
- the heat may be coupled to a different side of the enclosure, other than the lid, such as the bottom. Coupling to a different side of the enclosure can be accomplished by rearranging various elements of the various embodiments described.
- one or more heat-generating components in an electronic enclosure are maintained at acceptable temperatures primarily through conduction cooling to a proximate cold plate.
- Heat is thermally coupled from the heat generating components to thermal interfaces, heat-risers or spreaders.
- the heat flux may be spread out over a larger area and further coupled through the enclosure lid to a cold plate for heat removal.
- heat and heat flux are the elements of interest, for purposes herein, power and power dissipation are sometimes used as a proxy for heat flux.
- a methodology to design a cooling mechanism for a given electronic component or components may start with calculating a design window.
- a physical implementation of the design can use information derived from the calculating steps.
- a design window can be calculated by identifying and quantifying (e.g., calculating) a power dissipation of all heat generating components that are not maintained at a sufficiently low temperature by natural convection and conduction cooling means.
- a maximum or acceptable temperature rise from the cold plate interface to the heat generating components is then determined.
- a maximum or acceptable allowable heat flux (or power) per unit area at the cold plate/enclosure interface is determined to maintain the maximum acceptable temperature rise.
- the heat flux per unit area is commonly referred to as the thermal impedance.
- a cold plate surface area required to conduct the heat to the cold plate is calculated for each the heat generating components. The cold plate surface area determines an overall thermal resistance between each of the components and the cold plate.
- thermal interfaces generally between each of the one or more components and the cold plate interface.
- thermal interfaces may be placed between one or more of the components and an adjacent component as well.
- the one or more thermal interfaces can be placed in various locations, such as between a component and a heat riser, between a heat riser and a cold plate, or between a component and a cold plate, between a heat riser and a lid, between a component and a lid or between a cold plate and a lid, as aforementioned.
- a type and size of each of the heat-risers or spreaders is determined based on the heat flux, spreading information, and distances between each of the one or more components and the cold plate.
- the heat-risers or spreaders are produced and installed.
- the heat-risers or spreaders are generally placed to be substantially coplanar with the cold plate or lid interface with thermal coupling between the heat-risers or spreaders and the cold plate or lid, achieved with the one or more thermal interfaces.
- the thermal coupling between lid and cold plate is achieved with a thermal interface.
- a conventional motherboard is deployed in a 1 U form factor electronic enclosure.
- the 1 U electronic enclosure is nominally 1.75 inches (approximately 4.45 cm) high by 19 inches (approximately 0.482 m) wide by 24 inches (approximately 0.610 m) deep with a removable top lid in one embodiment.
- the enclosure may contain one or more of a compute server, a storage device, a network switch, a power supply, other electronic devices, or any combination, singly or multiply, thereof.
- an exemplary cross-sectional view of an electronic enclosure 100 includes a lid 111 and has a motherboard 110 mounted therein.
- the electronic enclosure 100 and the lid 111 may each be fabricated from thermally conductive materials, independently known in the art.
- the motherboard no carries some or all of the VLSI components (e.g., integrated circuits in addition to discrete electronic components) and most, if not all, auxiliary circuits.
- the motherboard no is coupled to the electronic enclosure 100 via a plurality of standoffs 105 .
- the motherboard 110 acts as a heat sink for components attached thereon. Through convective and radiative heat transfer to the electronic enclosure 100 , the motherboard 110 has sufficient heat dissipation to provide generally sufficient heat removal for lower-powered circuits.
- Heat dissipation from the motherboard 110 may be further enhanced by one or more layers of thermal interface material 113 arranged between the motherboard no and one or more walls of the electronic enclosure 100 .
- the thermal interface 113 functions to bring the motherboard no into thermal contact with the cold plate (e.g. enclosure wall or any other suitable cooling component.).
- Heat risers 102 , 104 and 106 preferably conduct heat from higher-powered components to the cold plate (preferably through the lid).
- An exterior side of the lid 111 can be covered with a thin layer of a compliant thermal interface 103 to optimize contact with an external cold plate (not shown in FIG. 1A ) while the interior side can be covered in whole or in part with a second layer of compliant thermal interface material 101 to optimize thermal contact with the heat risers 102 , 104 and 106 .
- the compliant thermal interface 103 can comprise two layers laminated or otherwise joined together to form a sheet, as shown in FIG. 1B .
- the first layer 103 A functions to resist wear and tear
- the second layer 103 B functions to facilitate heat flux from the first layer 103 A to the cold plate.
- the two layers can be laminated together, joined at or near the edges, in a quilted pattern, or in various other fashions as will be recognizable to a skilled artisan. Alternately, one layer may be deposited onto the other by chemical deposition, vacuum deposition, or any other suitable deposition method.
- the layers can be substantially comprised of polyester and aluminum; the polyester layer being roughly about 0.5 thousandths of an inch (approximately 13 microns) in thickness and the aluminum, about 2 thousandths of an inch.
- the substantially polyester layer provides strength and toughness to the compliant thermal interface 103 but the thermal conductivity is still high due to the relative thinness of the polyester layer.
- the substantially polyester layer surface also provides good thermal coupling from an external cold plate (not shown) to itself (i.e., the compliant thermal interface 103 ).
- the aluminum layer is substantially hermetic, containing the thermally conductive fluid, and spreads the heat flux coupled to the polyester layer from/to the external heat source/cold plate, ensuring a more uniform heat flux to a proximate thermally conductive fluid and reducing the overall thermal impedance.
- the dual layer sheet can be formed into a dual layer bag 801 by joining opposing edges of the sheet, by joining the corners of the sheet, or by joining a second sheet of substantially similar or dissimilar construction (e.g. materials, geometry, number of layers, etc.) to the first sheet.
- a dual-layer bag 801 could be formed and be further reinforced with a third layer 805 for strength or structure, such as a porous fiberglass though which a thermally conductive fluid 802 could flow, thus providing additional strength while maintaining good thermal conductivity.
- the third layer 805 may also be heat-conductive, such that it facilitates heat transfer within the thermal interface.
- the third layer 805 may be a thermally conductive plate, coupled to the thermally conductive fluid 805 , that facilitates heat spreading throughout the bag 801 (e.g. through the thermally conductive fluid 802 ).
- the conductive plate is preferably metallic or prismatic, (e.g. graphite), and is preferably slightly flexible, with a thickness of approximately 0.02 inches (0.5 mm). However, the conductive plate may comprise other materials, properties, and thicknesses.
- the conductive plate may additionally be porous or include through holes to allow thermally conductive fluid flow.
- the third layer 805 may be laminated along the edges to the bag 801 , with a first 802 and a second 802 A thermally conductive fluid encapsulated against each main face (shown in FIG. 8C ).
- thermally conductive fluid 802 and 802 A are encapsulated against the first and second main faces by a first and second dual-layer sheet, respectively, wherein the first and second main faces are joined along the edges to the edges of the third layer.
- the third layer 805 may be merely enclosed within the bag 801 , such that the thermally conductive fluid 802 has unrestricted flow over every face (shown in FIG. 8D ), or may be entirely laminated to the bag interior.
- Thermal interface 101 can also be similarly constructed.
- an electrically conductive path 806 which can be a wire or a metal ribbon, may be attached to conductive layer 804 and auxiliary layer 805 .
- an electrical connection is made to the lid. Clips or metal tape may be used to install the thermal interface, providing additional shielding by bridging the gap between lid and thermal interface.
- High-density integrated circuit devices such as a CPU 108 , a graphics chip 109 , a memory 106 , a power supply transistor 114 , and inductors (not shown) require heat risers to provide a low thermal impedance path to a common plane as defined by, for example, the lid 111 .
- the heat risers conduct heat to the lid 111 from a component that is, for example, from 0.9 inches (approximately 2.3 cm) to 1.3 inches (approximately 3.3 cm) below the lid 111 .
- each of a plurality of heat risers 102 , 104 , 112 have an overall length of from about 0.9 inches (approximately 2.3 cm) to 1.3 inches (approximately 3.3 cm). Tops of the plurality of heat risers 102 , 104 , 112 are effectively planarized through the use of a plurality of riser thermal interfaces 101 so that at least one of the plurality of heat risers 102 , 104 , 112 conforms to the lid 111 . Minimizing thermal impedances from a high power dissipation device to the external cold plate (not shown) can be accomplished by spreading the heat flux over a larger area.
- one of the plurality of heat risers 102 which is also a heat spreader, is designed to spread the heat flux over an area about ten times greater at its top thermal contact with one of the plurality of riser thermal interfaces 101 to the lid 111 than at a bottom thermal contact 107 to the CPU 108 .
- the ten times greater area thereby reduces the heat flux and thermal gradient across one of the plurality of riser thermal interfaces 101 , the lid 111 , and the compliant thermal interface 103 by a factor of about ten.
- the reduction in heat flux due to the greater area is more fully described under VLSI cooling below.
- a heat riser may be used to carry the heat away from more than one component.
- one of the plurality of heat risers 102 is also in thermal contact with the power supply transistor 114 , transporting heat generated therein, along with heat from the CPU 108 to the lid 111 .
- Thermal paths for high dissipation, high heat flux integrated circuit devices are provided by combination heat-risers/spreaders.
- Such heat-risers/spreaders have top surfaces from about two to twenty times larger than their bottom surfaces.
- one of the plurality of heat risers 102 that also has heat spreading characteristics is examined in further detail.
- at least one of the plurality of heat risers 102 is constructed from a highly thermally conductive material, such as a metal block.
- the metal block is fabricated from aluminum.
- the heat riser 102 is 3 inches (approximately 70.6 cm) wide by 6 inches (approximately 15.2 cm) long by 1 inch (approximately 2.5 cm) high.
- a pad area 202 is configured to mount to the CPU 108 .
- the heat riser 102 receives heat from a high heat flux area of the pad area 202 and spreads the heat flux (illustrated by a plurality of dashed arrows 204 ) over a larger area 203 to reduce the heat flux.
- a surface area of the larger area 203 is about 10 times larger than a surface area of the pad area 202 , thus reducing heat flux proportionately (i.e., by a factor of ten). Reducing the heat flux allows use of thermal interfaces with lower thermal conductivity, while still maintaining a thermal resistance from the electronic component through the lid 111 (or another side of the electronic enclosure 100 ) of less than about 0.25° C./Watt.
- the heat riser 102 is installed in contact with the VLSI component, such as the CPU 108 , using the same fixtures as are normally used to hold down a conventional heat sink.
- two screws 205 secure the heat riser 102 to the VLSI component.
- the heat riser 102 can be constructed using a simple block of a conducting material such as aluminum or graphite. Each of these, and related materials, may be machined or cast into more complex shapes to optimize performance per unit weight, to fit into limited areas, or to contact multiple heat generating components. Alternately, the heat riser 102 may be fabricated from more complex constructs using, for example, heat pipes.
- the plurality of heat pipes 301 are preferably tubular and may have a cross section that is round, square, or other shapes, and can be fabricated from highly thermally conductive material such as, for example, copper. They typically contain a small amount of fluid, generally water under a partial vacuum.
- the plurality of heat pipes 301 are thermally coupled with two or more parallel plates (only two plates are shown for clarity) including a small plate 302 and a large plate 303 .
- the small plate 302 and the large plate 303 can be fabricated from any highly thermally conductive material, such as copper.
- the small plate 302 is intended for placement on top of the device to be cooled, such as the CPU 108 , and the large plate 303 can be placed against the lid 111 of the electronic enclosure 100 (see FIG. 1 ).
- the plurality of heat pipes 301 is arranged so that their center sections are in good thermal contact with the small plate 302 and each of the ends of the plurality of heat pipes 301 are arranged in good thermal contact with the large plate 303 .
- thermal contact with both the small plate 302 and the large plate 303 is augmented by placing each of the plurality of heat pipes in grooves (not shown explicitly but understandable to a skilled artisan) milled into the small plate 302 and the large plate 303 .
- the grooves are roughly equal in diameter to each of the plurality of heat pipes 301 .
- each of the plurality of heat pipes 301 is affixed by soldering.
- the heat riser 102 a preferably has a thermal resistance of less than about 0.03° C./Watt, but may have a thermal resistance of less than about 0.07° C./Watt.
- a total number of the plurality of heat pipes 301 and dimensions of the small plate 302 and the large plate 303 can be adapted to fit various applications.
- the larger the large plate 303 in relation to the small plate 302 the greater the reduction in heat flux across the large plate 303 .
- the small plate 302 has dimensions of about 2 inches by 2 inches (approximately 5.1 cm square) and the large plate has dimensions of about 6 inches by 3 inches (approximately 15.2 cm by 7.6 cm).
- the device to be cooled such as the CPU 108 (see FIG. 1 ) has a top surface of about 1.3 inches by 1.3 inches (approximately 3.3 cm square)
- the generated heat flux is effectively spread over an area about ten times greater at the large plate 303 as compared to the small plate 302 .
- the plurality of heat pipes 301 could be replaced by a single wide flat heat pipe (not shown, but understandable to a skilled artisan). Taking it a step further as illustrated in an exemplary embodiment of FIG. 4 , the small 302 and the large 303 plates of FIG. 3 can be eliminated and substituted by a flat, wide heat pipe 401 .
- the flat, wide heat pipe 401 may be used as a heat-riser/spreader all by itself.
- the flat, wide heat pipe 401 is fabricated from a highly thermally conductive material such as metal (e.g., copper).
- the flat, wide heat pipe 401 is 3 inches (approximately 7.6 cm) wide and placed so that its center portion lies directly on top of the device to be cooled, such as the CPU 108 , and a large portion of the ends of the flat, wide heat pipe is in contact with the lid 111 of the electronic enclosure 100 (see FIG. 1 ).
- thermal performance is slightly better with the flat, wide heat pipe 401 and a lack of coplanarity between the component (e.g., the CPU 108 ) and the lid 111 can be compensated for by the flexibility of the heat pipe.
- the flat, wide heat pipe 401 can be used in conjunction with the plurality of heat pipes 301 of FIG. 3 .
- the block 203 shown in FIG. 2 may also be hollow and partially filled with a fluid, such as water, and may be partially evacuated.
- a fluid such as water
- the hot component 202 causes the fluid to boil and subsequently condense on the opposite surface where it is in contact with lid 111 .
- each of the risers also spreads the heat over a larger area.
- simpler risers can sufficiently be effective for cooling the components.
- a simple block heat riser having dimensions of 1 inch by 1 inch by 1 inch (approximately 2.5 cm on a side) can be fabricated from aluminum. Since any face in contact with a component has an opposing face, to be thermally coupled to the lid 111 , has as identical surface area, no heat spreading occurs.
- an exemplary embodiment of one type of effective heat riser is a spring riser 500 as illustrated.
- the spring riser 500 is similar to one of the plurality of heat risers 104 of FIG. 1 and the flat, wide heat pipe 401 of FIG. 4 .
- the spring riser 500 can be constructed out of a highly thermally conductive flexible material such as, for example, copper.
- the spring riser benefits from being fabricated from an at least slightly resilient material, such as hard (e.g. cold rolled) copper, to provide a spring-like characteristic to the spring riser 500 .
- the spring riser 500 can be a round or elliptical spring having a width 506 of about 1 inch (approximately 2.5 cm) wide and a thickness 505 of about 5 mils (0.005 inches or approximately 127 microns).
- a width 506 of about 1 inch (approximately 2.5 cm) wide and a thickness 505 of about 5 mils (0.005 inches or approximately 127 microns).
- various shapes other than round can readily be employed as well as other dimensions.
- the spring riser 500 removes heat from a component, such as the graphics chip 109 of FIG. 1 , by a combination of conduction to the lid 111 , and natural convective and radiative heat transfer to a local environment of the component.
- the spring riser 500 can be affixed to the component by gluing or other means, and has at least one of a plurality of riser thermal interfaces 101 thermally coupling the spring riser 500 to the lid in.
- the spring-like nature of the spring riser 500 assures a good mechanical and thermal contact to the lid 111 , while automatically compensating for variations in height and coplanarity.
- the spring riser 500 is light in weight and low in cost. Thermal resistance for an exemplary embodiment of the spring riser 500 described above ranges from about 0.5.degree. C./Watt to 2.degree. C./Watt.
- a DIMM 606 is encased with one or more thermally conductive strips 612 on its sides that act as heat risers.
- the one or more thermally conductive strips 612 make thermal contact to memory components 613 within the DIMM 606 at a thermal interface 607 .
- the thermal interface 607 is preferably a dual-layer thermal interface as described above, but alternately can be a thermally conductive grease known independently in the art.
- the thermal interface 607 can be a thermal-grease-based thermal interface.
- the one or more thermally conductive strips 612 provide a low thermal impedance path from the DIMM 606 to an uppermost portion 614 of the one or more thermally conductive strips 612 .
- a 1 mm thick aluminum block is used for the one or more thermally conductive strips 612 .
- the one or more thermally conductive strips 612 can be held in place by, for example, a plurality of spring clips 611 , such that the thermal interface is sandwiched between the thermally conductive strip 612 and the electronic component.
- the spring clips 611 each preferably comprise two tines joined by a spring element, wherein spring element applies a restorative reaction force to the tines when the tines are displaced from a resting position.
- each tine is preferably curved away from the end of the opposing tine.
- the clips preferably apply a substantially normal, compressive force to the coupling surfaces, and are preferably stamped, machined, or otherwise formed as a single piece from a metallic sheet or block. However, other manufacturing methods may be used.
- the plurality of spring clips 611 is preferably coupled together on a rail.
- the one or more thermally conductive strips 612 can be glued to components of the memory components 613 without requiring the plurality of spring clips 611 .
- the glue thus provides both a mechanical and thermal attachment.
- the uppermost portion 614 of the one or more thermally conductive strips 612 is substantially orthogonal to the sides and made as wide as a pitch of the DIMM 606 allows (e.g., 0.4 inches or approximately 10 mm), thus minimizing the thermal resistance of the DIMM 606 to an interface of the lid 111 of the electronic enclosure 100 (see FIG. 1 ).
- a typical thermal resistance of the interface between the DIMM 606 and the lid 111 is 1.6.degree. C./Watt with 0.2 mm thick thermal interface.
- a worst case thermal resistance is 2.degree. C./Watt for the exemplary embodiment shown, resulting in a temperature rise of approximately 20.degree. C. for a 10 Watt DIMM.
- Thermally conductive strips 612 on opposite sides of the DIMM module can be overlapped at the top of the module and thermally coupled by a thermal interface such as thermal grease of a thermal pad.
- the top strip 614 then extends across the entire DIMM top surface (or more) providing a larger planarized surface to the cold plate interface for a lowered thermal resistance.
- a flexible circuit populated with DIMMs may be wrapped around a thermally conductive metal strip to improve thermal performance.
- the DIMM substrate may additionally be formed into a “T” shape to improve heat transfer to ambient air (e.g. air-cooling).
- the substrate is more preferably formed as a wide “T” shape and coupled to a cold plate through a thermal interface to conduct heat to the cold plate.
- the substrate may be formed as an “L” shape or any other suitable form.
- the one or more thermally conductive strips 612 are shown on both sides of the memory subassembly, in many cases components are mounted on one only side. Thus, in such an application only the single mounted side requires only one of the one or more thermally conductive strips 612 .
- a voltage regulator module converts an internal 12 V power supply to voltages required by the individual components, such as the CPU 108 and the memory 106 (see FIG. 1 ).
- the VRM often supplies over 100 amps of current at just over 1 VDC and dissipates up to 30 Watts. In contemporaneous designs, the power is commonly dissipated among six transistors and inductors.
- a piece of metal such as 4 inch long by 1 ⁇ 8 inch thick (approximately 10 cm long by 3.2 mm thick) aluminum strip (not shown) is placed over the transistors and inductors with a thin thermal interface coating there-between.
- the piece of metal can, in turn, be coupled to the lid 111 of FIG. 1 by one of the plurality of heat risers 102 as shown for the power supply transistor 114 , or a solid metal, such as the heat riser iota of FIG. 3 , or one of the spring risers, such as flat, wide heat pipe 401 or the spring riser 500 , of FIGS. 4 and 5 respectively, can be employed to thermally rise and couple the aluminum strip to the lid 111 .
- an input power converter converts input power to a lower intermediate voltage, nominally 12 VDC. Power is delivered to a motherboard through one or more electrical connectors. Input power converter subassemblies are mounted (not shown), typically by screws, directly to the lid 111 of the electronic enclosure 100 . A layer of thermal interface material between the cover and the device ensures good thermal contact.
- disk drives (not shown) consume about 10 Watts so adequate cooling is typically achieved by conductive and natural convective heat transfer within an enclosure. Cooling of the disk drives can be enhanced by inserting, for example, a thermal interface 113 such as was done for the motherboard no of FIG. 1 between the disk drive and the electronic enclosure 100 .
- auxiliary circuit board subassemblies generally have low dissipation (e.g., below 30 Watts) and just a few integrated circuit components.
- an auxiliary circuit board 701 is commonly inserted into the motherboard no so that the auxiliary circuit board 701 is coplanar with and slightly above the motherboard 110 as illustrated.
- Components mounted to the auxiliary circuit board 701 can be cooled via an aluminum block or a spring riser 704 glued, coupled, or otherwise adhered on top of the components and coupled to the lid 111 of the electronic enclosure 100 in a fashion similar to that described for other devices, above.
- a plurality of auxiliary circuit boards can be placed in an area previously occupied by fans and associated control mechanisms normally used for forced-air convective cooling.
- the plurality of auxiliary circuit boards can be connected to the motherboard with high speed interfaces such as HyperTransport®, PCI Express®, or any other similar widely accepted protocol. Mounting the plurality of auxiliary circuit boards in an area previously occupied by fans and associated control mechanisms enables a 1 U enclosure to offer the same functionality as a 2 U, 3 U, or 4 U enclosure.
- auxiliary circuit board subassemblies may obstruct a direct thermal path between the motherboard no component and the lid 111 .
- heat generated by the component is directed around the obstruction.
- a component such as the graphics chip 109
- the auxiliary circuit board 701 (plugged into a socket 702 ) lies directly above the graphics chip 109 .
- an exemplary half spring riser 703 has one end in thermal contact with the graphics chip 109 , wraps around the auxiliary circuit board 701 , and thermally contacts at least one of the plurality of riser thermal interfaces 101 under the lid 111 .
- the half spring riser 703 can be a simple strip of copper as described above for one of the spring risers, such as the spring riser 500 of FIG. 5 . If a lower thermal resistance is required, the half spring riser 703 can be constructed much like the flat, wide heat pipe 401 described with reference to FIG. 4 .
- the half spring riser 703 can be fabricated from a heavier gauge thermally-conductive material or even a block of metal cut in such a fashion as to extend out from under the obstruction and rise to the lid 111 .
- a thermal interface (not shown) may be inserted under the obstructed component in order to conduct heat to the enclosure bottom as referred to above.
- a planarization step can be included further enhancing thermal coupling to the lid 111 with a low thermal resistance.
- Assembly of the motherboard 110 may result in the top portions of the components not being coplanar either with one another or an uppermost portion of heat risers attached thereto not being coplanar with the lower portion of the underside of the lid 111 . Consequently, the upper portions of the attached heat risers may not be at an exact distance below the lid 111 .
- an integrated circuit may have dimensions of 33 mm.times.33 mm with an installed height variance of roughly 0.2 mm, and a surface coplanarity variance of about 0.3 mm between either of the two sets of parallel faces.
- a top face or surface of, for example, the larger area 203 of one of the plurality of heat risers 102 (see FIG. 2 ) multiplies an effect of the variation simply due to the increased surface area.
- both the motherboard 110 and the electronic enclosure 100 are flexible and can sag away from their respective support structures.
- coplanarity variance can be up to roughly 1.4 mm or more.
- any of the various spring risers described herein are flexible, and will therefore adjust to variations in height and planarity automatically, the tops of larger risers/spreaders (e.g., one of the plurality of heat risers 102 ) can benefit from planarization and a resulting height adjustment thus assuring good, low-thermal resistance coupling to the lid 111 .
- Ordinary rubber-like thermal interface sheet materials of the prior art do not have sufficient compliance to overcome large coplanarity differences.
- a compliant thermally conductive substance such as a thermal grease, known independently in the art, can improve conductive heat transfer between contacting surfaces.
- a self-leveling thermally conductive potting compound may be poured in a mask over the riser and allowed to set.
- a thermal grease or thermally conducting potting compound may be encapsulated in a bag and laid over one or a plurality of risers, functioning as at least one of the plurality of riser thermal interfaces 101 , 103 . The bag of this exemplary embodiment is described in detail with reference to FIG. 8 , below.
- Self-leveling thermally conductive potting compounds are known independently in the art, as are ceramic or metal based thermal greases.
- an uppermost top portion of the heat riser 102 is covered with a moderately high conductivity (e.g., 3 Watts/m-.degree.K) potting compound prior to replacing the lid 111 on the electronic enclosure 100 .
- the potting compound is cured in place between the heat riser 102 and the lid 111 .
- the cured potting compound then functions as at least one of the plurality of riser thermal interfaces 101 described above with a thermal impedance of less than about 0.1.degree. C./Watt/in.sup.2 (approximately 0.016.degree. C./W/cm.sup.2).
- a thermal interface such as a thermal grease or an elastomeric pad (known separately and independently in the art), may be inserted between the contacting surfaces.
- the riser may be physically clamped to the lid by a screw or clamping fixture, or otherwise adhered (e.g., by an epoxy or chemical bonding agent), using a generally inherent flexibility of the motherboard 110 and the lid 111 to compensate for non-coplanarity and height variations.
- the flexibility of the motherboard 110 can compensate for some or all the height and coplanarity issues.
- the lid 111 is pressed down on the heat riser 102 (e.g. by clamps or any suitable coupling mechanism). Thermal resistance is minimized by flattening the lid 111 against the heat riser 102 and minimizing a thickness of one or more of the plurality of riser thermal interfaces 101 . Screwing or locking sliders (not shown but readily understood by a skilled artisan) are one form of attachment but other attachment methods will work.
- the pressing down process can benefit from a semi flexible enclosure lid capable of bending with the rest of the enclosure when force is applied thereto.
- the lid is pressed into contact with heat riser 102 and the motherboard 110 is flexed to compensate for any mechanical height differences due to, for example, dimensional tolerances of the various components such as the enclosure, motherboard, heat riser, etc.).
- any of the risers or spreaders are patterned (not shown but readily understandable to a skilled artisan) on an uppermost portion (i.e., that portion configured to contact the lid 111 ).
- a portion of the lid 111 corresponding to a contact point of the patterned riser or spreader, is similarly patterned to engage with the riser or spreader pattern.
- the patterned surface increases an overall surface area of the contacting surfaces, thus increasing the thermal contact area. Patterning of opposing surfaces brought into contact with one another is discussed in more detail with reference to FIG. 9 , below.
- a compliant thermally-conducting foam (not shown) can function as at least one of the plurality of riser thermal interfaces 101 .
- the compliant thermally conducting foam is compressed by the lid 111 providing coplanarity between the heat riser 102 and the lid 111 .
- the compliant thermally conducting foam is useful in situations where planarity divergence is small or relatively high pressures can be applied to press down the lid 111 .
- a flexible vapor chamber (not shown) fabricated from a resilient and thermally conductive material can be clamped to the riser or device to be cooled. A pressure-cooker-effect is then utilized to expand a top of the vapor chamber top into planarity with the lid 111 , thus providing enhanced conductive heat transfer.
- a skilled artisan will recognize that any or all of the methods and means described above can be combined for various applications.
- a bag 801 is filled with a thermally conductive fluid 802 (note that the thermally conductive fluid 802 is contained within the bag 801 ).
- the fluid can be, for example, a thermal grease.
- thermal grease Various types of thermal grease are known independently in the art.
- the bag 801 can be fabricated to be slightly larger than a top surface of the riser, for example, from about 5% to 20% larger on a side. For example, for the 3 inch by 6 inch (approximately 70.6 cm by 15.2 cm) dimension of the larger area 203 of the heat riser 102 (see FIG.
- the bag can be 3.3 inches by 6.6 inches (approximately 8.4 cm by 16.8 cm).
- the bag 801 can be sized large enough to allow an excess amount of the thermally conductive fluid 802 a place to escape when the fit is tight, but not so large that much of the thermally conductive fluid 802 will flow away beyond one or more edges of the heat riser 102 or cold plate, thus leaving a void above the heat riser 102 or cold plate.
- the bag 801 can also be sized such that coupling the bag 801 to a heat riser 102 or cold plate causes the coupling surfaces of the bag 801 to distend as thermally conductive fluid 801 is forced away from the coupling site.
- An amount of the thermally conductive fluid 802 used in the bag 801 is dependent upon a worst-case coplanarity variation, as described above.
- the bag 801 could also be large enough to cover a multiplicity of components, simply covering over many or all of the components.
- the bag 801 can act as the lid 111 of the electronic enclosure 100 .
- the bag 801 can be fabricated using a dual-layer polyester and aluminum construction. This embodiment is described with reference to the specific exemplary embodiment of constructing the compliant thermal interface 103 discussed above.
- the dual-layers can be filled with various types of fluid such as the thermally conductive fluid 802 .
- one of the layers of the bag can be the lid 111 of the electronic enclosure 100 .
- the second of the dual-layers is coupled to the lid 111 so as to form a cavity between the lid 111 and the second of the dual-layers.
- the second of the dual-layers can be comprised substantially of either, for example, aluminum or polyester.
- the bag 801 can be in contact with one surface of the entire lid 111 or, alternatively, in contact with only certain portions. Of course, multiple instantiations of the bag 801 can be in contact with different areas of the lid 111 as well.
- either of the dual-layers can be comprised of any other material that is generally non-reactive when in contact with the thermally conductive fluid 802 or thermal greases and has a relatively good thermal conductivity. Additionally, the materials for the dual-layers should be relatively impervious to leaks when used to encapsulate various types of fluid such as the thermally conductive fluid 802 . In other exemplary embodiments where the bag 801 comes into contact with the lid 111 , there should be a good thermal contact between the bag 801 and the lid 111 .
- the bag 801 can be fabricated using a dual-layer polyester and aluminum construction on one side with the other side comprising the lid 111 of the electronic enclosure 100 (see FIG. 1A ).
- the dual-layer polyester and aluminum construction side is affixed to the lid 111 by gluing or other means. This embodiment is described with reference to the specific exemplary embodiment of constructing the compliant thermal interface 103 discussed above.
- the space between the dual-layers and the lid 111 can be filled with various types of fluid as the thermally conductive fluid 802 .
- the bag 801 with the auxiliary spreader 805 can be located in a hole in the lid cut to the dimensions of the bag and secured with clips or metallic tape so that it is coplanar with the lid.
- FIG. 6B shows an exemplary implementation.
- the clip 601 is fabricated from a thin, springy material such as steel or beryllium copper. Typical thickness is approximately 0.005 inches.
- the clip 611 may be a continuous spring that spans the whole length of a single side of the bag 801 , or may be deployed in small sections with multiple instances along each side of the bag.
- the clips are attached to the bag 801 by sliding the jaw 602 over the edge of the bag.
- the bag is preferably inserted from the top into an appropriately sized hole in the lid.
- the edge 603 preferably gives during insertion and springs back to hold the bag in place.
- the clips can also form a capacitive coupling to the lid for EMI suppression, and can be augmented by a direct electrical connection to the auxiliary spreader and conduction layers of the bag. Removal of a small amount of the protective layer under one or more clips may also provide an adequate connection.
- the auxiliary layer can similarly be connected to the conductive layer by a small leaf spring.
- the thermally conductive fluid 802 can either be a setting or non-setting compound depending upon a specific application. For example, if components within the electronic enclosure 100 are changed over the life of the equipment, a non-setting compound is adaptable to the new dimensions of one or more new components. However, a setting compound is less likely to leak or otherwise fail than a non-setting compound. Thus, the setting compound can be better suited for applications that are not modified.
- the enclosure may be mounted on edge, (e.g. with the bag 801 positioned vertically).
- a thixotropic grease in a tightly contained bag 801 is preferred in order to ensure that the grease does not puddle at the bottom of the bag to the detriment of its thermal conductivity.
- the bag 801 is utilized to achieve the pressure-cooker effect, describe above.
- This specific exemplary embodiment is similar to the aforementioned technique of encapsulating thermal grease or thermally conducting potting compound in a bag.
- the bag 801 is fabricated from a flexible and thermally conductive material.
- the bag 801 is evacuated, except for a small amount of volatile fluid 802 that boils just above the cold plate operating temperature.
- the bag 801 acting as a vapor chamber, is affixed to the heat riser 102 . When the bag 801 cools, it is compressed flat by the lack of vapor-counteracting air pressure.
- the bag 801 warms up until the fluid 802 boils, expanding the bag 801 and forcing it tightly against the lid 111 .
- the fluid 802 at the top of the bag 801 that is in thermal contact with the lid 111 cools and condenses, thus releasing heat into the lid 111 . In this manner, heat is transferred from the heat riser 102 to the lid 111 .
- an exemplary embodiment of a grooved interface between the heat riser 102 and the lid 111 exemplifies one of the techniques described above to compensate for a lack of coplanarity.
- the heat riser 102 is patterned with a plurality of grooves 901 .
- the plurality of grooves 901 engages a plurality of corresponding grooves 902 formed into a lower portion of the lid 111 .
- each of the plurality of grooves 901 and the plurality of corresponding grooves 902 are formed to a depth of 3 mm with a groove pitch 903 of 1 mm, along the z-axis (the z-axis being defined as being orthogonal to the drawing), such that a width of each “tooth” is slightly less than one half the groove pitch 903 .
- This ratio assures some skew tolerance in the x-axis as well as the y- and z-axes.
- the width of the teeth can vary between the plurality of grooves 901 and the plurality of corresponding grooves 902 or even from tooth-to-tooth.
- the two components properly mate such that a surface area, and a resulting convective heat transfer, increases.
- the lid 111 is replaced, the two sets of grooves mesh and, because of the skew tolerance, compensation is made between a lack of coplanarity between the heat riser 102 and the lid 111 .
- the grooved surfaces thus assure a larger interface area for a lower thermal resistance between the heat riser 102 and the lid 111 .
- the grooved surfaces may be manufactured as part of the heat riser 102 and the lid 111 , or they may be separate pieces of thermally conductive material applied to either or both surfaces.
- thermal grease is applied between the surfaces to effect a low thermal resistance or one or both surfaces can include a compliant and thermally conductive thermal interface.
- one skilled in the art will realize other depths, pitches, and interlocking patterns other than grooves, (e.g., a checkerboard pattern), may also be used in different applications.
- the thermal interface directly couples to the cold plate.
- the thermal interface comprises the embodiment with a substantially rigid third layer 805 , such that it is self-supporting.
- the cold plate 1001 includes an attached groove for mounting the thermal interface.
- the thermal interface may be slid into place adjacent to the cold plate along said grooves that guide and retain the thermal interface 1002 along a broad surface.
- the thermal interface 1002 may be attached to the cold plate 1001 by adhesive (e.g. metal tape) or by the spring clips described above.
- heat risers are used as a thermal path between one or more of the various components to be cooled and an enclosure lid.
- to properly couple heat from the top of the heat riser to the cold plate through the lid utilizes, for example, at least two of the plurality of riser thermal interfaces 101 or the compliant thermal interface 103 as shown in FIG. 1A .
- the two layers of thermal interface may add too much thermal resistance. In such a case, the lid may be modified or eliminated.
- holes are cut through the lid to match sizes of one or more of the heat-risers or spreaders.
- the heat-risers/spreaders are made slightly taller than described in other embodiments, above, so the heat-riser/spreaders poke through the lid and are level with an outside portion of the top of the lid.
- a thermal interface is then added to the top of the riser that is then directly coupled to an external cold plate through the thermal interface.
- a spring clip as described above, preferably couples the thermal interface to the lid to retain the thermal interface position as well as to ground the thermal interface. However, the thermal interface may also be adhered to the lid with metal tape to achieve the same effects.
- the bag 801 of FIG. 8 above is designed to fit over the top of all the heat riser components, thereby replacing and eliminating the lid.
- the bag 801 can be metalized and electrically coupled to the enclosure to provide for electrical isolation. This technique is also applicable to blade servers.
- the lid itself, or a portion thereof may be constructed as a flat heat pipe or vapor chamber using techniques described above.
- inventive subject matter may be referred to herein, individually or collectively, by the term “invention” merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is, in fact, disclosed.
- inventive concept merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is, in fact, disclosed.
- inventive subject matter is intended to cover any and all adaptations or variations of the various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description.
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Abstract
Description
- This application claims priority benefit of U.S. Ser. No. 12/535,272 filed on 4 Aug. 2009, which claims priority to U.S. Ser. No. 61/085,931 filed on 4 Aug. 2008, which are both hereby incorporated in their entirety by reference.
- The present application relates generally to the cooling of compute and storage systems; and, in a specific exemplary embodiment, to a system and method for cooling electronic equipment in modularly deployed systems cooled by attachment to a cold plate.
- In a variety of contemporaneous applications, various types of fluid-based cooling systems cool computers and other electronic equipment. In the simplest case, fluid moves heat from a hard-to-cool location to a different area. For example, a liquid circulation system consisting of a heat absorber, a pump and a heat dissipater could be employed to remove heat from hot electronic components to finned sides of a computer case where convective cooling with ambient air removes the heat without the use of forced air.
- Enterprise-based compute and storage systems are increasingly deployed as modular systems with standardized form factor electronic enclosure modules mounted in standardized support structures. The standardized electronic enclosure modules can be devoted to perform any of a number of different functions such as computing, storage, or networking. The enclosure modules are commonly mounted in standardized support structures such as 19 inch (approximately 0.482 m) or 24 inch (approximately 0.610 m) wide racks. Such enclosures are commonly industry standard 1 U (1.75 inch; approximately 4.45 cm), 2 U (3.5 inch; approximately 8.89 cm), 3 U (5.25 inch; approximately 13.3 cm), or 4 U (7 inch; approximately 17.8 cm) high. Often, the reasons for the adoption of the larger 2 U, 3 U, or 4 U modules are to increase reliability of electronic components through improved airflow for cooling and to provide space for more adapter cards.
- Modular enclosures are frequently air-cooled. The enclosures draw air in from the room in which they are housed by means of fans that accelerate the air and force it over the enclosure's internal components, thus cooling the components. The resulting heated air is exhausted back into the room. The room air itself is cooled by chillers or other means.
- Other cooling methods have focused on fluid cooled systems using a cold plate means. The cold plate means are typically complex. For example, an individual spring-loaded cold plate is used for each component. Each cold plate, in turn, is connected with individual flexible pipes. Each cold plate includes, at least, a temperature-controlled valve, temperature sensors, and controllers.
- Other cooling methods have employed a compressible thermally-conductive-material heat sink assembly. To be compressible, the heat sink assembly must conform to components to be cooled. However, all conformable materials have a relatively low thermal conductivity as compared to pure metals or heat pipes. Thus, the conformable heat sink assemblies have a relatively high thermal resistance. Consequently, very little heat spreading is provided such that each thermal interface must have a very low thermal resistance for the assembly to be effective. Further, the assembly is not extensible to vertical daughter cards on a motherboard such as, for example, dual in-line memory modules (DIMMs) used in computer and other memory systems.
- Importantly, no existing solution comprises a conventional, modularly deployed system with a high thermal conductivity connectable to all components. Further, no such system also includes high heat dissipation on a conventional motherboard, including removable daughter and memory cards, to a common cold plate. Moreover, such a system should also be readily serviceable. Additionally, no solution proposes thermally connecting all such high heat dissipation devices to a common cooling plate by thermal elevation and co-planarization to a side of the enclosure. None of the existing systems further includes an easily serviceable system accessible through a removable lid as part of the heat removal system.
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FIGS. 1A and 1B are a cross-sectional drawing illustrating an exemplary embodiment of an enclosure with heat risers and thermal interfaces, and a schematic representation of the thermal interface construction, respectively; -
FIG. 2 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader made from a highly thermally-conductive material such as a block of metal; -
FIG. 3 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader using heat pipes mounted in, for example, metal plates; -
FIG. 4 is a bottom and side view of an exemplary embodiment of a heat-riser/spreader made from a flat heat pipe; -
FIG. 5 is a bottom and side view of an exemplary embodiment of spring heat riser; -
FIGS. 6A and 6B are a front and side view of an exemplary embodiment of a heat riser usable with a DIMM, and a schematic representation of an embodiment of a coupling mechanism; -
FIG. 7 is a cross-sectional drawing illustrating an exemplary embodiment of an enclosure with an auxiliary card and a motherboard; -
FIGS. 8A , 8B, 8C, and 8D are an isometric view of an exemplary embodiment of a planarization thermal interface bag, a cross sectional view of an embodiment of a thermal interface bag, a cross sectional view of an embodiment of a thermal interface bag including a joined third layer, and a cross sectional view of an embodiment of the thermal interface bag encapsulating a third layer, respectively; and -
FIG. 9 illustrates an exemplary embodiment of a grooved interface between a between heat riser and a lid. -
FIG. 10 is a schematic representation of a grooved support interface between a cold plate and a thermal interface. - The description that follows includes illustrative systems, methods, and techniques that cover various exemplary embodiments defined by various aspects of the present disclosure. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide an understanding of various embodiments of the inventive subject matter. It will be evident, however, to those skilled in the art that embodiments of the inventive subject matter may be practiced without these specific details. Further, well-known instruction instances, protocols, structures, and techniques have not been shown in detail.
- As used herein, the term “or” may be construed in an inclusive or exclusive sense. Similarly, the term “exemplary” may be construed merely to mean an example of something or an exemplar and not necessarily a preferred means of accomplishing a goal. Additionally, although various exemplary embodiments discussed below focus on a thermal cooling system for electronic components, the embodiments are merely given for clarity in disclosure. Thus, any type of thermal cooling application is considered as being within a scope of the present invention.
- Disclosed herein is a comprehensive system for adapting conventional electronic enclosures, components, motherboards, subassemblies, and similar components to conductive cooling systems. Also described herein are methods and structures to calculate and thermally couple electronic components or subassemblies housed in the conventional electronic enclosures though a side of the enclosure to a proximate cold plate. In a specific exemplary embodiment, the cold plate comprises a lid of the enclosure. In another specific exemplary embodiment, the lid contacts an external cold plate therein taking at least a portion of the function of the cold plate itself.
- The electronic components, subassemblies, or similar components are thermally elevated, planarized, and coupled, by means of heat risers and/or thermal interfaces, to a proximate cold plate. The enclosures may be the common electronic enclosures described above, other form-factor enclosures, or unenclosed systems such as server blades or bare server motherboards. Each of these components are known independently in the art.
- The contact-cooled enclosure described herein can, among other things, comprise an instantiation of the contact-cooled enclosure referred to in a previously filed patent application by Lipp and Hughes. The patent application describes a rack mounted cold plate system is found in U.S. Provisional Patent Application No. 61/008,136, entitled “A Cooling System for Contact Cooled Electronic Modules,” filed Dec. 19, 2007, and U.S. Pat. No. 8,000,103, having the same title, filed Dec. 19, 2008 (issued Aug. 16, 2011), both of which are incorporated herein by reference in their entirety.
- In an exemplary embodiment, a system to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate to mount on the electronic enclosure and thermally conduct heat. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. At least one of the plurality of electronic components are thermally coupled by one or more heat risers and/or thermal interfaces to the first surface of the cold plate.
- In another exemplary embodiment, a system to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate to provide heat removal. The cold plate is configured to be mounted external to the electronic enclosure. One or more heat risers is configured to be thermally coupled on a first end to at least one of the plurality of electronic components. A lid, configured to be mounted on the electronic enclosure, has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. The lid has a plurality of holes positioned to accommodate the one or more heat risers to poke through the lid. A layer of thermal interface material thermally couples a second end of the one or more heat risers to the cold plate. In a variation, the thermal interface material may be affixed in the same plane as the lid and held in place with a series of clips placed around the periphery of the thermal interface, as shown in
FIG. 8 . Alternatively, tape (e.g. metalized tape) can be used for the same function. Another function of the lid is to provide a barrier against electromagnetic interference (EMI). By providing an electrical contact, either capacitively by means of the clips, metalized tape or lid overlap ofmetal layer 804, or an additional electrical connection between 804 or 805 and the surroundinglid 111 the interposed thermal interface material can provide a barrier against EMI. - In another exemplary embodiment, a method for thermally coupling a plurality of heat generating components in an electronic enclosure to a cold plate is disclosed. The method comprises calculating a power dissipation of each of the plurality of heat generating components, determining an acceptable temperature rise between the cold plate and the plurality of heat generating components, and determining an acceptable thermal impedance to maintain the acceptable temperature rise. A surface area of the cold plate needed to conduct heat from each of the plurality of heat generating components is calculated. A type of heat riser selected for each of a plurality of heat risers is determined based on the thermal impedance where at least one of the plurality of heat risers is associated with each of the plurality of heat generating components.
- In another exemplary embodiment, a thermal interface to provide cooling to a plurality of electronic components is disclosed. The thermal interface comprises a first layer of a first thermal interface material. The first thermal interface material has a first thermal conductivity. A second layer of a second compliant thermal interface material is joined to the first layer. The second compliant thermal interface material has a second thermal conductivity being lower the first thermal conductivity. In a specific exemplary embodiment, the first thermal interface material is laminated to the second complaint thermal interface material, and the edges sealed to form a bag. A thermally conductive fluid is encapsulated within the bag, as shown in
FIG. 8A . - In a specific exemplary embodiment described herein, a system for thermally coupling one or more heat generating components in a 1 U enclosure to, for example, the removable lid of the enclosure, is disclosed. The lid can be further coupled to an external cold plate for additional heat removal. Although the actual descriptions provided herein are limited to 1 U enclosures, a skilled artisan will recognize that similar systems, methods, and means may be applied to other styles of enclosures of various styles and dimensions. In addition, upon reading the disclosure, the skilled artisan will further recognize that the heat may be coupled to a different side of the enclosure, other than the lid, such as the bottom. Coupling to a different side of the enclosure can be accomplished by rearranging various elements of the various embodiments described.
- In an exemplary embodiment, described in detail below, one or more heat-generating components in an electronic enclosure are maintained at acceptable temperatures primarily through conduction cooling to a proximate cold plate. Heat is thermally coupled from the heat generating components to thermal interfaces, heat-risers or spreaders. The heat flux may be spread out over a larger area and further coupled through the enclosure lid to a cold plate for heat removal. Although heat and heat flux are the elements of interest, for purposes herein, power and power dissipation are sometimes used as a proxy for heat flux.
- In an exemplary embodiment, a methodology to design a cooling mechanism for a given electronic component or components may start with calculating a design window. A physical implementation of the design can use information derived from the calculating steps.
- In this exemplary embodiment, a design window can be calculated by identifying and quantifying (e.g., calculating) a power dissipation of all heat generating components that are not maintained at a sufficiently low temperature by natural convection and conduction cooling means. A maximum or acceptable temperature rise from the cold plate interface to the heat generating components is then determined. A maximum or acceptable allowable heat flux (or power) per unit area at the cold plate/enclosure interface is determined to maintain the maximum acceptable temperature rise. The heat flux per unit area is commonly referred to as the thermal impedance. A cold plate surface area required to conduct the heat to the cold plate is calculated for each the heat generating components. The cold plate surface area determines an overall thermal resistance between each of the components and the cold plate. Each of these calculations and associated governing equations are known independently in the art.
- Once preliminary calculations are determined, a distance between each of the one or more components and the cold plate interface is determined. An additional spatial allowance is made for one or more thermal interfaces, generally between each of the one or more components and the cold plate interface. However, in certain applications, thermal interfaces may be placed between one or more of the components and an adjacent component as well. The one or more thermal interfaces can be placed in various locations, such as between a component and a heat riser, between a heat riser and a cold plate, or between a component and a cold plate, between a heat riser and a lid, between a component and a lid or between a cold plate and a lid, as aforementioned. A type and size of each of the heat-risers or spreaders is determined based on the heat flux, spreading information, and distances between each of the one or more components and the cold plate. The heat-risers or spreaders are produced and installed. The heat-risers or spreaders are generally placed to be substantially coplanar with the cold plate or lid interface with thermal coupling between the heat-risers or spreaders and the cold plate or lid, achieved with the one or more thermal interfaces. Similarly, the thermal coupling between lid and cold plate is achieved with a thermal interface.
- A conventional motherboard is deployed in a 1 U form factor electronic enclosure. The 1 U electronic enclosure is nominally 1.75 inches (approximately 4.45 cm) high by 19 inches (approximately 0.482 m) wide by 24 inches (approximately 0.610 m) deep with a removable top lid in one embodiment. The enclosure may contain one or more of a compute server, a storage device, a network switch, a power supply, other electronic devices, or any combination, singly or multiply, thereof.
- With reference to
FIG. 1A , an exemplary cross-sectional view of anelectronic enclosure 100 includes alid 111 and has amotherboard 110 mounted therein. Theelectronic enclosure 100 and thelid 111 may each be fabricated from thermally conductive materials, independently known in the art. The motherboard no carries some or all of the VLSI components (e.g., integrated circuits in addition to discrete electronic components) and most, if not all, auxiliary circuits. The motherboard no is coupled to theelectronic enclosure 100 via a plurality ofstandoffs 105. Themotherboard 110 acts as a heat sink for components attached thereon. Through convective and radiative heat transfer to theelectronic enclosure 100, themotherboard 110 has sufficient heat dissipation to provide generally sufficient heat removal for lower-powered circuits. Heat dissipation from themotherboard 110 may be further enhanced by one or more layers ofthermal interface material 113 arranged between the motherboard no and one or more walls of theelectronic enclosure 100. Thethermal interface 113 functions to bring the motherboard no into thermal contact with the cold plate (e.g. enclosure wall or any other suitable cooling component.).Heat risers lid 111 can be covered with a thin layer of a compliantthermal interface 103 to optimize contact with an external cold plate (not shown inFIG. 1A ) while the interior side can be covered in whole or in part with a second layer of compliantthermal interface material 101 to optimize thermal contact with theheat risers - In a specific exemplary embodiment, the compliant
thermal interface 103 can comprise two layers laminated or otherwise joined together to form a sheet, as shown inFIG. 1B . Thefirst layer 103A functions to resist wear and tear, and thesecond layer 103B functions to facilitate heat flux from thefirst layer 103A to the cold plate. The two layers can be laminated together, joined at or near the edges, in a quilted pattern, or in various other fashions as will be recognizable to a skilled artisan. Alternately, one layer may be deposited onto the other by chemical deposition, vacuum deposition, or any other suitable deposition method. In this specific exemplary embodiment, the layers can be substantially comprised of polyester and aluminum; the polyester layer being roughly about 0.5 thousandths of an inch (approximately 13 microns) in thickness and the aluminum, about 2 thousandths of an inch. A skilled artisan will recognize that other thicknesses and materials (such as PTFE, PET, LDPE or any other polymer or shear-resistant material for the first layer, and copper, gold, or any other conductive material for the second layer) can be readily employed. The substantially polyester layer provides strength and toughness to the compliantthermal interface 103 but the thermal conductivity is still high due to the relative thinness of the polyester layer. The substantially polyester layer surface also provides good thermal coupling from an external cold plate (not shown) to itself (i.e., the compliant thermal interface 103). The aluminum layer is substantially hermetic, containing the thermally conductive fluid, and spreads the heat flux coupled to the polyester layer from/to the external heat source/cold plate, ensuring a more uniform heat flux to a proximate thermally conductive fluid and reducing the overall thermal impedance. In a specific embodiment, shown inFIG. 8A , the dual layer sheet can be formed into adual layer bag 801 by joining opposing edges of the sheet, by joining the corners of the sheet, or by joining a second sheet of substantially similar or dissimilar construction (e.g. materials, geometry, number of layers, etc.) to the first sheet. The edges and/or corners are preferably overlapped and laminated to seal the bag, but may alternately be crimped or otherwise joined. In another specific exemplary embodiment, shown inFIG. 8C , a dual-layer bag 801 could be formed and be further reinforced with athird layer 805 for strength or structure, such as a porous fiberglass though which a thermallyconductive fluid 802 could flow, thus providing additional strength while maintaining good thermal conductivity. Thethird layer 805 may also be heat-conductive, such that it facilitates heat transfer within the thermal interface. For example, thethird layer 805 may be a thermally conductive plate, coupled to the thermallyconductive fluid 805, that facilitates heat spreading throughout the bag 801 (e.g. through the thermally conductive fluid 802). The conductive plate is preferably metallic or prismatic, (e.g. graphite), and is preferably slightly flexible, with a thickness of approximately 0.02 inches (0.5 mm). However, the conductive plate may comprise other materials, properties, and thicknesses. The conductive plate may additionally be porous or include through holes to allow thermally conductive fluid flow. Thethird layer 805 may be laminated along the edges to thebag 801, with a first 802 and a second 802A thermally conductive fluid encapsulated against each main face (shown inFIG. 8C ). More preferably, layers, approximately 0.02 inch (0.5 mm) thick, of thermallyconductive fluid third layer 805 may be merely enclosed within thebag 801, such that the thermallyconductive fluid 802 has unrestricted flow over every face (shown inFIG. 8D ), or may be entirely laminated to the bag interior.Thermal interface 101 can also be similarly constructed. Where the thermal interface is to be used to provide electromagnetic shielding, an electrically conductive path 806, which can be a wire or a metal ribbon, may be attached toconductive layer 804 andauxiliary layer 805. When installed, an electrical connection is made to the lid. Clips or metal tape may be used to install the thermal interface, providing additional shielding by bridging the gap between lid and thermal interface. - Another variant of this dual-layer bag is described with reference to
FIG. 8 , below. - Higher power dissipation devices, in particular high-density (e.g., LSI, VLSI, ULSI, etc.) integrated circuit devices such as a
CPU 108, agraphics chip 109, amemory 106, apower supply transistor 114, and inductors (not shown) require heat risers to provide a low thermal impedance path to a common plane as defined by, for example, thelid 111. The heat risers conduct heat to thelid 111 from a component that is, for example, from 0.9 inches (approximately 2.3 cm) to 1.3 inches (approximately 3.3 cm) below thelid 111. Consequently, in a specific exemplary embodiment, each of a plurality ofheat risers heat risers thermal interfaces 101 so that at least one of the plurality ofheat risers lid 111. Minimizing thermal impedances from a high power dissipation device to the external cold plate (not shown) can be accomplished by spreading the heat flux over a larger area. For example, one of the plurality ofheat risers 102, which is also a heat spreader, is designed to spread the heat flux over an area about ten times greater at its top thermal contact with one of the plurality of riserthermal interfaces 101 to thelid 111 than at a bottomthermal contact 107 to theCPU 108. The ten times greater area thereby reduces the heat flux and thermal gradient across one of the plurality of riserthermal interfaces 101, thelid 111, and the compliantthermal interface 103 by a factor of about ten. The reduction in heat flux due to the greater area is more fully described under VLSI cooling below. As will be recognized by a skilled artisan upon reading the disclosure, a heat riser may be used to carry the heat away from more than one component. For example, one of the plurality ofheat risers 102 is also in thermal contact with thepower supply transistor 114, transporting heat generated therein, along with heat from theCPU 108 to thelid 111. - Thermal paths for high dissipation, high heat flux integrated circuit devices (e.g., devices fabricated according to VLSI or ULSI design principles) are provided by combination heat-risers/spreaders. Such heat-risers/spreaders have top surfaces from about two to twenty times larger than their bottom surfaces. For example, with reference now to
FIG. 2 , one of the plurality ofheat risers 102 that also has heat spreading characteristics, is examined in further detail. In an exemplary embodiment, at least one of the plurality ofheat risers 102 is constructed from a highly thermally conductive material, such as a metal block. - In a specific exemplary embodiment, the metal block is fabricated from aluminum. In this specific exemplary embodiment, the
heat riser 102 is 3 inches (approximately 70.6 cm) wide by 6 inches (approximately 15.2 cm) long by 1 inch (approximately 2.5 cm) high. Apad area 202 is configured to mount to theCPU 108. Theheat riser 102 receives heat from a high heat flux area of thepad area 202 and spreads the heat flux (illustrated by a plurality of dashed arrows 204) over alarger area 203 to reduce the heat flux. A surface area of thelarger area 203 is about 10 times larger than a surface area of thepad area 202, thus reducing heat flux proportionately (i.e., by a factor of ten). Reducing the heat flux allows use of thermal interfaces with lower thermal conductivity, while still maintaining a thermal resistance from the electronic component through the lid 111 (or another side of the electronic enclosure 100) of less than about 0.25° C./Watt. - The
heat riser 102 is installed in contact with the VLSI component, such as theCPU 108, using the same fixtures as are normally used to hold down a conventional heat sink. In this specific exemplary embodiment, twoscrews 205 secure theheat riser 102 to the VLSI component. - In other specific exemplary embodiments, the
heat riser 102 can be constructed using a simple block of a conducting material such as aluminum or graphite. Each of these, and related materials, may be machined or cast into more complex shapes to optimize performance per unit weight, to fit into limited areas, or to contact multiple heat generating components. Alternately, theheat riser 102 may be fabricated from more complex constructs using, for example, heat pipes. - Referring to
FIG. 3 , another exemplary embodiment of aheat riser 102 a uses a plurality ofheat pipes 301. The plurality ofheat pipes 301 are preferably tubular and may have a cross section that is round, square, or other shapes, and can be fabricated from highly thermally conductive material such as, for example, copper. They typically contain a small amount of fluid, generally water under a partial vacuum. The plurality ofheat pipes 301 are thermally coupled with two or more parallel plates (only two plates are shown for clarity) including asmall plate 302 and alarge plate 303. Thesmall plate 302 and thelarge plate 303 can be fabricated from any highly thermally conductive material, such as copper. Thesmall plate 302 is intended for placement on top of the device to be cooled, such as theCPU 108, and thelarge plate 303 can be placed against thelid 111 of the electronic enclosure 100 (seeFIG. 1 ). - The plurality of
heat pipes 301 is arranged so that their center sections are in good thermal contact with thesmall plate 302 and each of the ends of the plurality ofheat pipes 301 are arranged in good thermal contact with thelarge plate 303. In a specific exemplary embodiment, thermal contact with both thesmall plate 302 and thelarge plate 303 is augmented by placing each of the plurality of heat pipes in grooves (not shown explicitly but understandable to a skilled artisan) milled into thesmall plate 302 and thelarge plate 303. The grooves are roughly equal in diameter to each of the plurality ofheat pipes 301. In another specific exemplary embodiment, each of the plurality ofheat pipes 301 is affixed by soldering. Using the design and fabrication techniques described herein, theheat riser 102 a preferably has a thermal resistance of less than about 0.03° C./Watt, but may have a thermal resistance of less than about 0.07° C./Watt. - A total number of the plurality of
heat pipes 301 and dimensions of thesmall plate 302 and thelarge plate 303 can be adapted to fit various applications. The larger thelarge plate 303 in relation to thesmall plate 302, the greater the reduction in heat flux across thelarge plate 303. In a specific exemplary embodiment, thesmall plate 302 has dimensions of about 2 inches by 2 inches (approximately 5.1 cm square) and the large plate has dimensions of about 6 inches by 3 inches (approximately 15.2 cm by 7.6 cm). As the device to be cooled, such as the CPU 108 (seeFIG. 1 ) has a top surface of about 1.3 inches by 1.3 inches (approximately 3.3 cm square), the generated heat flux is effectively spread over an area about ten times greater at thelarge plate 303 as compared to thesmall plate 302. - The plurality of
heat pipes 301 could be replaced by a single wide flat heat pipe (not shown, but understandable to a skilled artisan). Taking it a step further as illustrated in an exemplary embodiment ofFIG. 4 , the small 302 and the large 303 plates ofFIG. 3 can be eliminated and substituted by a flat,wide heat pipe 401. The flat,wide heat pipe 401 may be used as a heat-riser/spreader all by itself. The flat,wide heat pipe 401 is fabricated from a highly thermally conductive material such as metal (e.g., copper). In a specific exemplary embodiment, the flat,wide heat pipe 401 is 3 inches (approximately 7.6 cm) wide and placed so that its center portion lies directly on top of the device to be cooled, such as theCPU 108, and a large portion of the ends of the flat, wide heat pipe is in contact with thelid 111 of the electronic enclosure 100 (seeFIG. 1 ). Compared to the heat pipe/riser/spreader described above with reference toFIG. 3 , thermal performance is slightly better with the flat,wide heat pipe 401 and a lack of coplanarity between the component (e.g., the CPU 108) and thelid 111 can be compensated for by the flexibility of the heat pipe. In other exemplary embodiments (not shown), the flat,wide heat pipe 401 can be used in conjunction with the plurality ofheat pipes 301 ofFIG. 3 . - The
block 203 shown inFIG. 2 may also be hollow and partially filled with a fluid, such as water, and may be partially evacuated. Thehot component 202 causes the fluid to boil and subsequently condense on the opposite surface where it is in contact withlid 111. - In the various exemplary embodiments disclosed above, each of the risers also spreads the heat over a larger area. For components that dissipate less heat than various ones of the high-density integrated circuits discussed above, simpler risers can sufficiently be effective for cooling the components. For example, a simple block heat riser having dimensions of 1 inch by 1 inch by 1 inch (approximately 2.5 cm on a side) can be fabricated from aluminum. Since any face in contact with a component has an opposing face, to be thermally coupled to the
lid 111, has as identical surface area, no heat spreading occurs. - With reference to
FIG. 5 , an exemplary embodiment of one type of effective heat riser is aspring riser 500 as illustrated. Thespring riser 500 is similar to one of the plurality ofheat risers 104 ofFIG. 1 and the flat,wide heat pipe 401 ofFIG. 4 . Thespring riser 500 can be constructed out of a highly thermally conductive flexible material such as, for example, copper. The spring riser benefits from being fabricated from an at least slightly resilient material, such as hard (e.g. cold rolled) copper, to provide a spring-like characteristic to thespring riser 500. - In a specific exemplary embodiment, the
spring riser 500 can be a round or elliptical spring having awidth 506 of about 1 inch (approximately 2.5 cm) wide and athickness 505 of about 5 mils (0.005 inches or approximately 127 microns). However, various shapes other than round can readily be employed as well as other dimensions. - The
spring riser 500 removes heat from a component, such as thegraphics chip 109 ofFIG. 1 , by a combination of conduction to thelid 111, and natural convective and radiative heat transfer to a local environment of the component. Thespring riser 500 can be affixed to the component by gluing or other means, and has at least one of a plurality of riserthermal interfaces 101 thermally coupling thespring riser 500 to the lid in. The spring-like nature of thespring riser 500 assures a good mechanical and thermal contact to thelid 111, while automatically compensating for variations in height and coplanarity. Thespring riser 500 is light in weight and low in cost. Thermal resistance for an exemplary embodiment of thespring riser 500 described above ranges from about 0.5.degree. C./Watt to 2.degree. C./Watt. - Referring now to
FIG. 6 , various types of volatile and non-volatile memory subassemblies, such as VRAM or DRAM dual in-line memory modules (DIMMs), can be cooled by conductive heat transfer. In an exemplary embodiment, aDIMM 606, is encased with one or more thermallyconductive strips 612 on its sides that act as heat risers. The one or more thermallyconductive strips 612 make thermal contact tomemory components 613 within theDIMM 606 at athermal interface 607. Thethermal interface 607 is preferably a dual-layer thermal interface as described above, but alternately can be a thermally conductive grease known independently in the art. Thus, thethermal interface 607 can be a thermal-grease-based thermal interface. - Vertical sides of the one or more thermally
conductive strips 612 provide a low thermal impedance path from theDIMM 606 to anuppermost portion 614 of the one or more thermallyconductive strips 612. In a specific exemplary embodiment, a 1 mm thick aluminum block is used for the one or more thermallyconductive strips 612. The one or more thermallyconductive strips 612 can be held in place by, for example, a plurality of spring clips 611, such that the thermal interface is sandwiched between the thermallyconductive strip 612 and the electronic component. The spring clips 611 each preferably comprise two tines joined by a spring element, wherein spring element applies a restorative reaction force to the tines when the tines are displaced from a resting position. The end of each tine is preferably curved away from the end of the opposing tine. The clips preferably apply a substantially normal, compressive force to the coupling surfaces, and are preferably stamped, machined, or otherwise formed as a single piece from a metallic sheet or block. However, other manufacturing methods may be used. The plurality of spring clips 611 is preferably coupled together on a rail. - In an alternative exemplary embodiment, the one or more thermally
conductive strips 612 can be glued to components of thememory components 613 without requiring the plurality of spring clips 611. The glue thus provides both a mechanical and thermal attachment. - The
uppermost portion 614 of the one or more thermallyconductive strips 612 is substantially orthogonal to the sides and made as wide as a pitch of theDIMM 606 allows (e.g., 0.4 inches or approximately 10 mm), thus minimizing the thermal resistance of theDIMM 606 to an interface of thelid 111 of the electronic enclosure 100 (seeFIG. 1 ). A typical thermal resistance of the interface between theDIMM 606 and thelid 111 is 1.6.degree. C./Watt with 0.2 mm thick thermal interface. Generally, a worst case thermal resistance is 2.degree. C./Watt for the exemplary embodiment shown, resulting in a temperature rise of approximately 20.degree. C. for a 10 Watt DIMM. - Thermally
conductive strips 612 on opposite sides of the DIMM module can be overlapped at the top of the module and thermally coupled by a thermal interface such as thermal grease of a thermal pad. Thetop strip 614 then extends across the entire DIMM top surface (or more) providing a larger planarized surface to the cold plate interface for a lowered thermal resistance. Furthermore, a flexible circuit populated with DIMMs may be wrapped around a thermally conductive metal strip to improve thermal performance. The DIMM substrate may additionally be formed into a “T” shape to improve heat transfer to ambient air (e.g. air-cooling). The substrate is more preferably formed as a wide “T” shape and coupled to a cold plate through a thermal interface to conduct heat to the cold plate. However, the substrate may be formed as an “L” shape or any other suitable form. - Note that although the one or more thermally
conductive strips 612 are shown on both sides of the memory subassembly, in many cases components are mounted on one only side. Thus, in such an application only the single mounted side requires only one of the one or more thermallyconductive strips 612. - In a specific application of various embodiments of thermally cooling electronic components described herein, a voltage regulator module (VRM, not shown) converts an internal 12 V power supply to voltages required by the individual components, such as the
CPU 108 and the memory 106 (seeFIG. 1 ). The VRM often supplies over 100 amps of current at just over 1 VDC and dissipates up to 30 Watts. In contemporaneous designs, the power is commonly dissipated among six transistors and inductors. - Most server designs have the VRMs built onto the motherboard with the inductors and switching transistors laid out in a row up to 4 inches (approximately 10 cm) long. Consequently, a generated heat flux is relatively low. A piece of metal such as 4 inch long by ⅛ inch thick (approximately 10 cm long by 3.2 mm thick) aluminum strip (not shown) is placed over the transistors and inductors with a thin thermal interface coating there-between. The piece of metal can, in turn, be coupled to the
lid 111 ofFIG. 1 by one of the plurality ofheat risers 102 as shown for thepower supply transistor 114, or a solid metal, such as the heat riser iota ofFIG. 3 , or one of the spring risers, such as flat,wide heat pipe 401 or thespring riser 500, ofFIGS. 4 and 5 respectively, can be employed to thermally rise and couple the aluminum strip to thelid 111. - In another specific application of various embodiments of thermally cooling electronic components described herein, an input power converter converts input power to a lower intermediate voltage, nominally 12 VDC. Power is delivered to a motherboard through one or more electrical connectors. Input power converter subassemblies are mounted (not shown), typically by screws, directly to the
lid 111 of theelectronic enclosure 100. A layer of thermal interface material between the cover and the device ensures good thermal contact. - In another specific application of various embodiments of thermally cooling electronic components described herein, disk drives (not shown) consume about 10 Watts so adequate cooling is typically achieved by conductive and natural convective heat transfer within an enclosure. Cooling of the disk drives can be enhanced by inserting, for example, a
thermal interface 113 such as was done for the motherboard no ofFIG. 1 between the disk drive and theelectronic enclosure 100. - In another specific application of various embodiments of thermally cooling electronic components described herein, auxiliary circuit board subassemblies generally have low dissipation (e.g., below 30 Watts) and just a few integrated circuit components. With reference to
FIG. 7 , in a 1 U-sized system, anauxiliary circuit board 701 is commonly inserted into the motherboard no so that theauxiliary circuit board 701 is coplanar with and slightly above themotherboard 110 as illustrated. Components mounted to theauxiliary circuit board 701 can be cooled via an aluminum block or aspring riser 704 glued, coupled, or otherwise adhered on top of the components and coupled to thelid 111 of theelectronic enclosure 100 in a fashion similar to that described for other devices, above. - Further, a plurality of auxiliary circuit boards (not shown explicitly) can be placed in an area previously occupied by fans and associated control mechanisms normally used for forced-air convective cooling. The plurality of auxiliary circuit boards can be connected to the motherboard with high speed interfaces such as HyperTransport®, PCI Express®, or any other similar widely accepted protocol. Mounting the plurality of auxiliary circuit boards in an area previously occupied by fans and associated control mechanisms enables a 1 U enclosure to offer the same functionality as a 2 U, 3 U, or 4 U enclosure.
- Other objects, such as the auxiliary circuit board subassemblies described immediately above, may obstruct a direct thermal path between the motherboard no component and the
lid 111. In such a case, heat generated by the component is directed around the obstruction. For example and with continuing reference toFIG. 7 , a component, such as thegraphics chip 109, no longer has a direct unobstructed path to thelid 111. The auxiliary circuit board 701 (plugged into a socket 702) lies directly above thegraphics chip 109. In this case, an exemplaryhalf spring riser 703 has one end in thermal contact with thegraphics chip 109, wraps around theauxiliary circuit board 701, and thermally contacts at least one of the plurality of riserthermal interfaces 101 under thelid 111. For medium and lower power devices, thehalf spring riser 703 can be a simple strip of copper as described above for one of the spring risers, such as thespring riser 500 ofFIG. 5 . If a lower thermal resistance is required, thehalf spring riser 703 can be constructed much like the flat,wide heat pipe 401 described with reference toFIG. 4 . - Alternatively, the
half spring riser 703 can be fabricated from a heavier gauge thermally-conductive material or even a block of metal cut in such a fashion as to extend out from under the obstruction and rise to thelid 111. In another exemplary embodiment, a thermal interface (not shown) may be inserted under the obstructed component in order to conduct heat to the enclosure bottom as referred to above. The variations described are not all not shown as they are too numerous to itemize and are readily apparent to one skilled in the art using the disclosure and embodiments provided herein. - After thermal risers are attached to many or all components within the
electronic enclosure 100, thus bringing the thermal risers nominally up to a level of a lower portion on the underside of thelid 111, a planarization step can be included further enhancing thermal coupling to thelid 111 with a low thermal resistance. - Assembly of the
motherboard 110 may result in the top portions of the components not being coplanar either with one another or an uppermost portion of heat risers attached thereto not being coplanar with the lower portion of the underside of thelid 111. Consequently, the upper portions of the attached heat risers may not be at an exact distance below thelid 111. For example, an integrated circuit may have dimensions of 33 mm.times.33 mm with an installed height variance of roughly 0.2 mm, and a surface coplanarity variance of about 0.3 mm between either of the two sets of parallel faces. A top face or surface of, for example, thelarger area 203 of one of the plurality of heat risers 102 (seeFIG. 2 ), multiplies an effect of the variation simply due to the increased surface area. Moreover, both themotherboard 110 and theelectronic enclosure 100 are flexible and can sag away from their respective support structures. In this example, coplanarity variance can be up to roughly 1.4 mm or more. - While any of the various spring risers described herein are flexible, and will therefore adjust to variations in height and planarity automatically, the tops of larger risers/spreaders (e.g., one of the plurality of heat risers 102) can benefit from planarization and a resulting height adjustment thus assuring good, low-thermal resistance coupling to the
lid 111. Ordinary rubber-like thermal interface sheet materials of the prior art do not have sufficient compliance to overcome large coplanarity differences. - Several methods may be employed to offset a lack of coplanarity. In an exemplary embodiment, a compliant thermally conductive substance, such as a thermal grease, known independently in the art, can improve conductive heat transfer between contacting surfaces. Additionally, a self-leveling thermally conductive potting compound may be poured in a mask over the riser and allowed to set. In another exemplary embodiment, a thermal grease or thermally conducting potting compound may be encapsulated in a bag and laid over one or a plurality of risers, functioning as at least one of the plurality of riser
thermal interfaces FIG. 8 , below. Self-leveling thermally conductive potting compounds are known independently in the art, as are ceramic or metal based thermal greases. - In a specific exemplary embodiment, an uppermost top portion of the
heat riser 102 is covered with a moderately high conductivity (e.g., 3 Watts/m-.degree.K) potting compound prior to replacing thelid 111 on theelectronic enclosure 100. The potting compound is cured in place between theheat riser 102 and thelid 111. The cured potting compound then functions as at least one of the plurality of riserthermal interfaces 101 described above with a thermal impedance of less than about 0.1.degree. C./Watt/in.sup.2 (approximately 0.016.degree. C./W/cm.sup.2). - Further, since contacting surfaces between the top of risers/spreaders and the underside of the
lid 111 are never perfectly flat or coplanar, and may even be non-rigid and flexible, a thermal interface, such as a thermal grease or an elastomeric pad (known separately and independently in the art), may be inserted between the contacting surfaces. Alternatively or in addition, the riser may be physically clamped to the lid by a screw or clamping fixture, or otherwise adhered (e.g., by an epoxy or chemical bonding agent), using a generally inherent flexibility of themotherboard 110 and thelid 111 to compensate for non-coplanarity and height variations. The flexibility of themotherboard 110 can compensate for some or all the height and coplanarity issues. After mounting theheat riser 102 on the component to be cooled and replacing thelid 111, thelid 111 is pressed down on the heat riser 102 (e.g. by clamps or any suitable coupling mechanism). Thermal resistance is minimized by flattening thelid 111 against theheat riser 102 and minimizing a thickness of one or more of the plurality of riserthermal interfaces 101. Screwing or locking sliders (not shown but readily understood by a skilled artisan) are one form of attachment but other attachment methods will work. The pressing down process can benefit from a semi flexible enclosure lid capable of bending with the rest of the enclosure when force is applied thereto. The lid is pressed into contact withheat riser 102 and themotherboard 110 is flexed to compensate for any mechanical height differences due to, for example, dimensional tolerances of the various components such as the enclosure, motherboard, heat riser, etc.). - In another exemplary embodiment, any of the risers or spreaders are patterned (not shown but readily understandable to a skilled artisan) on an uppermost portion (i.e., that portion configured to contact the lid 111). A portion of the
lid 111, corresponding to a contact point of the patterned riser or spreader, is similarly patterned to engage with the riser or spreader pattern. The patterned surface increases an overall surface area of the contacting surfaces, thus increasing the thermal contact area. Patterning of opposing surfaces brought into contact with one another is discussed in more detail with reference toFIG. 9 , below. - In another exemplary embodiment, a compliant thermally-conducting foam (not shown) can function as at least one of the plurality of riser
thermal interfaces 101. The compliant thermally conducting foam is compressed by thelid 111 providing coplanarity between theheat riser 102 and thelid 111. The compliant thermally conducting foam is useful in situations where planarity divergence is small or relatively high pressures can be applied to press down thelid 111. - In yet another exemplary embodiment, a flexible vapor chamber (not shown) fabricated from a resilient and thermally conductive material can be clamped to the riser or device to be cooled. A pressure-cooker-effect is then utilized to expand a top of the vapor chamber top into planarity with the
lid 111, thus providing enhanced conductive heat transfer. A skilled artisan will recognize that any or all of the methods and means described above can be combined for various applications. - With reference now to
FIG. 8 , abag 801, discussed briefly above, is filled with a thermally conductive fluid 802 (note that the thermallyconductive fluid 802 is contained within the bag 801). The fluid can be, for example, a thermal grease. Various types of thermal grease are known independently in the art. For a single riser, thebag 801 can be fabricated to be slightly larger than a top surface of the riser, for example, from about 5% to 20% larger on a side. For example, for the 3 inch by 6 inch (approximately 70.6 cm by 15.2 cm) dimension of thelarger area 203 of the heat riser 102 (seeFIG. 2 ) discussed above, the bag can be 3.3 inches by 6.6 inches (approximately 8.4 cm by 16.8 cm). Thebag 801 can be sized large enough to allow an excess amount of the thermally conductive fluid 802 a place to escape when the fit is tight, but not so large that much of the thermallyconductive fluid 802 will flow away beyond one or more edges of theheat riser 102 or cold plate, thus leaving a void above theheat riser 102 or cold plate. Thebag 801 can also be sized such that coupling thebag 801 to aheat riser 102 or cold plate causes the coupling surfaces of thebag 801 to distend as thermallyconductive fluid 801 is forced away from the coupling site. An amount of the thermallyconductive fluid 802 used in thebag 801 is dependent upon a worst-case coplanarity variation, as described above. Thebag 801 could also be large enough to cover a multiplicity of components, simply covering over many or all of the components. In another exemplary embodiment, thebag 801 can act as thelid 111 of theelectronic enclosure 100. - In a specific exemplary embodiment, the
bag 801 can be fabricated using a dual-layer polyester and aluminum construction. This embodiment is described with reference to the specific exemplary embodiment of constructing the compliantthermal interface 103 discussed above. For thebag 801, the dual-layers can be filled with various types of fluid such as the thermallyconductive fluid 802. In a related specific exemplary embodiment, one of the layers of the bag can be thelid 111 of theelectronic enclosure 100. The second of the dual-layers is coupled to thelid 111 so as to form a cavity between thelid 111 and the second of the dual-layers. The second of the dual-layers can be comprised substantially of either, for example, aluminum or polyester. In this case, thebag 801 can be in contact with one surface of theentire lid 111 or, alternatively, in contact with only certain portions. Of course, multiple instantiations of thebag 801 can be in contact with different areas of thelid 111 as well. Additionally either of the dual-layers can be comprised of any other material that is generally non-reactive when in contact with the thermallyconductive fluid 802 or thermal greases and has a relatively good thermal conductivity. Additionally, the materials for the dual-layers should be relatively impervious to leaks when used to encapsulate various types of fluid such as the thermallyconductive fluid 802. In other exemplary embodiments where thebag 801 comes into contact with thelid 111, there should be a good thermal contact between thebag 801 and thelid 111. - In another exemplary embodiment, the
bag 801 can be fabricated using a dual-layer polyester and aluminum construction on one side with the other side comprising thelid 111 of the electronic enclosure 100 (seeFIG. 1A ). The dual-layer polyester and aluminum construction side is affixed to thelid 111 by gluing or other means. This embodiment is described with reference to the specific exemplary embodiment of constructing the compliantthermal interface 103 discussed above. For thebag 801, the space between the dual-layers and thelid 111 can be filled with various types of fluid as the thermallyconductive fluid 802. - In another exemplary embodiment, the
bag 801 with theauxiliary spreader 805 can be located in a hole in the lid cut to the dimensions of the bag and secured with clips or metallic tape so that it is coplanar with the lid.FIG. 6B shows an exemplary implementation. The clip 601 is fabricated from a thin, springy material such as steel or beryllium copper. Typical thickness is approximately 0.005 inches. Theclip 611 may be a continuous spring that spans the whole length of a single side of thebag 801, or may be deployed in small sections with multiple instances along each side of the bag. The clips are attached to thebag 801 by sliding the jaw 602 over the edge of the bag. The bag is preferably inserted from the top into an appropriately sized hole in the lid. The edge 603 preferably gives during insertion and springs back to hold the bag in place. The clips can also form a capacitive coupling to the lid for EMI suppression, and can be augmented by a direct electrical connection to the auxiliary spreader and conduction layers of the bag. Removal of a small amount of the protective layer under one or more clips may also provide an adequate connection. The auxiliary layer can similarly be connected to the conductive layer by a small leaf spring. This bag deployment method reduces the number of variants required for various server lid types as a single design may be used, thus benefiting more from the economics of higher volume manufacturing. - The thermally
conductive fluid 802 can either be a setting or non-setting compound depending upon a specific application. For example, if components within theelectronic enclosure 100 are changed over the life of the equipment, a non-setting compound is adaptable to the new dimensions of one or more new components. However, a setting compound is less likely to leak or otherwise fail than a non-setting compound. Thus, the setting compound can be better suited for applications that are not modified. - In certain applications, such as in blade servers, the enclosure may be mounted on edge, (e.g. with the
bag 801 positioned vertically). In such a situation, a thixotropic grease in a tightly containedbag 801 is preferred in order to ensure that the grease does not puddle at the bottom of the bag to the detriment of its thermal conductivity. - In a specific exemplary embodiment, the
bag 801 is utilized to achieve the pressure-cooker effect, describe above. This specific exemplary embodiment is similar to the aforementioned technique of encapsulating thermal grease or thermally conducting potting compound in a bag. However, with the pressure-cooker effect, thebag 801 is fabricated from a flexible and thermally conductive material. Thebag 801 is evacuated, except for a small amount ofvolatile fluid 802 that boils just above the cold plate operating temperature. Thebag 801, acting as a vapor chamber, is affixed to theheat riser 102. When thebag 801 cools, it is compressed flat by the lack of vapor-counteracting air pressure. When theheat riser 102 starts to conduct heat, thebag 801 warms up until the fluid 802 boils, expanding thebag 801 and forcing it tightly against thelid 111. At that point, the fluid 802 at the top of thebag 801 that is in thermal contact with thelid 111 cools and condenses, thus releasing heat into thelid 111. In this manner, heat is transferred from theheat riser 102 to thelid 111. - Referring now to
FIG. 9 , an exemplary embodiment of a grooved interface between theheat riser 102 and thelid 111 exemplifies one of the techniques described above to compensate for a lack of coplanarity. In this exemplary embodiment, theheat riser 102 is patterned with a plurality ofgrooves 901. The plurality ofgrooves 901 engages a plurality ofcorresponding grooves 902 formed into a lower portion of thelid 111. - In a specific exemplary embodiment, each of the plurality of
grooves 901 and the plurality ofcorresponding grooves 902 are formed to a depth of 3 mm with agroove pitch 903 of 1 mm, along the z-axis (the z-axis being defined as being orthogonal to the drawing), such that a width of each “tooth” is slightly less than one half thegroove pitch 903. This ratio assures some skew tolerance in the x-axis as well as the y- and z-axes. However, the width of the teeth can vary between the plurality ofgrooves 901 and the plurality ofcorresponding grooves 902 or even from tooth-to-tooth. The only requirement is that the two components properly mate such that a surface area, and a resulting convective heat transfer, increases. When thelid 111 is replaced, the two sets of grooves mesh and, because of the skew tolerance, compensation is made between a lack of coplanarity between theheat riser 102 and thelid 111. - The grooved surfaces thus assure a larger interface area for a lower thermal resistance between the
heat riser 102 and thelid 111. The grooved surfaces may be manufactured as part of theheat riser 102 and thelid 111, or they may be separate pieces of thermally conductive material applied to either or both surfaces. To further increase convective heat transfer between the mating surfaces, either thermal grease is applied between the surfaces to effect a low thermal resistance or one or both surfaces can include a compliant and thermally conductive thermal interface. Using the teachings herein, one skilled in the art will realize other depths, pitches, and interlocking patterns other than grooves, (e.g., a checkerboard pattern), may also be used in different applications. - In another exemplary embodiment, the thermal interface directly couples to the cold plate. The thermal interface comprises the embodiment with a substantially rigid
third layer 805, such that it is self-supporting. As shown inFIG. 10 , thecold plate 1001 includes an attached groove for mounting the thermal interface. The thermal interface may be slid into place adjacent to the cold plate along said grooves that guide and retain thethermal interface 1002 along a broad surface. Alternately, thethermal interface 1002 may be attached to thecold plate 1001 by adhesive (e.g. metal tape) or by the spring clips described above. - In the various embodiments described herein, heat risers are used as a thermal path between one or more of the various components to be cooled and an enclosure lid. In an exemplary embodiment, to properly couple heat from the top of the heat riser to the cold plate through the lid utilizes, for example, at least two of the plurality of riser
thermal interfaces 101 or the compliantthermal interface 103 as shown inFIG. 1A . In high power applications, such as a 200-Watt CPU, or when it is desirous to have the temperature difference between the component and the cold plate lower, the two layers of thermal interface may add too much thermal resistance. In such a case, the lid may be modified or eliminated. - In the first case where the lid is modified, holes are cut through the lid to match sizes of one or more of the heat-risers or spreaders. The heat-risers/spreaders are made slightly taller than described in other embodiments, above, so the heat-riser/spreaders poke through the lid and are level with an outside portion of the top of the lid. A thermal interface is then added to the top of the riser that is then directly coupled to an external cold plate through the thermal interface. A spring clip, as described above, preferably couples the thermal interface to the lid to retain the thermal interface position as well as to ground the thermal interface. However, the thermal interface may also be adhered to the lid with metal tape to achieve the same effects.
- In the second case where the lid is completely eliminated, the
bag 801 ofFIG. 8 above is designed to fit over the top of all the heat riser components, thereby replacing and eliminating the lid. In applications where the lid is used for other purposes, such as Faraday shielding for EMI, thebag 801 can be metalized and electrically coupled to the enclosure to provide for electrical isolation. This technique is also applicable to blade servers. Moreover, to spread heat better across the lid, the lid itself, or a portion thereof, may be constructed as a flat heat pipe or vapor chamber using techniques described above. - Although various embodiments have been described herein, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of various forms of the present invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. The accompanying drawings that form a part hereof show by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced. The embodiments illustrated are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.
- Such embodiments of the inventive subject matter may be referred to herein, individually or collectively, by the term “invention” merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is, in fact, disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same or similar purposes may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all adaptations or variations of the various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description.
- For example, particular embodiments describe various arrangements, dimensions, materials, and topologies of systems. Such arrangements, dimensions, materials, and topologies are provided to enable a skilled artisan to comprehend principles of the present disclosure. Thus, for example, numerous other materials and arrangements may be readily utilized and still fall within the scope of the present disclosure. Additionally, a skilled artisan will recognize, however, that additional embodiments may be determined based upon a reading of the disclosure given herein.
Claims (27)
Priority Applications (1)
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US12/535,272 US8270170B2 (en) | 2008-08-04 | 2009-08-04 | Contact cooled electronic enclosure |
US13/588,836 US20130208422A1 (en) | 2008-08-04 | 2012-08-17 | Contact cooled electronic enclosure |
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US12/535,272 Continuation US8270170B2 (en) | 2008-08-04 | 2009-08-04 | Contact cooled electronic enclosure |
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Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130153187A1 (en) * | 2011-12-14 | 2013-06-20 | International Business Machines Corporation | Dual Heat Sinks For Distributing A Thermal Load |
US9006035B2 (en) | 2011-07-20 | 2015-04-14 | Shunsin Technology (Zhong Shan) Limited | Method for manufacturing package structure with electronic component |
WO2015105741A1 (en) * | 2014-01-08 | 2015-07-16 | Tango Tech, Inc | High power portable device and docking system |
US20160227642A1 (en) * | 2015-01-30 | 2016-08-04 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
US20160262253A1 (en) * | 2015-03-04 | 2016-09-08 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
US20160352244A1 (en) * | 2015-05-28 | 2016-12-01 | Delta Electronics,Inc. | Power circuit module |
US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US20170196129A1 (en) * | 2014-04-14 | 2017-07-06 | Marco Feusi | Device for preventing data theft, use of false identity, and fraud during contactless data transmission via electromagnetic radio waves |
US9795055B1 (en) * | 2016-04-18 | 2017-10-17 | International Business Machines Corporation | Electronics cooling assembly with multi-position, airflow-blocking mechanism |
US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US9904811B2 (en) | 2016-04-27 | 2018-02-27 | International Business Machines Corporation | Tamper-proof electronic packages with two-phase dielectric fluid |
US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US10136519B2 (en) | 2015-10-19 | 2018-11-20 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US10168185B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US20190045663A1 (en) * | 2018-06-25 | 2019-02-07 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US10345874B1 (en) | 2016-05-02 | 2019-07-09 | Juniper Networks, Inc | Apparatus, system, and method for decreasing heat migration in ganged heatsinks |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
WO2020028181A1 (en) * | 2018-07-31 | 2020-02-06 | Coolanyp, LLC | Modular computer cooling system |
US10591964B1 (en) * | 2017-02-14 | 2020-03-17 | Juniper Networks, Inc | Apparatus, system, and method for improved heat spreading in heatsinks |
CN110911368A (en) * | 2019-12-23 | 2020-03-24 | 杭州乐守科技有限公司 | Integrated circuit with automatic heat dissipation function |
CN111949094A (en) * | 2020-07-15 | 2020-11-17 | 苏州浪潮智能科技有限公司 | Water-cooling heat dissipation structure for memory |
US10980103B2 (en) * | 2018-04-25 | 2021-04-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Cooling of power electronics circuits |
US11122682B2 (en) | 2018-04-04 | 2021-09-14 | International Business Machines Corporation | Tamper-respondent sensors with liquid crystal polymer layers |
US11304338B1 (en) | 2020-12-01 | 2022-04-12 | Nan Chen | System, method, and apparatus for a high-efficiency heat riser |
US11606880B2 (en) | 2016-03-03 | 2023-03-14 | Wuxi Kalannipu Thermal Management Technology Co., Ltd. | Self-organizing thermodynamic system |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011530190A (en) | 2008-08-04 | 2011-12-15 | クラスタード システムズ カンパニー | Electronic equipment housing with cooled contacts |
US8027162B2 (en) * | 2009-09-24 | 2011-09-27 | International Business Machines Corporation | Liquid-cooled electronics apparatus and methods of fabrication |
CN201654652U (en) * | 2009-11-13 | 2010-11-24 | 鸿富锦精密工业(深圳)有限公司 | Cooling system for computer |
WO2011111209A1 (en) * | 2010-03-11 | 2011-09-15 | 株式会社島津製作所 | Turbo molecular pump device |
WO2011119926A2 (en) | 2010-03-25 | 2011-09-29 | Porreca Paul J | Conduction-cooled apparatus and methods of forming said apparatus |
JP2012033559A (en) * | 2010-07-28 | 2012-02-16 | J Devices:Kk | Semiconductor device |
US8300412B2 (en) * | 2010-09-30 | 2012-10-30 | Hamilton Sundstrand Corporation | Heat exchanger for motor controller |
US9119327B2 (en) * | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
CN102469742A (en) * | 2010-11-04 | 2012-05-23 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
US8488312B2 (en) | 2011-02-14 | 2013-07-16 | Adc Telecommunications, Inc. | Systems and methods for thermal management for telecommunications enclosures using heat pipes |
US8493738B2 (en) | 2011-05-06 | 2013-07-23 | International Business Machines Corporation | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails |
US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
US10966339B1 (en) * | 2011-06-28 | 2021-03-30 | Amazon Technologies, Inc. | Storage system with removable solid state storage devices mounted on carrier circuit boards |
US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
US9043035B2 (en) | 2011-11-29 | 2015-05-26 | International Business Machines Corporation | Dynamically limiting energy consumed by cooling apparatus |
US20130271918A1 (en) * | 2012-04-16 | 2013-10-17 | John Philip Neville Hughes | Cold plate with reduced bubble effects |
US9273906B2 (en) | 2012-06-14 | 2016-03-01 | International Business Machines Corporation | Modular pumping unit(s) facilitating cooling of electronic system(s) |
CN103517611A (en) * | 2012-06-19 | 2014-01-15 | 鸿富锦精密工业(深圳)有限公司 | Electronic device and heat dissipating device thereof |
US8913384B2 (en) | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
US9110476B2 (en) | 2012-06-20 | 2015-08-18 | International Business Machines Corporation | Controlled cooling of an electronic system based on projected conditions |
US9879926B2 (en) | 2012-06-20 | 2018-01-30 | International Business Machines Corporation | Controlled cooling of an electronic system for reduced energy consumption |
JP2014013849A (en) * | 2012-07-05 | 2014-01-23 | Fujikura Ltd | Heat dissipation structure for electronic apparatus |
TWI504852B (en) * | 2012-09-07 | 2015-10-21 | Compal Electronics Inc | Thermal dissipating module |
KR20150052063A (en) * | 2012-09-07 | 2015-05-13 | 톰슨 라이센싱 | Set top box having heat sink pressure applying means |
US9049811B2 (en) * | 2012-11-29 | 2015-06-02 | Bose Corporation | Circuit cooling |
US9313930B2 (en) | 2013-01-21 | 2016-04-12 | International Business Machines Corporation | Multi-level redundant cooling system for continuous cooling of an electronic system(s) |
US9390994B2 (en) * | 2013-08-07 | 2016-07-12 | Oracle International Corporation | Heat sinks with interdigitated heat pipes |
US10602642B2 (en) | 2013-12-11 | 2020-03-24 | Asia Vital Components Co., Ltd. | Back cover unit applied to portable device and having heat conduction function |
US10788869B2 (en) * | 2013-12-11 | 2020-09-29 | Asia Vital Components Co., Ltd. | Heat-conducting case unit for handheld electronic device |
US9706684B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Exfoliated graphite materials and composite materials and devices for thermal management |
US9700968B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Apparatus and methods for processing exfoliated graphite materials |
US9668334B2 (en) * | 2014-05-23 | 2017-05-30 | General Electric Company | Thermal clamp apparatus for electronic systems |
US10136558B2 (en) * | 2014-07-30 | 2018-11-20 | Dell Products L.P. | Information handling system thermal management enhanced by estimated energy states |
JP5955911B2 (en) * | 2014-08-27 | 2016-07-20 | 株式会社ジェイデバイス | Semiconductor device |
JP5854487B1 (en) * | 2014-10-28 | 2016-02-09 | Necプラットフォームズ株式会社 | External device heat dissipation structure, electronic device, and external device |
US9723753B2 (en) * | 2014-10-28 | 2017-08-01 | Hamilton Sundstrand Corporation | Planar heat cup with confined reservoir for electronic power component |
US11257527B2 (en) | 2015-05-06 | 2022-02-22 | SK Hynix Inc. | Memory module with battery and electronic system having the memory module |
KR20160131171A (en) * | 2015-05-06 | 2016-11-16 | 에스케이하이닉스 주식회사 | Memory module including battery |
US10220725B2 (en) * | 2015-05-13 | 2019-03-05 | Ge Global Sourcing Llc | System and method for passively cooling an enclosure |
EP3163989B1 (en) * | 2015-10-27 | 2021-06-02 | Samsung Electronics Co., Ltd. | Display apparatus and electronic apparatus having heat sink assembly |
KR102473586B1 (en) * | 2015-10-27 | 2022-12-05 | 삼성전자주식회사 | Display apparatus having heat sink assembly and electronic apparatus having the same |
US10356948B2 (en) * | 2015-12-31 | 2019-07-16 | DISH Technologies L.L.C. | Self-adjustable heat spreader system for set-top box assemblies |
US9823718B2 (en) * | 2016-01-13 | 2017-11-21 | Microsoft Technology Licensing, Llc | Device cooling |
US10327360B2 (en) | 2016-04-11 | 2019-06-18 | TechnoGuard Inc. | Method for decreasing air leakage between adjacent elements in a data center |
US10389397B2 (en) * | 2016-07-26 | 2019-08-20 | Laird Technologies, Inc. | Small form-factor pluggable (SFP) transceivers |
US10965333B2 (en) | 2016-07-26 | 2021-03-30 | Laird Technologies, Inc. | Thermal management assemblies suitable for use with transceivers and other devices |
JP6620725B2 (en) * | 2016-11-14 | 2019-12-18 | 株式会社オートネットワーク技術研究所 | Electrical junction box |
SE542115C2 (en) * | 2016-12-21 | 2020-02-25 | PrimeKey Solutions AB | A computer circuit board cooling arrangement |
DE102017103200A1 (en) | 2017-02-16 | 2018-08-16 | Fujitsu Technology Solutions Intellectual Property Gmbh | Cooling device for passive cooling of a computer system and computer system |
US10566262B2 (en) | 2017-09-12 | 2020-02-18 | Laird Technologies, Inc. | Thermal interface materials with wear-resisting layers and/or suitable for use between sliding components |
US10721840B2 (en) | 2017-10-11 | 2020-07-21 | DISH Technologies L.L.C. | Heat spreader assembly |
US10555439B2 (en) * | 2017-11-02 | 2020-02-04 | Laird Technologies, Inc. | Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components |
US11840013B2 (en) | 2018-02-27 | 2023-12-12 | Matthews International Corporation | Graphite materials and devices with surface micro-texturing |
JP7143647B2 (en) * | 2018-06-27 | 2022-09-29 | 株式会社村田製作所 | CIRCUIT MODULE AND CIRCUIT MODULE MANUFACTURING METHOD |
US10980151B2 (en) * | 2018-07-31 | 2021-04-13 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
EP3867729A4 (en) | 2018-12-18 | 2022-07-27 | CommScope Technologies LLC | Thermal management for modular electronic devices |
EP3994511A1 (en) | 2019-07-03 | 2022-05-11 | Telefonaktiebolaget LM ERICSSON (PUBL) | Thermally resistant remote radio unit |
US10806054B1 (en) * | 2019-08-06 | 2020-10-13 | Honeywell International Inc. | Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures |
US11483948B2 (en) * | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
US11415370B2 (en) | 2019-09-04 | 2022-08-16 | Toyota Motor Engineering & Manutacturing North America, Inc. | Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices |
CN111225544B (en) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | Heat sink for electronic component |
US11457545B2 (en) * | 2020-09-28 | 2022-09-27 | Google Llc | Thermal-control system of a media-streaming device and associated media-streaming devices |
US11477915B2 (en) * | 2021-01-14 | 2022-10-18 | Quanta Computer Inc. | Systems for cooling electronic components in a sealed computer chassis |
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CN115437480A (en) * | 2021-06-03 | 2022-12-06 | 英业达科技有限公司 | Servo device |
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US11800687B2 (en) | 2021-08-26 | 2023-10-24 | Dish Network L.L.C. | Heat transfer assembly |
JP7240470B1 (en) | 2021-10-18 | 2023-03-15 | レノボ・シンガポール・プライベート・リミテッド | Electronics and cooling modules |
US11665856B2 (en) * | 2021-10-26 | 2023-05-30 | Eagle Technology, Llc | Electronic device having flexible, heat conductive layer and associated methods |
US20230232596A1 (en) * | 2022-01-14 | 2023-07-20 | Nio Technology (Anhui) Co., Ltd. | Serviceable and accessible liquid cooled modules |
US12016111B2 (en) * | 2022-04-20 | 2024-06-18 | Western Digital Technologies, Inc. | Protective enclosure for an electronic device |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
US6027807A (en) * | 1995-01-11 | 2000-02-22 | Matsushita Electric Industrial Co., Ltd. | Graphite cladding laminate structural material and a graphite device having said material |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US20040069460A1 (en) * | 2002-05-08 | 2004-04-15 | Yasumi Sasaki | Thin sheet type heat pipe |
US20050280987A1 (en) * | 2004-06-07 | 2005-12-22 | Kwitek Benjamin J | Phase change materials as a heat sink for computers |
US20080053640A1 (en) * | 2006-08-31 | 2008-03-06 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
US20080123263A1 (en) * | 2006-11-28 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Device |
US7864532B1 (en) * | 2004-10-18 | 2011-01-04 | Lockheed Martin Corporation | Molded or encapsulated transmit-receive module or TR module/antenna element for active array |
US7965508B2 (en) * | 2007-03-27 | 2011-06-21 | Denso Corporation | Cooling device for electronic component and power converter equipped with the same |
US8074706B2 (en) * | 2006-04-21 | 2011-12-13 | Taiwan Microloops Corp. | Heat spreader with composite micro-structure |
US8305762B2 (en) * | 2006-02-22 | 2012-11-06 | Thales Nederland B.V. | Planar heat pipe for cooling |
US8355254B2 (en) * | 2009-07-16 | 2013-01-15 | Denso Corporation | Electronic control unit |
US9111822B2 (en) * | 2005-01-05 | 2015-08-18 | Koninklijke Philips N. V. | Thermally and electrically conductive apparatus |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0566095A (en) * | 1991-04-09 | 1993-03-19 | Akutoronikusu Kk | Heat joint device and manufacture thereof |
SE469298B (en) * | 1991-10-24 | 1993-06-14 | Ericsson Telefon Ab L M | DEVICE FOR COOLING ELECTRONICS BY RADIO TRANSMISSION |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
JPH08139235A (en) * | 1994-11-08 | 1996-05-31 | Hitachi Ltd | Electronic equipment and its manufacture |
US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
US6064572A (en) * | 1996-11-27 | 2000-05-16 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
US5991155A (en) * | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
US5818692A (en) * | 1997-05-30 | 1998-10-06 | Motorola, Inc. | Apparatus and method for cooling an electrical component |
JPH11186472A (en) * | 1997-12-17 | 1999-07-09 | Nec Eng Ltd | Heat radiating structure for in-module heat generating element |
JP3677403B2 (en) * | 1998-12-07 | 2005-08-03 | パイオニア株式会社 | Heat dissipation structure |
JP2000261175A (en) * | 1999-03-10 | 2000-09-22 | Fujikura Ltd | Cooling device for electronic unit |
EP2234154B1 (en) * | 2000-04-19 | 2016-03-30 | Denso Corporation | Coolant cooled type semiconductor device |
US6393853B1 (en) * | 2000-12-19 | 2002-05-28 | Nortel Networks Limited | Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms |
JP2002280782A (en) | 2001-03-22 | 2002-09-27 | Toshiba Corp | Mechanism for dissipating heat from heat generating component and transmitter for broadcast |
JP2002318084A (en) * | 2001-04-18 | 2002-10-31 | Matsushita Electric Ind Co Ltd | Heat pipe connecting device and radiation device of electronic apparatus |
US6421240B1 (en) * | 2001-04-30 | 2002-07-16 | Hewlett-Packard Company | Cooling arrangement for high performance electronic components |
JP4706125B2 (en) * | 2001-05-24 | 2011-06-22 | パナソニック株式会社 | Information processing device with heat dissipation buffer structure for functional unit |
US7608324B2 (en) * | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
US20030178174A1 (en) * | 2002-03-21 | 2003-09-25 | Belady Christian L. | Thermal pouch interface |
US7167366B2 (en) * | 2002-09-11 | 2007-01-23 | Kioan Cheon | Soft cooling jacket for electronic device |
US7286355B2 (en) * | 2002-09-11 | 2007-10-23 | Kioan Cheon | Cooling system for electronic devices |
US20040052052A1 (en) * | 2002-09-18 | 2004-03-18 | Rivera Rudy A. | Circuit cooling apparatus |
JP3740116B2 (en) * | 2002-11-11 | 2006-02-01 | 三菱電機株式会社 | Molded resin encapsulated power semiconductor device and manufacturing method thereof |
JP4199018B2 (en) * | 2003-02-14 | 2008-12-17 | 株式会社日立製作所 | Rack mount server system |
US7063127B2 (en) * | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
JP2005228954A (en) * | 2004-02-13 | 2005-08-25 | Fujitsu Ltd | Heat conduction mechanism, heat dissipation system, and communication apparatus |
US20060070720A1 (en) * | 2004-09-17 | 2006-04-06 | Capp Joseph P | Heat riser |
US7218129B2 (en) * | 2005-01-12 | 2007-05-15 | International Business Machines Corporation | System, apparatus and method for controlling temperature of an integrated circuit under test |
US20070076376A1 (en) * | 2005-09-30 | 2007-04-05 | Intel Corporation | Method, apparatus and computer system for providing for the transfer of thermal energy |
US7212409B1 (en) * | 2005-12-05 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Cam actuated cold plate |
US7403393B2 (en) * | 2005-12-28 | 2008-07-22 | International Business Machines Corporation | Apparatus and system for cooling heat producing components |
US8284004B2 (en) * | 2006-11-29 | 2012-10-09 | Honeywell International Inc. | Heat pipe supplemented transformer cooling |
CN103298320A (en) | 2007-12-19 | 2013-09-11 | 集群系统公司 | Cooling system for contact cooled electronic modules |
JP2011530190A (en) | 2008-08-04 | 2011-12-15 | クラスタード システムズ カンパニー | Electronic equipment housing with cooled contacts |
CN101749979B (en) * | 2008-12-22 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Radiating fin, radiator and electronic device |
-
2009
- 2009-08-04 JP JP2011522056A patent/JP2011530190A/en active Pending
- 2009-08-04 EP EP09805260A patent/EP2321607A1/en not_active Withdrawn
- 2009-08-04 US US12/535,272 patent/US8270170B2/en active Active
- 2009-08-04 WO PCT/US2009/004462 patent/WO2010016890A1/en active Application Filing
- 2009-08-04 CN CN2009801306172A patent/CN102112840A/en active Pending
-
2012
- 2012-08-17 US US13/588,836 patent/US20130208422A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
US6027807A (en) * | 1995-01-11 | 2000-02-22 | Matsushita Electric Industrial Co., Ltd. | Graphite cladding laminate structural material and a graphite device having said material |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US20040069460A1 (en) * | 2002-05-08 | 2004-04-15 | Yasumi Sasaki | Thin sheet type heat pipe |
US20050280987A1 (en) * | 2004-06-07 | 2005-12-22 | Kwitek Benjamin J | Phase change materials as a heat sink for computers |
US7864532B1 (en) * | 2004-10-18 | 2011-01-04 | Lockheed Martin Corporation | Molded or encapsulated transmit-receive module or TR module/antenna element for active array |
US9111822B2 (en) * | 2005-01-05 | 2015-08-18 | Koninklijke Philips N. V. | Thermally and electrically conductive apparatus |
US8305762B2 (en) * | 2006-02-22 | 2012-11-06 | Thales Nederland B.V. | Planar heat pipe for cooling |
US8074706B2 (en) * | 2006-04-21 | 2011-12-13 | Taiwan Microloops Corp. | Heat spreader with composite micro-structure |
US20080053640A1 (en) * | 2006-08-31 | 2008-03-06 | International Business Machines Corporation | Compliant vapor chamber chip packaging |
US20080123263A1 (en) * | 2006-11-28 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Device |
US7965508B2 (en) * | 2007-03-27 | 2011-06-21 | Denso Corporation | Cooling device for electronic component and power converter equipped with the same |
US8355254B2 (en) * | 2009-07-16 | 2013-01-15 | Denso Corporation | Electronic control unit |
Cited By (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9006035B2 (en) | 2011-07-20 | 2015-04-14 | Shunsin Technology (Zhong Shan) Limited | Method for manufacturing package structure with electronic component |
US20130153187A1 (en) * | 2011-12-14 | 2013-06-20 | International Business Machines Corporation | Dual Heat Sinks For Distributing A Thermal Load |
WO2015105741A1 (en) * | 2014-01-08 | 2015-07-16 | Tango Tech, Inc | High power portable device and docking system |
US20170196129A1 (en) * | 2014-04-14 | 2017-07-06 | Marco Feusi | Device for preventing data theft, use of false identity, and fraud during contactless data transmission via electromagnetic radio waves |
US11337300B2 (en) | 2015-01-30 | 2022-05-17 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
US9877380B2 (en) * | 2015-01-30 | 2018-01-23 | E. Solutions GmbH | Arrangement and method for electromagnetic shielding |
US10779393B2 (en) | 2015-01-30 | 2020-09-15 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
US20160227642A1 (en) * | 2015-01-30 | 2016-08-04 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
US9560737B2 (en) * | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
US20160262253A1 (en) * | 2015-03-04 | 2016-09-08 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
US10237964B2 (en) | 2015-03-04 | 2019-03-19 | International Business Machines Corporation | Manufacturing electronic package with heat transfer element(s) |
US20160352244A1 (en) * | 2015-05-28 | 2016-12-01 | Delta Electronics,Inc. | Power circuit module |
US10104813B2 (en) * | 2015-05-28 | 2018-10-16 | Delta Electronics, Inc. | Power circuit module |
US10524362B2 (en) | 2015-07-15 | 2019-12-31 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
US10378924B2 (en) | 2015-09-25 | 2019-08-13 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US10257939B2 (en) | 2015-09-25 | 2019-04-09 | International Business Machines Corporation | Method of fabricating tamper-respondent sensor |
US9717154B2 (en) | 2015-09-25 | 2017-07-25 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US10264665B2 (en) | 2015-09-25 | 2019-04-16 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US10685146B2 (en) | 2015-09-25 | 2020-06-16 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US9913362B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US10271434B2 (en) | 2015-09-25 | 2019-04-23 | International Business Machines Corporation | Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage |
US9913416B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US10624202B2 (en) | 2015-09-25 | 2020-04-14 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US9936573B2 (en) | 2015-09-25 | 2018-04-03 | International Business Machines Corporation | Tamper-respondent assemblies |
US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US10178818B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US10395067B2 (en) | 2015-09-25 | 2019-08-27 | International Business Machines Corporation | Method of fabricating a tamper-respondent sensor assembly |
US10334722B2 (en) | 2015-09-25 | 2019-06-25 | International Business Machines Corporation | Tamper-respondent assemblies |
US10168185B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US10378925B2 (en) | 2015-09-25 | 2019-08-13 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US10331915B2 (en) | 2015-09-25 | 2019-06-25 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US10143090B2 (en) | 2015-10-19 | 2018-11-27 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
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US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
US10251288B2 (en) | 2015-12-01 | 2019-04-02 | International Business Machines Corporation | Tamper-respondent assembly with vent structure |
US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US10172232B2 (en) | 2015-12-18 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
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US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US9877383B2 (en) | 2015-12-18 | 2018-01-23 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US10115275B2 (en) | 2016-02-25 | 2018-10-30 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US10169968B1 (en) | 2016-02-25 | 2019-01-01 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US10217336B2 (en) | 2016-02-25 | 2019-02-26 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US10169967B1 (en) | 2016-02-25 | 2019-01-01 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US11606880B2 (en) | 2016-03-03 | 2023-03-14 | Wuxi Kalannipu Thermal Management Technology Co., Ltd. | Self-organizing thermodynamic system |
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US9795055B1 (en) * | 2016-04-18 | 2017-10-17 | International Business Machines Corporation | Electronics cooling assembly with multi-position, airflow-blocking mechanism |
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US10345874B1 (en) | 2016-05-02 | 2019-07-09 | Juniper Networks, Inc | Apparatus, system, and method for decreasing heat migration in ganged heatsinks |
US10177102B2 (en) | 2016-05-13 | 2019-01-08 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US10257924B2 (en) | 2016-05-13 | 2019-04-09 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
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US10535619B2 (en) | 2016-05-13 | 2020-01-14 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
US10242543B2 (en) | 2016-06-28 | 2019-03-26 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
US10667389B2 (en) | 2016-09-26 | 2020-05-26 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
US10591964B1 (en) * | 2017-02-14 | 2020-03-17 | Juniper Networks, Inc | Apparatus, system, and method for improved heat spreading in heatsinks |
US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
US10531561B2 (en) | 2018-02-22 | 2020-01-07 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
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US10980103B2 (en) * | 2018-04-25 | 2021-04-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Cooling of power electronics circuits |
US10595439B2 (en) * | 2018-06-25 | 2020-03-17 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US20190045663A1 (en) * | 2018-06-25 | 2019-02-07 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US11467637B2 (en) | 2018-07-31 | 2022-10-11 | Wuxi Kalannipu Thermal Management Technology Co., Ltd. | Modular computer cooling system |
WO2020028181A1 (en) * | 2018-07-31 | 2020-02-06 | Coolanyp, LLC | Modular computer cooling system |
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US11304338B1 (en) | 2020-12-01 | 2022-04-12 | Nan Chen | System, method, and apparatus for a high-efficiency heat riser |
Also Published As
Publication number | Publication date |
---|---|
CN102112840A (en) | 2011-06-29 |
WO2010016890A1 (en) | 2010-02-11 |
EP2321607A1 (en) | 2011-05-18 |
US8270170B2 (en) | 2012-09-18 |
US20100027220A1 (en) | 2010-02-04 |
JP2011530190A (en) | 2011-12-15 |
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