CN110911368B - Integrated circuit with automatic heat dissipation function - Google Patents
Integrated circuit with automatic heat dissipation function Download PDFInfo
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- CN110911368B CN110911368B CN201911332958.XA CN201911332958A CN110911368B CN 110911368 B CN110911368 B CN 110911368B CN 201911332958 A CN201911332958 A CN 201911332958A CN 110911368 B CN110911368 B CN 110911368B
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- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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Abstract
The invention discloses an integrated circuit with automatic heat dissipation function, belonging to the technical field of integrated circuits, the integrated circuit with automatic heat dissipation function comprises an integrated circuit, a substrate is arranged below the integrated circuit, one end of the substrate close to the integrated circuit is provided with a mounting groove, the inner bottom end of the mounting groove is fixedly connected with a heat conductor, the heat generated in the working process of the integrated circuit can be reduced through a micro radiator, meanwhile, the heat on the integrated circuit is led out through the arrangement of the heat conductor, an expansion body gradually expands after receiving the heat of the heat conductor to drive a sub conductive copper sheet to be contacted with a mother conductive copper sheet, the start of the micro radiator is realized, after the heat of the integrated circuit is reduced, the expansion body gradually recovers to the original state to separate the sub conductive copper sheet from the mother conductive copper sheet, the close of the micro radiator is realized, and the automatic start and close of the micro radiator can be realized in the process, the manpower is saved and the power resource is saved.
Description
Technical Field
The present invention relates to the field of integrated circuit technology, and more particularly, to an integrated circuit with an automatic heat dissipation function.
Background
An integrated circuit (integrated circuit) is a type of microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
Along with the high-speed development of electronic technology, the integration degree of an integrated circuit is higher and higher, the heat productivity of the integrated circuit is higher and higher, the integrated circuit is easy to overheat and cannot work if the heat is too high and is not discharged in time, even components are burnt out, great damage is caused to electrical equipment, and the use safety can also be poor.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to solve the problems in the prior art and provides an integrated circuit with an automatic heat dissipation function, which can reduce the heat generated in the working process of the integrated circuit through a micro radiator, meanwhile, the heat on the integrated circuit is led out through the arrangement of a heat conductor, an expansion body gradually expands after receiving the heat of the heat conductor to drive a sub conductive copper sheet to be in contact with a mother conductive copper sheet, so that the micro radiator is started, and after the heat of the integrated circuit is reduced, the expansion body gradually recovers to the original state to separate the sub conductive copper sheet from the mother conductive copper sheet, so that the micro radiator is closed.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
An integrated circuit with an automatic heat dissipation function comprises an integrated circuit, wherein a substrate is arranged below the integrated circuit, a mounting groove is formed in one end, close to the integrated circuit, of the substrate, a heat conductor is fixedly connected to the inner bottom end of the mounting groove, the upper end of the heat conductor is in contact with the integrated circuit, a plurality of accommodating grooves are formed in the inner wall of the mounting groove, jacks are formed in the top end of the accommodating grooves, a plurality of micro radiators are fixedly connected to the upper end of the substrate, the integrated circuit is located on the inner sides of the micro radiators, the bottom ends of the micro radiators are connected with wires, one ends, far away from the micro radiators, of the wires penetrate through the jacks and are connected with a mother conductive copper sheet, expansion bodies are arranged inside the accommodating grooves, a son conductive copper sheet is bonded to one end, close to the mother conductive copper sheet, of the expansion bodies is in contact with the inner bottom ends of the accommodating grooves, and the son conductive copper sheet is matched with the mother conductive copper sheet, can reduce produced heat in the integrated circuit course of operation through miniature radiator, simultaneously through the setting of heat conductor, derive the heat on the integrated circuit, the inflation body expands gradually and drives son conductive copper sheet and mother conductive copper sheet contact after receiving the heat of heat conductor, realize the start-up of miniature radiator, after the integrated circuit heat reduces, the inflation body restores to the original state gradually and makes son conductive copper sheet and mother conductive copper sheet separation, realize closing of miniature radiator, the automation that can realize miniature radiator in this process is opened and close, can practice thrift power resource when using manpower sparingly.
Further, be equipped with the heat dissipation between integrated circuit and the base plate and glue, integrated circuit and base plate all glue with the heat dissipation and bond mutually, the heat dissipation is glued and is the organic silica gel area of two-sided heat dissipation, glues through the heat dissipation and makes bonding between integrated circuit and the base plate, replaces the connected mode of most traditional screws, is difficult for causing the damage of integrated circuit or base plate, and the heat dissipation is glued when playing the bonding effect, can also provide effectual heat dispersion, carries out appropriate cooling operation to the contact surface of integrated circuit and base plate, is favorable to improving integrated circuit's radiating efficiency.
Furthermore, the heat conductor is a heat-conducting silica gel sheet, one end of the heat conductor, which is in contact with the integrated circuit, is bonded, heat generated in the working process of the integrated circuit is guided out through the arrangement of the heat conductor, and is transferred into the expansion body, so that the expansion process of the expansion body is realized, meanwhile, the heat conductor has certain viscosity, when the heat conductor is in contact with the integrated circuit, the integrated circuit and the heat conductor can be bonded through the viscosity of the heat conductor, and the bonding effect between the integrated circuit and the substrate is further enhanced.
Furthermore, the end, close to each other, of each of the female conductive copper sheet and the sub conductive copper sheet is coated with a conductive paste, the conductive paste is an electrical contact coating with good electrical performance, and can effectively prevent the oxidation phenomenon caused by the corrosion of the conductive surface of the female conductive copper sheet or the sub conductive copper sheet by the atmosphere, and when the sub conductive copper sheet is in contact with the female conductive copper sheet, the contact between the female conductive copper sheet and the sub conductive copper sheet can be tighter due to the arrangement of the conductive paste, and the electrical conductivity is better.
Furthermore, a positioning polishing piece is fixedly connected to the upper end of the secondary conductive copper sheet, the height of the positioning polishing piece and the height of the secondary conductive copper sheet are equal to the height of the cross section of the accommodating groove, the expansion body is heated and expanded to drive the secondary conductive copper sheet to move to be in contact with the primary conductive copper sheet, the position of the secondary conductive copper sheet can be changed along with the expansion of the expansion body (namely, the secondary conductive copper sheet cannot be in contact with the bottom end in the accommodating groove), and therefore the secondary conductive copper sheet can not be completely attached to the position of the primary conductive copper sheet.
Furthermore, the expansion body comprises a hollow expansion ball, the sub conductive copper sheets are connected with the hollow expansion ball, air is filled in the hollow expansion ball, when the heat conductor conducts heat in the integrated circuit out, the air in the hollow expansion ball is heated to expand so that the volume of the hollow expansion ball is enlarged, and then the hollow expansion ball can drive the sub conductive copper sheets to move to be gradually close to the main conductive copper sheets.
Further, the air filled in the hollow expansion ball is a mixed gas of nitrogen and helium, and the filling ratio of the nitrogen to the helium is 5: 1-2, nitrogen gas and helium all can expand after being heated, and both all can regard as to fill the protective gas, are difficult for taking place chemical reaction each other, use comparatively safely, and the coefficient of thermal expansion of helium is higher than nitrogen gas, and the price is far higher than nitrogen gas, sets up through suitable filling proportion, can practice thrift manufacturing cost when as far as possible increase inflation body coefficient of expansion.
Furthermore, one end of the hollow expansion ball close to the heat conductor is bonded with the heat conductor, the heat conductor has certain viscosity, the bonding between the hollow expansion ball and the heat conductor can be easily completed, the bonding point is the middle point of the hollow expansion ball close to the accommodating groove, the initial position of the hollow expansion ball can be limited through the bonding between the hollow expansion ball and the heat conductor, after the hollow expansion ball expands, the female conductive copper sheet is contacted with the sub conductive copper sheet to start the micro radiator, the micro radiator starts the radiating operation of the integrated circuit, after the heat of the integrated circuit is reduced, the expansion body is gradually restored to the original position, due to the bonding effect between the hollow expansion ball and the heat conductor, the hollow expansion ball is not easy to move freely in the accommodating groove, so that the female conductive copper sheet and the sub conductive copper sheet have the possibility of re-contact, the maximum height of the cross section of the hollow expansion ball is equal to the height of the cross section of the accommodating groove, the longitudinal deformation range of the hollow expansion ball is limited, so that the expansion deformation direction of the hollow expansion ball is mainly embodied as transverse, and the speed of the child conductive copper sheet approaching the parent conductive copper sheet can be increased.
Furthermore, the hollow expansion ball is of an oval structure, and is made of a high-temperature-resistant flexible material doped with a heat conduction material, so that heat on the heat conductor can be rapidly transferred into the hollow expansion ball, and the hollow expansion ball is not easily affected by the heat of the heat conductor and is damaged.
Further, the vertical plane that the inner wall place of heat conductor was kept away from to the jack and the vertical plane that the inner wall place of heat conductor was kept away from to the holding tank lie in the coplanar, make female conductive copper sheet can contact with the holding tank lateral wall when with the holding tank in the bottom contact, when son conductive copper sheet remove to with the contact of female conductive copper sheet, because of the effect that blocks of holding tank lateral wall, the laminating between female conductive copper sheet and the son conductive copper sheet is inseparabler, and the laminating position is more accurate.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can reduce produced heat in the integrated circuit working process through miniature radiator, simultaneously through the setting of heat conductor, derive the heat on the integrated circuit, the inflation body expands gradually and drives son conductive copper sheet and female conductive copper sheet contact after receiving the heat of heat conductor, realize the start-up of miniature radiator, after the integrated circuit heat reduces, the inflation body restores to the original state gradually and makes son conductive copper sheet and female conductive copper sheet separation, realize closing of miniature radiator, this in-process can realize the automation of miniature radiator and open and close, can practice thrift power resource when using manpower sparingly.
(2) Be equipped with the heat dissipation between integrated circuit and the base plate and glue, integrated circuit and base plate all glue mutually with the heat dissipation and bond, the heat dissipation is glued and is taken for two-sided heat dissipation organic silica gel, glue through the heat dissipation and make bonding between integrated circuit and the base plate, replace the connected mode of most traditional screws, be difficult for causing the damage of integrated circuit or base plate, the heat dissipation is glued when playing the bonding effect, can also provide effectual heat dispersion, carry out appropriate cooling operation to the contact surface of integrated circuit and base plate, be favorable to improving integrated circuit's radiating efficiency.
(3) The heat conductor is heat conduction silica gel sheet, the heat conductor bonds with integrated circuit one end of mutual contact mutually, produced heat guide away in with the integrated circuit working process through setting up of heat conductor, and with heat transfer to the inflation in, realize the inflation process of inflation body, heat conductor itself has certain viscidity simultaneously, when the heat conductor contacts with integrated circuit, its self viscidity effect can make and bond mutually between integrated circuit and the heat conductor, further strengthen the adhesive bonding between integrated circuit and the base plate.
(4) The conductive paste is an electric contact coating with good electrical property, can effectively prevent the oxidation phenomenon generated by the corrosion of the conductive surface of the mother conductive copper sheet or the son conductive copper sheet by the atmosphere, and can ensure that the mother conductive copper sheet and the son conductive copper sheet are in closer contact and have better electrical conductivity when in contact.
(5) The upper end of the secondary conductive copper sheet is fixedly connected with a positioning polishing sheet, the height of the positioning polishing sheet and the height of the secondary conductive copper sheet are equal to the height of the cross section of the accommodating groove, the expansion body is heated and expanded to drive the secondary conductive copper sheet to move to be in contact with the primary conductive copper sheet, the position of the secondary conductive copper sheet can be changed along with the expansion of the expansion body (namely, the secondary conductive copper sheet can not be in contact with the bottom end in the accommodating groove), the secondary conductive copper sheet can not be completely attached to the position of the primary conductive copper sheet possibly, the positioning polishing sheet can play a limiting role in moving the secondary conductive copper sheet, the expansion body is enabled to drive the secondary conductive copper sheet to move, the secondary conductive copper sheet can always keep the original track to move, the primary conductive copper sheet and the secondary conductive copper sheet can be completely attached to each other, and the circuit conduction process between the primary conductive copper sheet and the secondary conductive copper sheet can be completed.
(6) The expansion body comprises a hollow expansion ball, the sub conductive copper sheet is connected with the hollow expansion ball, air is filled in the hollow expansion ball, when heat in the integrated circuit is led out by the heat conductor, the air in the hollow expansion ball is heated to expand so that the volume of the hollow expansion ball is enlarged, and then the hollow expansion ball can be used for driving the sub conductive copper sheet to move to be gradually close to the main conductive copper sheet.
(7) The air filled in the hollow expansion ball is a mixed gas of nitrogen and helium, and the filling ratio of the nitrogen to the helium is 5: 1-2, nitrogen gas and helium all can expand after being heated, and both all can regard as to fill the protective gas, are difficult for taking place chemical reaction each other, use comparatively safely, and the coefficient of thermal expansion of helium is higher than nitrogen gas, and the price is far higher than nitrogen gas, sets up through suitable filling proportion, can practice thrift manufacturing cost when as far as possible increase inflation body coefficient of expansion.
(8) One end of the hollow expansion ball close to the heat conductor is bonded with the heat conductor, the heat conductor has certain viscosity, the bonding between the hollow expansion ball and the heat conductor can be easily completed, the bonding point is the middle point of the hollow expansion ball close to the containing groove, the initial position of the hollow expansion ball can be limited through the bonding between the hollow expansion ball and the heat conductor, after the hollow expansion ball expands, the female conductive copper sheet is contacted with the sub conductive copper sheet and starts the micro radiator, the micro radiator starts the radiating operation of the integrated circuit, after the heat of the integrated circuit is reduced, the expansion body gradually returns to the original position, due to the bonding effect between the hollow expansion ball and the heat conductor, the hollow expansion ball is not easy to move freely in the containing groove, the female conductive copper sheet is not contacted with the sub conductive copper sheet again, the maximum height of the section of the hollow expansion ball is equal to the height of the section of the containing groove, the longitudinal deformation range of the hollow expansion ball is limited, so that the expansion deformation direction of the hollow expansion ball is mainly embodied as transverse, and the speed of the child conductive copper sheet approaching the parent conductive copper sheet can be increased.
(9) The hollow expansion ball is of an oval structure, is made of a high-temperature-resistant flexible material doped with a heat conduction material, so that when heat on the heat conductor can be rapidly transferred into the hollow expansion ball, the hollow expansion ball is not easily influenced by the heat of the heat conductor and is damaged to some extent.
(10) The vertical plane at the inner wall place that the heat conductor was kept away from to the jack and the vertical plane at the inner wall place that the heat conductor was kept away from to the holding tank lie in the coplanar, make female conductive copper sheet can contact with the holding tank lateral wall when with the holding tank in the bottom contact, when son conductive copper sheet remove to with the contact of female conductive copper sheet, because of the effect that blocks of holding tank lateral wall, the laminating between female conductive copper sheet and the son conductive copper sheet is inseparabler, and the laminating position is more accurate.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic structural view of an inflation body portion of the present invention;
FIG. 3 is a schematic structural diagram of a sub-conductive copper sheet portion according to the present invention;
fig. 4 is a schematic structural view of the expansion body of the present invention when expanded.
The reference numbers in the figures illustrate:
1 integrated circuit, 2 heat dissipation glue, 31 micro radiator, 32 lead, 33 mother conductive copper sheet, 34 son conductive copper sheet, 35 conductive paste, 41 substrate, 42 mounting groove, 43 accommodating groove, 5 heat conductor, 6 hollow expansion ball and 7 positioning polishing sheet.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, an integrated circuit with an automatic heat dissipation function includes an integrated circuit 1, a substrate 41 is disposed below the integrated circuit 1, a heat dissipation adhesive 2 is disposed between the integrated circuit 1 and the substrate 41, both the integrated circuit 1 and the substrate 41 are bonded with the heat dissipation adhesive 2, the heat dissipation adhesive 2 is a double-sided heat dissipation organic silica gel tape, the integrated circuit 1 and the substrate 41 are bonded through the heat dissipation adhesive 2, a majority of conventional screw connection modes are replaced, the integrated circuit 1 or the substrate 41 is not easily damaged, the heat dissipation adhesive 2 plays a role in bonding, and can also provide effective heat dissipation performance, the contact surface between the integrated circuit 1 and the substrate 41 is properly cooled, which is beneficial to improving the heat dissipation efficiency of the integrated circuit 1.
The one end that base plate 41 is close to integrated circuit 1 is dug and is had mounting groove 42, the bottom end fixedly connected with heat conductor 5 in mounting groove 42, 5 upper ends of heat conductor contact with integrated circuit 1, heat conductor 5 is heat conduction silica gel piece, heat conductor 5 bonds with integrated circuit 1 one end of mutual contact, produced heat guide away in with integrated circuit 1 course of operation through setting up of heat conductor 5, and with heat transfer to the inflation in, realize the inflation process of the inflation body, heat conductor 5 itself has certain viscidity simultaneously, when heat conductor 5 contacts with integrated circuit 1, its self viscidity effect can make and bond between integrated circuit 1 and the heat conductor 5 mutually, further strengthen the adhesive effect between integrated circuit 1 and the base plate 41.
A plurality of accommodating grooves 43 are chiseled on the inner wall of the mounting groove 42, a jack is chiseled at the top end in the accommodating groove 43, the vertical plane where the inner wall of the jack far from the heat conductor 5 is located on the same plane as the vertical plane where the inner wall of the accommodating groove 43 far from the heat conductor 5 is located, so that the female conductive copper sheet 33 can contact with the side wall of the accommodating groove 43 while contacting with the inner bottom end of the accommodating groove 43, when the sub conductive copper sheet 34 moves to contact with the female conductive copper sheet 33, the fit between the female conductive copper sheet 33 and the sub conductive copper sheet 34 is tighter due to the blocking effect of the side wall of the accommodating groove 43, the fit position is more accurate, the upper end of the substrate 41 is fixedly connected with a plurality of micro radiators 31, the integrated circuit 1 is located at the inner sides of the plurality of micro radiators 31, the bottom end of the micro radiator 31 is connected with a lead 32, one end of the lead 32 far from the micro radiator 31 penetrates through the jack and is connected with the female conductive copper sheet 33, the accommodating groove 43 is provided with an expansion body therein.
Referring to fig. 2, the expansion body includes a hollow expansion ball 6, the hollow expansion ball 6 is an oval structure, the hollow expansion ball 6 is made of a high temperature resistant flexible material doped with a heat conductive material, so that heat on the heat conductor 5 can be rapidly transferred into the hollow expansion ball 6, the hollow expansion ball 6 is not easily damaged by the heat of the heat conductor 5, the sub conductive copper sheet 34 is connected with the hollow expansion ball 6, the hollow expansion ball 6 is filled with air, when the heat conductor 5 conducts heat in the integrated circuit 1, the air in the hollow expansion ball 6 expands by heating to increase the volume of the hollow expansion ball 6, and the hollow expansion ball 6 can drive the sub conductive copper sheet 34 to move to be gradually close to the main conductive copper sheet 33.
The air filled in the hollow expansion ball 6 is a mixed gas of nitrogen and helium, and the filling ratio of the nitrogen to the helium is 5: 1, nitrogen gas and helium all can expand after being heated, and both all can regard as to fill the protective gas, are difficult for taking place chemical reaction each other, use comparatively safely, and the coefficient of thermal expansion of helium is higher than nitrogen gas, and the price is far higher than nitrogen gas, sets up through suitable filling proportion, can practice thrift manufacturing cost when as far as possible increase inflation body coefficient of expansion.
One end of the hollow expansion ball 6 close to the heat conductor 5 is bonded with the heat conductor 5, the heat conductor 5 has certain viscosity, the bonding between the hollow expansion ball 6 and the heat conductor 5 can be easily completed, the bonding point is the middle point of the hollow expansion ball 6 close to the accommodating groove 43, the initial position of the hollow expansion ball 6 can be limited through the bonding between the hollow expansion ball 6 and the heat conductor 5, when the hollow expansion ball 6 expands, the female conductive copper sheet 33 is contacted with the sub conductive copper sheet 34 to trigger the micro radiator 31, the micro radiator 31 starts the radiating operation of the integrated circuit 1, when the heat of the integrated circuit 1 is reduced, the expansion body gradually returns to the original position, the hollow expansion ball 6 is not easy to move freely in the accommodating groove 43 due to the bonding between the hollow expansion ball 6 and the heat conductor 5, so that the female conductive copper sheet 33 and the sub conductive copper sheet 34 have the possibility of re-contact, the maximum height of the section of the hollow expansion ball 6 is equal to the height of the section of the accommodating groove 43, the longitudinal deformation range of the hollow expansion ball 6 is limited, so that the expansion deformation direction of the hollow expansion ball 6 is mainly horizontal, and the speed of the sub conductive copper sheet 34 approaching the main conductive copper sheet 33 can be increased.
Referring to fig. 1, a sub conductive copper sheet 34 is adhered to one end of the expansion body close to the female conductive copper sheet 33, the sub conductive copper sheet 34 is in contact with the inner bottom end of the accommodation groove 43, and the sub conductive copper sheet 34 is matched with the female conductive copper sheet 33.
Referring to fig. 3, the upper end of the sub-conductive copper sheet 34 is fixedly connected with a positioning polishing sheet 7, the height of the positioning polishing sheet 7 and the height of the sub-conductive copper sheet 34 are equal to the height of the cross section of the accommodating groove 43, when the expansion body expands under heat and drives the sub-conductive copper sheet 34 to move to contact with the main conductive copper sheet 33, the position of the sub-conductive copper piece 34 may be changed according to the expansion of the expansion body (i.e. the sub-conductive copper piece 34 may not contact the bottom end in the receiving groove 43), and further, the positions of the sub conductive copper sheet 34 and the mother conductive copper sheet 33 can not be completely attached, the positioning polishing sheet 7 can limit the movement of the sub conductive copper sheet 34, so that in the process that the expansion body expands to drive the sub conductive copper sheet 34 to move, the sub conductive copper sheet 34 can always keep the original track to move, therefore, the female conductive copper sheet 33 and the sub conductive copper sheet 34 can be completely attached to each other, and the circuit conduction process between the two is completed.
Referring to fig. 3, the conductive paste 35 is coated on the end of the mother conductive copper sheet 33 close to the child conductive copper sheet 34, and the conductive paste 35 is an electrical contact coating with good electrical performance, which can effectively prevent the conductive surface of the mother conductive copper sheet 33 or the child conductive copper sheet 34 from being oxidized due to the erosion of the atmosphere, and when the child conductive copper sheet 34 contacts the mother conductive copper sheet 33, the conductive paste 35 can make the contact between the two sheets tighter and the conductivity better.
The heat generated by the upper half part of the integrated circuit 1 in the working process is dissipated to the outside air, a small part of the heat generated by the lower half part (namely the contact part of the integrated circuit 1 and the substrate 41) can be dissipated through the heat dissipation adhesive 2, most of the heat is conducted into the heat conductor 5, the heat conductor 5 gradually rises the temperature of the heat conductor 5 when receiving the heat of the integrated circuit 1, in the process, the expansion body is heated and expands to change the volume of the expansion body, the expansion body drives the active conductive copper sheet 34 to move to be gradually close to the parent conductive copper sheet 33 when expanding, when the parent conductive copper sheet 33 is contacted with the active conductive copper sheet 34, the circuit is conducted, the micro radiator 31 is started, the integrated circuit 1 is further radiated through the micro radiator 31, and when the temperature of the integrated circuit 1 is reduced, the expansion body gradually recovers to drive the active conductive copper sheet 34 to be far away from the parent conductive copper sheet 33, the circuit is disconnected, the micro radiator 31 is closed, the heat generated in the working process of the integrated circuit 1 can be reduced through the micro radiator 31, meanwhile, the heat on the integrated circuit 1 is led out through the arrangement of the heat conductor 5, the expansion body gradually expands after receiving the heat of the heat conductor 5 to drive the sub conductive copper sheet 34 to be in contact with the mother conductive copper sheet 33, the micro radiator 31 is started, after the heat of the integrated circuit 1 is reduced, the expansion body gradually recovers to the original state to separate the sub conductive copper sheet 34 from the mother conductive copper sheet 33, the micro radiator 31 is closed, automatic opening and closing of the micro radiator 31 can be achieved in the process, manpower is saved, and meanwhile power resources can be saved.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (7)
1. An integrated circuit with automatic heat dissipation function, comprising an integrated circuit (1), a substrate (41) is arranged below the integrated circuit (1), and the integrated circuit is characterized in that: the heat sink is characterized in that one end, close to the integrated circuit (1), of the substrate (41) is provided with a mounting groove (42), a heat conductor (5) is fixedly connected to the inner bottom end of the mounting groove (42), the upper end of the heat conductor (5) is in contact with the integrated circuit (1), a plurality of accommodating grooves (43) are formed in the inner wall of the mounting groove (42), jacks are formed in the inner top end of the accommodating grooves (43), the upper end of the substrate (41) is fixedly connected with a plurality of micro radiators (31), the integrated circuit (1) is located on the inner sides of the micro radiators (31), the bottom end of each micro radiator (31) is connected with a lead (32), one end, far away from the micro radiators (31), of each lead (32) penetrates through the jacks and is connected with a female conductive copper sheet (33), an expansion body is arranged inside the accommodating groove (43), and one end, close to the female conductive copper sheet (33), of the expansion body is bonded with a sub conductive copper sheet (34), the sub conductive copper sheet (34) is contacted with the inner bottom end of the accommodating groove (43), and the sub conductive copper sheet (34) is matched with the female conductive copper sheet (33);
the upper end of the sub conductive copper sheet (34) is fixedly connected with a positioning polishing sheet (7), and the sum of the heights of the positioning polishing sheet (7) and the sub conductive copper sheet (34) is equal to the height of the section of the accommodating groove (43);
the expansion body comprises a hollow expansion ball (6), the sub-conductive copper sheet (34) is connected with the hollow expansion ball (6), and air is filled in the hollow expansion ball (6);
one end of the hollow expansion ball (6) close to the heat conductor (5) is bonded with the heat conductor (5), and the maximum height of the cross section of the hollow expansion ball (6) is equal to the height of the cross section of the accommodating groove (43).
2. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: be equipped with heat dissipation between integrated circuit (1) and base plate (41) and glue (2), integrated circuit (1) and base plate (41) all bond mutually with heat dissipation glue (2), heat dissipation glue (2) are two-sided heat dissipation organic silica gel area.
3. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: the heat conductor (5) is a heat-conducting silica gel sheet, and one end of the heat conductor (5) which is contacted with the integrated circuit (1) is bonded.
4. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: and one end of each female conductive copper sheet (33) close to one end of each sub conductive copper sheet (34) is coated with a conductive paste (35).
5. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: the air filled in the hollow expansion ball (6) is a mixed gas of nitrogen and helium, and the filling ratio of the nitrogen to the helium is 5: 1-2.
6. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: the hollow expansion ball (6) is of an oval structure, and the hollow expansion ball (6) is made of high-temperature-resistant flexible materials doped with heat conduction materials.
7. An integrated circuit with automatic heat dissipation function as claimed in claim 1, wherein: the vertical plane where the inner wall of the jack far away from the heat conductor (5) is located and the vertical plane where the inner wall of the accommodating groove (43) far away from the heat conductor (5) is located are located on the same plane.
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| CN201911332958.XA CN110911368B (en) | 2019-12-23 | 2019-12-23 | Integrated circuit with automatic heat dissipation function |
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| CN201911332958.XA CN110911368B (en) | 2019-12-23 | 2019-12-23 | Integrated circuit with automatic heat dissipation function |
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