CN112103250A - Floating shock-absorbing heat dissipation type semiconductor packaging structure - Google Patents
Floating shock-absorbing heat dissipation type semiconductor packaging structure Download PDFInfo
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- CN112103250A CN112103250A CN202010918600.1A CN202010918600A CN112103250A CN 112103250 A CN112103250 A CN 112103250A CN 202010918600 A CN202010918600 A CN 202010918600A CN 112103250 A CN112103250 A CN 112103250A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a floating shock-absorbing heat dissipation type semiconductor packaging structure, which belongs to the field of semiconductor packaging and comprises a circuit board body, wherein the lower end of the circuit board body is welded with a semiconductor chip main body, a sealing plate is attached to the semiconductor chip main body, two pairs of extending columns are fixedly connected to the sealing plate, the upper surface of the circuit board body is fixedly connected with a bottom plate, the inner wall of the bottom plate is slidably connected with a floating buffer shell, one end of the floating buffer shell, which is far away from the circuit board body, is fixedly connected with a heat dissipation plate, the inner wall of the floating buffer shell is fixedly connected with a heat exchange plate, the upper surface of the circuit board body is attached with a heat conduction film, a plurality of buffer balls are connected between the heat conduction film and the heat exchange plate, the loss of silicone grease in the packaging structure can be reduced, and different heat, the heat dissipation assembly is prevented from aging due to long-time work, and the service life of the device is prolonged.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a floating shock-absorbing heat dissipation type semiconductor packaging structure.
Background
With the rapid development of wireless communication, automotive electronics, and other consumer electronics products, microelectronic packaging technology is developing towards multifunction, miniaturization, portability, high speed, low power consumption, and high reliability. The system-in-package is a novel packaging technology, and can effectively reduce the packaging area.
The existing multifunctional SIP packaging chip is to attach one or more bare chips on the surface of a packaging substrate, along with the high integration of the chip, the power is larger and larger, the heat generated by the chip is dissipated into a problem which needs to be considered in the packaging process, except for a small part of the heat which is dissipated outwards through a bottom carrier plate and welding spots, the main heat is dissipated through the surface of the chip, therefore, the existing chip packaging design is generally to add a heat dissipation cover on the chip, and the heat dissipation cover is adhered on the chip and the carrier plate through a heat conduction material to form a sealed packaging structure, however, the chip generates high heat, and the heat conduction performance of the sealed packaging structure is not good, so that the temperature around the chip is too high, and the working efficiency of the chip is affected.
The current heat conduction material can age gradually under long-time use, makes the heat conductivility of heat conduction material descend to influence the radiating effect, and the heat conduction material is sealed in packaging structure, can not change, so need a packaging structure that can work for a long time and the radiating effect is good.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to provide a floating shock-absorbing heat dissipation type semiconductor packaging structure, which can reduce the loss of silicone grease in the packaging structure, gradually increase different heat dissipation components for different heat productivity, avoid the aging of the heat dissipation components caused by long-time work, prolong the service life of the device, and perform buffer protection when external impact is applied to prevent a semiconductor chip from being damaged.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A heat dissipation type semiconductor packaging structure with floating shock absorption comprises a circuit board body, wherein a semiconductor chip main body is welded at the lower end of the circuit board body, a sealing plate is attached to the semiconductor chip main body, two pairs of extending columns are fixedly connected to the sealing plate, a bottom plate is fixedly connected to the upper surface of the circuit board body, jacks matched with the extending columns are formed in the circuit board body and the bottom plate, a floating buffer shell is connected to the inner wall of the bottom plate in a sliding mode, a heat dissipation plate is fixedly connected to one end, away from the circuit board body, of the floating buffer shell, a heat exchange plate is fixedly connected to the inner wall of the floating buffer shell, a heat conduction film is attached to the upper surface of the circuit board body, two ends of the heat conduction film extend into the floating buffer shell and are fixedly connected with the inner wall of the floating buffer shell, and a plurality of buffer balls which are uniformly distributed are connected, the loss of silicone grease in the reduction packaging structure can be realized, and different radiator unit uses to calorific capacity gradual increase of difference, avoids radiator unit long-time work and ageing to increase the life of device, and can cushion when receiving external impact and protect, prevent that semiconductor chip is impaired.
Furthermore, the lower extreme of circuit board body is opened and is dug a plurality of evenly distributed's annular seal groove, fixedly connected with and annular seal groove assorted sealing ring on the closing plate can realize after the closing plate fixes semiconductor chip main part pressure, and semiconductor chip main part is sealed by the sealing ring.
Furthermore, a plurality of heat conduction holes which are uniformly distributed and are matched with the semiconductor chip main body are formed in the circuit board body, heat conduction sheets are arranged at two ends of each heat conduction hole, one of the heat conduction sheets is fixedly connected with the circuit board body, the other heat conduction sheet is connected to the heat conduction holes in a sliding mode, phase-change silicone grease is connected between the two heat conduction sheets, and heat is quickly transferred through the phase change of the phase-change silicone grease due to the fact that the phase change silicone grease is heated and phase-changed, so that heat can be quickly transferred.
Furthermore, a plurality of exhaust holes which are uniformly distributed are drilled in the side wall of the floating buffer shell, the exhaust holes are located in the middle of the floating buffer shell, and when the heat of the floating buffer shell is accumulated too much, the exhaust holes can be exposed to dissipate heat quickly.
Furthermore, a plurality of heat dissipation holes are uniformly distributed on the heat conduction membrane, and the heat dissipation holes are distributed on the outer side of the heat exchange plate, so that gasified silicone grease is discharged through the heat dissipation holes, and the device can dissipate heat quickly.
Further, the buffering ball includes buffering ball and heat transfer board fixedly connected with elastic ball, the downside of elastic ball is equipped with the inflation ball, fixedly connected with and the heat conduction resin layer that the elastic ball matches on the outer wall of inflation ball, the outer wall cladding of inflation ball is gone up on the heat conduction resin layer, and the upper end on heat conduction resin layer exposes the elastic ball in the partial cladding of heat transfer board, the elastic ball is the elastic rubber ball, the heat conduction resin layer is moulded plastics by porous polymer resin and is made, the inflation ball cushions through the elastic ball and the inflation ball of buffering ball for filling the elastic airbag who has the helium, and the heat conduction resin layer through its outer cladding carries out the recovery and the heat conduction heat dissipation of gasification silicone grease to the heat fast transfer that electronic component gived off.
Furthermore, a plurality of evenly distributed cushions are fixedly connected to the inner wall of the sealing plate, so that the buffer performance of the device is improved.
Furthermore, one end of the semiconductor chip main body, which is close to the circuit board body, is fixedly connected with a plurality of uniformly distributed welding spots, a plurality of uniformly distributed metal strips are paved on the circuit board body, and the metal strips are arranged among the plurality of heat conducting holes in a penetrating manner.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can realize reducing the loss of silicone grease among the packaging structure, and to the calorific capacity of difference increase different radiator unit gradually and use, avoids radiator unit long-time work and ageing to increase the life of device, and can cushion the protection when receiving external shock, prevent that semiconductor chip is impaired.
(2) The circuit board body is provided with a plurality of evenly distributed heat conduction holes matched with the semiconductor chip main body, the two ends of each heat conduction hole are respectively provided with a heat conduction sheet, one heat conduction sheet is fixedly connected with the circuit board body, the other heat conduction sheet is connected onto the heat conduction hole in a sliding mode, phase change silicone grease is connected between the two heat conduction sheets, the phase change silicone grease is heated to transfer heat quickly, so that the heat is transmitted quickly, heat dissipation holes are evenly distributed on the heat conduction film, the heat dissipation holes are distributed outside the heat exchange plate, gasified silicone grease is discharged through the heat dissipation holes, and the device can dissipate heat quickly.
(3) The buffer ball includes buffer ball and heat transfer board fixed connection elasticity ball, the downside of elasticity ball is equipped with the inflation ball, fixedly connected with and the heat conduction resin layer that the elasticity ball matches on the outer wall of inflation ball, the outer wall cladding of inflation ball is with the heat conduction resin layer, and the upper end on heat conduction resin layer exposes the elasticity ball in the partial cladding of heat transfer board, the elasticity ball is the elastic rubber ball, the heat conduction resin layer is moulded plastics by porous polymer resin and is made, the elasticity gasbag of helium is filled for the inflation ball to the inflation ball, cushion through the elasticity ball and the inflation ball of buffer ball, the heat conduction resin layer through its outer cladding carries out the recovery and the heat conduction heat dissipation of gasification silicone grease, so that the heat fast transfer that electronic component gived off.
(3) The lower end of the circuit board body is provided with a plurality of uniformly distributed annular sealing grooves in a chiseling mode, the sealing plate is fixedly connected with sealing rings matched with the annular sealing grooves, and the semiconductor chip body can be sealed by the sealing rings after the sealing plate is used for fixedly compressing the semiconductor chip body
(3) Fixedly connected with a plurality of evenly distributed's blotter on the inner wall of closing plate, it has a plurality of evenly distributed's exhaust hole to cut on the lateral wall of the unsteady buffer shell of shock-absorbing capacity that can improve the device, and the exhaust hole is located the middle part of the buffer shell that floats, when unsteady buffer shell heat is piled up too much, can make the exhaust hole expose and dispel the heat fast.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a rear perspective view of the present invention;
FIG. 3 is a cross-sectional view of the present invention;
FIG. 4 is a schematic view of the structure at A in FIG. 3;
FIG. 5 is a schematic view of the structure at B in FIG. 3;
fig. 6 is a partial cross-sectional view of a phase change silicone grease during operation of the present invention.
The reference numbers in the figures illustrate:
the circuit board comprises a circuit board body 1, a semiconductor chip body 2, a sealing plate 3, an extension column 4, a bottom plate 5, a buffer shell 6, a heat dissipation plate 7, a buffer ball 8, an elastic ball 801, an expansion ball 802, a heat conduction resin layer 803, a heat conduction film 9, a heat exchange sheet 10, a heat conduction sheet 11 and phase change silicone grease 12.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a floating shock-absorbing heat dissipation type semiconductor package structure includes a circuit board body 1, a semiconductor chip main body 2 welded to a lower end of the circuit board body 1, a plurality of uniformly distributed solder joints fixedly connected to an end of the semiconductor chip main body 2 close to the circuit board body 1, a plurality of uniformly distributed metal strips laid on the circuit board body 1, the metal band is arranged among the plurality of heat conduction holes in a penetrating way, the semiconductor chip main body 2 is attached with a sealing plate 3, the inner wall of the sealing plate 3 is fixedly connected with a plurality of evenly distributed buffer pads, the buffer performance of the device can be improved, the lower end of the circuit board body 1 is provided with a plurality of evenly distributed annular seal grooves, the seal plate 3 is fixedly connected with a seal ring 301 matched with the annular seal grooves, it is possible to realize that the semiconductor chip body 2 is sealed by the seal ring 301 after the seal plate 3 has pressed and fixed the semiconductor chip body 2.
Referring to fig. 2-4, two pairs of extending columns 4 are fixedly connected to the sealing plate 3, a bottom plate 5 is fixedly connected to the upper surface of the circuit board body 1, jacks matched with the extending columns 4 are drilled in the circuit board body 1 and the bottom plate 5, the extending columns 4 are connected to the jacks in the bottom plate 5 in a clamping manner, a floating buffer shell 6 is slidably connected to the inner wall of the bottom plate 5, one end of the floating buffer shell 6, which is far away from the circuit board body 1, is fixedly connected with a heat dissipation plate 7, a heat exchange plate 10 is fixedly connected to the inner wall of the floating buffer shell 6, a heat conduction film 9 is attached to the upper surface of the circuit board body 1, two ends of the heat conduction film 9 extend into the floating buffer shell 6 and are fixedly connected to the inner wall of the floating buffer shell 6, a plurality of buffer balls 8 which are uniformly distributed are connected between the heat conduction film 9 and the heat exchange plate 10, impact on the device is.
Referring to fig. 3, a plurality of heat conduction holes are uniformly distributed on the circuit board body 1 and matched with the semiconductor chip main body 2, and heat conduction fins 11 are disposed at both ends of the heat conduction holes, one of the heat conducting fins 11 is fixedly connected with the circuit board body 1, the other heat conducting fin 11 is connected on the heat conducting hole in a sliding way, phase change silicone grease 12 is connected between the two heat conducting fins 11, the phase change silicone grease 12 is heated to change the phase to quickly transfer the heat so as to quickly transmit the heat, a plurality of radiating holes which are uniformly distributed are formed on the heat conducting film 9 and are distributed on the outer side of the heat exchange plate 10, gasified silicone grease is discharged through the heat dissipation holes, so that the device can dissipate heat quickly, a plurality of uniformly distributed exhaust holes are drilled in the side wall of the floating buffer shell 6 and are located in the middle of the floating buffer shell 6, and when too much heat is accumulated in the floating buffer shell 6, the exhaust holes can be exposed to dissipate heat quickly.
Referring to fig. 4, the buffer ball 8 includes an elastic ball 801 fixedly connected to the buffer ball 8 and the heat exchange plate 10, an expansion ball 802 is disposed on a lower side of the elastic ball 801, a heat conductive resin layer 803 matched with the elastic ball 801 is fixedly connected to an outer wall of the expansion ball 802, the outer wall of the expansion ball 802 is covered by the heat conductive resin layer 803, and an upper end of the heat conductive resin layer 803 covers a portion of the elastic ball 801 exposed to the heat exchange plate 10, the elastic ball 801 is an elastic rubber ball, the heat conductive resin layer 803 is made of porous polymer resin by injection molding, the expansion ball 802 is an elastic air bag filled with helium, the helium expands by heating to expand the elastic air bag, the elastic ball 801 and the expansion ball 802 of the buffer ball 8 are used for buffering, and the heat conductive resin layer 803 coated on an outer layer thereof is used for recycling of gasified silicone grease and heat conduction and dissipation.
When the semiconductor chip main body 2 works, the heat emitted by the semiconductor chip main body 2 is transferred into the phase-change silicone grease 12 through the heat conducting sheet 11, so that part of the phase-change silicone grease 12 is subjected to phase-change gasification, the gasified phase-change silicone grease 12 is contacted with the heat conducting sheet 11 for heat exchange and cooling, the heat conducting film 9 connected with the heat conducting sheet 11 absorbs the heat on the heat conducting sheet 11 and transfers the heat to the heat exchange plate 10, and then the heat is emitted to the outside through the heat radiating plate 7
When the heat emitted by the semiconductor chip main body 2 is large, the gasified phase-change silicone grease 12 in the phase-change silicone grease 12 cannot be emitted through the phase heat of the heat-conducting sheet 11 in time, at this time, the gasified phase-change silicone grease 12 in the phase-change silicone grease 12 is accumulated, so that the air pressure in the heat-conducting hole is increased, the heat-conducting sheet 11 is jacked up, the gasified phase-change silicone grease 12 is discharged into the inner space of the buffer shell 6 through the heat-radiating hole on the heat-conducting film 9, at this time, the gasified phase-change silicone grease 12 is absorbed by the heat-conducting resin layer 803, the heat carried by the phase-change silicone grease 12 is guided to the heat-exchanging plate 10 through the heat-conducting resin layer 803, and the gasified phase-change silicone grease 12 is cooled and solidified in the heat-conducting resin layer 803 after being absorbed by the heat-conducting resin layer 803, so that the heat-,
when the heat emitted from the semiconductor chip body 2 is too much, the heat-conducting resin layer 803 cannot completely absorb the vaporized phase-change silicone grease 12, so that the heat is accumulated inside the buffer shell 6, and at this time, the expansion balls 802 are heated and expanded, so that the buffer shell 6 is lifted upwards by the buffer balls 8, and the exhaust holes on the buffer shell 6 are exposed above the bottom plate 5, so that the heat in the buffer shell 6 can be exhausted outwards through the exhaust holes.
This scheme can be realized, absorb the silicone grease of evaporation through heat conduction resin layer 803 on buffering ball 8 when the device is overheated, heat conductivity rises after buffering ball 8 absorbs the silicone grease, to prevent that heat dispersion descends fast after the silicone grease loss among the packaging structure, and to the different radiator unit use of calorific capacity increase gradually of difference, when calorific capacity is less, phase change silicone grease 12 is only at the heat conduction downthehole circulation, after the radiating effect descends, phase change silicone grease 12 reenters and dispels the heat in buffering shell 6, avoid using single radiator unit long-time work after, heat dispersion because of the ageing and lead to of heat radiation structure descends, method can increase the life of device, and accessible buffering shell 6 and buffering ball 8 carry out the buffer protection when receiving external impact, prevent that the semiconductor chip from damaging.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (8)
1. The utility model provides a shock-absorbing heat dissipation type semiconductor package structure floats, includes circuit board body (1), its characterized in that: the semiconductor chip heat-insulating circuit board is characterized in that a semiconductor chip main body (2) is welded at the lower end of the circuit board body (1), a sealing plate (3) is attached to the semiconductor chip main body (2), two pairs of extending columns (4) are fixedly connected to the sealing plate (3), a bottom plate (5) is fixedly connected to the upper surface of the circuit board body (1), jacks matched with the extending columns (4) are formed in the circuit board body (1) and the bottom plate (5) in a chiseled mode, a floating buffer shell (6) is connected to the inner wall of the bottom plate (5) in a sliding mode, a heat-radiating plate (7) is fixedly connected to one end, far away from the circuit board body (1), of the floating buffer shell (6), a heat-exchanging plate (10) is fixedly connected to the inner wall of the floating buffer shell (6), a heat-conducting film (9) is attached to the upper surface of the circuit board body (1), and two ends of the heat-conducting film (9) extend, a plurality of buffer balls (8) which are uniformly distributed are connected between the heat-conducting film (9) and the heat exchange plate (10).
2. The semiconductor package structure of claim 1, wherein: the lower extreme of circuit board body (1) is opened and is dug there are a plurality of evenly distributed's annular seal groove, fixedly connected with and annular seal groove assorted sealing ring (301) on closing plate (3).
3. The semiconductor package structure of claim 1, wherein: the circuit board comprises a circuit board body (1), wherein a plurality of heat conduction holes which are uniformly distributed and matched with a semiconductor chip main body (2) are formed in the circuit board body (1), heat conduction sheets (11) are arranged at two ends of each heat conduction hole, one of the heat conduction sheets (11) is fixedly connected with the circuit board body (1), the other heat conduction sheet (11) is connected to the heat conduction holes in a sliding mode, and phase-change silicone grease (12) is connected between the two heat conduction sheets (11).
4. The semiconductor package structure of claim 1, wherein: a plurality of exhaust holes which are uniformly distributed are drilled in the side wall of the floating buffer shell (6), and the exhaust holes are located in the middle of the floating buffer shell (6).
5. The semiconductor package structure of claim 1, wherein: a plurality of radiating holes are uniformly distributed on the heat conducting film (9), and the radiating holes are distributed on the outer side of the heat exchange plate (10).
6. The semiconductor package structure of claim 1, wherein: buffer ball (8) are including buffer ball (8) and heat transfer board (10) fixedly connected with elastic ball (801), the downside of elastic ball (801) is equipped with inflation ball (802), fixedly connected with and elastic ball (801) assorted heat conduction resin layer (803) on the outer wall of inflation ball (802), heat conduction resin layer (803) are with the outer wall cladding of inflation ball (802), and the upper end of heat conduction resin layer (803) exposes elastic ball (801) in the partial cladding of heat transfer board (10), elastic ball (801) are elastic rubber ball, heat conduction resin layer (803) are moulded plastics by porous polymer resin and are made, inflation ball (802) are the elasticity gasbag that has the helium.
7. The semiconductor package structure of claim 1, wherein: the inner wall of the sealing plate (3) is fixedly connected with a plurality of cushions which are uniformly distributed.
8. The semiconductor package structure of claim 1, wherein: one end of the semiconductor chip main body (2) close to the circuit board body (1) is fixedly connected with a plurality of uniformly distributed welding spots, a plurality of uniformly distributed metal bands are paved on the circuit board body (1), and the metal bands penetrate among the plurality of heat conducting holes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010918600.1A CN112103250A (en) | 2020-09-04 | 2020-09-04 | Floating shock-absorbing heat dissipation type semiconductor packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010918600.1A CN112103250A (en) | 2020-09-04 | 2020-09-04 | Floating shock-absorbing heat dissipation type semiconductor packaging structure |
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| CN112103250A true CN112103250A (en) | 2020-12-18 |
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| CN202010918600.1A Withdrawn CN112103250A (en) | 2020-09-04 | 2020-09-04 | Floating shock-absorbing heat dissipation type semiconductor packaging structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601429A (en) * | 2020-12-24 | 2021-04-02 | 江苏新途电气设备有限公司 | Heat dissipation's electrical control cabinet floats |
| CN112954973A (en) * | 2021-02-09 | 2021-06-11 | 陆兵 | Multipoint thermal vibration type high-heat-dissipation power supply |
| CN113423236A (en) * | 2021-05-13 | 2021-09-21 | 刘飞 | Waterproof switch with discontinuous heat dissipation function |
| CN113438846A (en) * | 2021-06-28 | 2021-09-24 | 浙江重力智能装备有限公司 | Electric box with buffer protection mechanism for numerical control machine tool |
| CN113782502A (en) * | 2021-11-17 | 2021-12-10 | 湃晟芯(苏州)科技有限公司 | Chip packaging structure and chip packaging method for digital isolator |
| CN113966070A (en) * | 2021-10-20 | 2022-01-21 | 深圳市嘉海辉电子科技有限公司 | Packaging structure for manufacturing electronic element based on AI (Artificial Intelligence) packaging recognition system |
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2020
- 2020-09-04 CN CN202010918600.1A patent/CN112103250A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601429A (en) * | 2020-12-24 | 2021-04-02 | 江苏新途电气设备有限公司 | Heat dissipation's electrical control cabinet floats |
| CN112954973A (en) * | 2021-02-09 | 2021-06-11 | 陆兵 | Multipoint thermal vibration type high-heat-dissipation power supply |
| CN113423236A (en) * | 2021-05-13 | 2021-09-21 | 刘飞 | Waterproof switch with discontinuous heat dissipation function |
| CN113438846A (en) * | 2021-06-28 | 2021-09-24 | 浙江重力智能装备有限公司 | Electric box with buffer protection mechanism for numerical control machine tool |
| CN113438846B (en) * | 2021-06-28 | 2022-01-18 | 浙江重力智能装备有限公司 | Electric box with buffer protection mechanism for numerical control machine tool |
| CN113966070A (en) * | 2021-10-20 | 2022-01-21 | 深圳市嘉海辉电子科技有限公司 | Packaging structure for manufacturing electronic element based on AI (Artificial Intelligence) packaging recognition system |
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