CN219591381U

CN219591381U - Paster diode with improved structure

Info

Publication number: CN219591381U
Application number: CN202320562097.XU
Authority: CN
Inventors: 卢涛
Original assignee: Heyuan Chuangji Electronic Technology Co ltd
Current assignee: Heyuan Chuangji Electronic Technology Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-08-25
Anticipated expiration: 2033-03-21

Abstract

The utility model discloses a patch diode with an improved structure, which comprises a packaging shell and a heat collecting plate, wherein a chip is arranged in the packaging shell, the top of the chip is fixedly connected with a heat conducting plate, the top of the heat conducting plate is fixedly connected with heat conducting columns, the tops of a plurality of heat conducting columns are fixedly connected to the bottom end of the heat collecting plate, the tops of the heat collecting plates are fixedly connected with a plurality of heat radiating fins at equal intervals, two ends of two sides of the chip are fixedly connected with linear pins, one end of each linear pin is provided with a cross clamping groove, two sides of the packaging shell are adhered with packaging end covers through packaging glue, and two ends of two sides of each packaging end cover are inserted with L-shaped pins.

Description

Paster diode with improved structure

Technical Field

The utility model relates to the technical field of diodes, in particular to a patch diode with an improved structure.

Background

The patch diode utilizes unidirectional conductive characteristics of the diode to realize the functions of rectification, clamping, amplitude limiting and the like in a circuit. The existing patch diode has the following problems:

1. the chip inside the patch diode can emit heat due to the passing of current in the working process, and a plurality of chips which are timely cooled can cause damage to electronic elements inside the diode, so that the service life of the diode is influenced;

2. most of the pins of the existing diode are of an integrated structure, and the existing diode is inconvenient to replace when the pins are broken and damaged.

Disclosure of Invention

The utility model aims to provide a patch diode with an improved structure, so as to solve the problems that the chip in the patch diode provided in the background art can emit heat due to the passing of current in the working process, and a plurality of chips can timely emit heat to damage electronic elements in the diode, thereby influencing the service life of the diode, and the pins of the existing diode are mostly of an integrated structure, so that the replacement is inconvenient when the pins are broken and damaged.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a paster diode with improve structure, includes encapsulation shell and heat collecting plate, the internally mounted of encapsulation shell has the chip, the top fixedly connected with heat conduction board of chip, the top fixedly connected with heat conduction post of heat conduction board, a plurality of the equal fixedly connected with in the bottom of heat collecting plate in top of heat conduction post, the equal distance fixedly connected with in top of heat collecting plate a plurality of heat dissipation wing strips, the equal fixedly connected with straight line pin in both ends of chip both sides, the cross draw-in groove has been seted up to the one end of straight line pin, the both sides of encapsulation shell have encapsulation end cover through encapsulation glue bonding, the both ends of encapsulation end cover both sides all alternate to have L shape pin.

The chip diode with the improved structure of the technical scheme is used, heat on the surface of a chip is conducted to the heat conducting plate and the heat conducting column through the insulating pad, the heat is conducted to the heat collecting plate through the heat conducting column, the heat radiating fin strips are used for conducting the heat, the radiating area is enlarged through the heat radiating fin strips, and the heat and the cold are replaced through the heat radiating fin strips and the air contact with the outside, so that the purpose of radiating the diode is achieved, and the service life of the diode is prolonged.

Preferably, one end of the L-shaped pin is fixedly connected with a cross clamping block, and the cross clamping block is clamped with the cross clamping groove, so that the L-shaped pin can be replaced.

Preferably, limiting plates are fixedly connected to two sides of the top and two sides of the bottom of the inner cavity of the packaging shell, limiting grooves are formed in the top and the bottom of the packaging end cover, and the limiting plates are clamped with the limiting grooves to limit the packaging end cover.

Preferably, an insulating pad is adhered to the joint of the heat conducting plate and the chip, and the insulating pad is made of a heat conducting silica gel material and is used for insulating the heat conducting plate and the chip.

Preferably, the inner cavity of the packaging shell is filled with a packaging layer, and the packaging layer is made of insulating resin materials and packages the chip.

Preferably, the top of the heat dissipation fin strip penetrates through the packaging shell to extend to the outside, and dissipates heat with air refrigeration replacement.

Compared with the prior art, the utility model has the beneficial effects that:

1. the heat on the surface of the chip is conducted to the heat-conducting plate and the heat-conducting column through the insulating pad, the heat-conducting column transfers the heat to the heat-collecting plate and the heat-radiating fins, and the heat-radiating fins are contacted with the outside air to perform cold and hot replacement, so that the heat dissipation of the diode is realized, and the service life of the diode is prolonged;

2. the air heater is used for heating the joint of the packaging end cover and the packaging shell, so that glue is melted, then the cross clamping block is moved out of the inner cavity of the cross clamping groove, at the moment, the new packaging end cover is replaced, the new L-shaped pin is clamped with the straight line pin again, the replacement of the pin can be completed, and the recycling is realized.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

FIG. 3 is a diagram showing the connection relationship between L-shaped pins and straight pins according to the present utility model;

fig. 4 is a side view of a thermally conductive plate of the present utility model.

In the figure: 1. a chip; 2. a heat conductive plate; 3. a heat conducting column; 4. a heat collecting plate; 5. radiating fin strips; 6. a package housing; 7. a straight pin; 8. a cross clamping groove; 9. a cross clamping block; 10. l-shaped pins; 11. packaging the end cover; 12. a limiting plate; 13. a limit groove; 14. an insulating pad; 15. and an encapsulation layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the utility model provides a patch diode with an improved structure, which comprises a packaging shell 6 and a heat collecting plate 4, wherein a chip 1 is installed in the packaging shell 6, the top of the chip 1 is fixedly connected with a heat conducting plate 2, the top of the heat conducting plate 2 is fixedly connected with heat conducting columns 3, the tops of the heat conducting columns 3 are fixedly connected with the bottom end of the heat collecting plate 4, the tops of the heat collecting plate 4 are fixedly connected with a plurality of heat radiating fins 5 at equal intervals, two ends of two sides of the chip 1 are fixedly connected with linear pins 7, one end of each linear pin 7 is provided with a cross clamping groove 8, two sides of the packaging shell 6 are adhered with packaging end covers 11 through packaging glue, and two ends of two sides of each packaging end cover 11 are penetrated with L-shaped pins 10; the chip 1 during operation is inside can send out the heat, at this moment with the heat conduction of chip 1 surface for heat conduction board 2 through insulating pad 14, then give heat conduction post 3 with heat conduction board 2 again, give heat collection board 4 with heat conduction through heat conduction post 3, heat dissipation fin 5 is given through heat collection board 4 with heat dissipation fin 5 expansion radiating area and carry out cold and hot replacement with outside air contact, thereby realize the radiating purpose of diode, improve the life of diode, and when one of them L shape pin 10 breaks, the junction heating for encapsulation end cover 11 and encapsulation shell 6 through the air heater this moment, make glue melt, then shift out cross fixture block 9 from the inner chamber of cross draw-in groove 8, at this moment again change new encapsulation end cover 11, and with new L shape pin 10 and sharp pin 7 joint again, the change of pin can be accomplished, realize reuse.

Referring to fig. 1-4, further, one end of the L-shaped pin 10 is fixedly connected with a cross clamping block 9, and the cross clamping block 9 is clamped with the cross clamping groove 8, so that the L-shaped pin 10 and the linear pin 7 can be disassembled in a manner of clamping the cross clamping block 9 and the cross clamping groove 8, and the replacement after the L-shaped pin 10 is broken is facilitated.

Referring to fig. 1-4, further, two sides of the top and two sides of the bottom of the inner cavity of the packaging shell 6 are fixedly connected with limiting plates 12, the top and the bottom of the packaging end cover 11 are provided with limiting grooves 13, the limiting plates 12 are clamped with the limiting grooves 13, and the packaging end cover 11 is limited through the clamping between the limiting grooves 13 and the limiting plates 12, so that the packaging end cover 11 is prevented from being deviated.

Referring to fig. 1-4, further, an insulating pad 14 is adhered to the connection between the heat conducting plate 2 and the chip 1, and the insulating pad 14 is made of a heat conducting silica gel material, which has good insulation and heat conductivity and does not affect heat transfer.

Referring to fig. 1-4, further, the inner cavity of the packaging shell 6 is filled with a packaging layer 15, and the packaging layer 15 is made of insulating resin material, so as to package the chip 1, and the radiating area is enlarged through the radiating fins 5 and is contacted with the external air for cold and hot replacement, so that the purpose of radiating the diode is achieved.

Referring to fig. 1-4, further, the top of the heat dissipating fin 5 extends through the package housing 6 to the outside.

When the LED packaging structure is specifically used, heat can be emitted from the inside of the chip 1 during operation, at the moment, the heat on the surface of the chip 1 is conducted to the heat conducting plate 2 through the insulating pad 14, then the heat is transferred to the heat conducting post 3 through the heat conducting plate 2, the heat is transferred to the heat collecting plate 4 through the heat conducting post 3, the heat is conducted to the heat radiating fin strips 5 through the heat collecting plate 4, the heat radiating area is enlarged through the heat radiating fin strips 5, and the heat are replaced by contacting with the air outside, so that the heat radiating purpose of the diode is achieved, the service life of the diode is prolonged, when one L-shaped pin 10 is broken, at the moment, the joint of the packaging end cover 11 and the packaging shell 6 is heated through the hot air fan, so that the glue is melted, then the cross clamping block 9 is removed from the inner cavity of the cross clamping groove 8, at the moment, the new packaging end cover 11 is replaced, and the new L-shaped pin 10 is clamped with the straight pin 7 again, and the replacement of the pins can be completed, and the recycling is achieved.

Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a paster diode with improve structure, includes encapsulation shell (6) and heat collecting plate (4), its characterized in that: the inside mounting of encapsulation shell (6) has chip (1), the top fixedly connected with heat conduction board (2) of chip (1), the top fixedly connected with heat conduction post (3) of heat conduction board (2), a plurality of the equal fixedly connected with in top of heat-collecting plate (4) bottom of heat conduction post (3), the equal fixedly connected with in top equidistance of heat-collecting plate (4) a plurality of heat dissipation wing strip (5), the equal fixedly connected with straight line pin (7) in both ends of chip (1) both sides, cross draw-in groove (8) have been seted up to the one end of straight line pin (7), the both sides of encapsulation shell (6) have encapsulation end cover (11) through encapsulation glue bonding, the both ends of encapsulation end cover (11) both sides all alternate to have L shape pin (10).

2. The patch diode with improved structure of claim 1, wherein: one end of the L-shaped pin (10) is fixedly connected with a cross clamping block (9), and the cross clamping block (9) is clamped with the cross clamping groove (8).

3. The patch diode with improved structure of claim 1, wherein: limiting plates (12) are fixedly connected to two sides of the top and two sides of the bottom of the inner cavity of the packaging shell (6), limiting grooves (13) are formed in the top and the bottom of the packaging end cover (11), and the limiting plates (12) are clamped with the limiting grooves (13).

4. The patch diode with improved structure of claim 1, wherein: an insulating pad (14) is adhered to the joint of the heat conducting plate (2) and the chip (1), and the insulating pad (14) is made of a heat conducting silica gel material.

5. The patch diode with improved structure of claim 1, wherein: the inner cavity of the packaging shell (6) is filled with a packaging layer (15), and the packaging layer (15) is made of an insulating resin material.

6. The patch diode with improved structure of claim 1, wherein: the top of the heat dissipation fin strip (5) penetrates through the packaging shell (6) to extend to the outside.