JP2011521481A5 - - Google Patents

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Publication number
JP2011521481A5
JP2011521481A5 JP2011510816A JP2011510816A JP2011521481A5 JP 2011521481 A5 JP2011521481 A5 JP 2011521481A5 JP 2011510816 A JP2011510816 A JP 2011510816A JP 2011510816 A JP2011510816 A JP 2011510816A JP 2011521481 A5 JP2011521481 A5 JP 2011521481A5
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JP
Japan
Prior art keywords
optoelectronic semiconductor
semiconductor component
carrier
connection
silicone
Prior art date
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Application number
JP2011510816A
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English (en)
Japanese (ja)
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JP5750040B2 (ja
JP2011521481A (ja
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Priority claimed from DE102008025491A external-priority patent/DE102008025491A1/de
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Publication of JP2011521481A publication Critical patent/JP2011521481A/ja
Publication of JP2011521481A5 publication Critical patent/JP2011521481A5/ja
Application granted granted Critical
Publication of JP5750040B2 publication Critical patent/JP5750040B2/ja
Active legal-status Critical Current
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JP2011510816A 2008-05-28 2009-04-20 オプトエレクトロニクス半導体コンポーネント Active JP5750040B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025491.6 2008-05-28
DE102008025491A DE102008025491A1 (de) 2008-05-28 2008-05-28 Optoelektronisches Halbleiterbauteil und Leiterplatte
PCT/DE2009/000543 WO2009143796A2 (de) 2008-05-28 2009-04-20 Optoelektronisches halbleiterbauteil und leiterplatte

Publications (3)

Publication Number Publication Date
JP2011521481A JP2011521481A (ja) 2011-07-21
JP2011521481A5 true JP2011521481A5 (enExample) 2012-06-14
JP5750040B2 JP5750040B2 (ja) 2015-07-15

Family

ID=41064795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510816A Active JP5750040B2 (ja) 2008-05-28 2009-04-20 オプトエレクトロニクス半導体コンポーネント

Country Status (7)

Country Link
US (1) US9397271B2 (enExample)
EP (1) EP2281316B1 (enExample)
JP (1) JP5750040B2 (enExample)
KR (1) KR101541565B1 (enExample)
CN (1) CN101971375B (enExample)
DE (1) DE102008025491A1 (enExample)
WO (1) WO2009143796A2 (enExample)

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DE102010044470B4 (de) * 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
DE102010054068A1 (de) 2010-12-10 2012-06-14 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement
JP5795251B2 (ja) * 2011-12-14 2015-10-14 信越化学工業株式会社 光学半導体装置用基台及びその製造方法、並びに光学半導体装置
JP5851875B2 (ja) * 2012-02-14 2016-02-03 信越化学工業株式会社 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法
TWI590494B (zh) * 2012-02-14 2017-07-01 信越化學工業股份有限公司 Optical semiconductor device package, its manufacturing method, and optical semiconductor device and its manufacturing method
JP5770674B2 (ja) * 2012-04-04 2015-08-26 信越化学工業株式会社 光学半導体装置用基板及びその製造方法、並びに光学半導体装置
JP5767160B2 (ja) * 2012-05-07 2015-08-19 信越化学工業株式会社 光学半導体装置用基板の製造方法
DE102012105176B4 (de) * 2012-06-14 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
JP2014203942A (ja) * 2013-04-04 2014-10-27 信越化学工業株式会社 光半導体装置
KR102086098B1 (ko) * 2013-07-03 2020-03-09 삼성디스플레이 주식회사 표시 장치
JP2015165546A (ja) * 2014-02-07 2015-09-17 株式会社ミマキエンジニアリング 紫外線発光ダイオードユニット、紫外線発光ダイオードユニットのセット、インクジェット装置および三次元造形物製造装置
JP6628473B2 (ja) * 2014-12-26 2020-01-08 日亜化学工業株式会社 発光装置
DE102015115722A1 (de) * 2015-09-17 2017-03-23 Osram Opto Semiconductors Gmbh Träger für ein Bauelement, Bauelement und Verfahren zur Herstellung eines Trägers oder eines Bauelements
JP6365592B2 (ja) * 2016-05-31 2018-08-01 日亜化学工業株式会社 発光装置
US10083885B1 (en) * 2017-06-06 2018-09-25 Cree, Inc. Multi-layer potting for electronic modules
JP7089167B2 (ja) * 2018-04-23 2022-06-22 日亜化学工業株式会社 発光装置
CN215989229U (zh) * 2020-02-10 2022-03-08 东友精细化工有限公司 天线堆叠结构和包括天线堆叠结构的显示装置
DE102020111728B4 (de) 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils

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