JP5750040B2 - オプトエレクトロニクス半導体コンポーネント - Google Patents

オプトエレクトロニクス半導体コンポーネント Download PDF

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Publication number
JP5750040B2
JP5750040B2 JP2011510816A JP2011510816A JP5750040B2 JP 5750040 B2 JP5750040 B2 JP 5750040B2 JP 2011510816 A JP2011510816 A JP 2011510816A JP 2011510816 A JP2011510816 A JP 2011510816A JP 5750040 B2 JP5750040 B2 JP 5750040B2
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JP
Japan
Prior art keywords
carrier
connection
semiconductor component
optoelectronic semiconductor
potting material
Prior art date
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Active
Application number
JP2011510816A
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English (en)
Japanese (ja)
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JP2011521481A5 (enExample
JP2011521481A (ja
Inventor
ハラルト イェーガー
ハラルト イェーガー
ヨルグ エリッヒ ゾルグ
ヨルグ エリッヒ ゾルグ
柏木　努
努 柏木
塩原　利夫
利夫 塩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2011521481A publication Critical patent/JP2011521481A/ja
Publication of JP2011521481A5 publication Critical patent/JP2011521481A5/ja
Application granted granted Critical
Publication of JP5750040B2 publication Critical patent/JP5750040B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2011510816A 2008-05-28 2009-04-20 オプトエレクトロニクス半導体コンポーネント Active JP5750040B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025491.6 2008-05-28
DE102008025491A DE102008025491A1 (de) 2008-05-28 2008-05-28 Optoelektronisches Halbleiterbauteil und Leiterplatte
PCT/DE2009/000543 WO2009143796A2 (de) 2008-05-28 2009-04-20 Optoelektronisches halbleiterbauteil und leiterplatte

Publications (3)

Publication Number Publication Date
JP2011521481A JP2011521481A (ja) 2011-07-21
JP2011521481A5 JP2011521481A5 (enExample) 2012-06-14
JP5750040B2 true JP5750040B2 (ja) 2015-07-15

Family

ID=41064795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510816A Active JP5750040B2 (ja) 2008-05-28 2009-04-20 オプトエレクトロニクス半導体コンポーネント

Country Status (7)

Country Link
US (1) US9397271B2 (enExample)
EP (1) EP2281316B1 (enExample)
JP (1) JP5750040B2 (enExample)
KR (1) KR101541565B1 (enExample)
CN (1) CN101971375B (enExample)
DE (1) DE102008025491A1 (enExample)
WO (1) WO2009143796A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010044470B4 (de) * 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
DE102010054068A1 (de) 2010-12-10 2012-06-14 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement
JP5795251B2 (ja) * 2011-12-14 2015-10-14 信越化学工業株式会社 光学半導体装置用基台及びその製造方法、並びに光学半導体装置
JP5851875B2 (ja) * 2012-02-14 2016-02-03 信越化学工業株式会社 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法
TWI590494B (zh) * 2012-02-14 2017-07-01 信越化學工業股份有限公司 Optical semiconductor device package, its manufacturing method, and optical semiconductor device and its manufacturing method
JP5770674B2 (ja) * 2012-04-04 2015-08-26 信越化学工業株式会社 光学半導体装置用基板及びその製造方法、並びに光学半導体装置
JP5767160B2 (ja) * 2012-05-07 2015-08-19 信越化学工業株式会社 光学半導体装置用基板の製造方法
DE102012105176B4 (de) * 2012-06-14 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
JP2014203942A (ja) * 2013-04-04 2014-10-27 信越化学工業株式会社 光半導体装置
KR102086098B1 (ko) * 2013-07-03 2020-03-09 삼성디스플레이 주식회사 표시 장치
JP2015165546A (ja) * 2014-02-07 2015-09-17 株式会社ミマキエンジニアリング 紫外線発光ダイオードユニット、紫外線発光ダイオードユニットのセット、インクジェット装置および三次元造形物製造装置
JP6628473B2 (ja) * 2014-12-26 2020-01-08 日亜化学工業株式会社 発光装置
DE102015115722A1 (de) * 2015-09-17 2017-03-23 Osram Opto Semiconductors Gmbh Träger für ein Bauelement, Bauelement und Verfahren zur Herstellung eines Trägers oder eines Bauelements
JP6365592B2 (ja) * 2016-05-31 2018-08-01 日亜化学工業株式会社 発光装置
US10083885B1 (en) * 2017-06-06 2018-09-25 Cree, Inc. Multi-layer potting for electronic modules
JP7089167B2 (ja) * 2018-04-23 2022-06-22 日亜化学工業株式会社 発光装置
CN215989229U (zh) * 2020-02-10 2022-03-08 东友精细化工有限公司 天线堆叠结构和包括天线堆叠结构的显示装置
DE102020111728B4 (de) 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568012A (en) * 1968-11-05 1971-03-02 Westinghouse Electric Corp A microminiature circuit device employing a low thermal expansion binder
GB1583544A (en) * 1977-07-25 1981-01-28 Uop Inc Metal-clad laminates
JP3417079B2 (ja) * 1994-08-31 2003-06-16 ソニー株式会社 半導体装置の製造方法
DE19964228B4 (de) * 1998-09-08 2008-11-13 Fujitsu Ltd., Kawasaki Verfahren zur Herstellung eines Reflexionsfilms und Herstellung optischer Vorrichtungen die einen Reflexionsfilm verwenden
JP2000150701A (ja) * 1998-11-05 2000-05-30 Shinko Electric Ind Co Ltd 半導体装置並びにこれに用いる接続用基板及びその製造方法
CN1225801C (zh) * 2000-02-09 2005-11-02 日本光源股份有限公司 光源装置
JP2001257410A (ja) 2000-03-09 2001-09-21 Kyocera Corp 電子部品
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
US20040038442A1 (en) * 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
JP4071639B2 (ja) * 2003-01-15 2008-04-02 信越化学工業株式会社 発光ダイオード素子用シリコーン樹脂組成物
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
EP1604385B1 (de) 2003-03-10 2019-12-11 OSRAM Opto Semiconductors GmbH Optoelektronisches bauelement mit einem gehäusekörper aus kunststoffmaterial
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
JP2005064047A (ja) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード
US7087465B2 (en) * 2003-12-15 2006-08-08 Philips Lumileds Lighting Company, Llc Method of packaging a semiconductor light emitting device
WO2005072031A2 (en) * 2004-01-20 2005-08-04 World Properties, Inc. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US8835937B2 (en) 2004-02-20 2014-09-16 Osram Opto Semiconductors Gmbh Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic component
JP4598432B2 (ja) * 2004-05-12 2010-12-15 浜松ホトニクス株式会社 電子部品及びその製造方法
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
WO2006099741A1 (en) 2005-03-24 2006-09-28 Tir Systems Ltd. Solid-state lighting device package
US7288798B2 (en) * 2005-06-02 2007-10-30 Lighthouse Technology Co., Ltd Light module
DE102006000476A1 (de) * 2005-09-22 2007-05-24 Lexedis Lighting Gesmbh Lichtemissionsvorrichtung
JP2007180203A (ja) * 2005-12-27 2007-07-12 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
US7521728B2 (en) * 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
JP4996101B2 (ja) * 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5268082B2 (ja) 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
JP4969119B2 (ja) 2006-03-20 2012-07-04 日本碍子株式会社 発光ダイオード装置
TW200805694A (en) * 2006-07-04 2008-01-16 Secure Tech Co Ltd Light-emitting component and manufacturing method thereof
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
JP4979299B2 (ja) 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
JP2008071955A (ja) * 2006-09-14 2008-03-27 Nichia Chem Ind Ltd 発光装置

Also Published As

Publication number Publication date
WO2009143796A3 (de) 2010-03-11
US9397271B2 (en) 2016-07-19
CN101971375A (zh) 2011-02-09
KR101541565B1 (ko) 2015-08-04
KR20110016857A (ko) 2011-02-18
DE102008025491A1 (de) 2009-12-03
US20110108870A1 (en) 2011-05-12
WO2009143796A2 (de) 2009-12-03
CN101971375B (zh) 2013-02-20
EP2281316B1 (de) 2015-06-10
JP2011521481A (ja) 2011-07-21
EP2281316A2 (de) 2011-02-09

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