KR101541565B1 - 광전 반도체 소자 및 인쇄 회로 기판 - Google Patents

광전 반도체 소자 및 인쇄 회로 기판 Download PDF

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KR101541565B1
KR101541565B1 KR1020107020194A KR20107020194A KR101541565B1 KR 101541565 B1 KR101541565 B1 KR 101541565B1 KR 1020107020194 A KR1020107020194 A KR 1020107020194A KR 20107020194 A KR20107020194 A KR 20107020194A KR 101541565 B1 KR101541565 B1 KR 101541565B1
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South Korea
Prior art keywords
carrier
semiconductor chip
potting
semiconductor device
glass
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KR20110016857A (ko
Inventor
해럴드 예거
조지 에리흐 솔그
츠토무 가시와기
토시오 시오바라
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20110016857A publication Critical patent/KR20110016857A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
KR1020107020194A 2008-05-28 2009-04-20 광전 반도체 소자 및 인쇄 회로 기판 Active KR101541565B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008025491.6 2008-05-28
DE102008025491A DE102008025491A1 (de) 2008-05-28 2008-05-28 Optoelektronisches Halbleiterbauteil und Leiterplatte

Publications (2)

Publication Number Publication Date
KR20110016857A KR20110016857A (ko) 2011-02-18
KR101541565B1 true KR101541565B1 (ko) 2015-08-04

Family

ID=41064795

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107020194A Active KR101541565B1 (ko) 2008-05-28 2009-04-20 광전 반도체 소자 및 인쇄 회로 기판

Country Status (7)

Country Link
US (1) US9397271B2 (enExample)
EP (1) EP2281316B1 (enExample)
JP (1) JP5750040B2 (enExample)
KR (1) KR101541565B1 (enExample)
CN (1) CN101971375B (enExample)
DE (1) DE102008025491A1 (enExample)
WO (1) WO2009143796A2 (enExample)

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DE102010044470B4 (de) * 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
DE102010054068A1 (de) 2010-12-10 2012-06-14 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement
JP5795251B2 (ja) * 2011-12-14 2015-10-14 信越化学工業株式会社 光学半導体装置用基台及びその製造方法、並びに光学半導体装置
JP5851875B2 (ja) * 2012-02-14 2016-02-03 信越化学工業株式会社 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法
TWI590494B (zh) * 2012-02-14 2017-07-01 信越化學工業股份有限公司 Optical semiconductor device package, its manufacturing method, and optical semiconductor device and its manufacturing method
JP5770674B2 (ja) * 2012-04-04 2015-08-26 信越化学工業株式会社 光学半導体装置用基板及びその製造方法、並びに光学半導体装置
JP5767160B2 (ja) * 2012-05-07 2015-08-19 信越化学工業株式会社 光学半導体装置用基板の製造方法
DE102012105176B4 (de) * 2012-06-14 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
JP2014203942A (ja) * 2013-04-04 2014-10-27 信越化学工業株式会社 光半導体装置
KR102086098B1 (ko) * 2013-07-03 2020-03-09 삼성디스플레이 주식회사 표시 장치
JP2015165546A (ja) * 2014-02-07 2015-09-17 株式会社ミマキエンジニアリング 紫外線発光ダイオードユニット、紫外線発光ダイオードユニットのセット、インクジェット装置および三次元造形物製造装置
JP6628473B2 (ja) * 2014-12-26 2020-01-08 日亜化学工業株式会社 発光装置
DE102015115722A1 (de) * 2015-09-17 2017-03-23 Osram Opto Semiconductors Gmbh Träger für ein Bauelement, Bauelement und Verfahren zur Herstellung eines Trägers oder eines Bauelements
JP6365592B2 (ja) * 2016-05-31 2018-08-01 日亜化学工業株式会社 発光装置
US10083885B1 (en) * 2017-06-06 2018-09-25 Cree, Inc. Multi-layer potting for electronic modules
JP7089167B2 (ja) * 2018-04-23 2022-06-22 日亜化学工業株式会社 発光装置
CN215989229U (zh) * 2020-02-10 2022-03-08 东友精细化工有限公司 天线堆叠结构和包括天线堆叠结构的显示装置
DE102020111728B4 (de) 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils

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JP2008071955A (ja) * 2006-09-14 2008-03-27 Nichia Chem Ind Ltd 発光装置

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Also Published As

Publication number Publication date
WO2009143796A3 (de) 2010-03-11
US9397271B2 (en) 2016-07-19
CN101971375A (zh) 2011-02-09
KR20110016857A (ko) 2011-02-18
DE102008025491A1 (de) 2009-12-03
US20110108870A1 (en) 2011-05-12
WO2009143796A2 (de) 2009-12-03
CN101971375B (zh) 2013-02-20
EP2281316B1 (de) 2015-06-10
JP5750040B2 (ja) 2015-07-15
JP2011521481A (ja) 2011-07-21
EP2281316A2 (de) 2011-02-09

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