CN101971375B - 光电子半导体器件和电路板 - Google Patents

光电子半导体器件和电路板 Download PDF

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Publication number
CN101971375B
CN101971375B CN2009801090657A CN200980109065A CN101971375B CN 101971375 B CN101971375 B CN 101971375B CN 2009801090657 A CN2009801090657 A CN 2009801090657A CN 200980109065 A CN200980109065 A CN 200980109065A CN 101971375 B CN101971375 B CN 101971375B
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CN
China
Prior art keywords
supporting mass
optoelectronic semiconductor
semiconductor chip
mass
carrier
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CN2009801090657A
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English (en)
Chinese (zh)
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CN101971375A (zh
Inventor
哈拉尔德·雅格
约尔格·埃里希·佐尔格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of CN101971375A publication Critical patent/CN101971375A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
CN2009801090657A 2008-05-28 2009-04-20 光电子半导体器件和电路板 Active CN101971375B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025491.6 2008-05-28
DE102008025491A DE102008025491A1 (de) 2008-05-28 2008-05-28 Optoelektronisches Halbleiterbauteil und Leiterplatte
PCT/DE2009/000543 WO2009143796A2 (de) 2008-05-28 2009-04-20 Optoelektronisches halbleiterbauteil und leiterplatte

Publications (2)

Publication Number Publication Date
CN101971375A CN101971375A (zh) 2011-02-09
CN101971375B true CN101971375B (zh) 2013-02-20

Family

ID=41064795

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801090657A Active CN101971375B (zh) 2008-05-28 2009-04-20 光电子半导体器件和电路板

Country Status (7)

Country Link
US (1) US9397271B2 (enExample)
EP (1) EP2281316B1 (enExample)
JP (1) JP5750040B2 (enExample)
KR (1) KR101541565B1 (enExample)
CN (1) CN101971375B (enExample)
DE (1) DE102008025491A1 (enExample)
WO (1) WO2009143796A2 (enExample)

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DE102010044470B4 (de) * 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
DE102010054068A1 (de) 2010-12-10 2012-06-14 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement
JP5795251B2 (ja) * 2011-12-14 2015-10-14 信越化学工業株式会社 光学半導体装置用基台及びその製造方法、並びに光学半導体装置
JP5851875B2 (ja) * 2012-02-14 2016-02-03 信越化学工業株式会社 光学半導体装置用パッケージの製造方法及び光学半導体装置の製造方法
TWI590494B (zh) * 2012-02-14 2017-07-01 信越化學工業股份有限公司 Optical semiconductor device package, its manufacturing method, and optical semiconductor device and its manufacturing method
JP5770674B2 (ja) * 2012-04-04 2015-08-26 信越化学工業株式会社 光学半導体装置用基板及びその製造方法、並びに光学半導体装置
JP5767160B2 (ja) * 2012-05-07 2015-08-19 信越化学工業株式会社 光学半導体装置用基板の製造方法
DE102012105176B4 (de) * 2012-06-14 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
JP2014203942A (ja) * 2013-04-04 2014-10-27 信越化学工業株式会社 光半導体装置
KR102086098B1 (ko) * 2013-07-03 2020-03-09 삼성디스플레이 주식회사 표시 장치
JP2015165546A (ja) * 2014-02-07 2015-09-17 株式会社ミマキエンジニアリング 紫外線発光ダイオードユニット、紫外線発光ダイオードユニットのセット、インクジェット装置および三次元造形物製造装置
JP6628473B2 (ja) * 2014-12-26 2020-01-08 日亜化学工業株式会社 発光装置
DE102015115722A1 (de) * 2015-09-17 2017-03-23 Osram Opto Semiconductors Gmbh Träger für ein Bauelement, Bauelement und Verfahren zur Herstellung eines Trägers oder eines Bauelements
JP6365592B2 (ja) * 2016-05-31 2018-08-01 日亜化学工業株式会社 発光装置
US10083885B1 (en) * 2017-06-06 2018-09-25 Cree, Inc. Multi-layer potting for electronic modules
JP7089167B2 (ja) * 2018-04-23 2022-06-22 日亜化学工業株式会社 発光装置
CN215989229U (zh) * 2020-02-10 2022-03-08 东友精细化工有限公司 天线堆叠结构和包括天线堆叠结构的显示装置
DE102020111728B4 (de) 2020-04-29 2022-06-23 Schott Ag Elektro-optisches Wandlerbauteil mit einem Abstandhalter, sowie Abstandhalter-Wafer zur Herstellung eines elektro-optischen Wandlerbauteils

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EP1657758A2 (en) * 2004-11-15 2006-05-17 LumiLeds Lighting U.S., LLC Light emitting diode with molded lens and method of manufacturing the same
CN1914961A (zh) * 2004-01-20 2007-02-14 环球产权公司 电路材料、电路、多层电路及其制造方法

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DE19964228B4 (de) * 1998-09-08 2008-11-13 Fujitsu Ltd., Kawasaki Verfahren zur Herstellung eines Reflexionsfilms und Herstellung optischer Vorrichtungen die einen Reflexionsfilm verwenden
JP2000150701A (ja) * 1998-11-05 2000-05-30 Shinko Electric Ind Co Ltd 半導体装置並びにこれに用いる接続用基板及びその製造方法
JP2001257410A (ja) 2000-03-09 2001-09-21 Kyocera Corp 電子部品
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
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JP4071639B2 (ja) * 2003-01-15 2008-04-02 信越化学工業株式会社 発光ダイオード素子用シリコーン樹脂組成物
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
EP1604385B1 (de) 2003-03-10 2019-12-11 OSRAM Opto Semiconductors GmbH Optoelektronisches bauelement mit einem gehäusekörper aus kunststoffmaterial
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
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JP4996101B2 (ja) * 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5268082B2 (ja) 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
JP4969119B2 (ja) 2006-03-20 2012-07-04 日本碍子株式会社 発光ダイオード装置
TW200805694A (en) * 2006-07-04 2008-01-16 Secure Tech Co Ltd Light-emitting component and manufacturing method thereof
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JP4979299B2 (ja) 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
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Publication number Priority date Publication date Assignee Title
CN1366714A (zh) * 2000-02-09 2002-08-28 日本光源股份有限公司 光源装置
CN1914961A (zh) * 2004-01-20 2007-02-14 环球产权公司 电路材料、电路、多层电路及其制造方法
EP1657758A2 (en) * 2004-11-15 2006-05-17 LumiLeds Lighting U.S., LLC Light emitting diode with molded lens and method of manufacturing the same

Also Published As

Publication number Publication date
WO2009143796A3 (de) 2010-03-11
US9397271B2 (en) 2016-07-19
CN101971375A (zh) 2011-02-09
KR101541565B1 (ko) 2015-08-04
KR20110016857A (ko) 2011-02-18
DE102008025491A1 (de) 2009-12-03
US20110108870A1 (en) 2011-05-12
WO2009143796A2 (de) 2009-12-03
EP2281316B1 (de) 2015-06-10
JP5750040B2 (ja) 2015-07-15
JP2011521481A (ja) 2011-07-21
EP2281316A2 (de) 2011-02-09

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ASS Succession or assignment of patent right

Owner name: SHIN-ETSU CHEMICAL INDUSTRY CO., LTD.

Effective date: 20130528

C41 Transfer of patent application or patent right or utility model
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: Jaeger Harald

Inventor after: Sorg Joerg Erich

Inventor after: Bai Mumian

Inventor after: Shiohara Toshio

Inventor before: Jaeger Harald

Inventor before: Sorg Joerg Erich

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: HARALD JAEGER ERICH SORG JOERG TO: HARALD JAEGER ERICH SORG JOERG BAI MUMIAN HALO TOSHIO

TR01 Transfer of patent right

Effective date of registration: 20130528

Address after: Regensburg, Germany

Patentee after: Osram Opto Semiconductors GmbH

Patentee after: Shin-Etsu Chemical Industry Co., Ltd.

Address before: Regensburg, Germany

Patentee before: Osram Opto Semiconductors GmbH

TR01 Transfer of patent right

Effective date of registration: 20190723

Address after: Tokyo, Japan, Japan

Patentee after: Shin-Etsu Chemical Industry Co., Ltd.

Address before: Regensburg, Germany

Co-patentee before: Shin-Etsu Chemical Industry Co., Ltd.

Patentee before: Osram Opto Semiconductors GmbH

TR01 Transfer of patent right