JP2011507285A5 - - Google Patents

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Publication number
JP2011507285A5
JP2011507285A5 JP2010538326A JP2010538326A JP2011507285A5 JP 2011507285 A5 JP2011507285 A5 JP 2011507285A5 JP 2010538326 A JP2010538326 A JP 2010538326A JP 2010538326 A JP2010538326 A JP 2010538326A JP 2011507285 A5 JP2011507285 A5 JP 2011507285A5
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JP
Japan
Prior art keywords
metal body
optoelectronic component
laminate
embodied
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2010538326A
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English (en)
Japanese (ja)
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JP2011507285A (ja
JP5568476B2 (ja
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Publication date
Priority claimed from DE102008011809A external-priority patent/DE102008011809A1/de
Application filed filed Critical
Publication of JP2011507285A publication Critical patent/JP2011507285A/ja
Publication of JP2011507285A5 publication Critical patent/JP2011507285A5/ja
Application granted granted Critical
Publication of JP5568476B2 publication Critical patent/JP5568476B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010538326A 2007-12-20 2008-12-04 オプトエレクトロニクス部品 Expired - Fee Related JP5568476B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102007061480.4 2007-12-20
DE102007061480 2007-12-20
DE102008011809.5 2008-02-29
DE102008011809A DE102008011809A1 (de) 2007-12-20 2008-02-29 Optoelektronisches Bauelement
PCT/DE2008/002036 WO2009079978A1 (de) 2007-12-20 2008-12-04 Optoelektronisches bauelement

Publications (3)

Publication Number Publication Date
JP2011507285A JP2011507285A (ja) 2011-03-03
JP2011507285A5 true JP2011507285A5 (enExample) 2012-01-05
JP5568476B2 JP5568476B2 (ja) 2014-08-06

Family

ID=40690045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010538326A Expired - Fee Related JP5568476B2 (ja) 2007-12-20 2008-12-04 オプトエレクトロニクス部品

Country Status (8)

Country Link
US (1) US8476667B2 (enExample)
EP (1) EP2223354B1 (enExample)
JP (1) JP5568476B2 (enExample)
KR (1) KR20100099309A (enExample)
CN (1) CN101904022B (enExample)
DE (1) DE102008011809A1 (enExample)
TW (1) TWI431806B (enExample)
WO (1) WO2009079978A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243709A (ja) * 2010-05-17 2011-12-01 Panasonic Corp 発光モジュール及びこれを備えた照明装置
DE102010045390B4 (de) 2010-09-15 2025-07-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronisches Halbleiterbauteils
DE102011017633A1 (de) * 2011-04-27 2012-10-31 Osram Ag Verfahren zum Bilden einer Leuchtstoffanordnung und dazugehörige Leuchtstoffanordnung
DE102013205179A1 (de) * 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
DE102013112826B4 (de) * 2013-11-20 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement umfassend eine Haftschicht und Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement
DE102014116080A1 (de) * 2014-11-04 2016-05-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016142258A1 (en) 2015-03-11 2016-09-15 Koninklijke Philips N.V. Light emitting device cooling
DE102017102247A1 (de) 2017-02-06 2018-08-09 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Herstellungsverfahren hierfür
IT201700070601A1 (it) * 2017-06-23 2018-12-23 Laser Point S R L Rilevatore veloce di radiazione elettromagnetica.

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JP2003324214A (ja) * 2002-04-30 2003-11-14 Omron Corp 発光モジュール
US6650018B1 (en) * 2002-05-24 2003-11-18 Axt, Inc. High power, high luminous flux light emitting diode and method of making same
JP2005535144A (ja) * 2002-07-31 2005-11-17 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 表面実装可能な半導体素子及び該半導体素子の製造のための方法
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JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
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EP1635403B1 (de) * 2004-09-08 2013-04-03 Asetronics AG Isoliertes Metallsubstrat mit mehreren Leuchtdioden
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DE102005041099A1 (de) * 2005-08-30 2007-03-29 Osram Opto Semiconductors Gmbh LED-Chip mit Glasbeschichtung und planarer Aufbau- und Verbindungstechnik
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TW200744227A (en) * 2006-05-19 2007-12-01 Chen Shiang Mian White LED light source and manufacturing method of fluorescent powder thereof
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