TWI358800B - - Google Patents

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Publication number
TWI358800B
TWI358800B TW096136526A TW96136526A TWI358800B TW I358800 B TWI358800 B TW I358800B TW 096136526 A TW096136526 A TW 096136526A TW 96136526 A TW96136526 A TW 96136526A TW I358800 B TWI358800 B TW I358800B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
high heat
package carrier
layer
dissipation package
Prior art date
Application number
TW096136526A
Other languages
English (en)
Chinese (zh)
Other versions
TW200915505A (en
Inventor
Shao Chung Hu
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW096136526A priority Critical patent/TW200915505A/zh
Priority to US12/071,307 priority patent/US7867892B2/en
Publication of TW200915505A publication Critical patent/TW200915505A/zh
Application granted granted Critical
Publication of TWI358800B publication Critical patent/TWI358800B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW096136526A 2007-09-29 2007-09-29 Packaging carrier with high heat-dissipation and method for manufacturing the same TW200915505A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096136526A TW200915505A (en) 2007-09-29 2007-09-29 Packaging carrier with high heat-dissipation and method for manufacturing the same
US12/071,307 US7867892B2 (en) 2007-09-29 2008-02-20 Packaging carrier with high heat dissipation and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096136526A TW200915505A (en) 2007-09-29 2007-09-29 Packaging carrier with high heat-dissipation and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200915505A TW200915505A (en) 2009-04-01
TWI358800B true TWI358800B (enExample) 2012-02-21

Family

ID=40507246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136526A TW200915505A (en) 2007-09-29 2007-09-29 Packaging carrier with high heat-dissipation and method for manufacturing the same

Country Status (2)

Country Link
US (1) US7867892B2 (enExample)
TW (1) TW200915505A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9166137B2 (en) 2012-12-13 2015-10-20 Industrial Technology Research Institute Structure of thermoelectric film

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008006745B3 (de) * 2008-01-30 2009-10-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterstruktur
US8410371B2 (en) * 2009-09-08 2013-04-02 Cree, Inc. Electronic device submounts with thermally conductive vias and light emitting devices including the same
US8507940B2 (en) 2010-04-05 2013-08-13 Taiwan Semiconductor Manufacturing Company, Ltd. Heat dissipation by through silicon plugs
US8552554B2 (en) 2010-08-12 2013-10-08 Industrial Technology Research Institute Heat dissipation structure for electronic device and fabrication method thereof
TWI396267B (zh) 2010-08-12 2013-05-11 財團法人工業技術研究院 電子封裝、用於電子裝置的散熱結構及其製造方法
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
CN102740591A (zh) * 2012-07-09 2012-10-17 苏州热驰光电科技有限公司 超高导热双面铝基线路板及其制备方法
JP6171921B2 (ja) * 2013-12-24 2017-08-02 日亜化学工業株式会社 配線基板及び発光装置
CN113471639B (zh) * 2020-03-30 2024-03-19 东莞新能德科技有限公司 电芯及具有该电芯的电池

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521844B1 (en) * 1999-10-29 2003-02-18 International Business Machines Corporation Through hole in a photoimageable dielectric structure with wired and uncured dielectric
TW490820B (en) * 2000-10-04 2002-06-11 Advanced Semiconductor Eng Heat dissipation enhanced ball grid array package
JP3817453B2 (ja) * 2001-09-25 2006-09-06 新光電気工業株式会社 半導体装置
JP3875867B2 (ja) * 2001-10-15 2007-01-31 新光電気工業株式会社 シリコン基板の穴形成方法
US6713792B2 (en) * 2002-01-30 2004-03-30 Anaren Microwave, Inc. Integrated circuit heat sink device including through hole to facilitate communication
US7345350B2 (en) * 2003-09-23 2008-03-18 Micron Technology, Inc. Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
US7101792B2 (en) * 2003-10-09 2006-09-05 Micron Technology, Inc. Methods of plating via interconnects
US7316063B2 (en) * 2004-01-12 2008-01-08 Micron Technology, Inc. Methods of fabricating substrates including at least one conductive via

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9166137B2 (en) 2012-12-13 2015-10-20 Industrial Technology Research Institute Structure of thermoelectric film

Also Published As

Publication number Publication date
US20090085180A1 (en) 2009-04-02
TW200915505A (en) 2009-04-01
US7867892B2 (en) 2011-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees