JP2011518944A5 - - Google Patents

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Publication number
JP2011518944A5
JP2011518944A5 JP2010538121A JP2010538121A JP2011518944A5 JP 2011518944 A5 JP2011518944 A5 JP 2011518944A5 JP 2010538121 A JP2010538121 A JP 2010538121A JP 2010538121 A JP2010538121 A JP 2010538121A JP 2011518944 A5 JP2011518944 A5 JP 2011518944A5
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JP
Japan
Prior art keywords
particle size
particles
metallic nanoparticles
metallic
deposit metal
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JP2010538121A
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English (en)
Japanese (ja)
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JP5554718B2 (ja
JP2011518944A (ja
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Priority claimed from PCT/US2008/086210 external-priority patent/WO2009076430A1/en
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Publication of JP2011518944A5 publication Critical patent/JP2011518944A5/ja
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JP2010538121A 2007-12-11 2008-12-10 ナノ粒子を含む金属系複合コーティングの電解デポジット Active JP5554718B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1280907P 2007-12-11 2007-12-11
US61/012,809 2007-12-11
PCT/US2008/086210 WO2009076430A1 (en) 2007-12-11 2008-12-10 Electrolytic deposition of metal-based composite coatings comprising nano-particles

Publications (3)

Publication Number Publication Date
JP2011518944A JP2011518944A (ja) 2011-06-30
JP2011518944A5 true JP2011518944A5 (enExample) 2012-02-09
JP5554718B2 JP5554718B2 (ja) 2014-07-23

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JP2010538121A Active JP5554718B2 (ja) 2007-12-11 2008-12-10 ナノ粒子を含む金属系複合コーティングの電解デポジット

Country Status (8)

Country Link
US (1) US9217205B2 (enExample)
EP (1) EP2242873B1 (enExample)
JP (1) JP5554718B2 (enExample)
CN (1) CN101946029B (enExample)
ES (1) ES2694027T3 (enExample)
PL (1) PL2242873T3 (enExample)
TR (1) TR201816579T4 (enExample)
WO (1) WO2009076430A1 (enExample)

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CN107946271B (zh) * 2017-11-14 2020-01-21 汕头市骏码凯撒有限公司 一种半导体封装用银合金线及其制造方法
CN107978577B (zh) * 2017-11-22 2019-11-01 汕头市骏码凯撒有限公司 一种低阻抗的复合钯钌铜线及其制造方法
CN110553134A (zh) * 2018-05-31 2019-12-10 比亚迪股份有限公司 金属塑料复合体及其制备方法和应用
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EP3636804A1 (en) * 2018-10-11 2020-04-15 ABB Schweiz AG Silver-graphene composite coating for sliding contact and electroplating method thereof
CN109680308A (zh) * 2019-01-24 2019-04-26 南京理工大学 以天然木材为模板电镀制备颗粒状疏水镍材料的方法
GB202007853D0 (en) * 2020-05-26 2020-07-08 Univ College Dublin Nat Univ Ireland Dublin Improved electroforming
JP7501896B2 (ja) * 2020-07-16 2024-06-18 奥野製薬工業株式会社 電気ニッケルめっき皮膜及びめっき液、並びに電気ニッケルめっき液を用いた電気ニッケルめっき皮膜の製造方法
CN112695339B (zh) * 2020-12-15 2022-05-27 世能氢电科技有限公司 一种析氢催化电极、其制备方法及其应用
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