JP5554718B2 - ナノ粒子を含む金属系複合コーティングの電解デポジット - Google Patents

ナノ粒子を含む金属系複合コーティングの電解デポジット Download PDF

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Publication number
JP5554718B2
JP5554718B2 JP2010538121A JP2010538121A JP5554718B2 JP 5554718 B2 JP5554718 B2 JP 5554718B2 JP 2010538121 A JP2010538121 A JP 2010538121A JP 2010538121 A JP2010538121 A JP 2010538121A JP 5554718 B2 JP5554718 B2 JP 5554718B2
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nanoparticles
fluoropolymer
particles
metal
based composite
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JP2011518944A5 (enExample
JP2011518944A (ja
Inventor
エイビス，ジョセフ，エイ．
クドラック，エドワード，ジェイ．，ジュニア．
リー，ジンギェ
シュー，チェン
ファン，チョンルン
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エンソン インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2010538121A 2007-12-11 2008-12-10 ナノ粒子を含む金属系複合コーティングの電解デポジット Active JP5554718B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1280907P 2007-12-11 2007-12-11
US61/012,809 2007-12-11
PCT/US2008/086210 WO2009076430A1 (en) 2007-12-11 2008-12-10 Electrolytic deposition of metal-based composite coatings comprising nano-particles

Publications (3)

Publication Number Publication Date
JP2011518944A JP2011518944A (ja) 2011-06-30
JP2011518944A5 JP2011518944A5 (enExample) 2012-02-09
JP5554718B2 true JP5554718B2 (ja) 2014-07-23

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JP2010538121A Active JP5554718B2 (ja) 2007-12-11 2008-12-10 ナノ粒子を含む金属系複合コーティングの電解デポジット

Country Status (8)

Country Link
US (1) US9217205B2 (enExample)
EP (1) EP2242873B1 (enExample)
JP (1) JP5554718B2 (enExample)
CN (1) CN101946029B (enExample)
ES (1) ES2694027T3 (enExample)
PL (1) PL2242873T3 (enExample)
TR (1) TR201816579T4 (enExample)
WO (1) WO2009076430A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009036311B4 (de) * 2009-08-06 2021-10-28 Te Connectivity Corporation Selbstschmierende Beschichtung, selbstschmierendes Bauteil, Beschichtungselektrolyt und Verfahren zur Herstellung einer selbstschmierenden Beschichtung
FR2974582A1 (fr) * 2011-04-27 2012-11-02 Commissariat Energie Atomique Procede de croissance de particules metalliques par electrodeposition avec inhibition in situ
GB2497520A (en) * 2011-12-09 2013-06-19 Mahle Int Gmbh Method of electroplating a bearing surface
KR102064551B1 (ko) * 2012-03-28 2020-01-09 삼성전자주식회사 이산화탄소 흡착제, 그 제조 방법 및 이를 포함하는 이산화탄소 포집 모듈
TWI457474B (zh) * 2012-08-17 2014-10-21 Univ Nat Chiao Tung 一維金屬奈米結構之製造方法
EP2971263A1 (en) * 2013-03-15 2016-01-20 Enthone, Inc. Electrodeposition of silver with fluoropolymer nanoparticles
CN103526268B (zh) * 2013-10-22 2016-01-13 河南理工大学 一种表面超疏水的金属基复合镀层的制备方法
CN103540971A (zh) * 2013-10-29 2014-01-29 常熟市伟达电镀有限责任公司 导电强的电镀液
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US20160010214A1 (en) 2014-07-10 2016-01-14 Macdermid Acumen, Inc. Composite Electroless Nickel Plating
JP6607106B2 (ja) 2015-03-26 2019-11-20 三菱マテリアル株式会社 スルホニウム塩を用いためっき液
US10293372B2 (en) * 2015-09-18 2019-05-21 International Business Machines Corporation Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor
JP2017201053A (ja) * 2016-05-06 2017-11-09 豊橋鍍金工業株式会社 複合めっき方法および親水性粒子
CN106906498A (zh) * 2017-04-06 2017-06-30 上海电力学院 一种氧化石墨烯锌复合电镀溶液及其制备方法和应用
CN107164790A (zh) * 2017-06-01 2017-09-15 广东贝贝机器人有限公司 一种点胶针头的防堵塞处理方法
CN107946271B (zh) * 2017-11-14 2020-01-21 汕头市骏码凯撒有限公司 一种半导体封装用银合金线及其制造方法
CN107978577B (zh) * 2017-11-22 2019-11-01 汕头市骏码凯撒有限公司 一种低阻抗的复合钯钌铜线及其制造方法
CN110553134A (zh) * 2018-05-31 2019-12-10 比亚迪股份有限公司 金属塑料复合体及其制备方法和应用
DE102018005352A1 (de) 2018-07-05 2020-01-09 Dr.-Ing. Max Schlötter GmbH & Co KG Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten
EP3636804A1 (en) * 2018-10-11 2020-04-15 ABB Schweiz AG Silver-graphene composite coating for sliding contact and electroplating method thereof
CN109680308A (zh) * 2019-01-24 2019-04-26 南京理工大学 以天然木材为模板电镀制备颗粒状疏水镍材料的方法
GB202007853D0 (en) * 2020-05-26 2020-07-08 Univ College Dublin Nat Univ Ireland Dublin Improved electroforming
JP7501896B2 (ja) * 2020-07-16 2024-06-18 奥野製薬工業株式会社 電気ニッケルめっき皮膜及びめっき液、並びに電気ニッケルめっき液を用いた電気ニッケルめっき皮膜の製造方法
CN112695339B (zh) * 2020-12-15 2022-05-27 世能氢电科技有限公司 一种析氢催化电极、其制备方法及其应用
WO2024009698A1 (ja) * 2022-07-04 2024-01-11 株式会社神戸製鋼所 接点材料
JP7514277B2 (ja) * 2022-07-04 2024-07-10 株式会社神戸製鋼所 接点材料

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5021151B1 (enExample) * 1970-09-21 1975-07-21
CH623851A5 (enExample) 1975-10-04 1981-06-30 Akzo Nv
JPS6038480B2 (ja) * 1978-06-08 1985-08-31 新日本製鐵株式会社 耐食性電気亜鉛複合めつき鋼材の製造方法
US4486274A (en) 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4478691A (en) 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
US4427502A (en) 1981-11-16 1984-01-24 Bell Telephone Laboratories, Incorporated Platinum and platinum alloy electroplating baths and processes
US4468296A (en) 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
CH667108A5 (de) * 1985-04-22 1988-09-15 Fluehmann Ag Werner Galvanisches bad zum gemeinsamen abscheiden von metall und einem dauerschmierenden feststoffschmiermittel.
US4830889A (en) 1987-09-21 1989-05-16 Wear-Cote International, Inc. Co-deposition of fluorinated carbon with electroless nickel
US4911798A (en) 1988-12-20 1990-03-27 At&T Bell Laboratories Palladium alloy plating process
US5024733A (en) 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US4911799A (en) 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
US5028492A (en) 1990-03-13 1991-07-02 Olin Corporation Composite coating for electrical connectors
US5061351A (en) 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
US5435898A (en) 1994-10-25 1995-07-25 Enthone-Omi Inc. Alkaline zinc and zinc alloy electroplating baths and processes
US5721055A (en) 1995-01-03 1998-02-24 Surface Technology, Inc. Lubricated textile spinning machinery parts
US5667659A (en) * 1996-04-04 1997-09-16 Handy & Harman Low friction solder electrodeposits
US5976344A (en) 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
US5916696A (en) 1996-06-06 1999-06-29 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
WO1998023444A1 (en) * 1996-11-26 1998-06-04 Learonal, Inc. Lead-free deposits for bearing surfaces
JP3760028B2 (ja) * 1997-07-03 2006-03-29 関西ペイント株式会社 複層塗膜形成法
US6080447A (en) 1998-05-14 2000-06-27 Enthone-Omi, Inc. Low etch alkaline zincate composition and process for zincating aluminum
US6139977A (en) 1998-06-10 2000-10-31 Lucent Technologies Inc. Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings
US6126807A (en) 1999-04-30 2000-10-03 Lucent Technologies Inc. Process for making sodium gold sulfite solution
US6241870B1 (en) 1999-05-06 2001-06-05 Lucent Technologies Inc. Rhodium sulfate compounds and rhodium plating
US6274254B1 (en) * 1999-08-23 2001-08-14 Lucent Technologies Inc. Electrodeposited precious metal finishes having wear resistant particles therein
JP3551411B2 (ja) 1999-10-27 2004-08-04 常木鍍金工業株式会社 接点部材及びその製造方法
JP2001200838A (ja) * 1999-11-09 2001-07-27 Seiko Instruments Inc 流体動圧軸受、流体動圧軸受装置、流体動圧軸受の製造方法、及び軸受表面加工方法
JP3945956B2 (ja) * 2000-03-06 2007-07-18 独立行政法人科学技術振興機構 複合めっき方法
JP4681161B2 (ja) * 2000-07-14 2011-05-11 大阪瓦斯株式会社 メッキ皮膜及びそれを用いたメッキ被覆物
US20030025182A1 (en) 2001-06-22 2003-02-06 Abys Joseph A. Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth
WO2003022741A2 (en) * 2001-09-12 2003-03-20 F.W. Gartner Thermal Spraying Company Nanostructured titania coated titanium
EP1369504A1 (en) * 2002-06-05 2003-12-10 Hille & Müller Metal strip for the manufacture of components for electrical connectors
US6818116B2 (en) 2002-08-08 2004-11-16 The Curators Of The University Of Missouri Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys
US20050249968A1 (en) 2004-05-04 2005-11-10 Enthone Inc. Whisker inhibition in tin surfaces of electronic components
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
JP5248862B2 (ja) 2004-12-30 2013-07-31 スリーエム イノベイティブ プロパティズ カンパニー フルオロポリマーナノ粒子コーティング組成物を用いる物品のコーティング方法
US20060225605A1 (en) 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
CN100535199C (zh) * 2005-06-30 2009-09-02 北京交通大学 一种用于电镀液中纳米微粒的分散方法
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction

Also Published As

Publication number Publication date
CN101946029A (zh) 2011-01-12
CN101946029B (zh) 2012-12-19
EP2242873A4 (en) 2015-11-18
EP2242873B1 (en) 2018-09-12
US9217205B2 (en) 2015-12-22
PL2242873T3 (pl) 2019-02-28
TR201816579T4 (tr) 2018-11-21
US20100294669A1 (en) 2010-11-25
JP2011518944A (ja) 2011-06-30
WO2009076430A1 (en) 2009-06-18
EP2242873A1 (en) 2010-10-27
ES2694027T3 (es) 2018-12-17

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